Semiconductor device pin positioning and bending mechanism

Abstract

The utility model provides a semiconductor device pin positioning bending mechanism, which relates to the semiconductor production field, and comprises a pedestal, the left end of the upper side of the pedestal is provided with a support, the right side wall of the support is provided with an infrared distance meter, the upper end surface of the pedestal is provided with a guide groove, the upper side of the pedestal is fixedly provided with a positioning baffle plate, and the positioning baffle plate is provided with a positioning groove. A bending plate and a pressing plate are arranged on the upper side of the positioning baffle, a placement seat is arranged on the right side of the positioning baffle, a moving seat is rotationally connected to the lower end of the placement seat, the lower end of the moving seat is slidably connected with the base through a guide block and a guide groove, a lead screw is in threaded connection with the interior of the moving seat, and meanwhile, a second motor is connected to the right end of the lead screw; the left end of the lead screw is rotationally connected with the right end face of the positioning baffle. The pin positioning and bending mechanism solves the problems that an existing pin positioning and bending mechanism for the semiconductor device is inconvenient to accurately adjust the bending length of the pins and is inconvenient to bend the pins of the semiconductor device with a plurality of pins.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing technology, specifically to a semiconductor device pin positioning and bending mechanism. Background Technology

[0002] Some semiconductor devices, such as MOS devices and thyristors, contain pins that are used for circuit connections. While semiconductor device pins are typically straight, some pins need to be bent to fit on circuit boards or other devices. A search revealed existing technology (publication number: CN221336400U), which describes "a semiconductor device pin positioning and bending mechanism, including a base, a semiconductor device platform on the top of the base, a semiconductor device on the top of the semiconductor device platform, pins evenly distributed on one side of the semiconductor device, a pin positioning block for placing the pins on the semiconductor device platform, a support plate fixedly connected to the top of the base, and a bending head and a fixing pressure plate below the support plate. In use, when the mounting block at the bottom of the pin positioning block is inserted into the mounting groove, the mounting block presses against the inclined surface and controls the slider to move into the groove, compressing the spring. When the limiting groove aligns with the groove, the spring pushes the slider directly into the limiting groove, thus directly fixing the pin positioning block without needing to rotate screws, which is more convenient."

[0003] While existing semiconductor device pin positioning and bending mechanisms achieve the effect of easy disassembly, they still have some shortcomings: existing semiconductor device pin positioning and bending mechanisms are not convenient for accurately adjusting the bending length of the pins, and the height of the bent pins determines the height position of semiconductor soldering. Different semiconductor devices have different soldering position requirements. Secondly, some semiconductor devices have pins in multiple directions around their perimeter, and existing bending mechanisms are not convenient for automatically reversing the bending operation of pins in different directions, resulting in limitations in their use. Utility Model Content

[0004] To overcome the shortcomings of existing technologies, a semiconductor device pin positioning and bending mechanism is provided to solve the problems that existing semiconductor device pin positioning and bending mechanisms are not convenient for accurately adjusting the pin bending length and are not convenient for bending the pins of semiconductor devices with multiple pins.

[0005] To achieve the above objectives, a semiconductor device pin positioning and bending mechanism is provided, comprising: a base, a bracket provided on the upper left side of the base, an infrared rangefinder mounted on the right side wall of the bracket, a guide groove provided on the upper surface of the base, a positioning baffle fixed on the upper side of the base, a bending plate and a pressing plate provided on the upper side of the positioning baffle, a placement seat provided on the right side of the positioning baffle, a movable seat rotatably connected to the lower end of the placement seat, and the lower end of the movable seat slidably connected to the base through a guide block and a guide groove, and a lead screw screwed inside the movable seat, with a second motor connected to the right end of the lead screw, and the left end of the lead screw rotatably connected to the right end face of the positioning baffle.

[0006] Furthermore, the bracket is configured as an inverted L-shaped structure, and a first cylinder and a second cylinder are installed at the upper end of the bracket. The piston rod of the first cylinder is connected to the upper end of the bending plate, while the piston rod of the second cylinder is connected to the upper end of the pressing plate.

[0007] Furthermore, an elastic telescopic cylinder is connected to the lower side of the clamping plate, and a pressure block is connected to the lower end of the elastic telescopic cylinder.

