Thermal infrared imager protection bin
By designing a protective chamber for infrared thermal imagers, and utilizing heat absorption, dust removal, and spray washing components, the impact of the metallurgical workshop environment on infrared thermal imagers was resolved, achieving effective protection and accurate measurement for infrared thermal imagers.
Patent Information
- Application Number
- CN202520238214.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-14
- Publication Date
- 2025-12-12
- Estimated Expiration
- 2035-02-14
AI Technical Summary
The complex environment of metallurgical production workshops causes dust and impurities to adhere to the lenses of infrared thermal imagers, affecting image quality and temperature measurement accuracy. Furthermore, the high-temperature environment has an adverse effect on the equipment, and the existing protection measures are insufficient.
An infrared thermal imager protective chamber was designed, comprising a protective chamber body, a light-transmitting glass, a heat-absorbing component, a dust removal component, and a spray washing component. The heat-absorbing component cools the imager, the dust removal component cleans it, and the spray washing component maintains the clarity of the light-transmitting glass, forming a relatively sealed environment to protect the infrared thermal imager.
It effectively prevents dust from adhering, maintains the clarity of the transparent glass, ensures that the infrared thermal imager operates at a suitable temperature, and improves measurement accuracy and equipment lifespan.
Smart Images
Figure CN223664109U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to thermal imager technical field, concretely relates to an infrared thermal imager protection bin. BACKGROUND
[0002] As an important thermal imaging equipment, the infrared thermal imager is widely used in industry, scientific research, military and other fields. Its working principle is to detect the temperature of an object using infrared rays and convert it into a visible image, having the advantage of non-destructive detection of the target in darkness, smoke and other conditions.
[0003] With the rapid development of infrared imaging and temperature measurement technology, the application of real-time monitoring of the temperature of production equipment by the infrared thermal imager in the metallurgical industry is also becoming more and more popular. However, the production workshop environment of the metallurgical industry is complex, and there are a lot of dust, coal fly ash and other impurities. These impurities will adhere to the lens surface of the infrared thermal imager, resulting in blurred imaging, decreased temperature measurement accuracy, and even causing equipment failure. In addition, the high temperature environment of the metallurgical workshop is also easy to adversely affect the infrared thermal imager, and the existing infrared thermal imager is difficult to effectively protect.
[0004] Therefore, an infrared thermal imager protection bin is proposed. CONTENT OF THE UTILITY MODEL
[0005] The utility model discloses the purpose at: for solving the problem mentioned in the background art, the utility model provides an infrared thermal imager protection bin.
[0006] The utility model discloses the purpose in order to realize the above-mentioned specific adoption following technical scheme:
[0007] An infrared thermal imager protection bin, comprising a mounting plate, the front surface of the mounting plate is fixedly connected with a protection bin main body, an infrared thermal imager body is fixedly installed inside the protection bin main body, a light-transmitting glass is embedded on the front surface of the protection bin main body, a heat absorption assembly and a constant temperature assembly for cooling the infrared thermal imager body are installed on the surface of the protection bin main body, and a dust removal assembly and a spray cleaning assembly for cleaning the light-transmitting glass are also arranged on the surface of the protection bin main body.
[0008] Further, the heat absorption assembly comprises a coil pipe, and the coil pipe is attached to the surface of the infrared thermal imager body, a liquid storage box is fixedly connected to the top surface of the protection bin main body, the inside of the liquid storage box is filled with cooling liquid, a first water pump is fixedly installed on the inner wall of the liquid storage box, a first connecting pipe is fixedly connected to the liquid outlet end of the first water pump, and the first connecting pipe is fixedly connected with the coil pipe, a return pipe is fixedly connected to the surface of the coil pipe, and the return pipe is in communication with the inside of the liquid storage box.
[0009] Furthermore, a semiconductor cooling chip is fixedly connected to the top surface of the liquid storage box, a cooling plate is fixedly connected to the cold end of the semiconductor cooling chip and the cooling plate is in contact with the coolant, and a heat dissipation fin is fixedly connected to the hot end of the semiconductor cooling chip.
[0010] Furthermore, the dust removal component includes a mounting shell, which is fixedly connected to the top surface of the protective chamber body. A motor is fixedly installed on the inner wall of the mounting shell, and a lead screw is fixedly connected to the output end of the motor. An installation rod is threadedly connected to the surface of the lead screw. A sliding groove is formed through the bottom surface of the mounting shell, and the inner wall of the sliding groove is slidably connected to the surface of the installation rod. An adhesive strip is fixedly connected to the back of the installation rod, and the adhesive strip is slidably connected to the surface of the light-transmitting glass.
