Ultra-thin polyimide flexible copper-clad plate

Abstract

The utility model relates to the technical field of flexible copper-clad plates and discloses an ultra-thin polyimide flexible copper-clad plate which comprises a block piece, a bearing is arranged on the inner surface of the block piece, a rotating shaft is rotatably installed on the outer surface of the bearing, an outer shell is arranged on the outer surface of the block piece, and a copper-clad plate assembly is arranged on the outer surface of the rotating shaft. The number of the block pieces and the number of the bearings are the same. According to the ultra-thin polyimide flexible copper-clad plate, the ultra-thin design of the whole copper-clad plate can be realized due to the thin thickness of the base layer film, the requirements of modern electronic equipment on miniaturization and light weight are met, the electronic equipment can integrate more functional components in a limited space, the portability and the aesthetic property of the electronic equipment are improved, and the application prospect is wide. Meanwhile, the material cost and the transportation cost are reduced, the weight of the copper-clad plate is further reduced through the design of the upper copper plate and the lower copper plate, the copper-clad plate can better adapt to flexible application scenes such as bending and folding, and the problem that the flexibility is reduced due to the fact that the copper plate is too thick is solved.

Description

Technical Field

[0001] This utility model relates to the field of flexible copper clad laminate technology, specifically to an ultra-thin polyimide flexible copper clad laminate. Background Technology

[0002] In today's era of rapid technological development, electronic devices such as smartphones, tablets, wearable devices, and various micro sensors are rapidly developing towards miniaturization and lightweighting. Consumers' demands for the portability and aesthetics of these devices are constantly increasing, which prompts electronic components and their basic materials to continuously break through traditional size limitations and achieve thinner designs. As a key carrier of electronic circuits, the reduction in the thickness of copper-clad laminates plays a crucial role in reducing the overall thickness and weight of electronic devices.

[0003] Chinese Utility Model Patent Publication No. CN 219171857 U discloses a flexible copper-clad laminate. Multiple grooves are provided on both the upper and lower surfaces of the polyimide-based film of this flexible copper-clad laminate, and these grooves are staggered. This minimizes the impact of the grooves on the overall strength performance of the polyimide-based film. However, this flexible copper-clad laminate is not suitable for meeting the urgent needs of miniaturization and lightweighting of modern electronic devices, which require integrating more functional components within a limited space. Furthermore, it does not facilitate reducing material and transportation costs, resulting in a thicker board, a more complex overall structure, and poor practicality. Summary of the Invention

[0004] The technical problem to be solved by this utility model is to provide an ultra-thin polyimide flexible copper-clad laminate, which can effectively solve the problems in the prior art that are not convenient to meet the urgent needs of miniaturization and lightweighting of modern electronic devices, enable electronic devices to integrate more functional components in a limited space, and are not convenient to reduce material and transportation costs, resulting in thicker thickness, more complex overall structure and poor practicality.

[0005] The technical solution adopted by this utility model is: an ultra-thin polyimide flexible copper-clad laminate, including a baffle plate, a bearing is provided on the inner surface of the baffle plate, a rotating shaft is rotatably mounted on the outer surface of the bearing, an outer shell is provided on the outer surface of the baffle plate, and a copper-clad laminate assembly is provided on the outer surface of the rotating shaft. Two identical baffle plates and bearings are provided, and the two baffle plates and bearings are symmetrically distributed on the center line of the rotating shaft.

[0006] Preferably, the inner surface of the housing has a hollow design, and the copper-clad laminate assembly is located on the inner surface of the housing and is adapted to the rotating shaft.

[0007] Through the above technical solution, the hollow design of the outer shell provides a suitable space for the copper clad laminate assembly, ensuring that the copper clad laminate assembly will not be obstructed by the outer shell during rotation. At the same time, it also plays a certain protective role for the copper clad laminate assembly, preventing external objects from directly colliding with the copper clad laminate assembly and reducing the risk of performance degradation or damage caused by physical damage.

[0008] Preferably, the copper clad laminate assembly includes a base film, with an upper copper plate disposed at one end of the base film and a lower copper plate disposed at the other end of the base film away from the upper copper plate.

[0009] The above technical solution, with the upper and lower copper plates located at the upper and lower ends of the base film respectively, forms a "sandwich" structure. This effectively utilizes the insulating properties of the base film to isolate the copper plates, prevent electrical short circuits, and ensure the electrical safety and reliability of the copper-clad laminate, enabling its stable application in various electronic circuits.