[0008] Furthermore, the upper end of the positioning baffle is provided with a groove, and the two sides of the groove are provided with sliding grooves, and a stop block is slidably connected between the sliding grooves. At the same time, an electric push rod is connected to the lower end of the stop block.

[0009] Furthermore, a first motor is installed inside the movable base, and the output shaft at the upper end of the first motor is connected to the lower center of the placement base.

[0010] Furthermore, the upper side of the placement base is provided with a placement groove, and the semiconductor device is placed inside the placement groove, and the bottom of the placement groove is provided with a suction hole.

[0011] Furthermore, the placement base has an air passage that communicates with the suction hole, and the lower end of the air passage is connected to an air pipe, and the other end of the air pipe is connected to a miniature vacuum pump, which is installed inside the placement base.

[0012] The beneficial effects of this utility model are as follows:

[0013] 1. In use, place the semiconductor device into the placement slot of the placement base, and then start the micro vacuum pump to adsorb and fix the semiconductor device through the suction hole. At this time, the pins of the semiconductor device are located on the upper side of the positioning baffle. Then, start the second cylinder to drive the clamping plate downward to clamp the pins placed in the groove. At this time, according to the preset parameters, the second motor, lead screw and guide block drive the moving seat to move to one side of the bracket. At the same time, the infrared rangefinder is used to detect the distance of the semiconductor device pins beyond the positioning baffle. The second motor is stopped when the preset parameters are reached. This allows for accurate adjustment of the bending length of the pins of different semiconductor devices. Then, start the first cylinder to drive the bending plate downward to perform the bending operation of the pins.

[0014] 2. When bending multiple pins, after bending one side of the semiconductor device, the clamping plate is released, and the placement seat is moved upward a certain distance by the electro-hydraulic push rod installed on the outside of the first motor inside the moving seat, so that the bent pin passes the lower edge of the groove. Then, the second motor is started in reverse to move the moving seat to the right until the pin is located outside the positioning baffle. At this time, the first motor is started to drive the placement seat to rotate, so that the pin on the other side of the semiconductor device can be rotated to the position of the positioning baffle. Then, the second motor and the electro-hydraulic push rod are started again to make the pin position the same as the pin position before the last bending. Then, the bending plate is used again for bending, which facilitates the bending of pins on semiconductor devices with multiple pins. Attached Figure Description

[0015] Figure 1 This is a front view structural diagram of an embodiment of the present utility model.

[0016] Figure 2 This is a partial cross-sectional structural diagram of an embodiment of the present utility model.

[0017] Figure 3 This is a schematic cross-sectional view of the placement seat according to an embodiment of the present invention.

[0018] Figure 4 This is a three-dimensional structural diagram of the positioning baffle according to an embodiment of the present utility model.

[0019] In the diagram: 1. Base; 11. Bracket; 12. Guide groove; 13. Infrared rangefinder; 2. Moving seat; 21. First motor; 22. Guide block; 3. First cylinder; 31. Bending plate; 4. Second cylinder; 41. Pressing plate; 42. Elastic telescopic cylinder; 43. Pressing block; 5. Positioning baffle; 51. Groove; 52. Electric push rod; 53. Stop block; 54. Slide groove; 6. Second motor; 61. Lead screw; 7. Placement seat; 71. Placement groove; 72. Suction hole; 73. Air passage; 74. Air pipe; 75. Miniature vacuum pump. Detailed Implementation

[0020] Reference Figures 1 to 4 As shown, this utility model provides a semiconductor device pin positioning and bending mechanism, including: a base 1, a bracket 11 on the upper left side of the base 1, an infrared rangefinder 13 mounted on the right side wall of the bracket 11, a guide groove 12 on the upper surface of the base 1, a positioning baffle 5 fixed on the upper side of the base 1, a bending plate 31 and a pressing plate 41 on the upper side of the positioning baffle 5, a placement seat 7 on the right side of the positioning baffle 5, a groove 51 on the upper end of the positioning baffle 5, sliding grooves 54 on both sides of the groove 51, a stop block 53 slidably connected between the sliding grooves 54, an electric push rod 52 connected to the lower end of the stop block 53, a movable seat 2 rotatably connected to the lower end of the placement seat 7, and the lower end of the movable seat 2 slidably connected to the base 1 through a guide block 22 and a guide groove 12, a lead screw 61 screwed inside the movable seat 2, a second motor 6 connected to the right end of the lead screw 61, and a rotatably connected left end to the right side of the positioning baffle 5.

