Radiator module with improved vapor chamber structure

Abstract

The utility model discloses a radiator module with an improved vapor chamber structure, which comprises a radiating fin group used for conducting heat, a radiating tube penetrating through the radiating fin group, and a vapor chamber arranged on one side of the radiating fin group and used for being in contact with an electronic element for conducting heat, a plurality of air guide grooves used for directly guiding heat dissipation air to the electronic elements are formed in the edge of the vapor chamber in a concave-convex mode. The vapor chamber is further provided with a first heat conduction piece used for being matched with the air guide groove to guide heat dissipation air to the electronic element. A plurality of concave air guide grooves are formed in the edge of the vapor chamber through stamping, so that heat dissipation air generated by a fan can be directly blown to an electronic element from the air guide grooves in the periphery of the vapor chamber for heat dissipation, the heat dissipation efficiency can be greatly improved, the influence of the heat conduction performance of a heat dissipation fin group and the vapor chamber on heat dissipation can be reduced, and the service life of the electronic element is prolonged. The high temperature of the electronic component caused by the heat-conducting property change of the radiating fin group and the vapor chamber in the long-term use process is avoided, the service life of the electronic component is prolonged, and the operation performance stability of the electronic component is improved.

Description

Technical fields:

[0001] This utility model relates to the field of radiator technology, and specifically to a radiator module with an improved heat spreader structure. Background technology:

[0002] In modern electronic products, especially high-performance graphics cards, the design of heat sinks is particularly important. This is because electronic devices generate a significant amount of heat during operation, especially under high-load computing tasks such as graphics processing and complex calculations. The primary cause of this heat generation is the power consumption of the components; when current flows through semiconductor materials, resistance causes some electrical energy to be converted into heat. If this heat cannot be dissipated in time, the increased temperature will lead to a decline in component performance or even damage.

[0003] Currently, traditional heat dissipation methods mainly include air cooling, liquid cooling, and heat pipe cooling. Air cooling relies on fans to remove heat from the surface of electronic components. It is a widely used and cost-effective method, but it often suffers from insufficient heat dissipation efficiency in high-performance products. Liquid cooling removes heat through liquid circulation, which is more efficient and quieter, but it has a complex structure, higher cost, and requires leak-proof measures. Heat pipe cooling uses materials with good thermal conductivity to quickly transfer heat to the heatsink area, but it is limited by the heat capacity of the heat pipe design. Especially in high-performance graphics cards, the heat generated increases rapidly with the increase in computing power. If the cooling system cannot reduce the temperature quickly enough, the graphics card will reduce its frequency to protect itself, resulting in a performance degradation.

[0004] For example, the heat dissipation device disclosed in Chinese Patent Publication No. CN 101605442B is mainly used for heat dissipation of circuit boards. The heat dissipation device includes a base, a heat sink, a fan, and a cover. The base includes a substrate and a heat spreader. During operation, a fixing member passes downwards through the base and the circuit board, engaging with a backplate located below the circuit board to fix the heat dissipation device to the circuit board. The bottom surface of the heat spreader can contact one or more electronic components. Thermally conductive adhesive can be applied between the bottom surface of the heat spreader and the top surface of the electronic components to enhance thermal conductivity. An insulating film can also be placed between the heat dissipation device and the circuit board for insulation and buffering. Because the heat spreader is a highly efficient heat-conducting plate-shaped heat pipe, the heat generated by the electronic components can be absorbed by the heat spreader and quickly and evenly distributed across the entire heat spreader. The heat is then conducted to the entire heat sink, and finally, the airflow generated by the fan quickly carries away the heat through the airflow channels within the heat sink, thus achieving rapid cooling of the electronic components.

[0005] As described in the aforementioned patent, since current heat dissipation devices on the market all use airflow generated by fans to blow away heat from the heat sink or heat conductor, their heat dissipation efficiency largely depends on the thermal conductivity of the heat sink or heat conductor. When the heat sink or heat conductor's thermal conductivity decreases due to dust accumulation or other reasons, electronic components are prone to instantaneous high temperatures, leading to a decline in the performance or damage of the electronic components. Therefore, ensuring continuous and stable heat dissipation of electronic components is an important factor in maintaining the performance and extending the lifespan of electronic products.