[0011] Furthermore, the spray washing assembly includes a U-shaped water tank, which is fixedly connected to the main body of the protective chamber. The interior of the U-shaped water tank is filled with cleaning agent. A water inlet pipe is fixedly inserted into the top surface of the U-shaped water tank. A second water pump is fixedly installed on the left side of the U-shaped water tank. A second connecting pipe is fixedly connected to the outlet end of the second water pump. A nozzle is fixedly connected to the surface of the second connecting pipe.
[0012] Furthermore, mounting holes are provided at all four corners of the mounting plate.
[0013] The beneficial effects of this utility model are as follows:
[0014] Fixed in its working position by a mounting plate, the infrared thermal imager operates and its operating temperature can be monitored. A relatively sealed environment is formed by the protective chamber and the transparent glass, protecting the imager. A dust removal component removes dust and impurities adhering to the transparent glass surface, while a spray cleaning component cleans the glass surface to maintain its clarity. Furthermore, heat absorption and temperature control components absorb heat from the imager's surface, keeping it at a suitable operating temperature and preventing overheating. This system effectively protects the infrared thermal imager, preventing impurities from adhering to its surface, ensuring measurement accuracy, and maintaining the imager's surface temperature to guarantee normal operation. Attached Figure Description
[0015] Fig. 1 This is a three-dimensional structural diagram of the present invention;
[0016] Fig. 2 This is a side sectional view of the structure of this utility model;
[0017] Fig. 3 This is a front sectional view of the ash removal component structure of this utility model;
[0018] Mark No. : 1, mounting plate; 2, protective bin main body; 3, infrared thermal imager body; 4, heat absorption assembly; 401, coil pipe; 402, liquid storage box; 403, first water pump; 404, first connecting pipe; 405, return pipe; 5, constant temperature assembly; 501, semiconductor refrigeration sheet; 502, cold conducting sheet; 503, heat dissipation fin; 6, light transmission glass; 7, ash removal assembly; 701, mounting shell; 702, motor; 703, screw rod; 704, mounting rod; 705, sliding groove; 706, rubber strip; 8, spray washing assembly; 801, U-shaped water tank; 802, water filling pipe; 803, second water pump; 804, second connecting pipe; 805, nozzle. DETAILED DESCRIPTION
[0019] To make the objects, technical solutions, and advantages of the embodiments of the present application clearer, the following will be a clear and complete description of the technical solutions in the embodiments of the present application with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings can be arranged and designed in various different configurations.
[0020] Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the claimed present application, but only represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative labor fall within the scope of the present application.
[0021] It should be noted that: similar reference numbers and letters represent similar items in the following drawings, therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings. In addition, the terms "first", "second", etc. are only used for differentiation in description, and cannot be understood as indicating or implying relative importance.
[0022] The electrical components appearing in the text are all electrically connected with the master controller and 220V mains, and the master controller can be a conventional known device such as a computer.
[0023] In the description of the embodiments of the present application, it should be noted that the directions or position relationships indicated by the terms "inner", "outer", "upper", etc. are based on the directions or position relationships shown in the drawings, or the directions or position relationships commonly placed when the product of the present application is used, which are only for the convenience of describing the present application and simplifying the description, and cannot be understood as indicating or implying that the indicated device or element must have a particular direction, be constructed and operated in a particular direction, and therefore cannot be understood as limiting the present application.
[0024] As Figs. 1 to 3As shown, an infrared thermal imager protection bin includes a mounting plate 1, the front of the mounting plate 1 is fixedly connected with a protection bin body 2, the inside of the protection bin body 2 is fixedly installed with an infrared thermal imager body 3, the front of the protection bin body 2 is embedded with a light transmission glass 6, the surface of the protection bin body 2 is installed with a heat absorption assembly 4 and a constant temperature assembly 5 for cooling the infrared thermal imager body 3, and the surface of the protection bin body 2 is also provided with a dust removal assembly 7 and a spray cleaning assembly 8 for cleaning the light transmission glass 6. More specifically, the mounting plate 1 is fixed in the working position, the infrared thermal imager body 3 is used to run, the equipment working temperature can be monitored, the protection bin body 2 and the light transmission glass 6 form a relatively closed environment, the infrared thermal imager body 3 is protected, the dust and impurities attached to the surface of the light transmission glass 6 can be scraped off by the dust removal assembly 7, the surface of the light transmission glass 6 can be sprayed and cleaned by the spray cleaning assembly 8, the clarity of the light transmission glass 6 is maintained, and in addition, the heat on the surface of the infrared thermal imager body 3 can be absorbed by the heat absorption assembly 4 and the constant temperature assembly 5, so that the infrared thermal imager body 3 is at a suitable working temperature, and the infrared thermal imager body 3 is prevented from overheating.
