Calcium fluoride wafer wet type polishing device
By designing a support plate, electric telescopic rod, limiting plate, rubber bumps, and automatic polishing fluid system, the problems of poor adaptability of calcium fluoride wafer polishing devices to different sizes and the need for manual liquid addition were solved, realizing an efficient and automated polishing process and improving the surface quality of the wafers.
Patent Information
- Application Number
- CN202423317123.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-31
- Publication Date
- 2025-12-12
- Estimated Expiration
- 2034-12-31
AI Technical Summary
Existing calcium fluoride wafer polishing equipment is difficult to adapt to the clamping and limiting of wafers of different sizes, and polishing fluid needs to be added manually during the polishing process, resulting in low versatility and inconvenience.
A device comprising a support plate, an electric telescopic rod, a limiting plate, rubber bumps, a water spray system, and an automatic polishing fluid addition mechanism was designed to achieve limiting of wafers of different sizes and automated polishing fluid supply.
It improves the versatility of the device, buffers and limits pressure, protects the wafer, improves surface flatness and smoothness, and reduces manual intervention and surface roughness.
Smart Images
Figure CN223656738U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to calcium fluoride wafer polishing technical field, especially in kind of calcium fluoride wafer wet type polishing device. BACKGROUND
[0002] Calcium fluoride wafer is an important optical material, it is the compound that calcium element and fluorine element compose, can reach the extremely high flatness and the finish of wafer surface through polishing, satisfies the requirement of optical application, and calcium fluoride wafer is used to manufacture infrared lens, window piece, optical filter etc., can also be used as laser window, laser mirror element.
[0003] At present, calcium fluoride wafer is inconvenient for the clamping and limiting of different size calcium fluoride wafers, the device has low universality, and usually needs manual addition of polishing liquid in the process of grinding and polishing, and manual addition of polishing liquid is troublesome. UTILITY MODEL CONTENT
[0004] The utility model discloses a kind of calcium fluoride wafer wet type polishing devices, can be limited to different size calcium fluoride wafer, improve the universality of device use, while buffering the pressure of limiting plate to calcium fluoride wafer, protect the ground calcium fluoride wafer.
[0005] To achieve the above-mentioned purpose, the utility model also provides with the above-mentioned one kind of calcium fluoride wafer wet type polishing device, including: operation platform, the upper surface of the operation platform is fixedly connected with support plate, the left surface of the support plate is fixedly connected with electric telescopic handle, the left surface of the electric telescopic handle is fixedly connected with moving rod, the left surface of the moving rod is fixedly connected with limiting plate, the inner surface of the limiting plate is fixedly connected with rubber convex grain, the upper surface of the operation platform is fixedly connected with first baffle, the upper surface of the first baffle is fixedly connected with support column, the upper surface of the support column is fixedly connected with water spraying plate, the left surface of the water spraying plate is fixedly connected with nozzle, the right surface of the water spraying plate is fixedly connected with water outlet pipe, the end of water outlet pipe away from water spraying plate is fixedly connected with pump body, the upper surface of the pump body is fixedly connected with connecting pipe, the end of connecting pipe away from pump body is fixedly connected with liquid storage tank.
[0006] According to the calcium fluoride wafer wet type polishing device, the inside of the first baffle is provided with a limiting hole, and the inner surface of the limiting hole is in sliding connection with the moving rod.
[0007] According to the calcium fluoride wafer wet type polishing device, the lower surface of the pump body is fixedly connected with the operation platform, and the lower surface of the liquid storage tank is fixedly connected with the operation platform, thereby increasing the stability of the structural connection.
[0008] According to the calcium fluoride wafer wet polishing device, the upper surface of the operating table is fixedly connected with a fixed plate, the upper surface of the fixed plate is fixedly connected with a top plate, the upper surface of the top plate is fixedly connected with a gas cylinder, the output end of the gas cylinder is fixedly connected with a fixed box, and the electric telescopic rod, the pump body and the gas cylinder are electrically connected with an external power source.
[0009] According to the calcium fluoride wafer wet polishing device, the inside of the fixed box is provided with a heat dissipation groove, the bottom inner wall of the fixed box is fixedly connected with a motor, the output end of the motor is fixedly connected with a rotating shaft, and the lower surface of the rotating shaft is fixedly connected with a polishing block.
