Computer CPU (Central Processing Unit) heat dissipation device

Abstract

The utility model relates to the technical field of CPU heat dissipation, in particular to a computer CPU heat dissipation device which comprises a liquid storage tank, a CPU body and a heat dissipation unit, the heat dissipation unit comprises a plurality of partition plates, a plurality of arc-shaped seats, a strip-shaped frame, a copper plate, a heat dissipation fan, a connecting bin, a heat dissipation plate, a circulating assembly and a rotating assembly, the CPU body is firstly placed on a mainboard, then the heat dissipation plate is in contact with the CPU body, and the CPU body is placed on the connecting bin. Heat is conveyed into the liquid storage tank through the circulation assembly, at the moment, the bottom of the copper plate absorbs heat brought back by cooling liquid, the heat can be transferred to the top of the copper plate through the heat conductivity of copper, the controller is clicked to start the cooling fan, and the copper plate is rapidly cooled through air. And the rotating assembly is used for dispersing the cooling liquid, so that the heat contained in the cooling liquid is eliminated in this way, normal work of the CPU main body is ensured, and the situation of heat accumulation is avoided.

Description

Technical Field

[0001] This utility model relates to the field of CPU heat dissipation technology, and in particular to a computer CPU heat dissipation device. Background Technology

[0002] The CPU, also known as the Central Processing Unit, is the core component of a computer. When the CPU is working continuously, it generates a lot of heat. The cooling devices used for CPUs are mostly air-cooled, which can only dissipate the heat dissipated by the heatsink and cannot cool the heatsink in time. After long-term use, the temperature of the CPU itself will continue to rise.

[0003] The prior art patent application with authorization publication number CN213024309U discloses a computer CPU heat dissipation device, including a CPU body and a heat plate. The heat plate is connected to a support frame, the support frame is connected to a liquid outlet pipe, a water pump is fixedly installed on the liquid outlet pipe, the water pump is connected to a liquid storage tank, the liquid storage tank is connected to a heat dissipation pipe, and a movable baffle can divide the liquid storage tank into upper and lower sides. The coolant discharged by the serpentine pipe can be simply cooled above the movable baffle, and after cooling, it can enter the lower part of the movable baffle through the groove, thereby replenishing the coolant to the water pump in a timely manner.

[0004] However, in the aforementioned prior art, the coolant carries a lot of heat when it flows back to the reservoir, and relies on the ambient temperature for natural heat dissipation. Over a long period of use, this can easily cause the coolant to heat up, affecting the heat dissipation of the CPU itself. Utility Model Content

[0005] The purpose of this invention is to provide a computer CPU cooling device that solves the problem that in the prior art, when the coolant flows back to the reservoir, it carries a lot of heat and relies on the ambient temperature for natural heat dissipation. Over a long period of use, this can easily cause the coolant to heat up, affecting the heat dissipation of the CPU itself.

[0006] To achieve the above objectives, this utility model provides a computer CPU heat dissipation device, including a liquid reservoir, a CPU body, and a heat dissipation unit. The heat dissipation unit includes multiple partitions, multiple arc-shaped seats, a strip frame, a copper plate, a cooling fan, a connecting compartment, a heat sink, a circulation assembly, and a rotating assembly. The CPU body is disposed on one side of the liquid reservoir, and the heat dissipation unit is connected to the liquid reservoir. Multiple partitions are fixedly connected to the liquid reservoir and are respectively located on the inner wall of the liquid reservoir. Multiple arc-shaped seats are fixedly connected to corresponding partitions and are located at one end of each partition. The frame is fixedly connected to the liquid storage tank and located on the inner side wall of the liquid storage tank. The copper plate is fixedly connected to the strip frame and located on the inner side wall of the strip frame. The connecting compartment is fixedly connected to the liquid storage tank and located above the liquid storage tank. The cooling fan is detachably connected to the connecting compartment and located on the inner side wall of the connecting compartment. The heat sink is disposed on one side of the liquid storage tank. The CPU body contacts the heat sink and is located on one side of the heat sink. The circulation component is connected to the heat sink and the liquid storage tank respectively. The rotating component is disposed on the inner side wall of the heat sink.

