Vapor chamber

Abstract

The utility model discloses a vapor chamber which comprises a bottom plate, a plurality of supporting columns, a middle plate and a cover plate, the bottom plate is provided with a containing cavity, the supporting columns are connected with the bottom wall of the containing cavity and distributed at intervals, the middle plate is arranged in the containing cavity and provided with a plurality of through holes, the supporting columns penetrate through the through holes respectively, and the cover plate is arranged in the containing cavity. The cover plate is arranged on the side, provided with the middle plate, of the bottom plate, the cover plate is connected with the peripheral side of the bottom plate and all the supporting columns, so that a temperature equalizing cavity is formed between the middle plate and the cover plate, and the temperature equalizing cavity is used for containing working fluid. The vapor chamber is provided with the multiple supporting columns, so that the bottom plate and the cover plate can be connected through the multiple supporting columns, the strength of the vapor chamber can be improved, the vapor chamber can be manufactured through an existing vapor chamber manufacturing machine, equipment does not need to be additionally found, the problem that the cost of a jig is high can be solved, and the production cost is reduced.

Description

Technical Field

[0001] This application relates to the field of heat sink technology, specifically to a heat exchanger. Background Technology

[0002] With technological advancements, increasingly higher demands are being placed on the functionality and integration of electronic devices. Simultaneously, the integration of numerous components within electronic devices generates significant heat during operation, necessitating robust heat dissipation capabilities. Therefore, vapor chambers are widely used for cooling heat-generating components in electronic devices.

[0003] A vapor chamber (VC) is a two-phase passive heat sink that relies on capillary force to drive the evaporation of a medium. The heat from the heat-generating components is continuously cooled within the vapor chamber through alternating cycles of vaporization and liquefaction.

[0004] However, existing heat spreaders may have the following problems: poor strength and high cost. Utility Model Content

[0005] In order to overcome the problems existing in the above-mentioned related technologies, the main purpose of this application is to provide a heat exchange plate with high strength and low cost.

[0006] To achieve the above objectives, this application specifically adopts the following technical solution:

[0007] This application provides a temperature distribution plate, the temperature distribution plate comprising:

[0008] The base plate has a receiving cavity;

[0009] Multiple support columns are provided, each of which is connected to the bottom wall of the receiving cavity, and the multiple support columns are spaced apart.

[0010] A middle plate is disposed within the receiving cavity, and the middle plate has multiple through holes, through which multiple support columns pass respectively;

[0011] A cover plate is disposed on the side of the base plate where the middle plate is located, and the cover plate is connected to the periphery of the base plate and each of the support columns, so that a temperature equalization cavity is formed between the middle plate and the cover plate, and the temperature equalization cavity is used to contain the working fluid.

[0012] In some embodiments, the middle plate and the support column are respectively provided with capillary structures for capillary liquid absorption.

[0013] In some embodiments, the middle plate is provided with a first heat dissipation area and a second heat dissipation area, and there are multiple second heat dissipation areas, which are respectively located on both sides of the first heat dissipation area, and the thickness of the first heat dissipation area is greater than the thickness of the second heat dissipation area.

[0014] In some embodiments, the plurality of support columns include a plurality of first support columns and a plurality of second support columns. The plurality of first support columns are distributed at equal intervals in the first heat dissipation area, and the plurality of second support columns are distributed at equal intervals in the second heat dissipation area. The distance between two adjacent first support columns is less than the distance between two adjacent second support columns.

[0015] In some embodiments, the diameter of the first support column is smaller than the diameter of the second support column.

[0016] In some embodiments, a plurality of first support columns are arranged along the length of the middle plate to form multiple rows of first support columns, and a first air duct is formed between two adjacent rows of first support columns;

[0017] Multiple second support columns are arranged along the length of the middle plate to form multiple rows of second support columns. A second air duct is formed between two adjacent rows of second support columns. At least one of the airflows from the first air duct is diverted to two second air ducts.

[0018] In some embodiments, the spacing between two adjacent first support columns is 2mm to 6mm, and the spacing between two adjacent second support columns is 5mm to 10mm.

