Semiconductor device heat treatment equipment

Abstract

The utility model belongs to the field of semiconductor device processing, and particularly relates to semiconductor device heat treatment equipment which comprises an annealing furnace main body, the interior of the annealing furnace main body is rotationally connected with a rotary drum; the inner wall of the annealing furnace main body is fixedly connected with a tray; the tray is located in the rotary drum; the middle part of the tray is slidably connected with a plurality of groups of first sliding rods; the top of the first sliding rod is fixedly connected with a top plate. A first top block is fixedly connected to the bottom of the first sliding rod; two groups of second top blocks are fixedly connected to the inner wall of the rotary drum, and the corresponding surfaces of the second top blocks and the first top blocks are arc-shaped; the top plate capable of moving up and down is arranged on the inner wall of the tray, so that part of materials stacked in the tray can be turned over or transferred, and the situation that the contact surfaces of the materials and the tray are difficult to be uniformly thermally treated due to long-time fixed placement when the original materials are thermally treated in the tray is reduced; and the thickness and the shape of the surface are not uniform.

Description

TECHNICAL FIELD

[0001] The utility model relates to the field of semiconductor device processing, and specifically relates to a semiconductor device heat treatment equipment. BACKGROUND

[0002] Semiconductor devices play the role of generating, controlling, receiving, transforming, amplifying signals and energy conversion in circuits, and its main manufacturing materials are silicon, gallium arsenide, germanium arsenide, gallium nitride, indium phosphide and silicon carbide, which are widely used in information technology and energy fields.

[0003] In order to change the semiconductor crystal structure and chemical composition, so as to improve the electronic structure and performance of semiconductor materials, the staff usually uses annealing furnace to heat treat semiconductor devices, which is mainly composed of temperature control system and hearth.

[0004] Through long observation, the existing annealing furnace is usually placed in the tray of the annealing furnace when the semiconductor device is heat treated, and the semiconductor device is heat treated, but the semiconductor device is usually fixedly placed in the tray of the annealing furnace, so that the contact surface of the semiconductor device and the tray is difficult to be uniformly heat treated, and the thickness and shape of the surface of the semiconductor device after heat treatment are not uniform; therefore, the semiconductor device heat treatment equipment is provided for the above problems. UTILITY MODEL CONTENTS

[0005] In order to make up for the deficiencies of the prior art and solve at least one technical problem in the background art, the utility model provides a semiconductor device heat treatment equipment.

[0006] The utility model solves the technical scheme that the utility model discloses a semiconductor device heat treatment equipment, including annealing furnace main part, the inside rotation of annealing furnace main part is connected with the rotary drum, the inner wall of annealing furnace main part is fixedly connected with the tray, the tray is located in the rotary drum inside setting, the middle part sliding connection of tray has a plurality of first slide rod, the top of first slide rod is fixedly connected with the top plate, the bottom of first slide rod is fixedly connected with the first top piece, the inner wall of rotary drum is fixedly connected with two second top pieces, and the corresponding surface of second top piece and first top piece is arc-shaped setting.

[0007] Preferably, the outer wall of the tray is fixedly connected with a plurality of slide rails; the slide rails and the middle part of the rotary drum are slidingly connected with two second slide rods; the middle part of the second slide rod is fixedly connected with a connecting plate; the bottom of the connecting plate is fixedly connected with a push plate, and the push plate is in contact with the bottom wall of the tray; the end part of the second slide rod is rotatably connected with two connecting rods; the end part of the connecting rod is rotatably connected with a supporting plate, and the supporting plate is fixedly connected to the top of the first top piece.

[0008] Preferably, the connecting rod is fixed with a heat-resistant spring in the middle; the heat-resistant spring is fixed with a fixing piece in the middle; the fixing piece is fixed with a knocking block at the end, and the knocking block is arranged at the bottom of the tray.

[0009] Preferably, the connecting plate is provided with a sliding groove in the middle; the sliding groove is slidably connected with a baffle on the inner wall, and the baffle is fixed on the inner wall of the tray at the end.

[0010] Preferably, the first top block is rotatably connected with a rotating rod at the top; the rotating rod is fixed with a counterweight block at the end.

[0011] Preferably, the second top block is rotatably connected with a rotating wheel in the middle, and the rotating wheel is in contact with the bottom of the first top block in the middle.

[0012] Preferably, the push plate is provided with a plurality of groups of air holes in the middle, and the air holes are arranged in a linear array in the middle of the push plate.

[0013] The utility model discloses the beneficial effect lies in:

[0014] 1. The utility model relates to a semiconductor device heat treatment equipment, be provided with the top plate of up and down motion in the inner wall of tray, can reduce the part material of accumulation in the inside tray and carry out the face or position transfer, reduce the heat treatment of the material and the tray contact surface difficultly even heat treatment when the original material is fixedly placed for a long time in the inside tray, lead to the problem that the thickness and shape of the material are uneven after being heat treated.