[0010] According to the calcium fluoride wafer wet polishing device, the motor is electrically connected with an external power source, the side surface of the rotating shaft is rotatably connected with the fixed box, and the right surface of the fixed box is fixedly connected with a second baffle.
[0011] According to the calcium fluoride wafer wet polishing device, the inside of the operating table is provided with a liquid outlet hole, the inside of the operating table is provided with a groove, and the lower surface of the operating table is fixedly connected with a waste liquid tank.
[0012] According to the calcium fluoride wafer wet polishing device, the number of the rubber convex particles is multiple, the inside of the liquid storage tank is provided with an observation window, and the upper surface of the liquid storage tank is fixedly connected with a liquid inlet pipe.
[0013] Compared with the prior art, the calcium fluoride wafer wet polishing device has the following beneficial effects:
[0014] 1. By arranging the supporting plate, the electric telescopic rod, the moving rod, the limiting plate and the rubber convex particles, the distance between the two limiting plates can be adjusted, so that the calcium fluoride wafers of different sizes can be limited, the universality of the device is improved, the pressure of the limiting plate on the calcium fluoride wafer can be buffered, and the polished calcium fluoride wafer is protected.
[0015] 2. By arranging the supporting column, the water spraying plate, the nozzle, the water outlet pipe, the pump body, the connecting pipe and the liquid storage tank, the polishing liquid can be conveniently added without manual addition, and the timely addition of the polishing liquid can improve the flatness and smoothness of the surface of the calcium fluoride wafer and effectively reduce the surface roughness.
[0016] The additional aspects and advantages of the present application will be in part apparent and in part pointed out hereinafter in the description of the application. BRIEF DESCRIPTION OF DRAWINGS
[0017] The present application will be further described below in conjunction with the drawings and embodiments;
[0018] Figure 1 is a whole structure schematic view of the calcium fluoride wafer wet polishing device of the present application;
[0019] Figure 2 is a limiting plate structure schematic view of the calcium fluoride wafer wet polishing device of the present application;
[0020] Figure 3 is a partial structure schematic view of the calcium fluoride wafer wet polishing device of the present application;
[0021] Figure 4 is a fixed box sectional view of the calcium fluoride wafer wet polishing device of the present application.
[0022] LEGEND
[0023] 1, operation table; 2, support plate; 3, electric telescopic rod; 4, moving rod; 5, limiting plate; 6, rubber convex grain; 7, first baffle; 8, limiting hole; 9, support column; 10, water spraying plate; 11, nozzle; 12, water outlet pipe; 13, pump body; 14, connecting pipe; 15, liquid storage tank; 16, observation window; 17, liquid inlet pipe; 18, liquid outlet hole; 19, waste liquid tank; 20, fixed plate; 21, top plate; 22, air cylinder; 23, fixed box; 24, heat dissipation groove; 25, motor; 26, rotating shaft; 27, polishing block; 28, second baffle; 29, groove. DETAILED DESCRIPTION
[0024] This part will describe the specific embodiments of the present application in detail, the preferred embodiments of the present application are shown in the drawings, the role of the drawings is to supplement the description of the text part with graphics, so that people can intuitively and visually understand each technical feature and the overall technical scheme of the present application, but it cannot be understood as the limitation of the protection scope of the present application.
[0025] REFERENCE Figures 1-4The utility model discloses a calcium fluoride wafer wet type polishing device, include: operation platform 1, the upper surface fixed connection of operation platform 1 has support plate 2, the left surface fixed connection of support plate 2 has electric telescopic handle 3, the left surface fixed connection of electric telescopic handle 3 has moving rod 4, the left surface fixed connection of moving rod 4 has limit stop 5, the inner fixed surface connection of limit stop 5 has rubber convex grain 6, start electric telescopic handle 3 and drive moving rod 4, limit stop 5, rubber convex grain 6 move and limit calcium fluoride wafer, start electric telescopic handle 3 and drive moving rod 4, limit stop 5, rubber convex grain 6 move, the distance between two limit stops 5 changes and can limit the calcium fluoride wafer of different size, the number of rubber convex grain 6 is multiple, and rubber convex grain 6 sets up and can buffer the pressure of limit stop 5 to calcium fluoride wafer, protects the calcium fluoride wafer of polishing, the upper surface fixed connection of operation platform 1 has first baffle 7, and first baffle 7 sets up and prevents polishing liquid to be sprayed to operation platform 1 surface, and the inside of first baffle 7 is provided with limit hole 8, and the inner surface of limit hole 8 is slidably connected with moving rod 4.