[0010] Preferably, the thickness of the base film is 5-15 μm, and the thickness of the upper copper plate and the lower copper plate is 3-12 μm.

[0011] The above technical solutions enable the thinner base film thickness to achieve an ultra-thin design for the entire copper clad laminate, meeting the requirements of modern electronic devices for miniaturization and lightweighting. This allows electronic devices to integrate more functional components within a limited space, improving their portability and aesthetics. It also reduces material and transportation costs. Furthermore, the design of the upper and lower copper plates further reduces the weight of the copper clad laminate and allows it to better adapt to flexible application scenarios such as bending and folding, reducing the problem of reduced flexibility caused by excessive copper plate thickness.

[0012] Preferably, the upper copper plate and the lower copper plate have the same structure, and the upper copper plate and the lower copper plate are located at the upper and lower ends of the base film, respectively.

[0013] The above technical solution simplifies the production process and equipment requirements by having the same structure for the upper and lower copper plates, and reduces production costs. During the production process, there is no need to set up complex production processes and equipment switching for copper plates with different structures, which improves production efficiency and is conducive to large-scale industrial production. Furthermore, when subjected to external forces, the upper and lower copper plates can work together to bear the force, reducing problems such as local deformation and cracking caused by uneven force on one side.

[0014] Preferably, the base film, the upper copper plate, and the lower copper plate are an integral structure, and the other end of the base film, the upper copper plate, and the lower copper plate extends to the outer surface of the outer shell.

[0015] Through the above technical solution, the integrated structure of the base film, upper copper plate and lower copper plate enhances the overall strength and stability of the copper clad laminate assembly. During use, there will be no interlayer separation, ensuring the reliability of electrical and mechanical performance, reducing the risk of failure due to structural instability, and improving product quality.

[0016] Preferably, the outer surface of the base film near both ends of the upper and lower copper plates is uniformly coated with an adhesive, and the base film, upper copper plate, and lower copper plate are bonded together by hot pressing.

[0017] Through the above technical solution, uniformly coating the adhesive and using a hot-pressing bonding process can achieve a tight and firm bond between the base film and the upper and lower copper plates. During the hot-pressing process, the melting and solidification of the adhesive can effectively eliminate gaps and micro-gaps between layers, improving the overall density of the copper-clad laminate. This not only enhances the connection strength between layers and avoids delamination during use, but also helps heat to be conducted more smoothly between layers, improving the overall thermal conductivity and ensuring that heat can be efficiently transferred from the heat source to the external environment.

[0018] Compared with the prior art, this utility model provides an ultra-thin polyimide flexible copper-clad laminate, which has the following beneficial effects:

[0019] 1. This ultra-thin polyimide flexible copper clad laminate, with its thinner base film thickness, helps to achieve an ultra-thin design of the entire copper clad laminate, meeting the requirements of modern electronic devices for miniaturization and lightweighting. This allows electronic devices to integrate more functional components within a limited space, improving the portability and aesthetics of electronic devices. It also reduces material and transportation costs. Furthermore, the design of the upper and lower copper plates further reduces the weight of the copper clad laminate and can better adapt to flexible application scenarios such as bending and folding, reducing the problem of reduced flexibility caused by excessive copper plate thickness.

[0020] 2. This ultra-thin polyimide flexible copper-clad laminate, with uniformly coated adhesive and hot-pressed, enables a tight and firm bond between the base film and the upper and lower copper plates. During the hot-pressing process, the melting and curing of the adhesive can effectively eliminate gaps and micro-gaps between layers, improving the overall density of the copper-clad laminate.

[0021] 3. This ultra-thin polyimide flexible copper-clad laminate has the same structure for both the upper and lower copper plates, which simplifies the production process and equipment requirements, reduces production costs, and eliminates the need for complex production processes and equipment switching for copper plates with different structures during production. This improves production efficiency, facilitates large-scale industrial production, and makes it easy to promote and use. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the three-dimensional structure of the present invention. Figure 1 ;

[0023] Figure 2 This is a schematic diagram of the three-dimensional structure of the present invention. Figure 2 ;

[0024] Figure 3 This is a schematic diagram of the disassembled structure of this utility model;

[0025] Figure 4 This is a three-dimensional structural diagram of the copper-clad laminate assembly of this utility model;

[0026] Figure 5 This is a schematic diagram of the disassembled structure of the copper-clad laminate assembly of this utility model. Figure 1 ;

[0027] Figure 6 This is a schematic diagram of the disassembled structure of the copper-clad laminate assembly of this utility model. Figure 2 .

