Automatic detection device and automatic detection system

Abstract

The utility model provides an automatic detection device and an automatic detection system, which are used for detecting semiconductor devices, and comprise sample containers, at least one sample container is suitable for containing a semiconductor device to be detected, and at least one sample container is suitable for containing a detected semiconductor device which has been detected, the detected semiconductor devices in the same sample container correspond to the same detection result; the detection assembly is used for detecting a to-be-detected semiconductor device and determining a detection result of the to-be-detected semiconductor device; and the device taking and placing device is suitable for taking out the to-be-detected semiconductor device from the sample container and placing the detected semiconductor device in the corresponding sample container according to the detection result of the detected semiconductor device. According to the utility model, the process automation of semiconductor device sampling and defect detection is realized, the cost is reduced, and the efficiency is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to semiconductor device detection technical field, specifically, relate to an automatic detection device and system. BACKGROUND

[0002] In the semiconductor device processing process, each process inevitably produces defects, and the defects on the semiconductor device will directly affect the service life and reliability. If the defective products flow into the next process, it will cause waste of production resources and cost, therefore, timely detection of defective products is of great importance to reduce the cost of semiconductor device processing.

[0003] In the existing semiconductor device processing process, the detection of defects mainly relies on manual identification by naked eye under strong light, which is not only low in efficiency, but also inaccurate in defect detection, and may exist in the case of false detection and missed detection.

[0004] In the existing defect detection technology, it is limited to visual recognition technology, and the detection result of the detected semiconductor device cannot be directly reflected after detection, and the semiconductor device with defects cannot be effectively distinguished, which affects the processing efficiency of the semiconductor device with defects and reduces the production efficiency. SUMMARY

[0005] A series of simplified concepts are introduced in the summary part, which will be further described in detail in the specific embodiment part. The summary part of the utility model does not mean to try to limit the key features and necessary technical features of the claimed technical solution, and even less means to determine the protection scope of the claimed technical solution.

[0006] In order to solve the above problems, the utility model is provided. According to one aspect of the utility model, an automatic detection device is provided for detecting semiconductor devices, comprising: a sample container, at least one of the sample containers is suitable for containing semiconductor devices to be detected, at least one of the sample containers is suitable for containing semiconductor devices that have been detected, wherein the semiconductor devices in the same sample container correspond to the same detection result; a detection assembly for detecting semiconductor devices to be detected and determining the detection result of the semiconductor devices to be detected; a device taking and placing device is suitable for taking out the semiconductor devices to be detected from the sample container, and placing the semiconductor devices that have been detected in the corresponding sample container according to the detection result of the semiconductor devices that have been detected.

[0007] In one embodiment of the utility model, a plurality of sample containers include at least one sample container to be detected, at least one qualified sample container and at least one defective sample container, the sample container to be detected is used to contain the semiconductor device to be detected, the qualified sample container is used to contain the detected semiconductor device with qualified detection result, and the defective sample container is used to contain the detected semiconductor device with defects.

[0008] In one embodiment of the utility model, the number of defective sample containers is multiple, and different defective sample containers are used to contain detected semiconductor devices of different defect types.

[0009] In one embodiment of the utility model, the detection assembly includes an image acquisition device, and the image acquisition device is suitable for acquiring the image of the semiconductor device to be detected.

[0010] In one embodiment of the utility model, the detection assembly further includes a semiconductor device bearing table, the semiconductor device bearing table is located below the image acquisition device and is suitable for bearing the semiconductor device to be detected.

[0011] In one embodiment of the utility model, the detection assembly further includes a data processing device, the data processing device is in communication connection with the image acquisition device, is suitable for receiving the image of the semiconductor device to be detected sent by the image acquisition device, and determines the detection result of the semiconductor device to be detected according to the image.

[0012] In one embodiment of the utility model, the detection assembly further includes a control device, the control device is in communication connection with the data processing device, is used for receiving the detection result of the semiconductor device to be detected, and controls the device taking and placing device to place the detected semiconductor device in the sample container corresponding to the detection result according to the detection result.

[0013] In one embodiment of the utility model, the detection assembly further includes a display device, the display device is in communication connection with the data processing device, and the display device is used for displaying the detection result.

[0014] In one embodiment of the utility model, the detection assembly further includes a driving assembly, the driving assembly is mechanically connected with the semiconductor device bearing table, and is suitable for adjusting the relative position between the semiconductor device to be detected on the semiconductor device bearing table and the image acquisition device.