[0007] The circulation assembly includes a circulation pump, a first hose, and a second hose. The circulation pump is connected to the liquid storage tank and is located on the outer wall of the liquid storage tank. One end of the first hose is connected to the circulation pump and is located at the output end of the circulation pump. The other end of the first hose is connected to the heat sink and is located on the outer wall of the heat sink. One end of the second hose is connected to the heat sink and is located on the outer wall of the heat sink. The other end of the second hose is connected to the liquid storage tank and is located on the outer wall of the liquid storage tank.

[0008] The circulation assembly further includes an ear plate frame, which is fixedly connected to the heat sink and located on the outer side wall of the heat sink. The ear plate frame has a round hole.

[0009] The rotating assembly includes two connecting seats, a rotating shaft, and multiple rotating blades. The two rotating shafts are fixedly connected to the heat sink and are located on the inner sidewall of the heat sink. The rotating shaft is rotatably connected to the two connecting seats and is located on the inner sidewall of the two connecting seats. The multiple rotating blades are fixedly connected to the rotating shaft and are located on the outer sidewall of the rotating shaft.

[0010] The rotating assembly further includes two semi-circular balls, each of which is fixedly connected to a corresponding connecting seat and located on the inner top wall of the connecting seat. Both semi-circular balls are rotatably engaged with the rotating shaft.

[0011] This utility model discloses a computer CPU cooling device. First, the CPU body is placed on the motherboard. Then, a heat sink is placed in contact with the CPU body, and the two are bonded together using silicone grease. Heat is transferred to the coolant tank via a circulation component. The bottom of the copper plate absorbs the heat brought back by the coolant, and the heat is transferred to the top of the copper plate due to copper's thermal conductivity. The controller activates the cooling fan, causing air to quickly dissipate heat from the copper plate. This cyclical process absorbs heat from the coolant. A rotating component disperses the coolant, and the cooperation of the baffle and the arc-shaped base drives the coolant to flow slowly within the coolant tank, further promoting heat absorption by the copper plate. This method eliminates heat contained in the coolant, ensuring the normal operation of the CPU body and preventing heat buildup. Attached Figure Description

[0012] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the accompanying drawings used in the description of the embodiments or the prior art will be briefly introduced below.

[0013] Figure 1 This is a schematic diagram of the computer CPU heat dissipation device of this utility model.

[0014] Figure 2 This is a right view of the computer CPU heat dissipation device of this utility model.

[0015] Figure 3 This is the utility model Figure 2 A sectional view along line AA.

[0016] Figure 4 This is the utility model Figure 3 Enlarged view of the local structure at point B.

[0017] Figure 5 This is the utility model Figure 2 CC-line sectional view.

[0018] 101-Liquid reservoir, 102-CPU main body, 103-Baffle, 104-Arc-shaped seat, 105-Strip frame, 106-Copper plate, 107-Cooling fan, 108-Connecting compartment, 109-Heat plate, 110-Circulating pump, 111-First hose, 112-Second hose, 113-Ear plate bracket, 114-Connecting seat, 115-Shaft, 116-Rotating blade, 117-Semi-circular ball, 118-Round hole. Detailed Implementation

[0019] Please see Figures 1 to 5 ,in, Figure 1 This is a structural schematic diagram of the computer CPU heat dissipation device of this utility model. Figure 2This is a right view of the computer CPU heat dissipation device of this utility model. Figure 3 This is the utility model Figure 2 AA-line sectional view, Figure 4 This is the utility model Figure 3 Enlarged view of the local structure at point B. Figure 5 This is the utility model Figure 2 CC-line sectional view.

