Wafer detection equipment
By introducing a height sensor and a moving mechanism into the wafer inspection equipment, the height of the wafer stage is adjusted to maintain the distance between the inspection area and the image acquisition module, thus solving the focusing difficulty caused by changes in wafer thickness and improving imaging clarity and inspection efficiency.
Patent Information
- Application Number
- CN202422839617.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-20
- Publication Date
- 2025-12-12
- Estimated Expiration
- 2034-11-20
AI Technical Summary
Existing wafer inspection equipment suffers from focusing difficulties and unclear imaging due to changes in wafer thickness when moving within the inspection area. Existing autofocus technology also suffers from lag and lens vibration.
The system employs a wafer stage, an image acquisition module, an image processing module, a height sensor, and vertical and horizontal movement mechanisms. The height of the wafer stage is adjusted by the height sensor to ensure that each detection area maintains a consistent distance from the image acquisition module, thus avoiding the vibration effects caused by the up-and-down movement of the lens.
It enables each detection area to be in focus without adjusting the image acquisition module vertically, reducing focusing difficulty, improving image quality, and avoiding the impact of lens vibration on imaging.
Smart Images
Figure CN223664531U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of semiconductor detection equipment, in particular to a wafer detection equipment. BACKGROUND
[0002] The wafer production process of the semiconductor industry has many steps, and the product is complex, precise and expensive to manufacture. Defects on the wafer can cause functional problems in the product. Therefore, high-precision detection of semiconductors is an important link in the semiconductor industry, affecting subsequent process, product yield, manufacturing cost, etc. Since the thickness of a wafer is not equal everywhere, and the range of high-precision detection is limited, when the detection area moves, the change in wafer thickness may cause false focus, and the image becomes unclear. Therefore, an automatic focusing module needs to be added to the existing wafer automatic detection equipment. The existing automatic focusing technology usually integrates a height detection system into the optical path, and moves the overall lens height according to the real-time height information. Although this saves time, the integration of the optical path is difficult, the real-time focusing has a lag, and the vibration caused by the up and down movement of the lens may affect the imaging. CONTENT OF THE UTILITY MODEL
[0003] Therefore, it is necessary to provide a wafer detection equipment to solve the technical problem of focusing difficulty of the detection equipment after the wafer moves in the prior art.
[0004] To achieve the above-mentioned purpose, the present application provides a wafer detection equipment, which comprises:
[0005] A wafer carrier is used to fix a wafer to be detected, and the wafer to be detected is divided into a plurality of detection areas;
[0006] An image acquisition module is arranged above the wafer carrier, and the image acquisition module is used to acquire a detection image to determine whether there is a defect on the surface of the detection area;
[0007] An image processing module is in communication connection with the image acquisition module, and the image processing module determines whether there is a defect on the surface of the detection area according to the detection image acquired by the image acquisition module;
[0008] A height sensor is arranged above the wafer carrier, and the height sensor is used to detect the distance between the wafer to be detected and the image acquisition module;
[0009] A vertical movement mechanism is arranged on the wafer carrier, and the vertical movement mechanism adjusts the height of the wafer carrier according to the height sensor, so that the distance between each detection area and the image acquisition module remains consistent; and
[0010] A horizontal movement mechanism is arranged on the vertical movement mechanism, and the horizontal movement mechanism is used to drive each detection area to move to the lower side of the image acquisition module in sequence.
[0011] Optionally, the transverse moving mechanism comprises:
[0012] an X-axis moving mechanism, the vertical moving mechanism being arranged on the X-axis moving mechanism; and
[0013] a Y-axis moving mechanism, the X-axis moving mechanism being arranged on the Y-axis moving mechanism.
[0014] Optionally, the X-axis moving mechanism comprises:
[0015] a first sliding rail, arranged along the X-axis;
[0016] a first sliding block, slidably arranged on the first sliding rail, the vertical moving mechanism being arranged on the first sliding block; and
[0017] a first linear motor, connected to the first sliding block.