[0006] In view of the above, the inventors propose the following technical solution. Utility model content:

[0007] The purpose of this invention is to overcome the shortcomings of the prior art and provide a radiator module with an improved heat sink structure.

[0008] To solve the above-mentioned technical problems, the present invention adopts the following technical solution: a heat sink module with an improved heat dissipation plate structure, comprising: at least one heat dissipation fin group for heat conduction, at least one heat dissipation pipe penetrating the heat dissipation fin group, and a heat dissipation plate disposed on one side of the heat dissipation fin group for contacting and conducting heat with electronic components. The edge of the heat dissipation plate is formed with a plurality of air guide grooves for directly guiding the heat dissipation air to the electronic components. A first heat-conducting component is also installed on the heat dissipation plate to cooperate with the air guide grooves to guide the heat dissipation air to the electronic components.

[0009] Furthermore, in the above technical solution, the air guide groove is formed circumferentially around the periphery of the heat spreader, and the heat spreader is provided with a plurality of first positioning posts for positioning the first heat-conducting component.

[0010] Furthermore, in the above technical solution, the first heat-conducting component is frame-shaped, with a hollowed-out middle section corresponding to the contact area between the heat spreader and the electronic component. The edge of the first heat-conducting component covers the air guide groove, and an air vent is reserved between it and the heat spreader for heat dissipation air to pass through.

[0011] Furthermore, in the above technical solution, the first heat-conducting component is provided with at least four first positioning holes for fitting onto the first positioning post, and the edge of the first heat-conducting component is also bent into a folded portion for positioning.

[0012] Furthermore, in the above technical solution, several heat dissipation pipes are arranged, and the heat dissipation pipes are located between the heat dissipation fin assembly and the heat spreader, and are flush with and in contact with the end face of the heat spreader.

[0013] Furthermore, in the above technical solution, two heat dissipation fin groups are arranged side by side, and a connecting plate is provided between the two heat dissipation fin groups for connection and fixation, and the heat dissipation pipe passes through the two heat dissipation fin groups.

[0014] Furthermore, in the above technical solution, a first heat-conducting surface is provided in the contact area between the heat dissipation fin group and the heat dissipation plate. The fins in the heat dissipation fin group are perpendicular to the first heat-conducting surface, and the heat dissipation pipes all pass through the first heat-conducting surface. The heat dissipation fin group is provided with a plurality of U-shaped grooves that pass through the first heat-conducting surface and are used to position the heat dissipation pipes.

[0015] Furthermore, in the above technical solution, the heat dissipation fin assembly is also equipped with a second heat-conducting component and a third heat-conducting component located on both sides of the heat dissipation plate, and the second heat-conducting component and the third heat-conducting component are respectively located on the two heat dissipation fin assemblies.

[0016] Furthermore, in the above technical solution, two connecting plates are arranged side by side and connected to two heat dissipation fin groups by welding. The two connecting plates and the heat dissipation plate are located on both sides of the heat dissipation fin groups respectively.

[0017] After adopting the above technical solution, the present invention has the following beneficial effects compared with the prior art: In the present invention, heat conduction is achieved by using a heat spreader plate in contact with electronic components, and multiple recessed air guide grooves are formed by stamping on the edge of the heat spreader plate. This allows the cooling air generated by fan A to be blown directly onto the electronic components from the air guide grooves around the heat spreader plate for heat dissipation. This not only significantly improves the heat dissipation efficiency but also reduces the impact of the thermal conductivity of the heat sink fins and heat spreader plate on heat dissipation, avoiding high temperatures in electronic components caused by changes in the thermal conductivity of the heat sink fins and heat spreader plate during long-term use, thus improving the service life and operational stability of electronic components. Secondly, by attaching the first thermal conductive component to the outer periphery of the heat spreader plate, the first thermal conductive component can be matched and covered on the air guide grooves to form a ventilation channel, facilitating the cooling air to be blown onto the electronic components along the air guide grooves. Attached image description:

[0018] Figure 1 This is a schematic diagram of the structure of this utility model;

[0019] Figure 2 This is an exploded view of the present invention. Detailed implementation method:

[0020] The present invention will be further described below with reference to specific embodiments and accompanying drawings.