[0019] In some embodiments, the diameter of the first support column is 1mm to 2mm, and the diameter of the second support column is 2mm to 4mm.

[0020] In some embodiments, the plurality of support columns further include a plurality of third support columns, which are distributed in the second heat dissipation area and located on both sides of the second heat dissipation area.

[0021] In some embodiments, the support column and the base plate are integrally formed.

[0022] In some embodiments, the temperature equalization plate further includes a liquid injection pipe disposed on the base plate and communicating with the temperature equalization cavity.

[0023] The heat spreader of this application includes a base plate, multiple support columns, a middle plate, and a cover plate. The base plate has a receiving cavity, and the multiple support columns are connected to the bottom wall of the receiving cavity at intervals. The middle plate is disposed within the receiving cavity and has multiple through holes through which the multiple support columns pass. The cover plate is disposed on the side of the base plate where the middle plate is located, and is connected to the periphery of the base plate and each support column, forming a heat spreader between the middle plate and the cover plate. The heat spreader is used to contain the working fluid. Compared with the prior art, the heat spreader of this application, by having multiple support columns, can connect the base plate and the cover plate, thereby improving the strength of the heat spreader. Furthermore, the heat spreader of this application can be manufactured using existing heat spreader manufacturing machines, eliminating the need for additional equipment, thus solving the problem of expensive fixtures and reducing production costs. Attached Figure Description

[0024] Figure 1 This is a perspective view of the heat spreader provided in an embodiment of this application.

[0025] Figure 2 An exploded perspective view of the heat spreader provided in the embodiments of this application.

[0026] Figure 3 A cross-sectional view of the heat spreader provided in an embodiment of this application.

[0027] Figure 4 This is a top view of a portion of the structure of a heat spreader provided in an embodiment of this application.

[0028] Figure 5 for Figure 1 Dimensional chart of the temperature equalization plate.

[0029] Figure 6 A partial top view of the heat spreader provided in another embodiment of this application.

[0030] Attached image labels:

[0031] 1. Base plate; 11. Receiving cavity; 12. Mounting hole; 2. Support column; 21. First support column; 22. Second support column; 23. Third support column; 3. Middle plate; 30. Through hole; 31. First heat dissipation area; 32. Second heat dissipation area; 33. First air duct; 34. Second air duct; 4. Cover plate; 5. Liquid injection pipe; 100. Temperature equalization cavity. Detailed Implementation

[0032] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0033] In the description of this application, unless otherwise expressly specified and limited, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance; unless otherwise specified or explained, the term "multiple" refers to two or more; the terms "connected," "fixed," etc., should be interpreted broadly. For example, "connected" can be a fixed connection, a detachable connection, an integral connection, or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0034] In the description of this specification, it should be understood that the directional terms such as "upper" and "lower" used in the embodiments of this application are used to describe the angles shown in the accompanying drawings and should not be construed as limiting the embodiments of this application. Furthermore, in the context, it should also be understood that when it is mentioned that an element is connected "upper" or "lower" to another element, it can be directly connected to the other element "upper" or "lower," or indirectly connected to the other element "upper" or "lower" through an intermediate element.

[0035] A vapor chamber (VC) is a heat pipe technology that utilizes a vacuum cavity and capillary structures to achieve heat conduction and cooling, suitable for high-performance electronic devices and liquid cooling systems. Capillary structures refer to the minute structures or phenomena at the microscopic scale of an object.

[0036] The thickness of the top and bottom plates of a conventional vapor chamber is 0.6mm, 0.8mm, or 1mm. To increase the strength of the vapor chamber, the thickness of the top and bottom plates can be increased to more than 1.2mm. However, increasing the plate thickness will increase the material cost accordingly, and the increased plate thickness will also affect heat transfer. Alternatively, the material of the top and bottom plates can be changed. As shown in Table 1, the tensile strength of stainless steel is much higher than that of copper. Since conventional vapor chambers are made of copper, if stainless steel is composited with copper, the strength of copper can be improved, thus improving the overall strength of the product. However, this method of composite stainless steel with vapor chambers will result in a lower thermal conductivity, and the process is more complex and the performance is also worse.