[0020] This utility model provides a computer CPU heat dissipation device, including a liquid storage tank 101, a CPU body 102, and a heat dissipation unit. The heat dissipation unit includes multiple partitions 103, multiple arc-shaped seats 104, a strip frame 105, a copper plate 106, a cooling fan 107, a connecting compartment 108, a heat sink 109, a circulation assembly, and a rotating assembly. The circulation assembly includes a circulation pump 110, a first hose 111, a second hose 112, and an ear plate bracket 113. The rotating assembly includes two connecting seats 114, a rotating shaft 115, multiple rotating blades 116, and two semi-circular balls 117. The ear plate bracket 113 has a circular hole 118.

[0021] The CPU body 102 is disposed on one side of the liquid storage tank 101, and the heat dissipation unit is connected to the liquid storage tank 101; multiple partitions 103 are fixedly connected to the liquid storage tank 101 and are respectively located on the inner sidewall of the liquid storage tank 101; multiple arc-shaped seats 104 are fixedly connected to the corresponding partitions 103 and are located at one end of the partitions 103; the strip frame 105 is fixedly connected to the liquid storage tank 101 and is located on the inner sidewall of the liquid storage tank 101; the copper plate 106 is fixedly connected to the strip frame 105 and is located on the inner sidewall of the strip frame 105. The inner wall of 05, the connecting compartment 108 is fixedly connected to the liquid storage tank 101 and located above the liquid storage tank 101, the cooling fan 107 is detachably connected to the connecting compartment 108 and located on the inner wall of the connecting compartment 108, the heat sink 109 is disposed on one side of the liquid storage tank 101, the CPU body 102 is in contact with the heat sink 109 and located on one side of the heat sink 109, the circulation component is connected to the heat sink 109 and the liquid storage tank 101 respectively, and the rotating component is disposed on the inner wall of the heat sink 109.

[0022] In this embodiment, the CPU body 102 is first placed on the motherboard, and then the heat sink 109 is brought into contact with the CPU body 102. Silicone grease can be used to bond them together. Heat is transferred to the coolant tank 101 via the circulation component. At this time, the bottom of the copper plate 106 absorbs the heat brought back by the coolant. Due to the thermal conductivity of copper, the heat is transferred to the top of the copper plate 106. The controller is activated to start the cooling fan 107, allowing air to quickly dissipate heat from the copper plate 106. This cyclical absorption of heat from the coolant is achieved. The rotating component disperses the coolant. The partition 103 and the arc-shaped seat 104 work together to drive the coolant to flow slowly within the coolant tank 101, further promoting heat absorption by the copper plate 106. This method eliminates the heat contained in the coolant, ensuring the normal operation of the CPU body 102 and preventing heat buildup.

[0023] Furthermore, the circulation pump 110 is connected to the liquid storage tank 101 and is located on the outer wall of the liquid storage tank 101. One end of the first hose 111 is connected to the circulation pump 110 and is located at the output end of the circulation pump 110. The other end of the first hose 111 is connected to the heat sink 109 and is located on the outer wall of the heat sink 109. One end of the second hose 112 is connected to the heat sink 109 and is located on the outer wall of the heat sink 109. The other end of the second hose 112 is connected to the liquid storage tank 101 and is located on the outer wall of the liquid storage tank 101.

[0024] In this embodiment, the circulation pump 110 is started to draw coolant into the heat sink 109 through the first hose 111, and then the coolant flows back into the storage tank 101 through the second hose 112. The heat of the coolant is then transferred to the copper plate 106. The structure is simple and easy to use.

[0025] Furthermore, the ear plate frame 113 is fixedly connected to the heat sink 109 and is located on the outer side wall of the heat sink 109, and the ear plate frame 113 has a round hole 118.

[0026] In this embodiment, the cooperation between the ear plate bracket 113 and the round hole 118 facilitates the installer to fix the heat sink 109 onto the motherboard, effectively improving the practicality of the heat sink 109.

