Multi-light compensation device for chip dispensing detection

Abstract

The utility model relates to the technical field of test auxiliary equipment, in particular to a multi-light compensation device for chip dispensing detection, which comprises an image collector and a double-color light source for supplementing light to a chip, the double-color light source comprises an annular light source main body, and a red light source and a blue light source which are arranged on the light source main body, the middle of the light source body is hollowed out, and the image collector is located above the double-color light source and right faces the hollowed-out middle of the light source body. The chip channel is used for allowing the chip to move, the blocking piece comprises a blocking rod capable of moving, the moving direction of the blocking rod is perpendicular to the moving direction of the chip on the chip channel, the side edge of the blocking rod can make contact with the chip, and the double-color light source is arranged above the blocking rod. By adopting the scheme, light source supplementation can be performed for image acquisition in the chip production process, and the definition of the acquired image is improved.

Description

Technical Field

[0001] This utility model relates to the technical field of testing auxiliary equipment, specifically a multi-light compensation device for chip dispensing inspection. Background Technology

[0002] In the chip manufacturing process, various inspections are required, such as solder joint inspection, which uses image analysis to determine whether the solder joints on the chip meet the requirements; adhesive dispensing inspection, which uses image analysis to determine whether the adhesive on the chip meets the requirements; and surface inspection, which uses image analysis to determine whether the chip surface meets the requirements, etc. These diverse inspections ensure the quality of chip production. To improve production efficiency, chip manufacturing equipment is developing towards automation and intelligence, with most inspection items shifting from manual to automatic. Since automatic chip inspection largely relies on image analysis, the image clarity acquired by the CCD camera largely determines the accuracy of the inspection.

[0003] In the current chip manufacturing process, there are many pieces of equipment involved, and the light on site can easily be blocked by other equipment, resulting in insufficient light when the CCD camera acquires images. In some cases, the equipment's shadow may be projected onto the chip, interfering with the acquired image and reducing the clarity of the acquired image, thereby reducing the accuracy of related testing items. Utility Model Content

[0004] The present invention aims to provide a multi-light compensation device for chip dispensing inspection, which can supplement the light source for image acquisition during chip manufacturing process and improve the clarity of the acquired images.

[0005] This utility model provides the following basic solution:

[0006] A multi-light compensation device for chip dispensing inspection includes an image acquisition unit and a dual-color light source for supplementing illumination to the chip. The dual-color light source includes a ring-shaped light source body, and a red light source and a blue light source disposed on the light source body. The center of the light source body is hollowed out, and the image acquisition unit is located above the dual-color light source, with the image acquisition unit facing the hollowed-out center.

[0007] Furthermore, both the red and blue light sources are circumferentially distributed with the axis of the light source body as the axis.

[0008] Furthermore, it also includes a mounting rod, on which the image acquisition device and the dual-color light source are both mounted, and the image acquisition device and the dual-color light source are slidably connected to the mounting rod.

[0009] Furthermore, it also includes a blocking element and a chip channel for chip movement. The blocking element includes a movable blocking rod whose movement direction is perpendicular to the chip's movement direction on the chip channel. The side of the blocking rod can contact the chip, and a dual-color light source is located above the blocking rod.

[0010] Furthermore, it also includes a side abutment, which includes a movable barrier plate. The moving direction of the barrier plate is perpendicular to the moving direction of the chip in the chip channel. The end of the barrier plate can abut against the chip, and the dual-color light source is directly facing the end of the barrier plate.

[0011] Furthermore, the blue light source is moved away from the image acquisition device.

[0012] Furthermore, the chip channel is tilted, and the chip moves from high to low along the chip channel.

[0013] Furthermore, the chip channel has a strip-shaped groove for chip movement, and a strip-shaped guide rail is provided at the bottom of the groove. The length direction of the strip-shaped guide rail is parallel to the length direction of the groove, and the bottom of the chip contacts the strip-shaped guide rail.