[0037]

[0038] Table 1. Parameter Comparison Table for Different Materials

[0039] Conventional vapor chambers typically use low-temperature solder paste when soldering heat dissipation components such as fins. In this case, the vapor chamber only needs to meet the soldering temperature requirements (the melting point of conventional low-temperature solder paste is 138℃, and the reflow peak temperature is 170℃~200℃). However, high-temperature solder paste has better solderability and is more robust. When customers require high-temperature solder paste for soldering vapor chambers, the vapor chamber must meet the soldering temperature requirements of high-temperature solder paste (the melting point of high-temperature solder paste is usually above 240℃, and the reflow peak temperature is 270℃~360℃). In this case, if the conventional vapor chamber structure is still used, it may not meet the structural strength and thermal performance requirements. Therefore, this application proposes a special vapor chamber with a support column structure, which can meet both the product's structural strength requirements and its thermal performance requirements.

[0040] Reference Figures 1 to 3 As shown in the figure, an embodiment of this application discloses a heat spreader, which includes a base plate 1, multiple support columns 2, a middle plate 3, and a cover plate 4. One side of the base plate 1 is recessed to form a receiving cavity 11. The multiple support columns 2 are respectively connected to the bottom wall of the receiving cavity 11, and the multiple support columns 2 are spaced apart. The middle plate 3 is disposed within the receiving cavity 11, and the middle plate 3 has multiple through holes 30, through which the multiple support columns 2 pass. The cover plate 4 is disposed on the side of the base plate 1 where the middle plate 3 is located, and the cover plate 4 is respectively connected to the periphery of the base plate 1 and each support column 2, forming a heat spreader 100 between the middle plate 3 and the cover plate 4. The heat spreader 100 is used to contain a working fluid. The middle plate 3 and the support columns 2 are respectively provided with capillary structures for capillary liquid absorption, and the sidewalls of the heat spreader 100 may also have capillary structures. The working fluid can be pure water, etc.

[0041] In this embodiment, each support column 2 and the base plate 1 can be integrally formed, and the cover plate 4 can be connected to the base plate 1 and each support column 2 by welding. The base plate 1, support column 2, middle plate 3 and cover plate 4 can all be made of copper.

[0042] It should be noted that there are various ways to arrange the support columns 2. For example, the support columns 2 can be arranged on the base plate 1 according to certain rules. Specifically, the support columns 2 can be arranged in multiple rows and columns on the base plate, with the distance between two adjacent rows of support columns 2 being equal and the distance between two adjacent columns of support columns 2 being equal; or the distance between two adjacent rows of support columns 2 being unequal and the distance between two adjacent columns of support columns 2 being equal; or the distance between two adjacent rows of support columns 2 being equal and the distance between two adjacent columns of support columns 2 being unequal; or the distance between two adjacent rows of support columns 2 being unequal and the distance between two adjacent columns of support columns 2 being unequal; or the support columns 2 can also be arranged in a certain shape; of course, the support columns 2 can also be arranged in an irregular way on the base plate 1, for example, not arranged in rows or columns or arranged in a certain shape, but arranged randomly. When dissipating heat from heating components, a heat spreader can be attached to the heating element, so that the base plate 1 is in contact with the heating component. This allows the working fluid in the heat spreader 100 to exchange heat with the heating component. After absorbing heat, the working fluid becomes a gaseous fluid. When the gaseous fluid encounters the cover plate 4 during its flow, it exchanges heat with the cover plate 4 and releases heat, becoming a liquid fluid. The liquid fluid can flow back to the middle plate 3 through the support column 2 or the capillary structure on the side wall of the heat spreader 100, or it can drip back to the middle plate 3 under the action of gravity, and then absorb heat and evaporate. This cycle is repeated to achieve cooling of the heating component.

[0043] This application forms a heat spreader plate that can be used to cool heat-generating components by providing a receiving cavity 11 on a base plate 1 and providing multiple support columns 2 in the receiving cavity 11, and then connecting a cover plate 4 to the periphery of the base plate 1 and the multiple support columns 2. The heat spreader plate has high structural strength, low cost, and significantly improved high temperature resistance. At the same time, since each support column 2 is integrally formed with the base plate 1, the structural strength and high temperature resistance of the heat spreader plate are further improved.

