Glue injection device for semiconductor rubber processing

Abstract

The utility model discloses a glue injection device for semiconductor rubber processing, which relates to the technical field of semiconductor rubber processing and comprises a turntable component, a glue injection component and an auxiliary component, the glue injection component is parallel to the turntable component, the auxiliary component is perpendicular to the glue injection component, and the turntable component and the glue injection component are rotatably connected with a motor shaft. Semiconductor rubber is conveyed to a corresponding position through the rotary disc assembly, then a certain amount of rubber is injected through the rubber injection device, meanwhile, material taking is completed relative to the rubber injection head, and under clamping of the auxiliary assembly, advancing path keeping of the rubber injection assembly and direction changing of the rubber injection head are completed. When the glue injection assembly descends in place, the second protruding column is matched with the scroll plate, and then the piston is matched with the scroll plate to achieve glue taking and placing of the glue injection head, intermittent advancing of the target piece is achieved through the arrangement of the rotating disc assembly and the cooperation of the intermittent gear and the protruding column plate, synchronization of the target piece and the glue injection head is guaranteed, and assembly line work of glue injection is achieved so as to improve the working efficiency.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor rubber processing, especially relates to a glue injection device for semiconductor rubber processing. BACKGROUND

[0002] Semiconductor rubber is a special rubber material that combines the properties of semiconductors and rubber, with unique electrical properties and physical properties. Glue injection devices are automated machines used to drip, coat, or encapsulate liquids on the surface or inside of products, capable of achieving irregular patterns such as points, lines, arcs, and circles.

[0003] The patent document with publication number CN114055707A relates to the technical field of semiconductor processing equipment, specifically an insulating glue pouring device for semiconductor silicon wafer processing. It includes a base frame with a worktable at the top, a drive mechanism between the base frame and the worktable that can drive the worktable to a workpiece processing position, a glue spraying mechanism on one side of the worktable that can spray insulating glue onto the workpiece on the worktable, and an adjustment mechanism at the top of the worktable that can drive the glue spraying mechanism to spray glue on workpieces of different diameters. A second motor drives the driving gear to rotate, the clamping plate moves the workpiece, and the injector also moves towards the workpiece. At this time, the positions of the injector and the clamping plate adapt to the diameter of the current workpiece, completing the pouring of insulating glue and automatically centering and adapting to semiconductor silicon wafers of different diameters.

[0004] The existing glue injection device needs to arrange and place the semiconductor rubber for glue injection one by one, and then take out the semiconductor rubber after glue injection. When performing large-scale operations, the overall efficiency is low and the workload of the workers is increased. UTILITY MODEL CONTENTS

[0005] The utility model discloses a glue injection device for semiconductor rubber processing, which aims to solve the technical problem of the existing glue injection device, which needs to arrange and place the semiconductor rubber for glue injection one by one, and then take out the semiconductor rubber after glue injection. When performing large-scale operations, the overall efficiency is low and the workload of the workers is increased.

[0006] To achieve the above purpose, the utility model adopts the following technical scheme:

[0007] A glue injection device for semiconductor rubber processing includes a turntable assembly, a glue injection assembly, and an auxiliary assembly. The glue injection assembly is parallel to the turntable assembly, and the auxiliary assembly is perpendicular to the glue injection assembly. The turntable assembly and the glue injection assembly are rotationally connected to the motor shaft.

[0008] The semiconductor rubber is conveyed to a corresponding position by the rotating disc assembly, and then a certain amount of injection is carried out by using the glue injection device, while the material is taken relative to the glue injection head, and the travel path of the glue injection assembly is kept and the direction of the glue injection head is changed under the holding of the auxiliary assembly.

[0009] In a preferred scheme, the rotating disc assembly comprises an intermittent gear, a convex column disc and a transmission rotating disc, the convex column disc is fixedly connected with the motor shaft, the convex column disc is rotationally connected with the intermittent gear, and the transmission rotating disc is provided with a first convex column.