[0014] The beneficial effects of the basic scheme:

[0015] 1. The dual-color light source provides multiple supplementary lighting sources to supplement the light source for different detection items. For example, a red light source is used for light compensation during soldering detection, while a blue light source is used for light supplementation during dispensing detection. Light supplementation is tailored to the object being detected, improving the imaging accuracy and recognition of the acquired images. The red and blue light sources are circumferentially distributed, meaning each light source forms a ring. This design serves two purposes: first, it makes the light source softer and the light distribution on the chip surface more uniform, resulting in a clearer chip image; second, it avoids the light source being concentrated in one point, which can hinder coordination between the light source and the image acquisition unit. For example, if the image acquisition unit is directly facing the chip, and the light source is concentrated, to achieve light supplementation, the light source needs to be positioned on one side of the chip, making the light intensity on the side closer to the light source greater than on the other side, resulting in uneven light distribution. This would affect the accuracy of the detection results based on the acquired images. This design reduces the coordination interference between the dual-color light source and the image acquisition unit, improving the clarity of the acquired images.

[0016] 2. The mounting rod provides mounting components for the image acquisition unit and the dual-color light source. Based on the chip manufacturing equipment, the height of the image acquisition unit and the dual-color light source can be adjusted to adapt to image detection in different chip manufacturing equipment.

[0017] 3. The chip channel setup restricts the chip's movement path. The blocking components obstruct the chip at designated locations, ensuring it remains in its designated position for production operations such as dispensing, soldering, and image acquisition. Simultaneously, side abutments abut against the chip at designated locations, pushing it against the chip channel to secure it. By fixing the chips, each chip is ensured to be in the same position during its corresponding production operation. For example, in image detection, acquiring images from the same location reduces the system memory required for image recognition and analysis, increases image recognition speed, and thus improves production efficiency.

[0018] 4. The chip channel is tilted, allowing the chip to slide freely within the channel, reducing the equipment required for chip movement and lowering production costs. The slotted design accommodates the chip and allows it to move within the slot. The strip-shaped guide rails, along with the sides of the slots, limit the chip's movement and provide support, reducing damage caused by collisions between chip pins and the chip channel during movement. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the structure of a multi-light compensation device for chip dispensing inspection according to a first embodiment of the present invention;

[0020] Figure 2 This is a schematic diagram of the structure of one side of the abutment, blocking component, and chip channel of the multi-light compensation device for chip dispensing inspection according to an embodiment of the present invention;

[0021] Figure 3 This is a schematic diagram of the structure of one side of the abutment and blocking component in an embodiment of the multi-light compensation device for chip dispensing inspection according to this utility model;

[0022] Figure 4 This is a schematic diagram of the structure of a second embodiment of the multi-light compensation device for chip dispensing inspection according to the present invention. Detailed Implementation

[0023] The following detailed description illustrates the specific implementation method:

[0024] The reference numerals in the accompanying drawings include: mounting rod 1, image acquisition device 2, dual-color light source 3, side abutment 4, blocking component 5, chip channel 6, base plate 7, blocking rod 8, first cylinder 9, blocking plate 10, second cylinder 11, short support column 12, and long support column 13.

[0025] Example 1

[0026] Multi-light compensation device for chip dispensing inspection, as shown in the attached Figure 1As shown, the system includes a mounting rod 1, an image acquisition unit 2, and a dual-color light source 3 for supplementing illumination to the chip. Both the image acquisition unit 2 and the dual-color light source 3 are mounted on the mounting rod 1 and are slidably connected to it. Specifically, the image acquisition unit 2 and the dual-color light source 3 are mounted on the mounting rod 1 via clamps. When height adjustment is required, the bolts are loosened to release the clamps, the image acquisition unit 2 and the dual-color light source 3 are moved to the corresponding height, and then the bolts are tightened to secure the clamps. The mounting rod 1 provides a mounting component for the image acquisition unit 2 and the dual-color light source 3. Based on the chip manufacturing equipment, the height of the image acquisition unit 2 and the dual-color light source 3 can be adjusted to adapt to image detection in different chip manufacturing equipment.