[0015] In one embodiment of the utility model, the driving assembly is further mechanically connected with the image acquisition device, and is used for adjusting the relative position between the semiconductor device to be detected on the semiconductor device bearing table and the image acquisition device.

[0016] In one embodiment of the present application, the driving assembly comprises a first driving module, a second driving module and a third driving module, the first driving module and the second driving module are connected to the semiconductor device carrying table, and the third driving module is connected to the image acquisition device, wherein the first driving module is adapted to drive the semiconductor device carrying table to move in a first direction, the second driving module is adapted to drive the semiconductor device carrying table to move in a second direction, and the third driving module is adapted to drive the image acquisition device to move in a third direction.

[0017] In one embodiment of the present application, the detection assembly further comprises a bottom light source, which is connected below the semiconductor device carrying table and used to provide illumination for the semiconductor device to be detected.

[0018] In one embodiment of the present application, the detection assembly further comprises a top light source, which is located above the semiconductor device carrying table and used to provide illumination for the semiconductor device to be detected.

[0019] In one embodiment of the present application, the device further comprises a mounting bracket, the image acquisition device is mounted above the mounting bracket, and the semiconductor device carrying table is located below the mounting bracket, wherein the mounting bracket is provided with an opening corresponding to the lens of the image acquisition device.

[0020] In one embodiment of the present application, the device further comprises a rack, the rack has a containing space therein, and the containing space is used to contain the sample container, the image acquisition device, the semiconductor device carrying table, the data processing device and the device taking and placing device.

[0021] In one embodiment of the present application, the device further comprises a state indicating lamp, which is used to indicate whether the running state of the automatic detection device is normal.

[0022] According to one aspect of the present application, an automatic detection system is provided, which comprises the automatic detection device as described above.

[0023] The automatic detection device according to the embodiments of the present application realizes automatic taking and placing of semiconductor devices through the device taking and placing device, distinguishes the semiconductor devices to be detected from the semiconductor devices that have been detected, realizes process automation of semiconductor device sampling and defect detection, and can visualize the detection results, thereby not only reducing cost and improving efficiency, but also providing a reference for subsequent production process improvement. BRIEF DESCRIPTION OF DRAWINGS

[0024] The above and other objects, features and advantages of the present application will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings in which like reference characters refer to like elements throughout. The accompanying drawings are intended to provide a further understanding of the present application, and are incorporated and constitute a part of this specification, illustrate embodiments of the present application and explain the present application, but do not limit the present application. In the drawings, like reference numerals refer to like elements throughout.

[0025] Figure 1 Structure diagram of the automatic detection device of one embodiment of the present application;

[0026] Figure 2 Top view diagram of the automatic detection device of one embodiment of the present application;

[0027] Figure 3 Detailed structure diagram of the automatic detection device of one embodiment of the present application.

[0028] Legend of reference numerals:

[0029] 100-sample container carrying table, 110-sample container, 120-image acquisition device, 130-semiconductor device carrying table, 140-data processing device, 150-device taking and placing device, 160-display device, 170-driving assembly, 171-first driving module, 172-second driving module, 173-third driving module, 180-bottom light source, 190-top light source, 200-mounting bracket, 210-rack, 220-control device, 230-state indicator. DETAILED DESCRIPTION

[0030] In the following description, numerous specific details are set forth to provide a more thorough understanding of the present application. However, it will be apparent to one of skill in the art that the present application can be practiced without one or more of these specific details. In other instances, well-known features have not been described in order to avoid obscuring the present application.

[0031] It should be understood that the present application can be practiced with the elements in different forms and should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided so that the disclosure will be thorough and complete, and fully convey the scope of the present application to those skilled in the art. In the drawings, the size and relative sizes of layers and regions can be exaggerated for clarity. Like reference numerals designate like elements throughout.

[0032] It will be understood that when an element or layer is referred to as being "on" or "connected to" another element or layer, it can be directly on or connected to the other element or layer or intervening elements or layers can be present. In contrast, when an element is referred to as being "directly on" or "directly connected to" another element or layer, there are no intervening elements or layers present. It will be understood that, although the terms first, second, third, etc. can be used herein to describe various elements, components, regions, layers and / or sections, these elements, components, regions, layers and / or sections should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of the present application.

[0033] Spatially relative terms, such as "beneath", "below", "lower", "under", "above", "upper" and the like, can be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use and / or

[0034] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the present application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and / or "comprising", when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof. As used herein the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0035] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and / or the present specification, and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

[0036] In order to make the objectives, technical solutions and advantages of the present application more apparent, the following will describe the example embodiments according to the present application in detail with reference to the drawings. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments of the present application, and it should be understood that the present application is not limited by the example embodiments described herein. Based on the embodiments of the present application described in the present application, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of the present application.

