Intelligent gateway server with efficient heat dissipation

Abstract

The utility model discloses an intelligent gateway server with efficient heat dissipation, which comprises a shell and a data processing module arranged in the shell, the shell is further provided with a heat dissipation system, a cooling circulation system and an intelligent temperature control system which are used for being connected with the data processing module, and the intelligent temperature control system is electrically connected with the data processing module. The shell made of a carbon fiber material is adopted, the weight can be reduced, meanwhile, the heat dissipation performance can be improved, the durability of the equipment is improved, a heat dissipation system and a cooling circulation system are arranged in the whole equipment, and effective air flow and temperature management are formed through combination of a heat dissipation cabin and a circulation cabin. The cold air conveying pipe is connected with the first air supply valve, the second air supply valve and the third air supply valve and transmits cooling air to the whole circulation cabin in a distributed mode, and good heat dissipation conditions are provided for the data processing module. The intelligent temperature control system monitors the temperature through a temperature detection sensor and carries out real-time temperature adjustment, so that the constant temperature of the system in the working process is ensured.

Description

Technical Field

[0001] This utility model relates to the field of gateway device technology, specifically to a smart gateway server with high-efficiency heat dissipation. Background Technology

[0002] The intelligent gateway server is responsible for connecting various sensors, devices, and the cloud platform, ensuring real-time information transmission and processing. However, traditional cooling systems typically rely on passive cooling technologies, such as aluminum alloy heat sinks or fans. While these technologies can reduce the surface temperature of the equipment to some extent, their heat dissipation effect is relatively poor and cannot effectively cope with prolonged high-load operation. Secondly, traditional cooling systems often lack temperature control functions, failing to monitor and regulate the server's internal temperature in real time. This can lead to the server becoming overheated or overcooled when environmental conditions change or hardware load fluctuates, thus affecting its normal operation. Utility Model Content

[0003] To overcome the shortcomings of existing technical solutions, this utility model provides an intelligent gateway server with high-efficiency heat dissipation, which can effectively solve the problems mentioned in the background technology.

[0004] The technical solution adopted by this utility model to solve its technical problem is:

[0005] A high-efficiency heat dissipation intelligent gateway server includes a shell and a data processing module disposed within the shell. The shell is further provided with a heat dissipation system, a cooling circulation system, and an intelligent temperature control system for connecting the data processing module. The intelligent temperature control system is electrically connected to the data processing module. The heat dissipation system includes a heat dissipation chamber and cooling components disposed within the heat dissipation chamber. The cooling circulation system includes a circulation chamber, an air supply valve one, an air supply valve two, and an air supply valve three. The intelligent temperature control system includes a control motherboard, a temperature detection sensor disposed on the control motherboard, and a controller. The control motherboard and the controller are electrically connected.

[0006] The heat dissipation chamber is connected to the circulation chamber. Several cold air delivery pipes are provided at the connection between the heat dissipation chamber and the circulation chamber. The cold air delivery pipes are connected to air supply valve one. Air supply valve one is connected to air supply valve two and air supply valve three in sequence. Air supply valve one, air supply valve two and air supply valve three are respectively located on the three side walls of the circulation chamber. Air supply valve one is located at the bottom of the control main board. Furthermore, an air guide structure is provided between air supply valve one and the control main board to evenly deliver cold air to the control main board.

[0007] As a further description of the above technical solution, the data processing module is located inside the circulation chamber. A temperature indicator light and a mounting part for connecting the outer shell are also provided on one side of the circulation chamber. The data processing module includes a signal interface, a power interface, a first data processing module and a second data processing module. A heat dissipation channel is formed between the circulation chamber and the first data processing module and the second data processing module, respectively. The heat dissipation channel is connected to air supply valve one, air supply valve two and air supply valve three, respectively.

[0008] As a further description of the above technical solution, the circulation chamber is provided with an air outlet at both ends, and the outer shell is provided with an air outlet on one side. The outer shell is made of carbon fiber, and the outer shell is provided with a transparent window on the side near the temperature indicator light.

