Heat dissipation device for heat dissipation of electronic equipment
By employing a hollow tube structure and heat-conducting plate design in electronic devices, the problem of low efficiency in traditional heat dissipation methods is solved, achieving close heat conduction and efficient heat dissipation. This makes the device suitable for heat dissipation needs in different scenarios and extends its service life.
Patent Information
- Application Number
- CN202520222694.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-12
- Publication Date
- 2025-12-09
- Estimated Expiration
- 2035-02-12
AI Technical Summary
Traditional heat dissipation methods are difficult to meet the high-efficiency heat dissipation requirements of modern electronic devices. In particular, air cooling is inefficient, the heat transfer efficiency of heat sinks is limited, and they are not tightly integrated with the device, resulting in high thermal resistance and affecting the heat dissipation effect.
The mounting strip features a hollow tube structure with an internal air duct and a uniform heat dissipation plate. It is combined with a heat conduction plate and a heat dissipation plate and fixed with bolts. Made of copper with good thermal conductivity, it supports water cooling or air cooling to ensure tight heat conduction and efficient heat dissipation.
It achieves close heat conduction between electronic equipment and heat dissipation device, improves heat dissipation efficiency, has strong applicability, and extends device reliability and service life.
Smart Images
Figure CN223652590U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of heat dissipation technology for electronic devices, and more specifically, to a heat dissipation device for heat dissipation of electronic devices. Background Technology
[0002] In today's era of rapid advancements in electronic technology, the performance and integration of electronic devices are constantly improving, leading to a significant increase in the heat generated during operation. Excessive temperatures can severely impact the performance, stability, and lifespan of electronic devices. Traditional heat dissipation methods, such as simple air cooling or basic heat sinks, often fall short of the efficient heat dissipation requirements of modern electronic devices. Air cooling is limited by the heat transfer efficiency of air, proving ineffective in handling high-heat situations; while ordinary heat sinks have limited heat dissipation area and thermal conductivity. Furthermore, some heat dissipation devices are not tightly integrated with electronic devices, resulting in significant thermal resistance during heat transfer and affecting heat dissipation performance. Utility Model Content
[0003] Based on the above-mentioned technical problems, this utility model proposes a heat dissipation device for electronic devices.
[0004] A heat dissipation device for electronic devices includes a mounting strip, which is a hollow tube with one end connected to the heat dissipation device. An internal air duct is provided, and uniformly spaced heat dissipation plates are arranged within the air duct, running longitudinally along the air duct. This significantly increases the heat exchange area within the air duct and improves heat dissipation efficiency. A heat-conducting plate is provided on the outer side of the mounting strip, passing through perforations in the mounting strip and connecting to the heat dissipation plates. This allows the heat generated by the electronic device to be rapidly transferred to the heat dissipation plates within the air duct. The electronic device is mounted on the outer side of the mounting strip, while the heat-conducting plate is located inside the electronic device, ensuring tight heat conduction.
[0005] As a further improvement, the mounting strip has evenly spaced screw holes on both the top and bottom sides, and the electronic device has an integrated end plate at both the top and bottom ends. The end plate has threaded holes that correspond one-to-one with the screw holes, so that the electronic device can be firmly and conveniently fixed on the mounting strip using bolts.
[0006] As a further improvement, the heat-conducting plate is made of copper, which has good thermal conductivity, and can quickly transfer the heat inside the electronic device to the heat sink.
[0007] As a further improvement, the width of the heat sink is smaller than the width of the air duct, and the heat conduction plate is in contact with one end of the heat sink, ensuring efficient heat transfer.
[0008] As a further improvement, the heat dissipation device can be a water-cooled circulation device, with the other end of the air duct connected to the return water port of the heat dissipation device, achieving efficient heat dissipation through water cooling circulation; or it can be an air-cooled device, with the other end of the air duct being a heat dissipation port, using airflow to remove heat.
[0009] Beneficial effects: First, the device achieves close heat conduction between electronic equipment and heat dissipation device through its unique structural design, effectively reducing equipment temperature and ensuring stable performance; second, the selectable water cooling or air cooling method increases the applicability of the device and can meet the heat dissipation needs of different scenarios; third, the robust installation method and high-quality thermally conductive materials improve the reliability and service life of the device. Attached Figure Description
[0010] Figure 1 A schematic diagram of the structure of this utility model is shown;
[0011] Figure 2 A schematic diagram of the structure of the electronic device of this utility model is shown. Detailed Implementation
[0012] To better understand the above-mentioned objectives, features, and advantages of this utility model, the present utility model will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.