[0025] The heat absorption assembly 4 includes a coil pipe 401, the coil pipe 401 is attached to the surface of the infrared thermal imager body 3, the top surface of the protection bin body 2 is fixedly connected with a liquid storage box 402, the inside of the liquid storage box 402 is filled with cooling liquid, the inner wall of the liquid storage box 402 is fixedly installed with a first water pump 403, the liquid outlet end of the first water pump 403 is fixedly connected with a first connecting pipe 404, the first connecting pipe 404 is fixedly connected with the coil pipe 401, the surface of the coil pipe 401 is fixedly connected with a return pipe 405, and the return pipe 405 is in communication with the inside of the liquid storage box 402. It should be noted that the cooling liquid in the liquid storage box 402 is sent into the first connecting pipe 404 by the operation of the first water pump 403, so that the inside of the coil pipe 401 is filled with cooling liquid, the heat on the surface of the infrared thermal imager body 3 is absorbed by the contact between the coil pipe 401 and the infrared thermal imager body 3, the infrared thermal imager body 3 is prevented from overheating, the cooling liquid that has absorbed heat reenters the coil pipe 401 through the return pipe 405, and the cooling liquid is recycled after being cooled by the constant temperature assembly 5.
[0026] The top surface of the liquid storage box 402 is fixedly connected with a semiconductor refrigeration sheet 501, the cold end of the semiconductor refrigeration sheet 501 is fixedly connected with a cold lead sheet 502, the cold lead sheet 502 is in contact with the cooling liquid, and the hot end of the semiconductor refrigeration sheet 501 is fixedly connected with a heat dissipation fin 503. More specifically, the cold end temperature of the semiconductor refrigeration sheet 501 is reduced by the operation of the semiconductor refrigeration sheet 501, the cooling liquid in the liquid storage box 402 is cooled by the conduction of the cold lead sheet 502, the cooling liquid is kept at a low temperature, and the cooling effect on the infrared thermal imager body 3 is ensured, and the heat dissipation area of the hot end of the semiconductor refrigeration sheet 501 is increased by the heat dissipation fin 503, and heat dissipation is facilitated.
[0027] The ash removal assembly 7 comprises a mounting shell 701, and the mounting shell 701 is fixedly connected with the top surface of the protective bin body 2. An inner wall of the mounting shell 701 is fixedly installed with a motor 702. An output end of the motor 702 is fixedly connected with a lead screw 703. The surface of the lead screw 703 is threadedly connected with a mounting rod 704. A bottom surface of the mounting shell 701 is provided with a sliding groove 705. An inner wall of the sliding groove 705 is slidably connected with the surface of the mounting rod 704. The back surface of the mounting rod 704 is fixedly connected with a rubber strip 706. The rubber strip 706 is slidably connected with the surface of the light-transmitting glass 6. It should be noted that the lead screw 703 is driven to rotate by the motor 702. Under the action of the thread, the mounting rod 704 can slide along the inner wall of the sliding groove 705, thereby pulling the rubber strip 706 to move along the surface of the light-transmitting glass 6. The dust and impurities attached to the surface of the light-transmitting glass 6 are cleaned, so that the surface of the light-transmitting glass 6 is kept clear.
[0028] The spray cleaning assembly 8 comprises a U-shaped water tank 801. The U-shaped water tank 801 is fixedly connected with the protective bin body 2. The inside of the U-shaped water tank 801 is filled with cleaning agent. The top surface of the U-shaped water tank 801 is fixedly inserted with a water adding pipe 802. The left side surface of the U-shaped water tank 801 is fixedly installed with a second water pump 803. The water outlet end of the second water pump 803 is fixedly connected with a second connecting pipe 804. The surface of the second connecting pipe 804 is fixedly connected with a spray nozzle 805. More specifically, the cleaning agent in the U-shaped water tank 801 can be pumped out by the operation of the second water pump 803. The cleaning agent can be transported through the second connecting pipe 804. Finally, the cleaning agent is sprayed on the surface of the light-transmitting glass 6 through the spray nozzle 805, so as to spray the dust and impurities on the surface of the light-transmitting glass 6. The inside of the U-shaped water tank 801 can be added with cleaning agent through the water adding pipe 802.
[0029] The mounting plate 1 is provided with mounting holes at the four corners. It should be noted that the mounting plate 1 is fixed at the mounting position through the mounting holes and bolts.