[0010] Through cooperation of the intermittent gear and the cam disc, when the convex column disc rotates to drive the intermittent gear, the first convex column is slidably connected with the sliding groove (a notch is arranged on the upper half of the sliding groove to prevent the motor shaft from rotating when it reverses), so that the semiconductor rubber is stably conveyed, and the rotating disc and the glue injection assembly are positionally synchronized.

[0011] In a preferred scheme, the glue injection assembly comprises a support arm, a glue injection head and a guide pipe, the support arm is provided with through holes at two ends, the glue injection head is installed in the through holes, the guide pipe is connected with the tail of the glue injection head, the glue injection assembly further comprises a piston, the piston is provided with a second convex column, a notch through hole is arranged on one side of the guide pipe, the second convex column slides in the inside of the notch hole, the glue injection assembly further comprises a vortex disc, the vortex disc is fixedly connected with one end of the motor shaft, and the second convex column is slidably connected with the vortex disc.

[0012] Through the setting of the glue injection assembly, the glue injection head is taken and placed by the piston and the guide pipe, and the notch hole is arranged on one side of the guide pipe to ensure that the piston and the vortex disc are stably matched.

[0013] In a preferred scheme, the auxiliary assembly comprises a bottom box, a first spring, a second spring and a stop rod, the bottom box is arranged at one end of the motor shaft, the intermittent gear and the convex column disc are rotationally connected on the upper side of the bottom box, the first spring is arranged between the convex column disc and the support arm, the second spring is fixed on one side of the gear, the support arm is provided with a guide and a threaded hole, the stop rod is slidably connected with the guide notch, a threaded block is arranged on the outside of the motor shaft, and the threaded hole is rotationally connected with the threaded block arranged on the outside of the motor shaft.

[0014] Through the setting of the auxiliary assembly, the glue injection assembly is up and down traveled by the threaded cooperation of the support arm and the motor shaft, and the rotation and resetting of the glue injection assembly are ensured by the cooperation of the stop rod and the guide notch.

[0015] The glue injection device for semiconductor rubber processing has the following beneficial effects.

[0016] Firstly, when the glue injection assembly is lowered to a position, the second convex column and the vortex disc are matched, and then the piston and the vortex disc are matched to realize taking and placing of the glue injection head;

[0017] Second, by setting the rotating disc assembly, the intermittent gear and the convex column disc are matched to realize the intermittent movement of the target piece, so that the target piece is synchronized with the glue injection head, and the glue injection realizes the assembly line operation. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 A whole view of the glue injection device for processing semiconductor rubber is provided.

[0019] Figure 2 An explosion schematic view of the glue injection device for processing semiconductor rubber is provided.

[0020] Figure 3 A position schematic view of the glue injection assembly and the rotating disc assembly of the glue injection device for processing semiconductor rubber is provided.

[0021] In the drawings: 1 rotating disc assembly; 2, glue injection assembly; 3, auxiliary assembly; 4, motor shaft; 101, intermittent gear; 101a, chute, 102, convex column disc; 103, transmission rotating disc; 103a, first convex column; 201, support arm; 202, glue injection head; 203, conduit; 203a, notch hole; 201a, through hole; 201b, guide notch; 201c, threaded hole; 204, piston; 204a, second convex column; 205, vortex disc; 301, bottom box; 302, first spring; 303, second spring; 304, stop rod; 401, threaded block. DETAILED DESCRIPTION

[0022] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all the embodiments.

[0023] In the description of the present application, it should be understood that the terms "up", "down", "front", "back", "left", "right", "top", "bottom", "in", "out" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, therefore it cannot be understood as a limitation of the present application.

[0024] The glue injection device for processing semiconductor rubber disclosed by the present application is mainly applied to the scene that the existing glue injection device needs to arrange and place the semiconductor rubber for glue injection in sequence when performing glue injection on the semiconductor rubber, and then takes out the semiconductor rubber in sequence after glue injection.