[0015] 2. The utility model relates to a semiconductor device heat treatment equipment, through the top plate of cooperation setting, can reduce the part material after being turned over to the edge of tray after being lifted by the top plate, make the subsequent up and down motion of top plate difficultly turn over the material again, improve the stability when turning over the material, utilize two groups of connecting rods and can improve the synchronism when the push plate moves. ACCURATE DRAWINGS

[0016] In order to more clearly illustrate the technical scheme in the embodiment of the utility model or prior art, the following will briefly introduce the drawings needed to be used in the embodiment or prior art description, and obviously, the drawings in the following description are only some embodiments of the utility model, and for those skilled in the art, other drawings can be obtained according to these drawings without paying the creativity labor intensity.

[0017] Figure 1 It is the three-dimensional structure schematic diagram in the utility model;

[0018] Figure 2 It is the tray structure schematic diagram in the utility model;

[0019] Figure 3 It is Figure 2An enlarged view of A in the figure;

[0020] Figure 4 A first slide rod structure in the utility model is a schematic view.

[0021] Figure 5 A connecting structure in the utility model is a schematic view.

[0022] In the figure: 1, annealing furnace main body; 11, rotary drum; 12, tray; 13, top plate; 14, first slide rod; 15, first top block; 16, second top block; 2, slide rail; 21, second slide rod; 22, connecting plate; 23, push plate; 24, connecting rod; 25, support plate; 3, heat-resistant spring; 31, fixing piece; 32, knocking block; 4, sliding groove; 41, baffle; 5, rotating rod; 51, counterweight block; 6, rotating wheel; 7, air hole. DETAILED DESCRIPTION

[0023] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the utility model.

[0024] As Figures 1-5As shown, a semiconductor device heat treatment equipment, including annealing furnace body 1, the inside of the annealing furnace body 1 is rotatably connected with rotary drum 11, the inner wall of the annealing furnace body 1 is fixedly connected with tray 12, the tray 12 is arranged in the inside of rotary drum 11, a plurality of groups of first sliding rods 14 are slidably connected in the middle part of tray 12, the top of the first sliding rod 14 is fixedly connected with top plate 13, the bottom of the first sliding rod 14 is fixedly connected with first top block 15, the inner wall of rotary drum 11 is fixedly connected with two groups of second top blocks 16, and the corresponding surfaces of the first top block 15 and the second top block 16 are both arc-shaped, in working, the staff needs to install tray 12 on the inner wall of annealing furnace body 1, and then place a plurality of materials to be heat treated in the inner wall of tray 12, after closing the furnace door, the tray 12 is rotated to heat treat the materials, by arranging a plurality of first sliding rods 14 in the middle part of tray 12, when the second top block 16 on the inner wall of rotary drum 11 approaches and contacts the bottom of first top block 15, the second top block 16 can push first top block 15 upward as a whole by the corresponding arc surfaces between them, at this time, top plate 13 will also be pushed upward synchronously, and the materials stacked on the top of top plate 13 are positionally transferred or turned over, after the second top block 16 and first top block 15 are away from each other, the first top block 15 can be used to reset the position of top plate 13 and a plurality of first sliding rods 14 by the gravity of the first top block 15, and the above steps are repeated, by arranging top plate 13 that can move up and down on the inner wall of tray 12, the materials stacked in the inside of tray 12 can be turned over or positionally transferred, the original materials in tray 12 are not fixedly placed for a long time during heat treatment, the contact surface between the materials and tray 12 is difficult to be uniformly heat treated, and the thickness and shape of the surface of the materials after heat treatment are not uniform.

[0025] As Figures 3-5As shown, the tray 12 outer wall is fixed with a plurality of groups of slide rails 2; the slide rails 2 and the middle part of the rotating drum 11 are slidably connected with two groups of second slide rods 21; the middle part of the second slide rod 21 is fixedly connected with a connecting plate 22; the bottom of the connecting plate 22 is fixedly connected with a push plate 23, and the push plate 23 is in contact with the bottom wall of the tray 12; the end of the second slide rod 21 is rotatably connected with two groups of connecting rods 24; the end of the connecting rod 24 is rotatably connected with a supporting plate 25, and the supporting plate 25 is fixedly connected to the top of the first top block 15; during work, by providing the supporting plate 25 on the top of the first top block 15, when the first top block 15 is lifted by the second top block 16 and moves upward, the two groups of connecting rods 24 will move to the two ends of the slide rails 2 under the action of the pushing force, and at the same time, the push plate 23 will slide at the bottom wall of the tray 12, and when the first top block 15 resets downward, the second slide rod 21 will move in the opposite direction again under the action of gravity, and in cooperation with the push plate 23, the materials that are transferred to the edge of the tray 12 due to the lifting of the top plate 13 can be pushed again to the top of the top plate 13, which can reduce the problem that it is difficult for the top plate 13 to turn the materials again after the materials are turned over to the edge of the tray 12, improve the stability during turning over of the materials, and improve the synchronization of the push plate 23 during movement by using the two groups of connecting rods 24.

