Semiconductor device frame, discrete device, power module and controller

Abstract

The utility model discloses a semiconductor device frame, a discrete device, a power module and a controller, and relates to the technical field of semiconductors. The frame comprises a frame body and an electroplated layer, wherein the surface of the frame body is provided with a frame groove. The electroplated layer covers the surface of the frame body and extends into the frame groove, so that a mounting groove is formed in the surface of the electroplated layer on the frame groove, and the mounting groove is matched with the shape of a plastic package body of the discrete device to form fixation. Therefore, when the device is packaged, the plastic package body can extend into the mounting groove, the connection strength between the plastic package body and the frame body can be improved, the voidage of the device is reduced, the air tightness of the discrete device is improved, and the performance reliability of the device is improved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor technology, and in particular to a semiconductor device framework, discrete device, power module, and controller. Background Technology

[0002] A power module is a combination of power electronic devices arranged in a specific functional order and then encapsulated into a single module. Due to its advantages such as high switching frequency and low drive power, power modules are widely used in various power electronic devices and systems, such as motor drives, inverters, frequency converters, and rectifiers. For example, in variable frequency air conditioners, the power module is a key component. For instance, the higher the output voltage of the power module, the greater the operating frequency and output power of the variable frequency compressor. Conversely, the lower the output voltage of the power module, the lower the operating frequency and output frequency of the variable frequency compressor.

[0003] A power module is an electronic component that integrates various discrete power devices. The reliability of these discrete devices determines the operational reliability of the power module. However, currently, some discrete devices, due to poor airtightness, allow external moisture to enter their interiors during parameter testing or operation, thereby increasing the parameter abnormality rate. Utility Model Content

[0004] To address the problem of high parameter anomaly rates during parameter testing caused by poor hermetic sealing of discrete components, this invention provides a semiconductor device framework, discrete components, power modules, and controller that overcomes or at least partially solves the aforementioned problems.

[0005] Based on a first aspect of the present invention, a semiconductor device framework is provided, the semiconductor device framework comprising:

[0006] A frame body, the surface of which is provided with frame grooves;

[0007] An electroplated layer covers the surface of the frame body and extends into the frame groove to form a mounting groove on the surface of the electroplated layer located on the frame groove. The mounting groove is fitted with the shape of the encapsulated body of the discrete device to form a fixed shape.

[0008] In one optional utility model, the frame groove extends spirally from the inner side near the center of the frame body towards the edge of the frame body.

[0009] Optionally, the frame groove comprises at least two first grooves and at least two second grooves, the at least two first grooves are arranged in parallel, the at least two second grooves are arranged in parallel, the first grooves and the second grooves are arranged at an angle, and the frame groove forms a mesh structure on the frame body.

[0010] Optionally, when the frame groove comprises at least two grooves, the at least two grooves are arranged in parallel and are distributed equidistantly on the surface of the frame body.

[0011] Optionally, the cross-sectional shape of the frame groove comprises a strip shape, a wave shape and a zigzag shape.

[0012] Optionally, when the cross-sectional shape of the frame groove is a target shape and there are at least two frame grooves, the at least two frame grooves are arranged in a matrix on the surface of the frame body.

[0013] Optionally, the target shape is one of a circle, an ellipse and a regular polygon.

[0014] Optionally, the depth of the frame groove is arranged to be between 0.008 and 0.012 mm.

[0015] Optionally, the width of the frame groove is arranged to be between 0.028 and 0.032 mm.

[0016] Based on the second aspect of the present application, a discrete device is further provided, the discrete device comprising the semiconductor device frame according to any one of the above aspects.

[0017] Optionally, the discrete device further comprises a plastic package, the plastic package covering the surface of the frame body and extending into the mounting groove.

[0018] Optionally, the discrete device further comprises:

[0019] a device chip, the device chip being located on the surface of the frame body;

[0020] a connecting layer, the connecting layer being located between the device chip and the frame body to fix the device chip on the frame body, wherein the connecting layer extending into the mounting groove is flush with the groove of the mounting groove, or the connecting layer extending into the mounting groove is arranged outwardly protruding from the groove of the mounting groove.

[0021] Based on the third aspect of the utility model, a power module is further provided, and the power module comprises the discrete device as described in the utility model content.

[0022] Based on the fourth aspect of the utility model, a controller is further provided, and the controller comprises the power module as described in the utility model content.