[0009] As a further description of the above technical solution, the installation includes a fixing steel plate, which is connected to the circulation chamber by bolts, and one end of the fixing steel plate is provided with a buckle for connecting to the outer shell.

[0010] As a further description of the above technical solution, the heat dissipation chamber is provided with an independent cooling chamber, and an aluminum alloy air inlet plate is also provided on one side of the heat dissipation chamber. The cooling components are located in the cooling chamber, and the cooling chamber is connected to the air supply valve through a cold air delivery pipe. The cold air delivery pipe is arranged in a straight line.

[0011] As a further description of the above technical solution, the cooling assembly includes a fan and several condenser tubes filled with refrigerant, the condenser tubes being arranged in a matrix on the aluminum alloy air inlet plate.

[0012] As a further description of the above technical solution, the first air supply valve, the second air supply valve, and the third air supply valve are respectively connected to the controller, and the temperature detection sensor is connected to the controller.

[0013] As a further description of the above technical solution, the air guiding structure is composed of a plurality of first air guiding plates and second air guiding plates. Both the first air guiding plates and the second air guiding plates are arc-shaped. The length of the first air guiding plate is greater than the length of the second air guiding plate, and each of the first air guiding plates and the second air guiding plates is symmetrically arranged on both sides of the control main board.

[0014] Compared with the prior art, the beneficial effects of this utility model are:

[0015] This utility model discloses a high-efficiency heat dissipation intelligent gateway server, which has at least one of the following beneficial effects during use:

[0016] The carbon fiber shell not only reduces weight but also improves heat dissipation and increases the equipment's durability. The entire device incorporates a heat dissipation system and a cooling circulation system. The combination of the heat dissipation chamber and the circulation chamber creates effective airflow and temperature management. Cold air delivery pipes connect to air supply valves one, two, and three, distributing cooling air throughout the circulation chamber to provide excellent heat dissipation for the data processing module. The intelligent temperature control system monitors the temperature through temperature sensors and performs real-time temperature adjustment via electrical connection between the control motherboard and the controller, ensuring a constant system temperature during operation. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the overall structure of a smart gateway server with high-efficiency heat dissipation according to the present invention.

[0018] Figure 2 This is a schematic diagram of the overall structure of the data processing module of a smart gateway server with high-efficiency heat dissipation according to the present invention.

[0019] Figure 3 This is a schematic diagram of the first side view of the data processing module of a high-efficiency heat dissipation intelligent gateway server according to the present invention.

[0020] Figure 4 This is a schematic diagram of the second side structure of the data processing module of a high-efficiency heat dissipation intelligent gateway server according to the present invention.

[0021] Figure 5 This is a schematic diagram of the third side structure of the data processing module of a high-efficiency heat dissipation intelligent gateway server according to the present invention.

[0022] Figure 6 This is a perspective structural diagram of the data processing module of a smart gateway server with high-efficiency heat dissipation according to the present invention.

[0023] Numbering on the map:

[0024] 1. Housing; 101. Data processing module; 102. Signal interface; 103. Power interface; 104. First data processing module; 105. Second data processing module; 2. Heat dissipation system; 201. Heat dissipation chamber; 202. Condenser pipe; 203. Fan; 204. Aluminum alloy air inlet plate; 205. Cold air delivery pipe; 3. Air guide structure; 301. First air guide plate; 302. Second air guide plate; 4. Cooling circulation system; 401. Mounting part; 402. Air supply valve one; 403. Air supply valve two; 404. Air supply valve three; 405. Clip; 406. Temperature indicator light; 407. Circulation chamber; 408. Heat dissipation channel; 5. Intelligent temperature control system; 501. Temperature detection sensor; 502. Controller; 503. Control motherboard. Detailed Implementation

[0025] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0026] like Figure 1-6 As shown, this utility model provides a high-efficiency heat dissipation intelligent gateway server, including a shell 1 and a data processing module 101 disposed within the shell 1. The shell 1 is also provided with a heat dissipation system 2, a cooling circulation system 4, and an intelligent temperature control system 5 for connecting the data processing module 101. The intelligent temperature control system 5 is electrically connected to the data processing module 101. The heat dissipation system 2 includes a heat dissipation chamber 201 and cooling components disposed within the heat dissipation chamber 201. The cooling circulation system 4 includes a circulation chamber 407, an air supply valve 402, an air supply valve 403, and an air supply valve 404. The intelligent temperature control system 5 includes a control motherboard 503, a temperature detection sensor 501 disposed on the control motherboard 503, and a controller 502. The control motherboard 503 and the controller 502 are electrically connected.