[0026] The upper surface fixed connection of first baffle 7 has support column 9, the upper surface fixed connection of support column 9 has water spraying plate 10, the left surface fixed connection of water spraying plate 10 has nozzle 11, the right surface fixed connection of water spraying plate 10 has water outlet pipe 12, one end fixed connection of water outlet pipe 12 away from water spraying plate 10 has pump body 13, and the lower surface of pump body 13 is fixedly connected with operation platform 1, and the upper surface of pump body 13 is fixedly connected with connecting pipe 14, one end fixed connection of connecting pipe 14 away from pump body 13 has liquid storage tank 15, starts pump body 13, and the polishing liquid in liquid storage tank 15 is sprayed on the surface of calcium fluoride wafer through nozzle 11 through connecting pipe 14, water outlet pipe 12, through water spraying plate 10, and the lower surface of liquid storage tank 15 is fixedly connected with operation platform 1, increases the stability of structure connection, and the inside of liquid storage tank 15 is provided with observation window 16, the upper surface fixed connection of liquid storage tank 15 has liquid inlet pipe 17, and the remaining amount of polishing liquid in liquid storage tank 15 can be observed through observation window 16, when the polishing liquid in liquid storage tank 15 is insufficient, can add the polishing liquid in liquid storage tank 15 through liquid inlet pipe 17 by opening the valve on liquid inlet pipe 17.
[0027] The upper surface of the operating table 1 is fixedly connected with a fixed plate 20, the upper surface of the fixed plate 20 is fixedly connected with a top plate 21, the upper surface of the top plate 21 is fixedly connected with an air cylinder 22, the electric telescopic rod 3, the pump body 13 and the air cylinder 22 are electrically connected with an external power supply, the output end of the air cylinder 22 is fixedly connected with a fixed box 23, the fixed box 23 is driven to move by starting the air cylinder 22, the use height of the fixed box 23 can be adjusted, and then the use height of the polishing block 27 can be adjusted, the inside of the fixed box 23 is provided with a heat dissipation groove 24, the bottom inner wall of the fixed box 23 is fixedly connected with a motor 25, the heat generated by the motor 25 during use is dissipated through the heat dissipation groove 24, the motor 25 is electrically connected with an external power supply, the output end of the motor 25 is fixedly connected with a rotating shaft 26, the side surface of the rotating shaft 26 is rotatably connected with the fixed box 23, the lower surface of the rotating shaft 26 is fixedly connected with a polishing block 27, the rotating shaft 26 and the polishing block 27 are driven to rotate by starting the motor 25, the polishing block 27 can polish the calcium fluoride wafer, the right surface of the fixed box 23 is fixedly connected with a second baffle 28, the second baffle 28 is arranged to place the polishing liquid sprayed by the nozzle 11 to enter the fixed box 23 through the heat dissipation groove 24, the inside of the operating table 1 is provided with a liquid outlet hole 18, the inside of the operating table 1 is provided with a groove 29, and the lower surface of the operating table 1 is fixedly connected with a waste liquid tank 19, the used polishing liquid is discharged from the groove 29 to the waste liquid tank 19 through the liquid outlet hole 18 for collection.
[0028] Working principle: in use, the calcium fluoride wafer to be polished is placed in the groove 29, the movable rod 4, the limiting plate 5 and the rubber convex grain 6 are driven to move by starting the electric telescopic rod 3 to limit the calcium fluoride wafer, the movable rod 4, the limiting plate 5 and the rubber convex grain 6 are driven to move by starting the electric telescopic rod 3, the distance between the two limiting plates 5 changes, and the calcium fluoride wafers of different sizes can be limited, the fixed box 23 and the polishing block 27 are driven to move downward to the appropriate position by starting the air cylinder 22, the motor 25 is started, the output end of the motor 25 is rotated to drive the rotating shaft 26 and the polishing block 27 to rotate to polish the calcium fluoride wafer, when the polishing liquid needs to be added during polishing, the fixed box 23 is driven to move upward by starting the air cylinder 22, the valve on the water outlet pipe 12 is opened, the pump body 13 is started, the polishing liquid in the liquid storage tank 15 is sprayed on the surface of the calcium fluoride wafer through the connecting pipe 14, the water outlet pipe 12, the water spraying plate 10 and the nozzle 11, the fixed box 23 is driven to move downward by starting the air cylinder 22, the motor 25 is started to drive the rotating shaft 26 and the polishing block 27 to continue polishing the calcium fluoride wafer, the device can limit the calcium fluoride wafers of different sizes, improve the universality of the device, buffer the pressure of the limiting plate 5 on the calcium fluoride wafer, protect the polished calcium fluoride wafer, and conveniently add the polishing liquid, without manual addition of the polishing liquid during the process, convenient addition of the polishing liquid can improve the flatness and smoothness of the wafer surface, and effectively reduce the surface roughness.