[0013] like Figures 1-2 The diagram shows a heat dissipation device for an electronic device 6. The device includes a mounting strip 1, which serves as a core support and heat dissipation channel. It is a hollow tube structure formed by extrusion of aluminum alloy, with a through-flow air duct 2 inside. The upper and lower sides of the strip are provided with equally spaced screw holes 5, and matching bolts 8 are used to securely connect the electronic device 6. One end of the strip is connected to the heat dissipation device, and a through-flow air duct 2 is provided inside the air duct 2. The air duct 2 is provided with evenly spaced heat dissipation plates 3. The heat dissipation plates 3 are arranged longitudinally along the air duct 2, which can significantly increase the heat exchange area inside the air duct 2 and improve the heat dissipation efficiency.
[0014] The mounting strip 1 has evenly spaced screw holes 5 on both the top and bottom sides. The electronic device 6 has an integrated end plate 7 at both the top and bottom ends. The end plate 7 has threaded holes that correspond one-to-one with the screw holes 5. The electronic device 6 is securely and conveniently fixed on the mounting strip 1 using bolts 8.
[0015] A heat-conducting plate 4 is provided on the outside of the mounting strip 1. The heat-conducting plate 4 passes through the perforation 9 on the mounting strip 1 and the opening 10 on the housing of the electronic device 6 and is connected to the heat sink 3, so that the heat generated by the electronic device 6 can be quickly transferred to the heat sink 3 in the air duct 2. The electronic device 6 is mounted on the outside of the mounting strip 1 and the heat-conducting plate 4 is located inside the electronic device 6, ensuring tight heat conduction.
[0016] In addition, the heat sink 3 is 2mm thick and has corrugated protrusions on its surface to further increase the heat exchange area.
[0017] The heat-conducting plate 4 is made of copper with good thermal conductivity. One end passes through the hole of the mounting strip 1 and is welded to the heat sink 3. The other end extends to the surface of the heat source of the chip inside the electronic device 6, which can quickly transfer the heat inside the electronic device 6 to the heat sink 3.
[0018] The width of the heat sink 3 is smaller than the width of the air duct 2, and the heat conduction plate 4 is in contact with one end of the heat sink 3, ensuring efficient heat transfer.
[0019] The heat dissipation device can be a water-cooled circulation device, with the other end of the air duct 2 connected to the return water port of the heat dissipation device, achieving efficient heat dissipation through water cooling circulation; or it can be an air-cooled device, with the other end of the air duct 2 being a heat dissipation port, using airflow to remove heat.
[0020] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.
Claims
1. A heat dissipation device for heat dissipation in electronic devices, characterized in that, include: The mounting strip is a hollow tube, with one end connected to a heat dissipation device. It has a through-flow duct inside, and evenly spaced heat dissipation plates are arranged within the duct, running longitudinally along the duct. A heat-conducting plate is located on the outer side of the mounting strip, passing through perforations in the mounting strip and connecting to the heat dissipation plates. Electronic devices are mounted on the outer side of the mounting strip, with the heat-conducting plate located inside the electronic devices.
2. The heat dissipation device for electronic equipment according to claim 1, characterized in that, The mounting strip has evenly spaced screw holes on both the top and bottom sides. The electronic device has an integrated end plate at both the top and bottom ends. The end plate has threaded holes that correspond one-to-one with the screw holes. The electronic device is fixedly mounted on the mounting strip using bolts.
3. The heat dissipation device for electronic devices according to claim 1, characterized in that, The heat-conducting plate is made of copper.
4. The heat dissipation device for electronic equipment according to claim 1, characterized in that, The width of the heat sink is smaller than the width of the air duct, and the heat-conducting plate is in contact with one end of the heat sink.
5. The heat dissipation device for electronic equipment according to claim 1, characterized in that, The heat dissipation device is a water-cooled circulation device, and the other end of the air duct is connected to the return water port of the heat dissipation device.
6. The heat dissipation device for electronic equipment according to claim 1, characterized in that, The heat dissipation device is an air-cooled device, and the other end of the air duct is a heat dissipation port.