[0027] The carbon fiber outer shell 1 used in this embodiment not only reduces weight but also improves heat dissipation performance and increases the durability of the equipment. The entire device is equipped with a heat dissipation system 2 and a cooling circulation system 4. The combination of the heat dissipation chamber 201 and the circulation chamber 407 creates effective airflow and temperature management. The cold air delivery pipe 205 connects to air supply valves 402, 403, and 404, distributing cooling air throughout the circulation chamber 407 to provide good heat dissipation for the data processing module 101. The intelligent temperature control system 5 monitors the temperature through a temperature sensor 501 and performs real-time temperature adjustment via an electrical connection between the control motherboard 503 and the controller 502, thereby ensuring a constant temperature during system operation.

[0028] The heat dissipation chamber 201 is connected to the circulation chamber 407. Several cold air delivery pipes 205 are provided at the connection between the heat dissipation chamber 201 and the circulation chamber 407. The cold air delivery pipes 205 are connected to the first air supply valve 402. The first air supply valve 402 is connected to the second air supply valve 403 and the third air supply valve 404 in sequence. The first air supply valve 402, the second air supply valve 403 and the third air supply valve 404 are respectively located on the three side walls of the circulation chamber 407. The first air supply valve 402 is located at the bottom of the control main board 503. A guide structure 3 is also provided between the first air supply valve 402 and the control main board 503 to evenly deliver cold air to the control main board 503.

[0029] This embodiment uses a cooling assembly with an independent cooling chamber to further enhance heat dissipation efficiency. The condenser pipe 202 is filled with refrigerant, which can more effectively remove heat, cooling the incoming air and evenly delivering it to the circulation chamber 407 via the air supply valve. Simultaneously, the air supply valve 402 additionally delivers cold air to the control mainboard 503, and combined with the air guide structure 3, ensures that the cold air is evenly distributed on the control mainboard 503, improving heat dissipation. Overall, through the integrated heat dissipation chamber 201, cooling circulation system 4, and intelligent temperature control system 5, efficient heat dissipation is achieved, reducing the equipment temperature and extending its service life. Real-time monitoring by the temperature detection sensor 501 and adjustment by the controller 502 ensure that the equipment remains stable under various operating conditions, effectively avoiding performance degradation or malfunctions caused by overheating. A temperature indicator light 406 and a transparent window are provided for users to easily monitor the equipment status in real time, improving the user experience.

[0030] Furthermore, the data processing module 101 is located inside the circulation chamber 407. A temperature indicator light 406 and a mounting part 401 for connecting the outer casing 1 are also provided on one side of the circulation chamber 407. The data processing module 101 includes a signal interface 102, a power interface 103, a first data processing module 104, and a second data processing module 105. A heat dissipation channel 408 is formed between the circulation chamber 407 and the first data processing module 104 and the second data processing module 105, respectively. The heat dissipation channel 408 is connected to the first air supply valve 402, the second air supply valve 403, and the third air supply valve 404, respectively.

[0031] The heat dissipation channel 408 is connected to air supply valve 1 402, air supply valve 2 403, and air supply valve 3 404 respectively, providing multi-point heat dissipation, enhancing airflow, and greatly improving the heat dissipation capacity of the entire system.

[0032] The entire design, through a reasonable airflow path and interface, allows cool air to be applied quickly and evenly to the data processing module 101, achieving effective cooling and extending the service life of the equipment. The clearly defined heat dissipation channel 408 design, in conjunction with the temperature indicator light 406, ensures that the data processing module 101 operates stably within its operating range, reducing the risk of failure due to overheating.