[0030] In summary, the mounting plate 1 is fixed at the working position. The equipment working temperature can be monitored by the operation of the infrared thermal imager body 3. The infrared thermal imager body 3 is protected by the relatively closed environment formed by the protective bin body 2 and the light-transmitting glass 6. The dust and impurities attached to the surface of the light-transmitting glass 6 can be scraped off by the ash removal assembly 7. The surface of the light-transmitting glass 6 can be sprayed and cleaned by the spray cleaning assembly 8, so as to maintain the clarity of the light-transmitting glass 6. In addition, the heat on the surface of the infrared thermal imager body 3 can be absorbed by the heat absorption assembly 4 and the constant temperature assembly 5, so that the infrared thermal imager body 3 is in a suitable working temperature, and the infrared thermal imager body 3 is prevented from overheating. In use, the effect of effectively protecting the infrared thermal imager is achieved. The impurities are prevented from being attached to the surface of the thermal imager, so as to protect the measurement accuracy. The surface temperature of the thermal imager is maintained as much as possible, so as to protect the normal work of the thermal imager.
[0031] The basic principle, main features and advantages of the present application are shown and described above. It should be understood by those skilled in the art that the present application is not limited by the above embodiments, and the above embodiments and descriptions in the specification are only the principles of the present application. Without departing from the spirit and scope of the present application, various changes and improvements can be made to the present application, and these changes and improvements all fall within the scope of the claimed present application. The scope of protection required by the present application is defined by the appended claims and their equivalents.
Claims
1. A protective enclosure for an infrared thermal imager, characterized in that, The device includes a mounting plate (1), on the front of which a protective chamber body (2) is fixedly connected. An infrared thermal imager body (3) is fixedly installed inside the protective chamber body (2). A light-transmitting glass (6) is embedded on the front of the protective chamber body (2). A heat-absorbing component (4) and a temperature-regulating component (5) for cooling the infrared thermal imager body (3) are installed on the surface of the protective chamber body (2). A dust removal component (7) and a spray washing component (8) for cleaning the light-transmitting glass (6) are also provided on the surface of the protective chamber body (2).
2. The infrared thermal imager protective chamber according to claim 1, characterized in that, The heat absorption component (4) includes a coil (401), and the coil (401) is attached to the surface of the infrared thermal imager body (3). A liquid storage box (402) is fixedly connected to the top surface of the protective chamber body (2). The liquid storage box (402) is filled with coolant. A first water pump (403) is fixedly installed on the inner wall of the liquid storage box (402). A first connecting pipe (404) is fixedly connected to the outlet end of the first water pump (403), and the first connecting pipe (404) is fixedly connected to the coil (401). A return pipe (405) is fixedly connected to the surface of the coil (401), and the return pipe (405) is connected to the inside of the liquid storage box (402).
3. The infrared thermal imager protective chamber according to claim 2, characterized in that, The top surface of the liquid storage box (402) is fixedly connected to a semiconductor cooling chip (501), the cold end of the semiconductor cooling chip (501) is fixedly connected to a cooling plate (502), and the cooling plate (502) is in contact with the coolant. The hot end of the semiconductor cooling chip (501) is fixedly connected to a heat dissipation fin (503).
4. The infrared thermal imager protective chamber according to claim 1, characterized in that, The dust removal component (7) includes a mounting shell (701), which is fixedly connected to the top surface of the protective chamber body (2). A motor (702) is fixedly installed on the inner wall of the mounting shell (701). A lead screw (703) is fixedly connected to the output end of the motor (702). An installation rod (704) is threadedly connected to the surface of the lead screw (703). A sliding groove (705) is opened through the bottom surface of the mounting shell (701), and the inner wall of the sliding groove (705) is slidably connected to the surface of the installation rod (704). A rubber strip (706) is fixedly connected to the back of the installation rod (704), and the rubber strip (706) is slidably connected to the surface of the light-transmitting glass (6).
5. The infrared thermal imager protective chamber according to claim 4, characterized in that, The spray washing assembly (8) includes a U-shaped water tank (801), which is fixedly connected to the protective chamber body (2). The U-shaped water tank (801) is filled with cleaning agent. A water supply pipe (802) is fixedly inserted into the top surface of the U-shaped water tank (801). A second water pump (803) is fixedly installed on the left side of the U-shaped water tank (801). A second connecting pipe (804) is fixedly connected to the outlet end of the second water pump (803). A nozzle (805) is fixedly connected to the surface of the second connecting pipe (804).
6. The infrared thermal imager protective chamber according to claim 1, characterized in that, Mounting holes are provided at all four corners of the mounting plate (1).