Radiator module with improved vapor chamber structure

Abstract

The utility model discloses a radiator module with an improved vapor chamber structure, which comprises a radiating fin group used for conducting heat, a radiating tube penetrating through the radiating fin group and a vapor chamber arranged on one side of the radiating fin group and used for contacting with an electronic element for conducting heat, and a plurality of radiating through holes penetrating through the vapor chamber are arranged on the vapor chamber. And air guide grooves which correspond to the heat dissipation through holes and extend towards the edge are formed in the bottom of the vapor chamber. The vapor chamber is in contact with the electronic element to conduct heat, the heat dissipation through holes penetrating through the vapor chamber are formed in the vapor chamber, heat dissipation air generated by the fan A is directly guided into the surface of the electronic element through the heat dissipation through holes, and the heat dissipation air is guided out through the air guide grooves extending towards the edge, so that heat generated by the electronic element is directly taken away, and the heat dissipation efficiency is improved. The heat dissipation efficiency is greatly improved, the influence of the heat conduction performance of the heat dissipation fin group and the vapor chamber on heat dissipation can be reduced, the service life of an electronic element is prolonged, and the operation performance stability of the electronic element is improved.

Description

Technical fields:

[0001] This utility model relates to the field of radiator technology, and specifically to a radiator module with an improved heat spreader structure. Background technology:

[0002] In modern electronic products, especially high-performance graphics cards, the design of heat sinks is particularly important. This is because electronic devices generate a significant amount of heat during operation, especially under high-load computing tasks such as graphics processing and complex calculations. The primary cause of this heat generation is the power consumption of the components; when current flows through semiconductor materials, resistance causes some electrical energy to be converted into heat. If this heat cannot be dissipated in time, the increased temperature will lead to a decline in component performance or even damage.

[0003] Currently, traditional heat dissipation methods mainly include air cooling, liquid cooling, and heat pipe cooling. Air cooling relies on fans to remove heat from the surface of electronic components. It is a widely used and cost-effective method, but it often suffers from insufficient heat dissipation efficiency in high-performance products. Liquid cooling removes heat through liquid circulation, which is more efficient and quieter, but it has a complex structure, higher cost, and requires leak-proof measures. Heat pipe cooling uses materials with good thermal conductivity to quickly transfer heat to the heatsink area, but it is limited by the heat capacity of the heat pipe design. Especially in high-performance graphics cards, the heat generated increases rapidly with the increase in computing power. If the cooling system cannot reduce the temperature quickly enough, the graphics card will reduce its frequency to protect itself, resulting in a performance degradation.

[0004] For example, the heat dissipation device disclosed in Chinese Patent Publication No. CN 101605442B is mainly used for heat dissipation of circuit boards. The heat dissipation device includes a base, a heat sink, a fan, and a cover. The base includes a substrate and a heat spreader. During operation, a fixing member passes downwards through the base and the circuit board, engaging with a backplate located below the circuit board to fix the heat dissipation device to the circuit board. The bottom surface of the heat spreader can contact one or more electronic components. Thermally conductive adhesive can be applied between the bottom surface of the heat spreader and the top surface of the electronic components to enhance thermal conductivity. An insulating film can also be placed between the heat dissipation device and the circuit board for insulation and buffering. Because the heat spreader is a highly efficient heat-conducting plate-shaped heat pipe, the heat generated by the electronic components can be absorbed by the heat spreader and quickly and evenly distributed across the entire heat spreader. The heat is then conducted to the entire heat sink, and finally, the airflow generated by the fan quickly carries away the heat through the airflow channels within the heat sink, thus achieving rapid cooling of the electronic components.

[0005] As described in the aforementioned patent, since current heat dissipation devices on the market all use airflow generated by fans to blow away heat from the heat sink or heat conductor, their heat dissipation efficiency largely depends on the thermal conductivity of the heat sink or heat conductor. When the heat sink or heat conductor's thermal conductivity decreases due to dust accumulation or other reasons, electronic components are prone to instantaneous high temperatures, leading to a decline in the performance or damage of the electronic components. Therefore, ensuring continuous and stable heat dissipation of electronic components is an important factor in maintaining the performance and extending the lifespan of electronic products.

[0006] In view of the above, the inventors propose the following technical solution. Utility model content:

[0007] The purpose of this invention is to overcome the shortcomings of the prior art and provide a radiator module with an improved heat spreader structure.