[0033] Furthermore, the circulation chamber 407 has an air outlet at both ends, and the outer shell 1 has an air outlet on one side. The outer shell 1 is made of carbon fiber, and the outer shell 1 has a transparent window on the side near the temperature indicator light 406.

[0034] The air outlet 1 of the circulation chamber 407 and the air outlet 2 of the outer shell 1 form an airflow path, guiding the cool air to circulate and carrying away heat. The outer shell 1 is made of carbon fiber material, which is lightweight and has good heat dissipation performance. At the same time, the transparent window design facilitates monitoring of the internal status and the function of the temperature indicator 406.

[0035] Furthermore, the installation includes a fixing steel plate, which is connected to the circulation chamber 407 by bolts, and one end of the fixing steel plate is provided with a buckle 405 for connecting the outer shell 1.

[0036] The fixing steel plate, serving as the mounting component 401, is connected to the circulation chamber 407 via bolts, ensuring the overall structural stability. Meanwhile, the snap-fit ​​design 405 makes the connection between the outer casing 1 and the circulation chamber 407 more convenient, facilitating maintenance and replacement. The modular design and detachable structure make the entire device easier to maintain and upgrade, allowing users to easily replace or upgrade individual components.

[0037] Furthermore, the heat dissipation chamber 201 is equipped with an independent cooling chamber, and an aluminum alloy air inlet plate 204 is also provided on one side of the heat dissipation chamber 201. The cooling components are located in the cooling chamber, and the cooling chamber is connected to the air supply valve 402 through a cold air delivery pipe 205. The cold air delivery pipe 205 is arranged in a straight line.

[0038] The independent cooling chambers within the heat dissipation compartment 201 provide independent protection and management for cooling components (such as the fan 203 and condenser coils 202). This design helps to more effectively concentrate cooling resources and avoid direct interference with heat sources. The air inlet effectively guides outside air into the cooling chambers, where it is cooled by the cooling components.

[0039] Furthermore, the cooling assembly includes a fan 203 and several condenser pipes 202 filled with refrigerant, which are arranged in a matrix on the aluminum alloy air inlet plate 204.

[0040] Arranging the cold air delivery pipes 205 in a straight line facilitates smooth airflow and ensures that cold air is evenly distributed to the areas requiring cooling, thus improving the overall cooling effect. The fan 203 in the cooling assembly enhances heat dissipation by promoting airflow; while the refrigerant-filled condenser tubes 202 absorb and remove heat through phase change. The matrix arrangement of the condenser tubes 202 increases the surface area in contact with the cold air, further improving air cooling efficiency. Due to the combination of independent cooling chambers, the high-efficiency fan 203, and the condenser tubes 202, the entire cooling system can quickly and effectively reduce equipment temperature.

[0041] Furthermore, the air supply valve 402, air supply valve 403, and air supply valve 404 are respectively connected to the controller 502, and the temperature detection sensor 501 is connected to the controller 502.

[0042] The controller 502 is the core of the entire system. It receives real-time temperature data from the temperature sensor 501 and controls the opening and closing of the air supply valves according to set thresholds, thereby adjusting the flow and direction of cool air for effective thermal management. The temperature sensor continuously monitors temperature changes within the circulation chamber 407 and transmits real-time data to the controller 502. If the temperature exceeds a preset range, the controller 502 issues a command to open or close the corresponding air supply valve. Air supply valve 402, air supply valve 403, and air supply valve 404 dynamically adjust the airflow according to the commands from the controller 502. For example, when the temperature is too high, the controller 502 may open all valves to increase the inflow of cool air; while when the temperature is suitable, the valves may partially close to reduce energy consumption.

[0043] Furthermore, the air guiding structure 3 is composed of several first air guiding plates 301 and second air guiding plates 302. Both the first air guiding plates 301 and the second air guiding plates 302 are arc-shaped. The length of the first air guiding plate 301 is greater than the length of the second air guiding plate 302. Each of the first air guiding plates 301 and the second air guiding plates 302 is symmetrically arranged on both sides of the control main board 503.