[0037] Therefore, in view of the foregoing technical problems, the present application provides an automatic detection device.

[0038] Referring to the drawings Figures 1-2 The automatic detection device of an embodiment of the present application is exemplarily described. Figure 1 The structure schematic diagram of the automatic detection device of an embodiment of the present application;

[0039] Figure 2 The top view schematic diagram of the automatic detection device of an embodiment of the present application. The automatic detection device comprises: a sample container 110, a detection assembly, a device taking and placing device 150.

[0040] The at least one sample container 110 is adapted to contain the semiconductor devices to be detected, and the at least one sample container 110 is adapted to contain the detected semiconductor devices which have completed detection, wherein the detected semiconductor devices in the same sample container 110 correspond to the same detection result. By placing the detected semiconductor devices with the same detection result in the same sample container 110, the classification of the detected semiconductor devices can be realized, which is beneficial to improve the processing efficiency.

[0041] The detection assembly is used for detecting the semiconductor devices to be detected and determining the detection result of the semiconductor devices to be detected. The device taking and placing device 150 is adapted to take out the semiconductor devices to be detected from the sample container 110, and place the detected semiconductor devices in the corresponding sample container 110 according to the detection result of the detected semiconductor devices. The display device 160 is used for displaying the detection result. Optionally, the detection result includes but is not limited to qualified or defective, etc.

[0042] According to the automatic detection device, the automatic taking and placing of the semiconductor devices are realized through the device taking and placing device, the to-be-detected semiconductor devices and the detected semiconductor devices are distinguished, the process automation of the semiconductor device sampling and defect detection is realized, the detection results can be visualized, and the cost can be reduced, the efficiency can be improved, and reference can be provided for subsequent production process improvement.

[0043] Exemplarily, the semiconductor device can refer to a device made on a substrate such as a wafer through a semiconductor manufacturing process, the device can be a device that has completed all manufacturing processes, or can also be an intermediate device, and the wafer can be Si, SiGe, SiC, SiGeC, silicon-on-insulator (SOI) or silicon germanium on insulator (SGOI), but is not limited thereto.

[0044] Exemplarily, the sample container carrying table 100 can be a fixed platform or a conveying belt for conveying the sample containers 110, and when the sample containers 110 containing the detected semiconductor devices are full, the conveying belt can be used to transport the sample containers 110 to the next process link for processing, and the degree of automation is higher. Exemplarily, the top view shape of the sample container carrying table 100 can be a semicircular ring or other suitable ring structure, and the device taking and placing device 150 is located at a region substantially at the center of the ring structure, so that the distance between the device taking and placing device 150 and the sample containers 110 is substantially consistent, and the device taking and placing device 150 can conveniently grasp and store the heat-resistant semiconductor devices.

[0045] In one embodiment, the detection assembly comprises an image acquisition device 120, and the image acquisition device 120 is adapted to acquire an image of the to-be-detected semiconductor device. Exemplarily, the image acquisition device 120 comprises a lens and a camera, and when the camera receives a signal that the to-be-detected semiconductor device is in place, the lens starts to work. Optionally, the lens can be a lens of an optical microscope, so as to magnify the surface of the photographed semiconductor device. The camera can be used to acquire the image in the field of view of the lens, and then acquire the image of the surface of the semiconductor device.

[0046] In one embodiment, the detection assembly further comprises a semiconductor device carrying table 130, and the semiconductor device carrying table 130 is located below the image acquisition device 120 and is adapted to carry the to-be-detected semiconductor device. In some embodiments, a limiting piece can be further arranged on the semiconductor device carrying table 130, and the limiting piece is used to limit the semiconductor device placed on the semiconductor device carrying table 130.

[0047] In one embodiment, the number of defect sample containers is multiple, and different defect sample containers are used to contain the detected semiconductor devices of different defect types.

[0048] In one embodiment, the plurality of sample containers 110 includes at least one to-be-tested sample container, at least one qualified sample container, and at least one defective sample container. The to-be-tested sample container is used to store the to-be-tested semiconductor devices. The qualified sample container is used to store the tested semiconductor devices with qualified test results. The defective sample container is used to store the tested semiconductor devices with defective test results. The plurality of sample containers are used to store the to-be-tested samples and the samples with qualified and defective test results. The tested semiconductor devices with different defect types can also be placed in different sample containers 110, so as to store the samples (i.e., semiconductor devices) with defects according to different defect types.