[0021] In this embodiment, fan A is located on one side of heat dissipation fin assembly 1 and is fixed to heat dissipation fin assembly 1 by a bracket 9. When the length of heat dissipation fin assembly 1 is long, multiple fans A can be installed side by side on the bracket 9.

[0022] See Figure 1 and Figure 2As shown, a heat sink module with an improved heat dissipation plate structure includes at least one heat dissipation fin assembly 1 for heat conduction, at least one heat dissipation pipe 2 penetrating the heat dissipation fin assembly 1, and a heat dissipation plate 4 disposed on one side of the heat dissipation fin assembly 1 for contacting and conducting heat with electronic components 3. The edge of the heat dissipation plate 4 is formed with a plurality of air guide grooves 41 for directly guiding the heat dissipation air to the electronic components 3. A first heat-conducting element 5 is also installed on the heat dissipation plate 4 to cooperate with the air guide grooves 41 to guide the heat dissipation air to the electronic components 3. By using a heat spreader 4 to conduct heat in contact with the electronic component 3, and punching multiple recessed air guide grooves 41 on the edge of the heat spreader 4, the cooling air generated by the fan A can be directly blown onto the electronic component 3 from the air guide grooves 41 around the heat spreader 4 for heat dissipation. This not only significantly improves the heat dissipation efficiency, but also reduces the impact of the thermal conductivity of the heat sink fin assembly 1 and the heat spreader 4 on heat dissipation, avoiding high temperatures in the electronic component 3 caused by changes in the thermal conductivity of the heat sink fin assembly 1 and the heat spreader 4 during long-term use, thus improving the service life and operational stability of the electronic component 3. Secondly, a first thermal conductive element 5 is attached to the outer periphery of the heat spreader 4, so that the first thermal conductive element 5 can fit over the air guide grooves 41 to form a ventilation channel, facilitating the cooling air to be blown onto the electronic component 3 along the air guide grooves 41.

[0023] The air guide groove 41 is formed circumferentially around the heat spreader 4, and the heat spreader 4 is provided with a plurality of first positioning posts 42 for positioning the first heat-conducting component 5. The first heat-conducting component 5 is provided with at least four first positioning holes 51 for fitting onto the first positioning posts 42, and the edge of the first heat-conducting component 5 is also bent to form a folded portion 52 for positioning.

[0024] The first heat-conducting component 5 is frame-shaped. The middle part of the first heat-conducting component 5 is hollowed out and corresponds to the contact area between the heat spreader 4 and the electronic component 3. The edge of the first heat-conducting component 5 is covered on the air guide groove 41, and an air vent is reserved between it and the heat spreader 4 for heat dissipation air to pass through.

[0025] Several heat dissipation pipes 2 are arranged in a row, and the heat dissipation pipes 2 are located between the heat dissipation fin group 1 and the heat spreader 4, and are flush with and in contact with the end face of the heat spreader 4. Two heat dissipation fin groups 1 are arranged side by side, and a connecting plate 6 is provided in front of the two heat dissipation fin groups 1 for connection and fixation, and the heat dissipation pipes 2 pass through the two heat dissipation fin groups 1.

[0026] The contact area between the heat dissipation fin assembly 1 and the heat spreader 4 is provided with a first heat-conducting surface 11. The fins in the heat dissipation fin assembly 1 are perpendicular to the first heat-conducting surface 11, and the heat dissipation pipes 2 all pass through the first heat-conducting surface 11. The heat dissipation fin assembly 1 is provided with multiple U-shaped grooves 12 that pass through the first heat-conducting surface 11 and are used to position the heat dissipation pipes 2. The heat dissipation fin assembly 1 is also equipped with a second heat-conducting element 7 and a third heat-conducting element 8 located on both sides of the heat spreader 4, and the second heat-conducting element 7 and the third heat-conducting element 8 are respectively located on two heat dissipation fin assemblies 1.

[0027] Two connecting plates 6 are arranged side by side and are connected to two heat dissipation fin groups 1 by welding. The two connecting plates 6 and the heat dissipation plate 4 are located on both sides of the heat dissipation fin group 1.