[0044] The arc-shaped design of the first air guide plate 301 and the second air guide plate 302 helps to effectively guide airflow. By directing airflow to the specific area required by the device, the flow efficiency of the airflow is increased. The design of the first air guide plate 301 being longer than the second air guide plate 302 can create differentiated airflow paths. In some applications, the longer air guide plate may be more suitable for guiding the flow of hot air over a greater distance, while the shorter air guide plate can be used closer to the control board 503, thereby optimizing the cooling effect.

[0045] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A smart gateway server with high-efficiency heat dissipation, characterized in that: The device includes a housing and a data processing module disposed within the housing. The housing is further provided with a heat dissipation system, a cooling circulation system, and an intelligent temperature control system for connecting the data processing module. The intelligent temperature control system is electrically connected to the data processing module. The heat dissipation system includes a heat dissipation chamber and a cooling component disposed within the heat dissipation chamber. The cooling circulation system includes a circulation chamber, an air supply valve one, an air supply valve two, and an air supply valve three. The intelligent temperature control system includes a control motherboard, a temperature detection sensor disposed on the control motherboard, and a controller. The control motherboard and the controller are electrically connected. The heat dissipation chamber is connected to the circulation chamber. Several cold air delivery pipes are provided at the connection between the heat dissipation chamber and the circulation chamber. The cold air delivery pipes are connected to air supply valve one. Air supply valve one is connected to air supply valve two and air supply valve three in sequence. Air supply valve one, air supply valve two and air supply valve three are respectively located on the three side walls of the circulation chamber. Air supply valve one is located at the bottom of the control main board. Furthermore, an air guide structure is provided between air supply valve one and the control main board to evenly deliver cold air to the control main board.

2. The intelligent gateway server with high-efficiency heat dissipation according to claim 1, characterized in that: The data processing module is located inside the circulation chamber. A temperature indicator light and a mounting part for connecting to the outer shell are also provided on one side of the circulation chamber. The data processing module includes a signal interface, a power interface, a first data processing module and a second data processing module. A heat dissipation channel is formed between the circulation chamber and the first data processing module and the second data processing module respectively. The heat dissipation channel is connected to air supply valve one, air supply valve two and air supply valve three respectively.

3. The intelligent gateway server with high-efficiency heat dissipation according to claim 2, characterized in that: The circulation chamber has an air outlet at both ends, and the outer shell has an air outlet on one side. The outer shell is made of carbon fiber, and the outer shell has a transparent window on the side near the temperature indicator light.

4. The intelligent gateway server with high-efficiency heat dissipation according to claim 2, characterized in that: The installation includes a fixing steel plate, which is connected to the circulation chamber by bolts, and one end of the fixing steel plate is provided with a buckle for connecting to the outer shell.

5. The intelligent gateway server with high-efficiency heat dissipation according to claim 1, characterized in that: The heat dissipation chamber is equipped with an independent cooling chamber, and an aluminum alloy air inlet plate is also provided on one side of the heat dissipation chamber. The cooling components are located in the cooling chamber, and the cooling chamber is connected to the air supply valve through a cold air delivery pipe. The cold air delivery pipe is arranged in a straight line.

6. The intelligent gateway server with high-efficiency heat dissipation according to claim 5, characterized in that: The cooling assembly includes a fan and several condenser tubes filled with refrigerant, which are arranged in a matrix on the aluminum alloy air inlet plate.

7. The intelligent gateway server with high-efficiency heat dissipation according to claim 1, characterized in that: The air supply valve one, air supply valve two, and air supply valve three are respectively connected to the controller, and the temperature detection sensor is connected to the controller.

8. The intelligent gateway server with high-efficiency heat dissipation according to claim 1, characterized in that: The air guiding structure consists of several first air guiding plates and second air guiding plates. Both the first air guiding plates and the second air guiding plates are arc-shaped. The length of the first air guiding plate is greater than the length of the second air guiding plate, and each of the first air guiding plates and the second air guiding plates is symmetrically arranged on both sides of the control main board.

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