[0026] As shown in Figure 5 , the middle part of the connecting rod 24 is fixedly connected with a heat-resistant spring 3; the middle part of the heat-resistant spring 3 is fixedly connected with a fixing piece 31; the end of the fixing piece 31 is fixedly connected with a knocking block 32, and the knocking block 32 is arranged at the bottom of the tray 12; during work, by providing the heat-resistant spring 3 in the middle part of the two groups of connecting rods 24, when the connecting rod 24 expands to the two ends, the overall length of the heat-resistant spring 3 will be elongated, and in the process of pulling the middle part of the heat-resistant spring 3, the fixing piece 31 will repeatedly swing in the middle part of the heat-resistant spring 3, and in cooperation with the knocking block 32 arranged at the end, the bottom of the tray 12 can be continuously knocked, and by cooperating with the knocking block 32 arranged at the bottom of the tray 12, the vibration force generated can vibrate the materials that are accumulated together after being turned over, further improving the uniformity of the materials during heat treatment, and at the same time, the dirt accumulated on the surface of the tray 12 can be cleaned, improving the cleanliness of the surface of the tray 12.

[0027] As shown in Figure 3 and 4As shown, a groove 4 is provided in the middle of the connecting plate 22; a baffle 41 is slidably connected to the inner wall of the groove 4, and the end of the baffle 41 is fixed to the inner wall of the tray 12; during operation, by providing a groove 4 in the middle of the push plate 23, when the connecting plate 22 slides repeatedly on the inner wall of the tray 12, the baffle 41 will slide synchronously on the inner wall of the groove 4 in the middle of the connecting plate 22, and the unfolded baffle 41 will block the overturned or vibrating material. This step, together with the unfolded baffle 41, can reduce the problem that when the material is overturned inside the tray 12, some material will be transferred to the back of the connecting plate 22, causing damage to the material when the connecting plate 22 moves, thus improving the quality of the material after heat treatment.

[0028] like Figure 4 and 5 As shown, a rotating rod 5 is rotatably connected to the top of the first top block 15; a counterweight 51 is fixedly connected to the end of the rotating rod 5; during operation, by setting a rotating counterweight 51 at the end of the first top block 15, the first top block 15 moves up and down, and under the action of inertia, the counterweight 51 will swing repeatedly. This step, combined with the downward gravity of the counterweight 51 as a whole and the tension generated during the swing, can improve the stability of the first top block 15 when it is reset, and reduce the problem that the surface of the first slide rod 14 is relatively rough, resulting in a low reset speed.

[0029] like Figure 3 As shown, a rotating wheel 6 is rotatably connected to the middle of the second top block 16, and the middle of the rotating wheel 6 is in contact with the bottom of the first top block 15. During operation, the rotating wheel 6 in the middle of the second top block 16 allows the rotating wheel 6 to directly contact the arc surface at the bottom of the first top block 15 when the second top block 16 is close to the first top block 15, and rotate at its bottom. This step, combined with the rotating wheel 6, can reduce the problem of excessive wear on the surfaces of the two parts due to direct contact between the second top block 16 and the bottom of the first top block 15 over a long period of time, and can also reduce the resistance when they are in contact.

[0030] like Figure 4 As shown, the push plate 23 has multiple sets of ventilation holes 7 in the middle, and the ventilation holes 7 are arranged in a linear array in the middle of the push plate 23. During operation, by setting multiple sets of ventilation holes 7 in the middle of the push plate 23, the wind force generated by the push plate 23 sliding repeatedly on the inner wall of the tray 12 will pass through multiple ventilation holes 7. This step, together with multiple ventilation holes 7, can reduce the resistance generated when the push plate 23 is pulled and moves repeatedly, and improve the flexibility of the push plate 23 when it moves.