[0028] The components are: 1. baffle plate; 2. bearing; 3. shaft; 4. housing; 5. copper clad laminate assembly; 501. base film; 502. upper copper plate; 503. lower copper plate. Detailed Implementation

[0029] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0030] Example 1: As Figure 1-6 As shown, the present invention provides an ultra-thin polyimide flexible copper-clad laminate, including a baffle plate 1, a bearing 2 disposed on the inner surface of the baffle plate 1, a rotating shaft 3 rotatably mounted on the outer surface of the bearing 2, a housing 4 disposed on the outer surface of the baffle plate 1, and a copper-clad laminate assembly 5 disposed on the outer surface of the rotating shaft 3. Two identical baffle plates 1 and bearings 2 are provided, and the two baffle plates 1 and bearings 2 are symmetrically distributed on the center line of the rotating shaft 3.

[0031] Specifically, the inner surface of the housing 4 has a hollow design, and the copper clad laminate assembly 5 is located on the inner surface of the housing 4 and is adapted to the rotating shaft 3. The advantage is that the hollow design of the housing 4 provides a suitable space for the copper clad laminate assembly 5, ensuring that the copper clad laminate assembly 5 is not obstructed by the housing 4 during rotation. At the same time, it also plays a certain protective role for the copper clad laminate assembly 5, preventing external objects from directly colliding with the copper clad laminate assembly 5 and reducing the risk of performance degradation or damage caused by physical damage.

[0032] Specifically, the copper clad laminate assembly 5 includes a base film 501, with an upper copper plate 502 at one end of the base film 501 and a lower copper plate 503 at the other end of the base film 501 away from the upper copper plate 502. The advantage is that the structural design of the upper copper plate 502 and the lower copper plate 503 located at the upper and lower ends of the base film 501 respectively forms a "sandwich" structure, which can effectively utilize the insulation properties of the base film 501 to isolate the copper plate, prevent electrical short circuits, and ensure the electrical safety and reliability of the copper clad laminate, enabling it to be stably applied in various electronic circuits.

[0033] Specifically, the thickness of the base film 501 is 5-15 μm, and the thickness of the upper copper plate 502 and the lower copper plate 503 is 3-12 μm. The advantage is that the thinner base film 501 helps to achieve the ultra-thin design of the entire copper clad laminate, meeting the requirements of modern electronic devices for miniaturization and lightweighting. This allows electronic devices to integrate more functional components in a limited space, improving the portability and aesthetics of electronic devices, while also reducing material and transportation costs. Furthermore, the design of the upper copper plate 502 and the lower copper plate 503 further reduces the weight of the copper clad laminate and can better adapt to flexible application scenarios such as bending and folding, reducing the problem of reduced flexibility caused by excessive copper plate thickness.

[0034] Example 2: Figure 2-6 As shown, this is an improvement on the previous embodiment.

[0035] Specifically, the upper copper plate 502 and the lower copper plate 503 have the same structure. The upper copper plate 502 and the lower copper plate 503 are located at the upper and lower ends of the base film 501, respectively. The advantage is that the identical structure of the upper copper plate 502 and the lower copper plate 503 simplifies the production process and equipment requirements, reduces production costs, and eliminates the need for complex production processes and equipment switching for copper plates with different structures during production, thereby improving production efficiency and facilitating large-scale industrial production. Furthermore, when subjected to external forces, the copper plates at the upper and lower ends can work together to reduce problems such as local deformation and cracking caused by uneven force on one side.

[0036] Specifically, the base film 501, the upper copper plate 502, and the lower copper plate 503 are an integrated structure. The other end of the base film 501, the upper copper plate 502, and the lower copper plate 503 extends to the outer surface of the outer shell 4. The advantage is that the integrated structure of the base film 501, the upper copper plate 502, and the lower copper plate 503 enhances the overall strength and stability of the copper clad laminate assembly 5. During use, there will be no separation between the layers, ensuring the reliability of electrical and mechanical performance, reducing the risk of failure due to structural instability, and improving product quality.

[0037] Specifically, an adhesive is uniformly coated on the outer surface of the base film 501 near both ends of the upper copper plate 502 and the lower copper plate 503. The base film 501, the upper copper plate 502, and the lower copper plate 503 are bonded together by hot pressing. The advantage is that the uniform coating of adhesive and the hot pressing process can achieve a tight and firm bond between the base film 501 and the upper copper plate 502 and the lower copper plate 503. During the hot pressing process, the melting and solidification of the adhesive can effectively eliminate the gaps and micro gaps between the layers, improve the overall density of the copper clad laminate, not only enhance the connection strength between the layers and avoid delamination during use, but also help the heat to be conducted more smoothly between the layers, improve the overall thermal conductivity, and ensure that the heat can be efficiently transferred from the heat source to the external environment.