[0049] The semiconductor devices without test results are stored in the to-be-tested sample container 110. The device taking and placing device 150 takes the to-be-tested semiconductor devices from the to-be-tested sample container 110 and places them on the semiconductor device carrying table 130. When the semiconductor devices are tested, the device taking and placing device 150 places the tested semiconductor devices in the corresponding sample container 110 according to the test results of the tested semiconductor devices on the semiconductor device carrying table 130. When the test result of the tested semiconductor device is qualified, the device taking and placing device 150 places the tested semiconductor device in the qualified sample container 110. When the test result of the tested semiconductor device is defective, the device taking and placing device 150 places the tested semiconductor device in the defective sample container 110.

[0050] For example, the defective sample containers are classified into different categories of defective sample containers according to the defect types of the semiconductor devices. Each defect type corresponds to at least one defective sample container, so as to classify and identify the multiple defects of the semiconductor devices and store them.

[0051] In one embodiment, the detection assembly further includes a driving assembly 170 mechanically connected to the semiconductor device carrying table 130 and adapted to adjust the relative position between the to-be-tested semiconductor devices on the semiconductor device carrying table 130 and the image acquisition device 120.

[0052] Since the size of the semiconductor device to be detected can be different, when the semiconductor device to be detected is placed on the semiconductor device carrier table 130, the image acquisition device 120 can completely acquire the surface image of the semiconductor device without changing the position of the semiconductor device carrier table 130 when acquiring a semiconductor device of a smaller size. However, when the image acquisition device 120 acquires a semiconductor device of a larger size, the surface image of the semiconductor device cannot be completely acquired, which can cause the automatic detection device to make an error in analyzing the defects of the semiconductor device or to detect a semiconductor device with defects as a qualified semiconductor device. Therefore, the driving assembly 170 is mechanically connected to the semiconductor device carrier table 130, and the relative position between the semiconductor device to be detected on the semiconductor device carrier table 130 and the image acquisition device 120 is adjusted by the driving assembly 170, so that the image acquisition device 120 can acquire images of different positions on the surface of the semiconductor device, ensuring that the automatic detection device can acquire image data of each part of the surface of the semiconductor device and preventing false detection and missed detection.

[0053] In one embodiment, the driving assembly 170 is also mechanically connected to the image acquisition device 120 for adjusting the relative position between the semiconductor device to be detected on the semiconductor device carrier table 130 and the image acquisition device 120.

[0054] When the distance between the image acquisition device 120 and the semiconductor device carrier table 130 in the vertical direction is too far, a clear image of the semiconductor device to be detected can not be acquired, or when the distance between the image acquisition device 120 and the semiconductor device carrier table 130 in the vertical direction is too close, a complete image of the semiconductor device to be detected can not be acquired, resulting in missed detection of defects of the semiconductor device. When the driving assembly 170 is connected to both the semiconductor device carrier table 130 and the image acquisition device 120, the semiconductor device carrier table 130 and the image acquisition device 120 can cooperate with each other, so that the distance between the image acquisition device 120 and the semiconductor device carrier table 130 in the vertical direction is adjustable to facilitate focusing of the lens and improve the clarity of the image, and the adjustment in the horizontal direction can ensure that the image acquisition device 120 can acquire images of different positions on the surface of the semiconductor device, ensuring that the automatic detection device can acquire image data of each part of the surface of the semiconductor device and preventing false detection and missed detection.

[0055] As shown in FIG. 1, the automatic detection device 100 includes a semiconductor device carrier table 130, an image acquisition device 120, a driving assembly 170, and a control device 140. Figure 3As shown, in one embodiment, the driving assembly 170 includes a first driving module 171, a second driving module 172, and a third driving module 173. The first driving module 171 and the second driving module 172 are connected to the semiconductor device carrier stage 130, and the third driving module 173 is connected to the image acquisition device 120. The first driving module 171 is adapted to drive the semiconductor device carrier stage 130 to move along a first direction; the second driving module 172 is adapted to drive the semiconductor device carrier stage 130 to move along a second direction; and the third driving module 173 is adapted to drive the image acquisition device 120 to move in a third direction. The first direction is also known as a first horizontal direction, the second direction is also known as a second horizontal direction, and the third direction is also known as a vertical direction. The first horizontal direction is different from the second horizontal direction. For example, the first horizontal direction and the second horizontal direction are perpendicular.