[0044] Reference Figure 4 As shown, the middle plate 3 is provided with a first heat dissipation area 31 and multiple second heat dissipation areas 32. In this embodiment, there are two second heat dissipation areas 32, which are located on both sides of the first heat dissipation area 31, and the thickness of the first heat dissipation area 31 is greater than the thickness of the second heat dissipation area 32. By setting the thickness of the first heat dissipation area 31 to be greater than the thickness of the second heat dissipation area 32, the working fluid stored in a unit volume of the first heat dissipation area 31 is greater than the working fluid stored in a unit volume of the second heat dissipation area 32, thereby enhancing the fluid replenishment capacity of the first heat dissipation area 31 and reducing its temperature. Because the first heat dissipation area 31 usually receives more heat than the second heat dissipation area 32, it is necessary to enhance the heat dissipation capacity of the first heat dissipation area 31.

[0045] Continue to refer to Figure 4As shown, the multiple support columns 2 include multiple first support columns 21 and multiple second support columns 22. The multiple first support columns 21 are evenly distributed in the first heat dissipation area 31, and the multiple second support columns 22 are evenly distributed in the second heat dissipation area 32. The diameter of the first support column 21 is smaller than the diameter of the second support column 22, and the distance between two adjacent first support columns 21 is smaller than the distance between two adjacent second support columns 22. In this embodiment, by making the diameter of the support columns in the first heat dissipation area 31 smaller than the diameter of the support columns in the second heat dissipation area 32, the heat dissipation area of ​​the first heat dissipation area 31 can be increased. At the same time, the distribution density of the first support columns 21 in the first heat dissipation area 31 is greater than the distribution density of the second support columns 22 in the second heat dissipation area 32 to avoid bulging. In addition, the high-density, small-spacing distribution of small-diameter support columns in the first heat dissipation area 31 can enhance the high-temperature resistance of the first heat dissipation area 31 and ensure unimpeded heat transfer. The large-spacing distribution of large-diameter support columns in the second heat dissipation area 32 can ensure high-temperature resistance by using an appropriate spacing for the support columns. Because the gaps between the first support columns are small, the number of first support columns can be increased, thereby increasing the support welding area and increasing the strength.

[0046] When cooling the components of electronic devices, a heat spreader can be attached to the heat-generating components, so that the heat generated by the components is transferred through the base plate 1 to the first heat dissipation area 31 and the second heat dissipation area 32. The liquid stored in the capillary structure inside the first heat dissipation area 31 and the second heat dissipation area 32 vaporizes and evaporates, taking away the heat. When the evaporated gas rises and touches the top cover, it condenses into liquid and flows back to the capillary structure in the middle plate 3. This cycle achieves the function of evaporation and condensation heating.

[0047] Continue to refer to Figure 4 As shown, multiple first support columns 21 are arranged along the length of the middle plate 3 to form multiple rows of first support columns 21, and a first air duct 33 is formed between two adjacent rows of first support columns 21. Figure 3 (The solid arrow in the middle indicates the location). Multiple second support columns 22 are arranged along the length of the middle plate 3, forming multiple rows of second support columns 22, and a second air duct 34 is formed between two adjacent rows of second support columns 22. Figure 3 (as indicated by the dotted arrow in the diagram), and the airflow from at least one of the first air ducts 33 is diverted to two second air ducts 34. This embodiment can achieve both high-temperature resistance and thermal performance requirements by adjusting the outer diameter of each support column 2, the spacing between each support column 2, and the arrangement of diverting the airflow from one first air duct 33 to two second air ducts 34. The heat exchanger is simple to manufacture, low in cost, suitable for mass production, and can effectively improve the high-temperature resistance structure of the heat exchanger.