[0008] To solve the above-mentioned technical problems, the present invention adopts the following technical solution: a heat sink module with an improved heat dissipation plate structure, comprising: at least one heat dissipation fin group for heat conduction, at least one heat dissipation pipe penetrating the heat dissipation fin group, and a heat dissipation plate disposed on one side of the heat dissipation fin group for contacting and conducting heat with electronic components. The heat dissipation plate is provided with a plurality of through heat dissipation holes, and the bottom of the heat dissipation plate is provided with corresponding heat dissipation holes and air guide grooves extending to the edge.

[0009] Furthermore, in the above technical solution, the heat dissipation plate is provided with two elongated heat dissipation through holes, and two corresponding air guide grooves are provided, extending along the longitudinal direction of the heat dissipation through holes to both sides.

[0010] Furthermore, in the above technical solution, the bottom surface of the heat spreader is provided with at least one convex surface, which is located next to the air guide channel, and the air guide channel does not pass through the convex surface. The air guide channel is a U-shaped channel.

[0011] Furthermore, in the above technical solution, the heat spreader is provided with a plurality of first positioning posts for fixing to the PCB board of electronic components, and the outer edge of the heat spreader is also bent with at least one bent platform for contacting heat conduction.

[0012] Furthermore, in the above technical solution, the heat spreader is a copper plate, and a heat-conducting component is provided on the side of the heat spreader. The heat-conducting component is a stamped folded plate and is provided with at least two second positioning posts for fixing the PCB board of electronic components.

[0013] Furthermore, in the above technical solution, several heat dissipation pipes are arranged, and the heat dissipation pipes are located between the heat dissipation fin assembly and the heat spreader, and are flush with and in contact with the end face of the heat spreader.

[0014] Furthermore, in the above technical solution, two heat dissipation fin groups are arranged side by side, and a connecting plate is provided between the two heat dissipation fin groups for connection and fixation, and the heat dissipation pipe passes through the two heat dissipation fin groups.

[0015] Furthermore, in the above technical solution, a first heat-conducting surface is provided in the contact area between the heat dissipation fin group and the heat dissipation plate. The fins in the heat dissipation fin group are perpendicular to the first heat-conducting surface, and the heat dissipation pipes all pass through the first heat-conducting surface. The heat dissipation fin group is provided with a plurality of U-shaped grooves that pass through the first heat-conducting surface and are used to position the heat dissipation pipes.

[0016] Furthermore, in the above technical solution, two connecting plates are arranged side by side and connected to two heat dissipation fin groups by welding. The two connecting plates and the heat dissipation plate are located on both sides of the heat dissipation fin groups respectively.

[0017] Furthermore, in the above technical solution, both the heat spreader and the heat conductor are stamped parts with uneven surfaces on both sides; the fins on the bottom surface of the heat dissipation fin assembly are uneven to match the different contact surfaces on the heat spreader and the heat conductor, and the contact areas between the fins and the heat spreader and the heat conductor are provided with heat-conducting surfaces. The fins on the top surface of the heat dissipation fin assembly are flat and are fixed to the connecting plate by welding.

[0018] After adopting the above technical solution, the present invention has the following beneficial effects compared with the prior art: In the present invention, a heat dissipation plate is used to conduct heat in contact with electronic components, and heat dissipation holes are provided through the heat dissipation plate. The heat dissipation air generated by the fan is directly introduced to the surface of the electronic components through the heat dissipation holes, and the heat dissipation air is discharged by the air guide grooves extending to the edge, thereby realizing the direct removal of the heat generated by the electronic components. This not only greatly improves the heat dissipation efficiency, but also reduces the impact of the thermal conductivity of the heat dissipation fins and the heat dissipation plate on heat dissipation, avoiding high temperature of electronic components caused by changes in the thermal conductivity of the heat dissipation fins and the heat dissipation plate during long-term use, and improving the service life and operational stability of electronic components. Attached image description:

[0019] Figure 1 This is a breakdown of the utility model. Figure 1 ;

[0020] Figure 2 This is a schematic diagram of the internal structure of this utility model. Figure 1 ;

[0021] Figure 3 This is a breakdown of the utility model. Figure 2 ;

[0022] Figure 4 This is a schematic diagram of the internal structure of this utility model. Figure 2 . Detailed implementation method:

[0023] The present invention will be further described below with reference to specific embodiments and accompanying drawings.

[0024] In this embodiment, fan A is located on one side of heat dissipation fin assembly 1 and is fixed to heat dissipation fin assembly 1 by a bracket 9. When the length of heat dissipation fin assembly 1 is long, multiple fans A can be installed side by side on the bracket 9.