[0056] The first drive module 171 and the second drive module 172 of the drive assembly 170 move the semiconductor device carrier stage 130 horizontally to ensure that the semiconductor device under test on the semiconductor device carrier stage 130 is within the observation range of the image acquisition device 120. The third drive module 173 of the drive assembly 170 moves the image acquisition device 120 vertically to ensure that the vertical distance between the image acquisition device 120 and the semiconductor device carrier stage 130 is adjustable to facilitate lens focusing and improve image clarity. Horizontal adjustability ensures that the image acquisition device 120 can acquire images from different positions on the surface of the semiconductor device, thus automating image acquisition from multiple perspectives. For example, the first horizontal direction is perpendicular to the second horizontal direction on the horizontal plane.

[0057] For example, as shown in the appendix Figure 3 As shown, the first drive module 171 and the second drive module 172 of the drive assembly 170 are located below the semiconductor device carrier stage 130, and the third drive module 173 of the drive assembly 170 is located behind the image acquisition device 120.

[0058] In one embodiment, as shown in the appendix Figure 3 As shown, the detection assembly also includes a bottom light source 180, which is connected below the semiconductor device carrier stage 130 to provide illumination for the semiconductor device under test. The bottom light source 180 provides illumination conditions for the semiconductor device under test according to specific illumination parameters. The bottom light source 180 is fixed below the semiconductor device carrier stage 130 to ensure that the semiconductor device under test receives good illumination conditions on the semiconductor device carrier stage 130, thus automating image acquisition under multiple illumination conditions. In some embodiments, the bottom light source 180 and the semiconductor device carrier stage 130 can be integrally formed. In some embodiments, the semiconductor device carrier stage 130 can also be implemented using an adsorption carrier stage with adsorption properties.

[0059] Exemplarily, when there is no semiconductor device to be detected on the semiconductor device carrier 130, the bottom light source 180 is in an off state, and when the semiconductor device carrier 130 is placed with the semiconductor device to be detected, the bottom light source 180 is in an on state.

[0060] In an embodiment, as shown in FIG. 1, the detection assembly further comprises a top light source 190 located above the semiconductor device carrier 130 for providing illumination for the semiconductor device to be detected. Figure 3 The top light source 190 provides illumination conditions for the semiconductor device to be detected according to specific illumination parameters, so that the image acquisition device 120 can obtain good illumination conditions when acquiring the image of the semiconductor device to be detected, and the automation of image acquisition under multiple illumination conditions is achieved.

[0061] Exemplarily, when the semiconductor device carrier 130 is away from the image acquisition device 120, the top light source 190 is in an off state, and when the semiconductor device carrier 130 is close to the image acquisition device 120, the top light source 190 is in an on state.

[0062] In an embodiment, the detection assembly further comprises a data processing device 140 communicatively connected to the image acquisition device 120, and adapted to receive the image of the semiconductor device to be detected sent by the image acquisition device 120, and determine the detection result of the semiconductor device to be detected according to the image. Optionally, the detection result includes but is not limited to qualified or defective, etc.

[0063] Exemplarily, the data processing device 140 can comprise a processor and a memory. The processor can be implemented by software, hardware, firmware or any combination thereof, and can use a circuit, a single or multiple Application Specific Integrated Circuits (ASICs), a single or multiple general-purpose integrated circuits, a single or multiple microprocessors, a single or multiple programmable logic devices, or any combination of the foregoing circuits and / or devices, or other suitable circuits or devices.

[0064] The memory is used to store instructions executed by the processor, and can also store detection results, analysis reports, etc. The memory can be a flash card, a solid state memory, a hard disk, etc. It can be a volatile memory and / or a non-volatile memory, a removable memory and / or a non-removable memory, etc.

[0065] In some embodiments, the data processing apparatus 140, for example, a processor of the data processing apparatus 140, can receive the image of the semiconductor device to be detected sent by the image acquisition apparatus, and perform recognition processing on the image to determine whether the semiconductor device to be detected is a qualified semiconductor device or a defective semiconductor device. Alternatively, in some embodiments, the data processing apparatus 140 can also determine the defect type of the defective semiconductor device through image recognition, so as to classify the detected semiconductor devices of different types of defects.

[0066] Exemplarily, the device pick-and-place apparatus 150 includes a mechanical arm, which takes out the semiconductor device to be detected in the sample container 110 and places it on the semiconductor device support table 130, and according to the detection result of the detected semiconductor device on the semiconductor device support table 130, places the detected semiconductor device in the corresponding sample container 110, realizing the automation of sample pick-and-place.

[0067] In one embodiment, the detection assembly further includes a control apparatus 220, which is in communication connection with the data processing apparatus 140, and is used to receive the detection result of the semiconductor device to be detected, and control the device pick-and-place apparatus 150 to place the detected semiconductor device in the sample container 110 corresponding to the detection result.