[0048] In some embodiments, the diameter C of the first support column 21 is 1mm~2mm, the diameter A of the second support column 22 is 2mm~4mm, the distance D between two adjacent first support columns 21 is 2mm~6mm, the distance B between two adjacent second support columns 22 is 5mm~10mm, and the edge distance E between the first support column 21 and the second support column 22 is 2mm~3mm. Figure 5 As shown. In other embodiments, the plurality of support pillars 2 further include a plurality of third support pillars 23, which are distributed on both sides of the second heat dissipation area 32, and the diameter F of the third support pillars 23 is 1mm to 3mm. (Refer to...) Figure 6 As shown. In this embodiment, the strength of the heat exchange plate can be further increased by providing a third support column 23 in the second heat dissipation zone 32.

[0049] To facilitate liquid injection, the base plate 1 is also provided with mounting holes 12. The temperature equalization plate also includes a liquid injection pipe 5, which is installed on the mounting holes 12 and is connected to the temperature equalization chamber 100, so that working fluid can be easily injected into the temperature equalization chamber 100 through the liquid injection pipe 5.

[0050] The method for manufacturing the heat spreader in this application is simple and reliable, and the required processes are mature. It can be manufactured using existing VC machines without the need for additional equipment, which can solve the problem of expensive fixtures and greatly save fixture costs. At the same time, the process is greatly simplified, saving a lot of manpower and resources for assembling, disassembling and welding fixtures, making it suitable for mass production processes.

[0051] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and not to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features. These modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A heat spreader, characterized in that, include: The base plate has a receiving cavity; Multiple support columns are provided, each of which is connected to the bottom wall of the receiving cavity, and the multiple support columns are spaced apart. A middle plate is disposed within the receiving cavity, and the middle plate has multiple through holes, through which multiple support columns pass respectively; A cover plate is disposed on the side of the base plate where the middle plate is located, and the cover plate is connected to the periphery of the base plate and each of the support columns, so that a temperature equalization cavity is formed between the middle plate and the cover plate, and the temperature equalization cavity is used to contain the working fluid.

2. The temperature distribution plate according to claim 1, characterized in that, Both the middle plate and the support column are equipped with capillary structures for capillary liquid absorption.

3. The temperature distribution plate according to claim 2, characterized in that, The middle plate is provided with a first heat dissipation area and a second heat dissipation area. There are multiple second heat dissipation areas, which are located on both sides of the first heat dissipation area, and the thickness of the first heat dissipation area is greater than the thickness of the second heat dissipation area.

4. The temperature distribution plate according to claim 3, characterized in that, The plurality of support columns include a plurality of first support columns and a plurality of second support columns. The plurality of first support columns are distributed at equal intervals in the first heat dissipation area, and the plurality of second support columns are distributed at equal intervals in the second heat dissipation area. The distance between two adjacent first support columns is less than the distance between two adjacent second support columns.

5. The temperature distribution plate according to claim 4, characterized in that, The diameter of the first support column is smaller than the diameter of the second support column.

6. The temperature distribution plate according to claim 4, characterized in that, Multiple first support columns are arranged along the length of the middle plate to form multiple rows of first support columns, and a first air duct is formed between two adjacent rows of first support columns; Multiple second support columns are arranged along the length of the middle plate to form multiple rows of second support columns. A second air duct is formed between two adjacent rows of second support columns. At least one of the airflows from the first air duct is diverted to two second air ducts.

7. The temperature distribution plate according to claim 4, characterized in that, The spacing between two adjacent first support columns is 2mm to 6mm, and the spacing between two adjacent second support columns is 5mm to 10mm; The diameter of the first support column is 1mm to 2mm, and the diameter of the second support column is 2mm to 4mm.

8. The temperature distribution plate according to claim 4, characterized in that, The plurality of support columns also include a plurality of third support columns, which are distributed in the second heat dissipation area and located on both sides of the second heat dissipation area.

9. The temperature distribution plate according to any one of claims 1 to 8, characterized in that, The support column and the base plate are integrally formed.

10. The temperature distribution plate according to any one of claims 1 to 8, characterized in that, The temperature equalization plate also includes a liquid injection pipe, which is disposed on the base plate and communicates with the temperature equalization cavity.

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