[0025] See Figures 1 to 4 As shown, a heat sink module with an improved heat dissipation plate structure includes at least one heat dissipation fin assembly 1 for heat conduction, at least one heat dissipation pipe 2 penetrating the heat dissipation fin assembly 1, and a heat dissipation plate 4 disposed on one side of the heat dissipation fin assembly 1 for contacting and conducting heat with electronic components 3. The heat dissipation plate 4 is provided with a plurality of through heat dissipation holes 41, and the bottom of the heat dissipation plate 4 is provided with air guide grooves 42 corresponding to the heat dissipation holes 41 and extending to the edge. Heat is conducted through contact between the heat exchange plate 4 and the electronic component 3. A heat dissipation through hole 41 is provided through the heat exchange plate 4 to directly guide the heat dissipation air generated by the fan A to the surface of the electronic component 3. The heat dissipation air is then discharged by the air guide groove 42 extending to the edge, thereby directly removing the heat generated by the electronic component 3. This not only greatly improves the heat dissipation efficiency, but also reduces the impact of the thermal conductivity of the heat dissipation fin assembly 1 and the heat exchange plate 4 on heat dissipation. It avoids the high temperature of the electronic component 3 caused by changes in the thermal conductivity of the heat dissipation fin assembly 1 and the heat exchange plate 4 during long-term use, thereby improving the service life and operational stability of the electronic component 3.

[0026] The heat spreader 4 has two elongated heat dissipation holes 41, and two corresponding air guide channels 42 are provided, extending longitudinally along the heat dissipation holes 41 to both sides. The bottom surface of the heat spreader 4 also has at least one convex surface 43, located beside the air guide channels 42, which do not pass through the convex surface 43. The air guide channels 42 are U-shaped. The heat spreader 4 has multiple first positioning posts 44 for fixing to the PCB board 30 of the electronic component 3, and the outer edge of the heat spreader 4 also has at least one bent platform 45 for contacting heat conduction. The heat spreader 4 is a copper plate, and a heat-conducting component 5, which is a stamped folded plate, is provided beside the heat spreader 4, with at least two second positioning posts 51 for fixing to the PCB board 30 of the electronic component 3. The heat spreader 4 is made of pure copper, which has higher heat dissipation efficiency. The heat spreader 4 is stamped with a convex surface 43 and a bent platform 45 to accommodate electronic components 3 of different heights and ensure that the heat spreader 4 can contact electronic components 3 of different heights at the same time.

[0027] Several heat dissipation pipes 2 are arranged in a row, and the heat dissipation pipes 2 are located between the heat dissipation fin group 1 and the heat spreader 4, and are flush and in contact with the end face of the heat spreader 4. Two heat dissipation fin groups 1 are arranged side by side, and a connecting plate 6 is provided between the two heat dissipation fin groups 1 for connection and fixation, and the heat dissipation pipes 2 pass through the two heat dissipation fin groups 1. A first heat-conducting surface 11 is provided in the contact area between the heat dissipation fin group 1 and the heat spreader 4. The fins in the heat dissipation fin group 1 are perpendicular to the first heat-conducting surface 11, and the heat dissipation pipes 2 all pass through the first heat-conducting surface 11. Multiple U-shaped grooves 12 are provided on the heat dissipation fin group 1 that pass through the first heat-conducting surface 11 and are used to position the heat dissipation pipes 2. Two connecting plates 6 are arranged side by side and are connected to the two heat dissipation fin groups 1 by welding. The two connecting plates 6 and the heat spreader 4 are located on both sides of the heat dissipation fin group 1, respectively.

[0028] Both the heat spreader 4 and the heat conductor 5 are stamped parts with uneven surfaces on both sides; the fins on the bottom surface of the heat dissipation fin assembly 1 are uneven to match the different contact surfaces on the heat spreader 4 and the heat conductor 5, and the contact areas between the fins and the heat spreader 4 and the heat conductor 5 are provided with heat-conducting surfaces. The fins on the top surface of the heat dissipation fin assembly 1 are flat and are fixed to the connecting plate 6 by welding.

[0029] In summary, this invention utilizes heat dissipation holes 41 punched into the edge of the heat spreader 4, allowing the cooling air generated by fan A to directly blow onto the surface of the electronic component 3. Furthermore, by punching air guide grooves 42 into the bottom surface of the heat spreader 4, the cooling air generated by fan A flows along the air guide grooves 42 towards the edge after hitting the electronic component 3, carrying away heat. This achieves direct heat dissipation for the electronic component 3, improving its heat dissipation efficiency. Moreover, punching the heat spreader 4 into an uneven convex surface 43 and a bent platform 45 allows the heat spreader 4 to contact more electronic components 3, thereby carrying away heat from the main electronic component 3 and other auxiliary electronic components, achieving highly efficient heat dissipation.