[0068] When the semiconductor device to be detected is stored in the sample container 110 of the sample container support table 100, the control apparatus 220 controls the device pick-and-place apparatus 150 to take out the semiconductor device to be detected from the sample container 110 and place it on the semiconductor device support table 130. When the semiconductor device is detected, the control apparatus 220 controls the device pick-and-place apparatus 150 to place the detected semiconductor device in the sample container 110 corresponding to the detection result.

[0069] Exemplarily, the control apparatus 220 includes a mechanical arm control system, which controls the mechanical arm to take out the semiconductor device to be detected from the sample container 110 when the semiconductor device to be detected is stored in the sample container 110 of the sample container support table 100, and places it on the semiconductor device support table 130. When the semiconductor device is detected, the mechanical arm control system controls the mechanical arm to place the detected semiconductor device in the sample container 110 corresponding to the detection result.

[0070] In an embodiment, the display device 160 is communicatively connected to the data processing device 140, and the display device 160 is configured to display the detection result. The display device 160 can be a display configured to display the detection result on a display interface. As an example, the display can be a touch display screen, a liquid crystal display screen, or the like, or can also be a separate liquid crystal display, a television, or the like separate display device; or, the display can also be a display screen of a smart phone, a tablet computer, or the like electronic device, and the like. The number of displays can be one or more.

[0071] In the process of detecting defects of the semiconductor device, multiple links need to be cooperated with each other. In order to better monitor the defect detection process, the defect detection process is displayed in real time on the display device 160, so as to facilitate the workers to better control and adjust the defect detection process. The number and type of surface defects of the semiconductor device have analysis significance. After the data processing device 140 determines the detection result of the semiconductor device to be detected, the display device can be directly controlled to display the detection result, or the data processing device 140 can also control the defect detection result after statistical analysis to be displayed in real time on the display device 140, which can be referred to by the workers, so that the workers can better analyze the process of the semiconductor device and improve the subsequent defect detection process, and realize data analysis and visualization of the detection result.

[0072] Exemplarily, the display device 160 can display a surface defect detection result analysis report of the semiconductor device in real time, and the analysis report is obtained by comprehensive analysis of the number and type of surface defects of the semiconductor device and the like.

[0073] In an embodiment, the device further comprises a mounting bracket 200, the image acquisition device 120 is mounted above the mounting bracket 200, and the semiconductor device carrying table 130 is located below the mounting bracket 200, wherein the mounting bracket 200 is provided with an opening corresponding to the lens of the image acquisition device 120.

[0074] The top light source 190 is mounted on the mounting bracket 200, and the top light source 190 is located above the semiconductor device carrying table 130. The top light source 190 and the semiconductor device carrying table 130 are spaced apart by the mounting bracket 200. The opening provided on the mounting bracket 200 is used for the lens of the image acquisition device 120 to acquire the image of the semiconductor device to be detected. Exemplarily, the opening is circular, and the diameter of the opening is greater than the maximum diameter of the lens.

[0075] Exemplarily, the mounting bracket 200 is also used to fix the first driving module 171, the second driving module 172 and the third driving module 173 of the driving assembly 170. The first driving module 171 and the second driving module 172 of the driving assembly 170 are located below the mounting bracket 200, and the third driving module 173 of the driving assembly 170 is located above the mounting bracket 200.

[0076] In an embodiment, the device further comprises a rack 210, and the rack 210 has a containing space for containing the sample container 110, the image acquisition device 120, the semiconductor device carrying table 130, the data processing device 140 and the device taking and placing device 150.

[0077] The containing space comprises an upper space and a lower space. The upper space is used for containing the sample container 110, the image acquisition device 120, the semiconductor device carrying table 130, the device taking and placing device 150, the display device 160, the driving assembly 170, the bottom light source 180, the top light source 190 and the mounting bracket 200. The lower space is used for containing the data processing device 140 and the control device 220. In order to facilitate the staff to view the defect detection process and the detection result in time, the display device 160 is installed on the outer side wall of the rack 210.

[0078] In an embodiment, the device further comprises a state indicating lamp 230, and the state indicating lamp 230 is used to indicate whether the running state of the automatic detection device is normal. Exemplarily, when the state indicating lamp 230 is red, it indicates that the running state of the automatic detection device is not normal; when the state indicating lamp 230 is green, it indicates that the running state of the automatic detection device is normal. This facilitates the staff to view the running state of the automatic detection device at any time and to adjust the defect detection process at any time.