[0027] Furthermore, both of the rotating shafts 115 are fixedly connected to the heat sink 109 and are respectively located on the inner sidewall of the heat sink 109. The rotating shafts 115 are rotatably connected to the two connecting seats 114 and are located on the inner sidewall of the two connecting seats 114. The plurality of rotating blades 116 are fixedly connected to the rotating shafts 115 and are respectively located on the outer sidewall of the rotating shafts 115.

[0028] In this embodiment, the coolant pumped by the circulating pump 110 is pressurized, which drives the rotating blade 116 and the rotating shaft 115 to rotate within the heat sink 109, thereby better driving the coolant to contact the heat sink 109.

[0029] Furthermore, both of the semi-circular beads 117 are fixedly connected to the corresponding connecting seats 114 and are located on the inner top wall of the connecting seats 114, and both of the semi-circular beads 117 are rotatably engaged with the rotating shaft 115.

[0030] In this embodiment, the semi-circular ball 117 can assist the rotating shaft 115 in rotating within the two connecting seats 114, thereby reducing the frictional pressure between the rotating shaft 115 and the connecting seats 114.

[0031] The above-disclosed embodiments are merely preferred embodiments of this application and should not be construed as limiting the scope of this application. Those skilled in the art will understand that all or part of the processes for implementing the above embodiments, and equivalent variations made in accordance with the claims of this application, still fall within the scope of this application.

Claims

1. A computer CPU cooling device, comprising a liquid reservoir and a CPU body, wherein the CPU body is disposed on one side of the liquid reservoir, characterized in that, It also includes a heat dissipation unit, which is connected to the liquid storage tank; The heat dissipation unit includes multiple partitions, multiple arc-shaped seats, a strip frame, a copper plate, a cooling fan, a connecting compartment, a heat sink, a circulation assembly, and a rotating assembly. Each partition is fixedly connected to the liquid reservoir and located on the inner wall of the reservoir. Each arc-shaped seat is fixedly connected to a corresponding partition and located at one end of the partition. The strip frame is fixedly connected to the liquid reservoir and located on its inner wall. The copper plate is fixedly connected to the strip frame and located on its inner wall. The connecting compartment is fixedly connected to the liquid reservoir and located above it. The cooling fan is detachably connected to the connecting compartment and located on its inner wall. The heat sink is located on one side of the liquid reservoir. The CPU body contacts the heat sink and is located on one side of the heat sink. The circulation assembly is connected to both the heat sink and the liquid reservoir. The rotating assembly is located on the inner wall of the heat sink.

2. The computer CPU heat dissipation device as described in claim 1, characterized in that, The circulation assembly includes a circulation pump, a first hose, and a second hose. The circulation pump is connected to the liquid storage tank and is located on the outer wall of the liquid storage tank. One end of the first hose is connected to the circulation pump and is located at the output end of the circulation pump. The other end of the first hose is connected to the heat sink and is located on the outer wall of the heat sink. One end of the second hose is connected to the heat sink and is located on the outer wall of the heat sink. The other end of the second hose is connected to the liquid storage tank and is located on the outer wall of the liquid storage tank.

3. The computer CPU heat dissipation device as described in claim 2, characterized in that, The circulation assembly also includes an ear plate frame, which is fixedly connected to the heat sink and located on the outer side wall of the heat sink. The ear plate frame has a round hole.

4. The computer CPU heat dissipation device as described in claim 3, characterized in that, The rotating assembly includes two connecting seats, a rotating shaft, and multiple rotating blades. The two rotating shafts are fixedly connected to the heat sink and are located on the inner sidewall of the heat sink, respectively. The rotating shaft is rotatably connected to the two connecting seats and is located on the inner sidewall of the two connecting seats. The multiple rotating blades are fixedly connected to the rotating shaft and are located on the outer sidewall of the rotating shaft, respectively.

5. The computer CPU cooling device as described in claim 4, characterized in that, The rotating assembly also includes two semi-circular balls, each of which is fixedly connected to a corresponding connecting seat and located on the inner top wall of the connecting seat. Both semi-circular balls are rotatably engaged with the rotating shaft.

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