[0025] Reference Figure 1 , Figure 2 andFigure 3 The application discloses a glue injection device for semiconductor rubber processing, which comprises a rotating disc assembly 1, a glue injection assembly 2 and an auxiliary assembly 3, the glue injection assembly 2 is parallel to the rotating disc assembly 1, the auxiliary assembly 3 is perpendicular to the glue injection assembly 2, the rotating disc assembly 1 and the glue injection assembly 2 are rotationally connected with a motor shaft, the rotating disc assembly 1 comprises an intermittent gear 101, a convex column disc 102 and a transmission rotating disc 103, the convex column disc 102 is hinged to the motor shaft, the convex column disc 102 is rotationally connected with the intermittent gear 101, the transmission rotating disc 103 is provided with a first convex column 103a, the intermittent gear 101 is provided with a sliding groove 101a, and the first convex column 103a is slidingly connected with the sliding groove 101a.

[0026] In the scheme, when a staff member processes the semiconductor rubber, the servo motor drives the convex column disc 102 to rotate, the convex column disc 102 is connected with the intermittent gear 101, the intermittent gear 101 is intermittently rotated, and the conveying line is stepped.

[0027] In the scheme, when a staff member processes the semiconductor rubber, the servo motor drives the convex column disc 102 to rotate, the convex column disc 102 is connected with the intermittent gear 101, the intermittent gear 101 is intermittently rotated, and the conveying line is stepped. Figure 2 Figure 3 In a preferred embodiment, the glue injection assembly 2 comprises a support arm 201, a glue injection head 202 and a guide pipe 203, both ends of the support arm 201 are provided with through holes 201a, the glue injection head 202 is installed in the through holes 201a, the guide pipe 203 is clamped and connected with the tail of the glue injection head 202, the glue injection assembly 2 further comprises a piston 204, the piston 204 is installed in the guide pipe 203, the piston 204 is provided with a second convex column 204a, one side of the guide pipe 203 is provided with a notched hole 203a, the second convex column 204a slides in the inside of the notched hole 203a, the glue injection assembly 2 further comprises a vortex disc 205, the vortex disc 205 is fixedly connected with one end of the motor shaft 4, and the second convex column 204a is slidingly connected with the vortex disc 205.

[0028] In the scheme, the screw holes 201c arranged in the center of the support arm 201 are matched with the screw blocks 401 arranged on the outside of the motor shaft 4, so that the glue injection assembly 2 is moved up and down, when the glue injection assembly 2 moves to a predetermined position, the vortex disc 205 is slidingly matched with the second convex column 204a, glue injection and glue taking are realized, after the glue injection is completed, the servo motor is reversely rotated, and the device is reset.

[0029] In the scheme, when a staff member processes the semiconductor rubber, the servo motor drives the convex column disc 102 to rotate, the convex column disc 102 is connected with the intermittent gear 101, the intermittent gear 101 is intermittently rotated, and the conveying line is stepped. Figure 1 Figure 3 ​​In a preferred embodiment, the auxiliary assembly 3 comprises a bottom box 301, a first spring 302, a second spring 303 and a stop rod 304, the bottom box 301 is arranged at one end of the motor shaft, the intermittent gear 101 and the convex column disc 102 are rotationally connected to the upper side of the bottom box 301, the first spring 302 is arranged between the convex column disc 102 and the support arm 201, the second spring 303 is fixed to one side of the scroll disc 205, the support arm 201 is provided with a guide block 201b and a threaded hole 201c, the stop rod 304 is slidably connected with the guide slot 201b, and the outer side of the motor shaft 4 is provided with a threaded block 401, and the threaded hole 201c is rotationally connected with the threaded block 401 arranged on the outer side of the motor shaft 4.

[0030] By arranging the auxiliary assembly 3, the first spring 302 and the second spring 303 are used to limit the support arm, so that the stability of the device during operation is better ensured, the stop rod 304 is arranged and cooperated with the guide slot 201b, so that the upward and downward movement of the glue injection assembly 2 is better ensured, when the glue injection assembly 2 moves downward to the predetermined position, the cooperation of the stop rod 304 and the first spring 302 can keep the position of the glue injection assembly 2, and when reset, the glue injection assembly 2 can be better ensured to be connected in the threaded cooperation, and the arrangement of the second spring 303 can better ensure the turning of the glue injection assembly 2 and the connection of the threaded cooperation.