[0079] The structure of the automatic detection device of the present application has been introduced so far. The complete automatic detection device can also comprise other component structures, which are not described here.

[0080] According to the automatic detection device of the present application, the automatic detection device of the present application, the device taking and placing device is used to realize the automatic taking and placing of the semiconductor device, the to-be-detected semiconductor device and the detected semiconductor device are distinguished, the data processing device is used to determine the detection result of the detected semiconductor device according to the image of the to-be-detected semiconductor device collected by the image processing device, and the display device is used to realize the visualization of the detection process and the detection result analysis report. The full-process automation of the semiconductor device sampling, image acquisition, defect detection and classification recycling is realized, the detection result can be visualized, the cost can be reduced, the efficiency can be improved, and the subsequent production process improvement can be provided with reference.

[0081] In addition to the automatic detection device described above, the utility model also provides an automatic detection system, this automatic detection system includes automatic detection device, specifically can be the automatic detection device provided in any one embodiment above, the beneficial effect can be corresponding reference above each embodiment. Other parts of the automatic detection system please refer to prior art, this paper will not repeat.

[0082] Although the example embodiments have been described herein with reference to the accompanying drawings, it is to be understood that the example embodiments are only exemplary and are not intended to limit the scope of the utility model. Those of ordinary skill in the art can make various changes and modifications without departing from the scope and spirit of the utility model. All these changes and modifications are intended to be included in the scope of the utility model claimed by the appended claims.

[0083] Those of ordinary skill in the art can realize that the units and algorithm steps of each example described in combination with the embodiments disclosed herein can be realized in electronic hardware, or a combination of computer software and electronic hardware. Whether the functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Those of ordinary skill in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of the utility model.

[0084] In several embodiments provided in the present application, it should be understood that the disclosed devices and methods can be implemented in other ways. For example, the device embodiments described above are only schematic, for example, the division of the units is only a logical function division, and actual implementation can have another division manner, for example, multiple units or components can be combined or integrated into another device, or some features can be ignored or not executed.

[0085] In the specification provided herein, a large number of specific details are described. However, it can be understood that the embodiments of the utility model can be practiced without these specific details. In some examples, well-known methods, structures and techniques are not shown in detail in order not to obscure the understanding of the present specification.

[0086] Similarly, it is to be understood that the embodiments of the present application can be positioned and described in many different fashions, and that the description of the embodiments of the present application as reflected in the exemplary embodiments described herein includes alternate embodiments. Therefore, the embodiments of the present application should not be construed as reflecting an exhaustive list of aspects in which the present application can be practiced. Moreover, it should be noted that the terms "comprises" and "comprising" are used herein in a perm issive sense, and that the term "comprises" is intended to allow for additional

[0087] Those skilled in the art will appreciate that all features described herein (including all companion claims, abstract and drawings) can be taken in combination with any and all other features described herein, and that where mutually exclusive features are described, only one of the mutually exclusive features can be employed. Each feature disclosed in this specification (including any accompanying claims, abstract and drawings) can be replaced by alternative features serving the same, equivalent or a similar purpose, unless expressly stated otherwise.

[0088] Furthermore, those skilled in the art will recognize that references in the specification to "one embodiment", "an embodiment", "an example embodiment", means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the application. The appearances of the phrase "in one embodiment" in various places in the specification are not necessarily all referring to the same embodiment, nor are they necessarily referring to a single, "one embodiment".

[0089] Various components of the present application can be implemented in hardware, or as software modules running in one or more processors, or combinations thereof. Those skilled in the art will appreciate that a microprocessor or digital signal processor (DSP) can be used in practice to implement some or all of the functionality of some of the modules according to embodiments of the present application. The present application can also be implemented as a program (for example, computer program and computer program product) for executing any or all of the methods described herein on a computer system. Such a program can be stored on a computer readable medium, or can be available for download over the Internet or from a carrier signal. Such a program can be available from a website, from a downloadable cloud storage location, or from any other location in the art.

[0090] It should be noted that the above embodiments illustrate the present application rather than limit the present application, and alternative embodiments can be designed by those skilled in the art without departing from the scope of the appended claims. In the claims, any reference signs placed between parentheses shall not be construed as limiting the claim. The word comprising does not exclude the presence of elements or steps not listed in the claims. The word a or an preceding an element does not exclude the presence of a plurality of such elements. The application can be implemented by means of both hardware and software, and the present application can be implemented by means of a suitably programmed computer. In a unit claim enumerating several means, the several means can be embodied by one and the same item of hardware. The use of the words first, second and third, etc. does not imply any ordering. These words have been used to name the elements for ease of use only.