[0018] Optionally, the Y-axis moving mechanism comprises:
[0019] a second sliding rail, arranged along the Y-axis;
[0020] a second sliding block, slidably arranged on the first sliding rail, the first sliding rail being arranged on the second sliding block; and
[0021] a second linear motor, connected to the second sliding block.
[0022] Optionally, the first sliding rail and the first sliding block are both arranged with two corresponding to each other, and the second sliding rail and the second sliding block are both arranged with two corresponding to each other.
[0023] Optionally, the height sensor and the vertical moving mechanism both have a precision of 0.1 microns.
[0024] Optionally, the wafer carrier is provided with a vacuum adsorption structure for fixing the wafer to be detected.
[0025] Optionally, the image acquisition module comprises a high-definition camera.
[0026] Optionally, the plurality of detection areas are arranged in multiple rows and multiple columns.
[0027] Optionally, the detection paths of the plurality of detection areas are in S-shape.
[0028] The wafer detection device provided by the application has the beneficial effects that, compared with the prior art, the wafer detection device comprises a wafer carrier, an image acquisition module, an image processing module, a height sensor, a vertical moving mechanism and a horizontal moving mechanism, the horizontal moving mechanism can drive the detection areas of the various to-be-detected wafers to move to the lower side of the image acquisition module in sequence, the vertical moving mechanism adjusts the height of the wafer carrier according to the height sensor, so that the distance between each detection area and the image acquisition module remains consistent, the image acquisition module does not need to be adjusted up and down, each detection area can be at the focal point of the image acquisition module, the focusing difficulty is reduced, and the influence on imaging caused by adjusting the image acquisition module up and down can be avoided. BRIEF DESCRIPTION OF DRAWINGS
[0029] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings needed to be used in the embodiments or the prior art description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative effort.
[0030] Figure 1 The front view structural schematic diagram of the wafer detection device provided by the embodiments of the present application is shown.
[0031] Figure 2 The distribution schematic diagram of the detection areas of the to-be-detected wafers provided by the embodiments of the present application is shown.
[0032] Explanation of reference signs:
[0033] 1, wafer carrier; 2, image acquisition module; 3, height sensor; 4, vertical moving mechanism; 5, horizontal moving mechanism; 510, X-axis moving mechanism; 520, Y-axis moving mechanism; 6, to-be-detected wafer. DETAILED DESCRIPTION
[0034] In order to make the above-mentioned purposes, features and advantages of the present application more apparent and easy to understand, the specific embodiments of the present application will be described in detail below with reference to the drawings. In the following description, many specific details are set forth in order to provide a thorough understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.
[0035] In the description of the present application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate the orientation or positional relationship shown in the drawings, which are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation of the present application.
[0036] In addition, the terms "first", "second" are only for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined with "first", "second" can explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "a plurality of" is at least two, such as two, three, etc., unless otherwise explicitly specified and limited.
[0037] In the present application, unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connecting", "fixing" and the like should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise explicitly limited. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.
[0038] In the present application, unless otherwise explicitly specified and limited, the first feature is "on" or "under" the second feature, which can be direct contact between the first and second features, or indirect contact between the first and second features through an intermediate medium. Moreover, the first feature "above", "above" and "above" the second feature can be directly above or obliquely above the first feature, or only indicate that the horizontal height of the first feature is higher than that of the second feature. The first feature "below", "below" and "below" the second feature can be directly below or obliquely below the first feature, or only indicate that the horizontal height of the first feature is less than that of the second feature.
[0039] It is to be understood that when an element such as a layer, region or substrate is referred to as being "on" or "connected to" another element, it can be directly on or connected to the other element or intervening elements can be present. In contrast, when an element is referred to as being "directly on" or "directly connected to" another element, there are no intervening elements present. It will be understood that, when a member is referred to as being "coupled" or "connected" to another member, it can be directly coupled or connected to the other member or intervening members can be present. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items. Expressions such as "at least one of," when preceding the syllables of a list of elements, modify the entire list of elements and do not modify the elements individually.