[0031] Specific implementation steps are as follows: first step, the target object for glue injection is placed in the slot of the transmission turntable 103, the servo motor is turned on, the intermittent gear 101 is engaged with the convex column disc 102, so as to drive the transmission turntable 103 to rotate, the target object is conveyed, and the glue injection head 202 falls to the designated position, the second convex column 204a is in contact with the scroll disc 205, so that the piston 204 is displaced to the left, and the glue injection and glue taking are realized.

[0032] Second step, after the glue injection is completed, the servo motor is reversed, the upper half of the sliding groove 101a provided with the intermittent gear 101 is provided with a notch, so that the motor shaft will not drive the transmission turntable 103 to rotate when reversed, the glue injection head is upwardly displaced and moves to the end of the threaded engagement, at the same time, the stop rod 303 is separated from the guide slot 201b, at this time, the glue injection assembly 2 is completed to rotate (180 degrees), and the motor is stopped.

[0033] Third step, the servo motor is turned on, the support arm 201 is connected in the thread under the action of the first spring 303, downward displacement is realized, and the first step is repeated to realize the cyclic operation.

[0034] The above is only a preferred specific embodiment of the present application, but the protection scope of the present application is not limited to this. The substitution can be the substitution of part of the structure, device, method step, or the complete technical scheme. According to the technical scheme and the inventive concept of the present application, equivalent substitution or change should be covered in the protection scope of the present application.

Claims

1. A kind of glue injection device for semiconductor rubber processing, including carousel assembly (1), glue injection assembly (2) and auxiliary assembly (3); characterized in that The glue injection assembly (2) is parallel with carousel assembly (1), the auxiliary assembly (3) is perpendicular to glue injection assembly (2), and the carousel assembly (1) and glue injection assembly (2) are rotatably connected with motor shaft (4).

2. The injection device for rubber processing according to claim 1, wherein The carousel assembly (1) includes intermittent gear (101), convex column disc (102) and transmission carousel (103), the convex column disc (102) is hinged to motor shaft, the convex column disc (102) is rotatably connected with intermittent gear (101), the transmission carousel (103) is provided with first convex column (103a), the intermittent gear (101) is provided with chute (101a), and the first convex column (103a) is slidably connected with the chute (101a).

3. The injection device for rubber processing according to claim 1, wherein The glue injection assembly (2) includes support arm (201), glue injection head (202) and catheter (203), both ends of the support arm (201) are provided with through hole (201a), the glue injection head (202) is installed in the through hole (201a), and the catheter (203) is clampedly connected with the tail of the glue injection head (202).

4. The injection device for rubber processing according to claim 1 or 3, wherein The glue injection assembly (2) further includes piston (204), the piston (204) is installed inside the catheter (203), the piston (204) is provided with second convex column (204a), one side of the catheter (203) is provided with notch hole (203a), and the second convex column (204a) slides in the inside of the notch hole (203a).

5. The injection device for rubber processing according to claim 4, wherein The glue injection assembly (2) further includes scroll disc (205), the scroll disc (205) is fixedly connected to one end of motor shaft (4), and the second convex column (204a) is slidably connected with the scroll disc (205).

6. The injection device for rubber processing according to claim 1, wherein The auxiliary assembly (3) includes bottom box (301), first spring (302), second spring (303) and stop lever (304), the bottom box (301) is arranged at one end of motor shaft (4), the intermittent gear (101) and the convex column disc (102) are rotatably connected on the upside of the bottom box (301), the first spring (302) is arranged between the convex column disc (102) and the support arm (201), and the second spring (303) is fixed to one side of the scroll disc (205).

7. The injection device for rubber processing according to claim 6, wherein The support arm (201) is provided with guide notch (201b) and threaded hole (201c), the stop lever (304) is slidably connected with the guide notch (201b), the outer side of the motor shaft (4) is provided with threaded block (401), and the threaded hole (201c) is rotatably connected with the threaded block (401) on the outer side of the motor shaft (4).

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