[0091] The above description is merely a specific implementation or explanation of the present application, and the protection scope of the present application is not limited thereto. Any skilled person in the art can easily think of changes or replacements within the technical range disclosed by the present application, and all of them should be covered within the protection scope of the present application. The protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. An automatic detection device, characterized in that, For detecting semiconductor devices, comprising: sample containers, at least one of which is adapted to hold semiconductor devices to be detected, and at least one of which is adapted to hold detected semiconductor devices that have completed detection, wherein the detected semiconductor devices in the same sample container correspond to the same detection result; a detection assembly for detecting semiconductor devices to be detected and determining the detection result of the semiconductor devices to be detected; a device pick-and-place device adapted to pick up the semiconductor devices to be detected from the sample containers and place the detected semiconductor devices corresponding to the detection result of the detected semiconductor devices in the corresponding sample containers.

2. The automatic detection device according to claim 1, wherein: a plurality of sample containers include at least one to-be-tested sample container, at least one qualified sample container, and at least one defective sample container, the to-be-tested sample container is used to hold semiconductor devices to be detected, the qualified sample container is used to hold detected semiconductor devices with a qualified detection result, and the defective sample container is used to hold detected semiconductor devices with a defective detection result.

3. The automatic detection device of claim 2, wherein, The number of defective sample containers is multiple, and different defective sample containers are used to hold detected semiconductor devices with different defect types.

4. The automatic detection device according to any one of claims 1 to 3, characterized in that The detection assembly comprises: an image acquisition device adapted to acquire images of semiconductor devices to be detected.

5. The automatic detection device of claim 4, wherein, The detection assembly further comprises: a semiconductor device support table located below the image acquisition device and adapted to support semiconductor devices to be detected.

6. The automatic detection device of claim 5, wherein The detection assembly further comprises: a data processing device, which is in communication with the image acquisition device, is adapted to receive images of semiconductor devices to be detected sent by the image acquisition device, and determines the detection result of the semiconductor devices to be detected according to the images.

7. The automatic detection device of claim 6, wherein The detection assembly further comprises a control device, which is in communication with the data processing device and is used to receive the detection result of the semiconductor devices to be detected and control the device pick-and-place device to place the detected semiconductor devices in the sample container corresponding to the detection result.

8. The automatic detection apparatus of claim 6, wherein The detection assembly further comprises: a display device in communication with the data processing device, which is used to display the detection result.

9. The automatic detection apparatus of claim 5, wherein The detection assembly further comprises a driving assembly, which is mechanically connected to the semiconductor device support table and is adapted to adjust the relative position between semiconductor devices to be detected on the semiconductor device support table and the image acquisition device.

10. The automatic detection device of claim 9, wherein, The driving assembly is also mechanically connected to the image acquisition device and is used to adjust the relative position between semiconductor devices to be detected on the semiconductor device support table and the image acquisition device.

11. The automatic detection device of claim 10, wherein, The driving assembly comprises a first driving module, a second driving module, and a third driving module, the first driving module and the second driving module are connected to the semiconductor device support table, and the third driving module is connected to the image acquisition device, wherein: the first driving module is adapted to drive the semiconductor device support table to move in a first direction; The second driving module is adapted to drive the semiconductor device carrying table to move in a second direction. The third driving module is adapted to drive the image acquisition device to move in a third direction.

12. The automatic detection apparatus of claim 5, wherein The detection assembly further comprises a bottom light source connected below the semiconductor device carrying table for providing illumination for the semiconductor device to be detected.

13. The automatic detection apparatus of claim 5, wherein The detection assembly further comprises a top light source located above the semiconductor device carrying table for providing illumination for the semiconductor device to be detected.

14. The automatic detection apparatus of claim 5, wherein Further comprising a mounting bracket, the image acquisition device is mounted above the mounting bracket, and the semiconductor device carrying table is located below the mounting bracket, wherein the mounting bracket is provided with an opening corresponding to the lens of the image acquisition device.

15. The automatic detection apparatus of claim 6, wherein Further comprising a rack, the rack has a containing space therein, and the containing space is used for containing the sample container, the image acquisition device, the semiconductor device carrying table, the data processing device and the device taking and placing device.

16. The automatic detection device according to claim 1, wherein, The device further comprises a state indicating lamp. The state indicating lamp is used for indicating whether the running state of the automatic detection device is normal.

17. An automated inspection system, comprising: The device comprises: The automatic detection device according to any one of claims 1 to 16.

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