[0021] In this embodiment, the base 1, the movable seat 2, the bending plate 31, the pressing plate 41, the positioning baffle 5, the lead screw 61, and the placement seat 7 constitute the main structure of the semiconductor device pin positioning and bending mechanism involved in this application.

[0022] Specifically, the detection end of the infrared rangefinder 13 faces the positioning baffle 5, and the detection end is matched with the horizontal height of the groove 51.

[0023] Specifically, the electric actuator 52 controls the lifting stroke through an external control button, so that the stop 53 can slightly contact the lower side of the pin. At the same time, the left vertical edge of the stop 53 and the right vertical edge of the bending plate 31 are approximately on the same vertical line as the left vertical edge of the clamping plate 41, that is, a gap is maintained between them.

[0024] Specifically, the clamping plate 41 is configured as a deformed Z-shaped structure, i.e. a stepped plate structure, with the lower side of the clamping plate 41 located on the upper side of the groove 51 and the higher side located on the upper side of the placement seat 7.

[0025] like Figure 1 In the middle, the bracket 11 is set as an inverted L-shaped structure, and the upper end of the bracket 11 is equipped with a first cylinder 3 and a second cylinder 4. The piston rod of the first cylinder 3 is connected to the upper end of the bending plate 31, and the piston rod of the second cylinder 4 is connected to the upper end of the pressing plate 41. The lower side of the pressing plate 41 is connected to an elastic telescopic cylinder 42, and the lower end of the elastic telescopic cylinder 42 is connected to a pressure block 43.

[0026] Specifically, the elastic telescopic cylinder 42 is equipped with a spring and a piston inside, as well as a slide rod connected to the lower end of the piston, which is connected to the lower end of the high side plate of the pressure plate 41, so that the semiconductor device is elastically protected and pressed when pressed down.

[0027] like Figure 2 and Figure 3 In the middle, the movable seat 2 is equipped with a first motor 21, and the output shaft of the upper end of the first motor 21 is connected to the lower center of the placement seat 7. The upper side of the placement seat 7 is provided with a placement groove 71, and the semiconductor device is placed inside the placement groove 71. The bottom of the placement groove 71 is provided with a suction hole 72. The placement seat 7 is provided with an air passage 73 communicating with the suction hole 72. The lower end of the air passage 73 is connected to an air pipe 74, and the other end of the air pipe 74 is connected to a micro vacuum pump 75. The micro vacuum pump 75 is installed inside the placement seat 7.

[0028] Specifically, the upper end of the placement seat 7 is provided with an installation groove, and the first motor 21 is placed inside the installation groove. The upper output shaft end of the first motor 21 is connected to a telescopic shaft. The telescopic shaft is a square tube structure with two inner and outer sliding sleeves, and the upper and lower ends of the square tube are sealed ends.

[0029] Specifically, electro-hydraulic push rods are symmetrically arranged on the outside of the first motor 21 and inside the placement seat 7, and the upper end of the electro-hydraulic push rods is connected to the bottom of the placement seat 7, so that in the pin switching chamber, the bent pins and semiconductor devices can be moved upward synchronously, thereby preventing the bent pins from being straightened when the moving seat 2 moves outward.

[0030] As a preferred embodiment, by providing a suction hole 72 at the bottom of the placement slot 71, a negative pressure suction effect is generated at the bottom of the slot under the action of the micro vacuum pump 75, thereby preventing the stability of the pre-placed semiconductor device when the first motor 21 starts to rotate.