[0027] The dual-color light source 3 includes a ring-shaped light source body, and red and blue light sources disposed on the light source body. In this embodiment, the light source body is connected to the clamp by bolts, and the red and blue light sources are embedded in the light source body. The center of the light source body is hollowed out, and the red and blue light sources are distributed circumferentially around the axis of the light source body, that is, the red and blue light sources are distributed in a ring. The blue light source is away from the image acquisition device 2. In this embodiment, the red light source is located above the blue light source.

[0028] Image acquisition device 2 is located above the dual-color light source 3, and is directly opposite the central cutout, which is directly opposite the chip. Image acquisition device 2 acquires images of the chip through the central cutout. In this embodiment, image acquisition device 2 is connected to the clamping device by bolts, and image acquisition device 2 uses an existing CCD camera.

[0029] As attached Figure 2 As shown, it also includes a side abutment 4, a blocking member 5, and a chip channel 6 for chip movement. The chip channel 6 has a strip-shaped groove for chip movement, and a strip-shaped guide rail is provided at the bottom of the groove. The length direction of the strip-shaped guide rail is parallel to the length direction of the groove, and the bottom of the chip contacts the strip-shaped guide rail. The chip channel 6 is located below the dual-color light source 3. The chip channel 6 and the mounting rod 1 are mounted on the base plate 7. In this embodiment, the chip channel 6 and the base plate 7 are connected by bolts, and the mounting rod 1 and the base plate 7 are also connected by bolts.

[0030] As attached Figure 3As shown, the blocking component 5 includes a movable blocking rod 8. The moving direction of the blocking rod 8 is perpendicular to the moving direction of the chip on the chip channel 6. The side of the blocking rod 8 can contact the chip. The dual-color light source 3 is located above the blocking rod 8. Specifically, the blocking component 5 also includes a first cylinder 9, which includes a piston rod. The piston rod of the first cylinder 9 is connected to the blocking rod 8. The extension and retraction direction of the piston rod of the first cylinder 9 is perpendicular to the moving direction of the chip on the chip channel 6. In this embodiment, the first cylinder 9 is bolted to the base plate 7. The piston rod of the first cylinder 9 is bolted to the slider. The blocking rod 8 is connected to the end of the slider away from the first cylinder 9. The slider and the blocking rod 8 are integrally formed.

[0031] The side abutment 4 includes a movable baffle plate 10. The moving direction of the baffle plate 10 is perpendicular to the moving direction of the chip on the chip channel 6. The end of the baffle plate 10 can abut against the chip, and the dual-color light source 3 is directly opposite the end of the baffle plate 10. Specifically, the side abutment 4 also includes a second cylinder 11, which includes another piston rod. The piston rod of the second cylinder 11 is connected to the baffle plate 10, and the extension and retraction direction of the piston rod of the second cylinder 11 is perpendicular to the moving direction of the chip on the chip channel 6. In this embodiment, the second cylinder 11 is bolted to the base plate 7, and the piston rod of the second cylinder 11 is bolted to another slider. The baffle plate 10 is bolted to the top of the slider.

[0032] During operation, the chip moves along chip channel 6. The first cylinder 9 controls the extension of the blocking rod 8, which is positioned on the chip's movement path, and the chip contacts the blocking rod 8. The second cylinder 11 controls the extension of the blocking plate 10, which contacts the chip and pushes it towards the wall of the slot, thus fixing the chip in place. At this time, the chip is directly below the dual-color light source 3. The image acquisition device 2 acquires an image of the chip. After image acquisition, the first cylinder 9 and the second cylinder 11 respectively control the blocking rod 8 and the blocking plate 10 to reset. Then, the first cylinder 9 controls the extension of the blocking rod 8, awaiting the next chip.

[0033] This solution utilizes a dual-color light source 3, providing multiple supplementary lighting sources to address different detection requirements, thereby improving the imaging and recognition accuracy of the acquired images. The two light sources are arranged in rings, resulting in softer light and uniform light distribution across the chip surface, leading to clearer chip images. The blocking element 5 and side-blocking element 4 obstruct and fix the chip at designated locations, ensuring that each chip is positioned identically during corresponding production operations. For example, in image detection, acquiring images from the same location reduces the system's computational memory usage for image recognition and analysis, increasing image recognition speed and thus improving production efficiency.