[0028] In summary, this invention employs a ring of air guide grooves 41 stamped on the edge of the heat spreader 4, allowing the cooling air blown by fan A towards the heat sink fin assembly 1 to directly reach the electronic component 3 from around the heat spreader 4, thereby achieving direct heat dissipation of the electronic component 3 and improving its heat dissipation efficiency. Furthermore, the addition of a first heat-conducting element 5 at the bottom of the heat spreader 4, which is square-shaped and fits perfectly over the air guide grooves 41, not only facilitates the entry of cooling air into the air guide grooves 41 but also utilizes the contact between the first heat-conducting element 5 and the edge of the electronic component 3 for heat conduction, facilitating the removal of heat when the cooling air enters the air guide grooves 41, thus achieving highly efficient heat dissipation.

[0029] Of course, the above description is only a specific embodiment of the present utility model and is not intended to limit the scope of the present utility model. All equivalent changes or modifications made to the structure, features and principles described in the claims of the present utility model should be included in the scope of the claims of the present utility model.

Claims

1. A heat sink module with an improved heat spreader structure, comprising at least one heat sink fin assembly (1) for heat conduction, at least one heat sink pipe (2) penetrating the heat sink fin assembly (1), and a heat spreader (4) disposed on one side of the heat sink fin assembly (1) for contacting and conducting heat with electronic components (3), characterized in that: The edge of the heat spreader (4) is embossed with several air guide grooves (41) for directing the heat dissipation air directly to the electronic components (3); The heat spreader (4) is also equipped with a first heat-conducting element (5) to guide the heat dissipation air to the electronic components (3) in conjunction with the air guide groove (41).

2. A radiator module with an improved heat spreader structure according to claim 1, characterized in that: The air guide groove (41) is formed around the periphery of the heat spreader (4), and the heat spreader (4) is provided with a plurality of first positioning posts (42) for positioning the first heat-conducting component (5).

3. A radiator module with an improved heat spreader structure according to claim 2, characterized in that: The first heat-conducting component (5) is frame-shaped. The middle part of the first heat-conducting component (5) is hollowed out and corresponds to the contact area between the heat spreader (4) and the electronic component (3). The edge of the first heat-conducting component (5) is covered on the air guide groove (41), and an air vent is reserved between it and the heat spreader (4) for heat dissipation air to pass through.

4. A radiator module with an improved heat spreader structure according to claim 3, characterized in that: The first heat-conducting component (5) is provided with at least four first positioning holes (51) for fitting onto the first positioning post (42), and the edge of the first heat-conducting component (5) is also bent into a folded portion (52) for positioning.

5. A radiator module with an improved heat spreader structure according to claim 1, characterized in that: The heat dissipation pipes (2) are arranged in a plurality of columns, and the heat dissipation pipes (2) are located between the heat dissipation fin group (1) and the heat spreader (4), and are flush with and in contact with the end face of the heat spreader (4).

6. A radiator module with an improved heat spreader structure according to any one of claims 1-5, characterized in that: Two heat dissipation fin groups (1) are arranged side by side, and a connecting plate (6) is provided in front of the two heat dissipation fin groups (1) to connect and fix them, and the heat dissipation pipe (2) passes through the two heat dissipation fin groups (1).

7. A radiator module with an improved heat spreader structure according to claim 6, characterized in that: The contact area between the heat dissipation fin group (1) and the heat dissipation plate (4) is provided with a first heat-conducting surface (11). The fins in the heat dissipation fin group (1) are perpendicular to the first heat-conducting surface (11), and the heat dissipation pipes (2) all pass through the first heat-conducting surface (11). The heat dissipation fin group (1) is provided with a plurality of U-shaped grooves (12) that pass through the first heat-conducting surface (11) and are used to position the heat dissipation pipes (2).

8. A radiator module with an improved heat spreader structure according to claim 6, characterized in that: The heat dissipation fin group (1) is also equipped with a second heat-conducting element (7) and a third heat-conducting element (8) located on both sides of the heat dissipation plate (4), and the second heat-conducting element (7) and the third heat-conducting element (8) are respectively located on the two heat dissipation fin groups (1).

9. A radiator module with an improved heat spreader structure according to claim 8, characterized in that: Two connecting plates (6) are arranged side by side and are connected to two heat dissipation fin groups (1) by welding. The two connecting plates (6) and the heat dissipation plate (4) are located on both sides of the heat dissipation fin group (1).

Images