[0029] The utility model embodiment makes the detailed explanation in combination with the drawing, but the utility model is not limited to the above -mentioned embodiment, still can make various changes in the knowledge range of ordinary skill in the art person who has possessed under the premise of not departing from the utility model tenet.
Claims
1. A wet polishing apparatus for calcium fluoride wafers, comprising: An operating table (1) is characterized in that a support plate (2) is fixedly connected to the upper surface of the operating table (1), an electric telescopic rod (3) is fixedly connected to the left surface of the support plate (2), a moving rod (4) is fixedly connected to the left surface of the electric telescopic rod (3), a limiting plate (5) is fixedly connected to the left surface of the moving rod (4), a rubber protrusion (6) is fixedly connected to the inner surface of the limiting plate (5), and a first baffle (7) is fixedly connected to the upper surface of the operating table (1). A support column (9) is fixedly connected to the upper surface of the first baffle (7). A water spray plate (10) is fixedly connected to the upper surface of the support column (9). A nozzle (11) is fixedly connected to the left surface of the water spray plate (10). A water outlet pipe (12) is fixedly connected to the right surface of the water spray plate (10). A pump body (13) is fixedly connected to the end of the water outlet pipe (12) away from the water spray plate (10). A connecting pipe (14) is fixedly connected to the upper surface of the pump body (13). A liquid storage tank (15) is fixedly connected to the end of the connecting pipe (14) away from the pump body (13).
2. The wet polishing apparatus for calcium fluoride wafers according to claim 1, characterized in that, The first baffle (7) is provided with a limiting hole (8) inside, and the inner surface of the limiting hole (8) is slidably connected to the moving rod (4).
3. The wet polishing apparatus for calcium fluoride wafers according to claim 1, characterized in that, The lower surface of the pump body (13) is fixedly connected to the operating table (1), and the lower surface of the liquid storage tank (15) is fixedly connected to the operating table (1).
4. The wet polishing apparatus for calcium fluoride wafers according to claim 1, characterized in that, A fixed plate (20) is fixedly connected to the upper surface of the operating table (1), a top plate (21) is fixedly connected to the upper surface of the fixed plate (20), a cylinder (22) is fixedly connected to the upper surface of the top plate (21), a fixed box (23) is fixedly connected to the output end of the cylinder (22), and the electric telescopic rod (3), pump body (13), and cylinder (22) are all electrically connected to an external power source.
5. The wet polishing apparatus for calcium fluoride wafers according to claim 4, characterized in that, The fixed box (23) is provided with a heat dissipation groove (24) inside. A motor (25) is fixedly connected to the bottom inner wall of the fixed box (23). A rotating shaft (26) is fixedly connected to the output end of the motor (25). A grinding block (27) is fixedly connected to the lower surface of the rotating shaft (26).
6. The wet polishing apparatus for calcium fluoride wafers according to claim 5, characterized in that, The motor (25) is electrically connected to an external power source, the side surface of the rotating shaft (26) is rotatably connected to the fixed box (23), and a second baffle (28) is fixedly connected to the right surface of the fixed box (23).
7. The wet polishing apparatus for calcium fluoride wafers according to claim 1, characterized in that, The operating table (1) is provided with a liquid outlet (18) inside, and a groove (29) is provided inside. A waste liquid tank (19) is fixedly connected to the lower surface of the operating table (1).
8. The wet polishing apparatus for calcium fluoride wafers according to claim 1, characterized in that, The number of rubber bumps (6) is multiple, the interior of the liquid storage tank (15) is provided with an observation window (16), and the upper surface of the liquid storage tank (15) is fixedly connected with a liquid inlet pipe (17).