[0038] Working Principle: During use, the hollow design of the outer shell 4 provides suitable space for the copper-clad laminate assembly 5, ensuring that the assembly 5 is not obstructed during rotation. It also provides some protection, preventing direct collisions with external objects and reducing the risk of performance degradation or damage due to physical impact. The upper copper plate 502 and lower copper plate 503, located at the upper and lower ends of the base film 501 respectively, form a "sandwich" structure. This effectively utilizes the insulation properties of the base film 501 to isolate the copper plates, preventing electrical short circuits and ensuring the electrical safety and reliability of the copper-clad laminate. This allows for stable application in various electronic circuits. The identical structure of the upper and lower copper plates 502 and 503 simplifies the production process and equipment requirements, reducing production costs. During production, there is no need for complex production processes and equipment switching for copper plates with different structures, improving production efficiency and facilitating large-scale industrial production. When subjected to external forces, the copper plates at both ends can work together to reduce problems such as local deformation and cracking caused by uneven force on one side. The integrated structure of the base film 501, the upper copper plate 502, and the lower copper plate 503 enhances the overall strength and stability of the copper clad laminate assembly 5. During use, there will be no separation between layers, ensuring the reliability of electrical and mechanical performance, reducing the risk of failure due to structural instability, and improving product quality. The uniform coating of adhesive and the use of hot-pressing bonding process can achieve a tight and firm bond between the base film 501 and the upper copper plate 502 and the lower copper plate 503. During the hot-pressing process, the melting and curing of the adhesive can effectively eliminate gaps and micro-gaps between layers, improving the overall density of the copper clad laminate. This not only enhances the connection strength between layers and avoids delamination during use, but also helps heat to be conducted more smoothly between layers, improving the overall thermal conductivity and ensuring that heat can be efficiently transferred from the heat source to the external environment.

[0039] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An ultra-thin polyimide flexible copper-clad laminate, comprising a grid sheet (1), characterized in that: The inner surface of the baffle plate (1) is provided with a bearing (2), and the outer surface of the bearing (2) is rotatably mounted with a rotating shaft (3). The outer surface of the baffle plate (1) is provided with a housing (4), and the outer surface of the rotating shaft (3) is provided with a copper-clad laminate assembly (5). There are two identical baffle plates (1) and bearings (2), and the two baffle plates (1) and bearings (2) are symmetrically distributed on the center line of the rotating shaft (3).

2. The ultra-thin polyimide flexible copper-clad laminate according to claim 1, characterized in that: The inner surface of the outer shell (4) is hollowed out, and the copper-clad laminate assembly (5) is located on the inner surface of the outer shell (4) and is adapted to the rotating shaft (3).

3. The ultra-thin polyimide flexible copper-clad laminate according to claim 1, characterized in that: The copper clad laminate assembly (5) includes a base film (501), with an upper copper plate (502) disposed at one end of the base film (501) and a lower copper plate (503) disposed at the other end of the base film (501) away from the upper copper plate (502).

4. The ultra-thin polyimide flexible copper-clad laminate according to claim 3, characterized in that: The thickness of the base film (501) is 5-15 μm, and the thickness of the upper copper plate (502) and the lower copper plate (503) is 3-12 μm.

5. The ultra-thin polyimide flexible copper-clad laminate according to claim 3, characterized in that: The upper copper plate (502) and the lower copper plate (503) have the same structure, and the upper copper plate (502) and the lower copper plate (503) are located at the upper and lower ends of the base film (501), respectively.

6. The ultra-thin polyimide flexible copper-clad laminate according to claim 3, characterized in that: The base film (501), upper copper plate (502) and lower copper plate (503) are an integral structure, and the other end of the base film (501), upper copper plate (502) and lower copper plate (503) extends to the outer surface of the outer shell (4).

7. The ultra-thin polyimide flexible copper-clad laminate according to claim 3, characterized in that: The outer surface of the base film (501) near both ends of the upper copper plate (502) and the lower copper plate (503) is uniformly coated with adhesive, and the base film (501), the upper copper plate (502) and the lower copper plate (503) are bonded together by hot pressing.

Images