[0040] Embodiments of the present application provide a wafer detection device, please refer to Figures 1 to 2 The wafer detection device comprises a wafer carrier 1, an image acquisition module 2, an image processing module, a height sensor 3, a vertical moving mechanism 4 and a horizontal moving mechanism 5. The wafer carrier 1 is used for fixing a wafer to be detected 6, and the wafer to be detected 6 is divided into a plurality of detection areas. The image acquisition module 2 is arranged above the wafer carrier 1, and the image acquisition module 2 is used for acquiring a detection image to determine whether the surface of the detection area has a defect. The image processing module is in communication connection with the image acquisition module 2, and the image processing module determines whether the surface of the detection area has a defect according to the detection image acquired by the image acquisition module 2. The height sensor 3 is arranged above the wafer carrier 1, and the height sensor 3 is used for detecting the distance between the wafer to be detected 6 and the image acquisition module 2. The wafer carrier 1 is arranged on the vertical moving mechanism 4, and the vertical moving mechanism 4 adjusts the height of the wafer carrier 1 according to the height sensor 3, so that the distance between each detection area and the image acquisition module 2 remains consistent. The vertical moving mechanism 4 is arranged on the horizontal moving mechanism 5, and the horizontal moving mechanism 5 is used to drive each detection area to move to the lower side of the image acquisition module 2 in turn.
[0041] In the embodiments of the present application, the wafer detection device comprises a wafer carrier 1, an image acquisition module 2, an image processing module, a height sensor 3, a vertical moving mechanism 4 and a horizontal moving mechanism 5. The horizontal moving mechanism 5 can drive the detection areas of each wafer to be detected 6 to move to the lower side of the image acquisition module 2 in turn. The vertical moving mechanism 4 adjusts the height of the wafer carrier 1 according to the height sensor 3, so that the distance between each detection area and the image acquisition module 2 remains consistent. Without adjusting the image acquisition module 2 up and down, each detection area can be at the focal point of the image acquisition module 2, reducing the focusing difficulty, and avoiding the influence on imaging caused by adjusting the image acquisition module 2 up and down.
[0042] In one embodiment, please refer to Figure 1 The horizontal moving mechanism 5 comprises an X-axis moving mechanism 510 and a Y-axis moving mechanism 520. The vertical moving mechanism 4 is arranged on the X-axis moving mechanism 510, and the X-axis moving mechanism 510 is arranged on the Y-axis moving mechanism 520. By controlling the movement along the X-axis and the movement along the Y-axis respectively, transposition on the horizontal plane can be realized.
[0043] In one embodiment, referring to Figure 1 , the X-axis moving mechanism 510 comprises a first sliding rail, a first sliding block and a first linear motor, the first sliding rail is laid along the X-axis, the first sliding block is slidably arranged on the first sliding rail, the vertical moving mechanism 4 is arranged on the first sliding block, and the first linear motor is connected to the first sliding block to drive the first sliding block to slide on the first sliding rail.
[0044] In one embodiment, referring to Figure 1 , the Y-axis moving mechanism 520 comprises a second sliding rail, a second sliding block and a second linear motor, the second sliding rail is laid along the Y-axis, the second sliding block is slidably arranged on the first sliding rail, the first sliding rail is arranged on the second sliding block, and the second linear motor is connected to the second sliding block to drive the second sliding block to slide on the second sliding rail.
[0045] In one embodiment, referring to Figure 1 , the first sliding rail and the first sliding block are both arranged in pairs, and the second sliding rail and the second sliding block are both arranged in pairs, so that the X-axis moving mechanism 510 and the Y-axis moving mechanism 520 move stably.
[0046] In one embodiment, the precision of the height sensor 3 and the vertical moving mechanism 4 is 0.1 microns, which reduces the error value of the distance between the wafer and the image acquisition module 2 and improves the image acquisition quality.
[0047] In one embodiment, the wafer stage 1 is provided with a vacuum adsorption structure for fixing the wafer to be detected 6.