[0031] The working principle is as follows: After the tray 12 is installed on the inner wall of the annealing furnace body 1, multiple materials requiring heat treatment are placed on the inner wall of the tray 12. After the furnace door is closed, the rotating tray 12 is used to perform heat treatment on the materials. Multiple sliding first slide rods 14 are provided in the middle of the tray 12. When the second top block 16 on the inner wall of the rotating drum 11 approaches and contacts the bottom of the first top block 15, the corresponding arc surfaces between them allow the second top block 16 to push the first top block 15 upwards. At this time, the top plate 13 is also simultaneously pushed upwards, transferring or flipping the material accumulated on top of the top plate 13. The second top block 16 and the first... After the top blocks 15 are in a separated state, the downward gravity of the first top block 15 can be used to reset the top plate 13 and multiple first sliding rods 14. This process is repeated. Because a support plate 25 is provided on top of the first top block 15, when the first top block 15 is lifted by the second top block 16 and moves upward, the two sets of connecting rods 24 will move towards both ends of the slide rail 2 under the action of the thrust. Simultaneously, this will cause the push plate 23 to slide against the bottom wall of the tray 12. At the same time, when the first top block 15 resets downward, gravity will cause the second sliding rods 21 to move in the opposite direction again. Together with the push plate 23, this will help to remove some of the weights caused by the top plate 13 being lifted. The material that has been moved to the edge of the pallet 12 is pushed back onto the top of the top plate 13. A heat-resistant spring 3 is provided in the middle of the two sets of connecting rods 24, causing the overall length of the heat-resistant spring 3 to be stretched when the connecting rods 24 are extended to both ends. Simultaneously, during the pulling of the middle of the heat-resistant spring 3, the fixing member 31 will repeatedly swing in the middle of the heat-resistant spring 3, and in conjunction with the striking block 32 at the end, it can continuously strike the bottom of the pallet 12. A groove 4 is provided in the middle of the push plate 23, causing the baffle 41 to slide synchronously on the inner wall of the groove 4 in the middle of the connecting plate 22 as the connecting plate 22 repeatedly slides against the inner wall of the pallet 12. The baffle 41 will block the overturned or vibrating material. By setting a rotating counterweight 51 at the end of the first top block 15, the counterweight 51 will swing repeatedly under the action of inertia after the first top block 15 moves up and down. By setting a rotating wheel 6 in the middle of the second top block 16, the wheel 6 will directly contact the arc surface at the bottom of the first top block 15 when the second top block 16 is close to the first top block 15 and rotate at its bottom. By setting multiple sets of ventilation holes 7 in the middle of the push plate 23, the wind force generated by the push plate 23 sliding repeatedly on the inner wall of the tray 12 will pass through multiple ventilation holes 7.

[0032] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model.

Claims

1. A semiconductor device heat treatment apparatus, comprising an annealing furnace body (1); a rotating cylinder (11) is rotatably connected inside the annealing furnace body (1); characterized in that: The inner wall of the annealing furnace body (1) is fixedly connected to a tray (12); the tray (12) is located inside the rotating cylinder (11); multiple sets of first slide rods (14) are slidably connected in the middle of the tray (12); a top plate (13) is fixedly connected to the top of the first slide rod (14); a first top block (15) is fixedly connected to the bottom of the first slide rod (14); two sets of second top blocks (16) are fixedly connected to the inner wall of the rotating cylinder (11), and the corresponding surfaces of the second top blocks (16) and the first top blocks (15) are both arc-shaped.

2. The semiconductor device heat treatment equipment according to claim 1, characterized in that: The outer wall of the tray (12) is fixed with multiple sets of slide rails (2); the slide rails (2) and the rotating drum (11) are slidably connected with two sets of second slide rods (21); the second slide rods (21) are fixed with a connecting plate (22); the bottom of the connecting plate (22) is fixed with a push plate (23), and the push plate (23) is in contact with the bottom wall of the tray (12); the end of the second slide rods (21) is rotatably connected with two sets of connecting rods (24); the end of the connecting rods (24) is rotatably connected with a support plate (25), and the support plate (25) is fixed on the top of the first top block (15).

3. The semiconductor device heat treatment equipment according to claim 2, characterized in that: A heat-resistant spring (3) is fixedly connected to the middle of the connecting rod (24); a fixing member (31) is fixedly connected to the middle of the heat-resistant spring (3); a striking block (32) is fixedly connected to the end of the fixing member (31), and the striking block (32) is located at the bottom of the tray (12).

4. The semiconductor device heat treatment equipment according to claim 2, characterized in that: The connecting plate (22) has a groove (4) in the middle; a baffle (41) is slidably connected to the inner wall of the groove (4), and the end of the baffle (41) is fixed to the inner wall of the tray (12).

5. The semiconductor device heat treatment equipment according to claim 1, characterized in that: The top of the first top block (15) is rotatably connected to a rotating rod (5); a counterweight (51) is fixedly connected to the end of the rotating rod (5).

6. The semiconductor device heat treatment equipment according to claim 1, characterized in that: The second top block (16) is rotatably connected to a rotating wheel (6) in the middle, and the middle of the rotating wheel (6) is in contact with the bottom of the first top block (15).

7. The semiconductor device heat treatment equipment according to claim 2, characterized in that: The push plate (23) has multiple sets of ventilation holes (7) in the middle, and the ventilation holes (7) are arranged in a linear array in the middle of the push plate (23).

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