[0034] Example 2

[0035] The difference between this embodiment and Embodiment 1 is that:

[0036] In multi-light compensation devices used for chip dispensing inspection, such as... Figure 4 As shown, the chip channel 6 is tilted, and the chip moves from high to low along the chip channel 6. Specifically, the base plate 7 is tilted, and the bottom of the base plate 7 is provided with multiple short pillars 12 and multiple long pillars 13. The short pillars 12 are evenly distributed on one side of the bottom of the base plate 7, and the long pillars 13 are evenly distributed on the other side of the bottom of the base plate 7. The tilting of the base plate 7 is achieved by the short pillars 12 and the long pillars 13. In this embodiment, the length of the long pillar 13 is greater than that of the short pillar 12, and there are two of each type of pillar. The base plate 7 is connected to the short pillars 12 and the long pillars 13 by bolts.

[0037] By using this solution, the base plate 7 is tilted, which allows the chip channel 6 to tilt, enabling the chip to slide freely within the chip channel 6. This reduces the equipment required for chip movement and lowers production costs.

[0038] The above descriptions are merely embodiments of this utility model. Commonly known structures and characteristics are not described in detail here. Those skilled in the art are aware of all common technical knowledge in the field prior to the application date or priority date, are knowledgeable of all existing technologies in that field, and possess the ability to apply conventional experimental methods prior to that date. Therefore, those skilled in the art can, based on the guidance provided in this application, improve and implement this solution in conjunction with their own capabilities. Typical known structures or methods should not be obstacles for those skilled in the art to implement this application. It should be noted that those skilled in the art can make several modifications and improvements without departing from the structure of this utility model. These modifications and improvements should also be considered within the scope of protection of this utility model, and will not affect the effectiveness of the implementation of this utility model or the practicality of the patent. The scope of protection claimed in this application should be determined by the content of its claims, and the specific embodiments described in the specification can be used to interpret the content of the claims.

Claims

1. A multi-light compensation device for die dispensing detection, characterized in that: The application relates to a double-color light source for supplementing light for a chip, which comprises an image collector and the double-color light source, wherein the double-color light source comprises a ring-shaped light source body, a red light source and a blue light source arranged on the light source body, and a hollow middle part of the light source body; the image collector is arranged above the double-color light source and faces the hollow middle part. 2.The multi-light compensation device for chip dispensing detection according to claim 1, wherein: The red light source and the blue light source are distributed in a circumferential direction of the axial direction of the light source body. 3.The multi-light compensation device for chip dispensing detection according to claim 2, wherein: The application further comprises a mounting rod, and the image collector and the double-color light source are sleeved on the mounting rod and are in sliding connection with the mounting rod.

4. The multi-light compensation device for chip dispensing detection according to claim 3, wherein: The application further comprises a blocking piece and a chip channel for moving the chip, wherein the blocking piece comprises a movable blocking rod, the moving direction of the blocking rod is perpendicular to the moving direction of the chip on the chip channel, the side edge of the blocking rod can contact the chip, and the double-color light source is arranged above the blocking rod.

5. The multi-light compensation device for chip dispensing detection according to claim 4, wherein: The application further comprises a side abutting piece, wherein the side abutting piece comprises a movable blocking plate, the moving direction of the blocking plate is perpendicular to the moving direction of the chip on the chip channel, the end of the blocking plate can abut against the chip, and the double-color light source faces the end of the blocking plate.

6. The multi-light compensation device for chip dispensing detection according to claim 5, wherein: The blue light source is away from the image collector.

7. The multi-light compensation device for die dispensing detection according to any one of claims 1-6, wherein: The chip channel is arranged in an inclined manner, and the chip moves from high to low along the chip channel. 8.The multi-light compensation device for chip dispensing detection of claim 7, wherein: The chip channel is provided with a strip-shaped groove for moving the chip, the groove bottom of the strip-shaped groove is provided with a strip-shaped guide rail, the length direction of the strip-shaped guide rail is parallel to the length direction of the strip-shaped groove, and the bottom of the chip contacts the strip-shaped guide rail.

Images