[0048] In one embodiment, the image acquisition module 2 comprises a high-definition camera.
[0049] In one embodiment, referring to Figure 2 , the plurality of detection areas are arranged in multiple rows and multiple columns.
[0050] Specifically, it can be considered that the wafer to be detected 6 is laid on an N×N grid area, and the center point of each grid is the measurement point of the height sensor 3. The specific number of grid areas is selected according to actual needs, and the more measurement points, the more accurate the data. Herein, it is not limited to be unique.
[0051] Exemplarily, the wafer to be detected 6 is laid on a 6×6 grid area.
[0052] In one embodiment, the detection paths of the plurality of detection areas are S-shaped.
[0053] Any combination of the technical features in the above-described embodiments can be made, and for the sake of brevity, not all possible combinations are described, however, it is to be understood that the application embraces all such possible combinations.
[0054] The above-described embodiments only express several implementation manners of the present application, and the description is relatively specific and detailed, but it should not be understood as a limitation on the patent scope of the application. It should be pointed out that for ordinary skilled persons in the art, some modifications and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the patent protection scope of the present application should be subject to the appended claims.
Claims
1. A wafer inspection apparatus characterized by comprising: The application relates to a wafer detection device. The wafer detection device comprises: a wafer carrier for fixing a wafer to be detected, wherein the wafer to be detected is divided into a plurality of detection areas; an image acquisition module arranged above the wafer carrier, wherein the image acquisition module is used for acquiring a detection image to determine whether the surface of the detection area is defective; an image processing module in communication connection with the image acquisition module, wherein the image processing module determines whether the surface of the detection area is defective according to the detection image acquired by the image acquisition module; a height sensor arranged above the wafer carrier, wherein the height sensor is used for detecting the distance between the wafer to be detected and the image acquisition module; a vertical moving mechanism, wherein the wafer carrier is arranged on the vertical moving mechanism, and the vertical moving mechanism adjusts the height of the wafer carrier according to the height sensor so that the distance between each detection area and the image acquisition module is consistent; and 2. The wafer inspection apparatus of claim 1, wherein a horizontal moving mechanism, wherein the vertical moving mechanism is arranged on the horizontal moving mechanism, and the horizontal moving mechanism is used for moving each detection area to the lower side of the image acquisition module in sequence. The horizontal moving mechanism comprises: an X-axis moving mechanism, wherein the vertical moving mechanism is arranged on the X-axis moving mechanism; and 3. The wafer inspection apparatus of claim 2, wherein a Y-axis moving mechanism, wherein the X-axis moving mechanism is arranged on the Y-axis moving mechanism. The X-axis moving mechanism comprises: a first sliding rail arranged along the X-axis; a first sliding block slidably arranged on the first sliding rail, wherein the vertical moving mechanism is arranged on the first sliding block; and 4. The wafer inspection apparatus according to claim 3, wherein a first linear motor connected to the first sliding block. The Y-axis moving mechanism comprises: a second sliding rail arranged along the Y-axis; a second sliding block slidably arranged on the first sliding rail, wherein the first sliding rail is arranged on the second sliding block; and 5. The wafer inspection apparatus of claim 4, wherein a second linear motor connected to the second sliding block.
6. The wafer inspection apparatus according to any one of claims 1 to 5, wherein The first sliding rail and the first sliding block are arranged in pairs, and the second sliding rail and the second sliding block are arranged in pairs.
7. The wafer inspection apparatus according to any one of claims 1 to 5, wherein The precision of the height sensor and the vertical moving mechanism is 0.1 microns.
8. The wafer inspection apparatus according to any one of claims 1 to 5, wherein The wafer carrier is provided with a vacuum adsorption structure for fixing the wafer to be detected.
9. The wafer inspection apparatus according to any one of claims 1 to 5, wherein The image acquisition module comprises a high-definition camera.
10. The wafer inspection apparatus of claim 9, wherein The plurality of detection areas are arranged in multiple rows and multiple columns. The detection path of the plurality of detection areas is in an S shape.