[0030] A first heat-conducting element 5 is added to the bottom of the heat spreader 4. The first heat-conducting element 5 is square and can just cover the air guide 41. This not only facilitates the entry of heat dissipation air into the air guide 41, but also utilizes the contact between the first heat-conducting element 5 and the edge of the electronic component 3 to conduct heat, so that the heat dissipation air blows into the air guide 41 and carries away the heat, thereby achieving efficient heat dissipation.

[0031] Of course, the above description is only a specific embodiment of the present utility model and is not intended to limit the scope of the present utility model. All equivalent changes or modifications made to the structure, features and principles described in the claims of the present utility model should be included in the scope of the claims of the present utility model.

Claims

1. A heat sink module with an improved heat spreader structure, comprising at least one heat sink fin assembly (1) for heat conduction, at least one heat sink pipe (2) penetrating the heat sink fin assembly (1), and a heat spreader (4) disposed on one side of the heat sink fin assembly (1) for contacting and conducting heat with electronic components (3), characterized in that: The heat spreader (4) is provided with multiple through heat dissipation holes (41), and the bottom of the heat spreader (4) is provided with corresponding heat dissipation holes (41) and air guide grooves (42) extending to the edge.

2. A radiator module with an improved heat spreader structure according to claim 1, characterized in that: The heat dissipation plate (4) is provided with two elongated heat dissipation through holes (41), and the air guide grooves (42) are provided with two corresponding ones, which extend along the longitudinal direction of the heat dissipation through holes (41) to both sides.

3. A radiator module with an improved heat spreader structure according to claim 1, characterized in that: The bottom surface of the heat spreader (4) is also provided with at least one convex surface (43), which is located on the side of the air guide trough (42) and the air guide trough (42) does not pass through the convex surface (43). The air guide trough (42) is a U-shaped trough.

4. A radiator module with an improved heat spreader structure according to claim 1, characterized in that: The heat spreader (4) is provided with a plurality of first positioning posts (44) for fixing to the PCB board (30) of the electronic component (3), and the outer edge of the heat spreader (4) is also bent with at least one bent platform (45) for contacting heat conduction.

5. A radiator module with an improved heat spreader structure according to any one of claims 1-4, characterized in that: The heat spreader (4) is a copper plate, and a heat-conducting component (5) is provided on the side of the heat spreader (4). The heat-conducting component (5) is a stamped folding plate and is provided with at least two second positioning posts (51) for fixing the PCB board (30) of the electronic component (3).

6. A radiator module with an improved heat spreader structure according to claim 5, characterized in that: The heat dissipation pipes (2) are arranged in a plurality of columns, and the heat dissipation pipes (2) are located between the heat dissipation fin group (1) and the heat spreader (4), and are flush with and in contact with the end face of the heat spreader (4).

7. A radiator module with an improved heat spreader structure according to claim 6, characterized in that: Two heat dissipation fin groups (1) are arranged side by side, and a connecting plate (6) is provided in front of the two heat dissipation fin groups (1) to connect and fix them, and the heat dissipation pipe (2) passes through the two heat dissipation fin groups (1).

8. A radiator module with an improved heat spreader structure according to claim 7, characterized in that: The contact area between the heat dissipation fin group (1) and the heat dissipation plate (4) is provided with a first heat-conducting surface (11). The fins in the heat dissipation fin group (1) are perpendicular to the first heat-conducting surface (11), and the heat dissipation pipes (2) all pass through the first heat-conducting surface (11). The heat dissipation fin group (1) is provided with a plurality of U-shaped grooves (12) that pass through the first heat-conducting surface (11) and are used to position the heat dissipation pipes (2).

9. A radiator module with an improved heat spreader structure according to claim 8, characterized in that: Two connecting plates (6) are arranged side by side and are connected to two heat dissipation fin groups (1) by welding. The two connecting plates (6) and the heat dissipation plate (4) are located on both sides of the heat dissipation fin group (1).

10. A radiator module with an improved heat spreader structure according to claim 9, characterized in that: The heat spreader (4) and the heat conductor (5) are both stamped parts with uneven surfaces on both sides; the fins on the bottom surface of the heat dissipation fin group (1) are uneven to match the different contact surfaces on the heat spreader (4) and the heat conductor (5), and the contact areas between the fins and the heat spreader (4) and the heat conductor (5) are all provided with heat-conducting surfaces. The fins on the top surface of the heat dissipation fin group (1) are flat and are fixed to the connecting plate (6) by welding.

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