[0031] In use, the semiconductor device is placed in the placement slot of the placement base, and then the micro vacuum pump is started to adsorb and fix the semiconductor device through the suction hole. At this time, the pins of the semiconductor device are located above the positioning baffle. Then, the second cylinder is activated to drive the clamping plate downward to clamp the pins placed in the groove. At this time, according to the preset parameters, the moving seat is driven to move to one side of the support by the second motor, lead screw and guide block. At the same time, the distance of the semiconductor device pins beyond the positioning baffle is detected by an infrared rangefinder. The second motor is stopped when the preset parameters are reached. This allows for accurate adjustment of the bending length of the pins of different semiconductor devices. Then, the first cylinder is activated to drive the bending plate downward to bend the pins. In the bending operation, when bending multiple pins, after the pins on one side of the semiconductor device are bent, the clamping plate is released, and then the placement seat is moved upward a certain distance by the electro-hydraulic push rod installed on the outside of the first motor inside the moving seat, so that the pin that was just bent moves upward past the lower edge of the groove. Then the second motor is started in reverse to move the moving seat to the right until the pin is located outside the positioning baffle. At this time, the first motor is started to drive the placement seat to rotate, so that the pins on the other side of the semiconductor device can be rotated to the position of the positioning baffle. Then the second motor and the electro-hydraulic push rod are started again to make the pin position the same as the pin position before the last bend. Then the bending plate is used again for bending, which facilitates the pin bending of semiconductor devices with multiple pins.

[0032] The semiconductor device pin positioning and bending mechanism of this utility model can effectively solve the problems of existing semiconductor device pin positioning and bending mechanisms, which are not convenient for accurately adjusting the pin bending length and for bending semiconductor devices with multiple pins. It realizes, based on the existing semiconductor device pin positioning and bending mechanism technology, that it is convenient for accurately adjusting the pin bending length and for bending semiconductor devices with multiple pins.

Claims

1. A semiconductor device pin positioning and bending mechanism, comprising: The base (1) is characterized in that: a bracket (11) is provided on the upper left side of the base (1), and an infrared rangefinder (13) is installed on the right side wall of the bracket (11), and a guide groove (12) is provided on the upper surface of the base (1). A positioning baffle (5) is fixed on the upper side of the base (1), and a bending plate (31) and a pressing plate (41) are provided on the upper side of the positioning baffle (5). A placement seat (7) is provided on the right side of the positioning baffle (5). A movable seat (2) is rotatably connected to the lower end of the placement seat (7), and the lower end of the movable seat (2) is slidably connected to the base (1) through a guide block (22) and a guide groove (12). A screw rod (61) is screwed inside the movable seat (2), and a second motor (6) is connected to the right end of the screw rod (61). The left end of the screw rod (61) is rotatably connected to the right end face of the positioning baffle (5).

2. The semiconductor device pin positioning and bending mechanism according to claim 1, characterized in that, The bracket (11) is designed as an inverted L-shaped structure, and a first cylinder (3) and a second cylinder (4) are installed on the upper end of the bracket (11). The piston rod of the first cylinder (3) is connected to the upper end of the bending plate (31), while the piston rod of the second cylinder (4) is connected to the upper end of the pressing plate (41).

3. The semiconductor device pin positioning and bending mechanism according to claim 1, characterized in that, The lower side of the pressing plate (41) is connected to an elastic telescopic cylinder (42), and the lower end of the elastic telescopic cylinder (42) is connected to a pressure block (43).

4. The semiconductor device pin positioning and bending mechanism according to claim 1, characterized in that, The positioning baffle (5) has a groove (51) at the upper end, and the groove (51) has sliding grooves (54) on both sides of the groove wall, and a stop block (53) is slidably connected between the sliding grooves (54), and an electric push rod (52) is connected at the lower end of the stop block (53).

5. The semiconductor device pin positioning and bending mechanism according to claim 1, characterized in that, The movable seat (2) is equipped with a first motor (21), and the output shaft of the upper end of the first motor (21) is connected to the lower center of the placement seat (7).

6. The semiconductor device pin positioning and bending mechanism according to claim 1, characterized in that, The upper side of the placement base (7) is provided with a placement groove (71), and the semiconductor device is placed inside the placement groove (71). The bottom of the placement groove (71) is provided with a suction hole (72).

7. The semiconductor device pin positioning and bending mechanism according to claim 1, characterized in that, The placement seat (7) has an air passage (73) that communicates with the suction hole (72) inside, and the lower end of the air passage (73) is connected to an air pipe (74), and the other end of the air pipe (74) is connected to a micro vacuum pump (75), while the micro vacuum pump (75) is installed inside the placement seat (7).

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