[0023] Compared with the prior art, the utility model discloses a frame body and electroplated layer, the surface of frame body is provided with frame groove. The electroplated layer covers the surface of the frame body and extends into the frame groove to form a mounting groove on the surface of the electroplated layer located on the frame groove, and the mounting groove is fixed with the plastic package body of the discrete device.

[0024] The above description is only a summary of the technical scheme of the utility model, in order to more clearly understand the technical means of the utility model, which can be implemented according to the content of the specification, and in order to let the above and other purposes, characteristics and advantages of the utility model can be more obvious and easy to understand, the following specific embodiments of the utility model are described. BRIEF DESCRIPTION OF DRAWINGS

[0025] By reading the detailed description of the preferred embodiments below, various other advantages and benefits will become apparent to those of ordinary skill in the art. The drawings are for the purpose of illustrating the preferred embodiments only and are not to be considered as limiting of the present utility model. Moreover, the same reference numerals are used throughout the several drawings to designate the same or similar parts.

[0026] In the drawings:

[0027] Figure 1 Is a structure schematic view of a semiconductor device frame provided by the utility model embodiment;

[0028] Figure 2 Is a partial structure schematic view of a discrete device provided by the utility model embodiment;

[0029] Figure 3 Is Figure 2 The cross-sectional structure schematic view of A-A in the figure;

[0030] Figure 4 Is a partial cross-sectional structure schematic view of a discrete device provided by the utility model embodiment;

[0031] Figure 5 Is a cross-sectional structure schematic view of a discrete device provided by the utility model embodiment;

[0032] Figure 6 is another frame groove shape distribution schematic view provided by the embodiment of the utility model;

[0033] Figure 7 is another frame groove shape distribution schematic view provided by the embodiment of the utility model;

[0034] Figure 8 is another frame groove shape distribution schematic view provided by the embodiment of the utility model;

[0035] Figure 9 is another frame groove shape distribution schematic view provided by the embodiment of the utility model;

[0036] The drawing mark: 1, frame body;2, frame groove;201, first groove;202, second groove;3, installation recess;4, electroplating layer;5, device chip;6, connecting layer;7, plastic package body. DETAILED DESCRIPTION

[0037] Exemplary embodiments of the present application will be described herein below with reference to the accompanying drawings. While exemplary embodiments of the present application are shown in the drawings, it is understood that the present application can be embodied in various forms and should not be limited by the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the present application to those skilled in the art.

[0038] A power module is a module formed by pouring and sealing power power electronic devices combined according to certain functions. Moreover, the power module is widely used in various power electronic devices and systems, such as motor drives, inverters, frequency converters, rectifiers, etc., due to its high switching frequency and low driving power. For example, in a variable frequency series air conditioner, the power module is a main component. For example, the higher the voltage output by the power module, the greater the frequency and output power of the variable frequency compressor. Conversely, the lower the voltage output by the power module, the smaller the frequency and output frequency of the variable frequency compressor.

[0039] A power module is an electronic component integrated with multiple power discrete devices. The reliability of the discrete devices determines the operation reliability of the power module. However, when some of the current discrete devices are tested or operated, due to poor air tightness, external moisture enters the interior of the device, thereby increasing the abnormal rate of the device parameters.

[0040] In order to solve the above technical problems, the utility model discloses a kind of semiconductor device frame, and the semiconductor device frame can include frame body 1 and electroplating layer 4, the surface of frame body 1 is provided with frame groove 2.Electroplating layer 4 covers the surface of frame body 1, and extends to the frame groove 2, to form mounting groove 3 on the surface of electroplating layer 4 located on the frame groove 2, and mounting groove 3 is fixed with the shape of the plastic package 7 of discrete device.Forming fixation.

[0041] Referring to Figures 1-9 The utility model embodiment provides a kind of semiconductor device frame, and the semiconductor device frame can include frame body 1 and electroplating layer 4, the surface of frame body 1 is provided with frame groove 2, electroplating layer 4 covers the surface of frame body 1, and extends to the frame groove 2, to form mounting groove 3 on the surface of electroplating layer 4 located on the frame groove 2, and mounting groove 3 is fixed with the shape of the plastic package 7 of discrete device.

[0042] In the utility model embodiment, the semiconductor device frame includes frame body 1 and electroplating layer 4, wherein the frame body 1 can be made of copper material.The frame body 1 can be used to connect device chip 5 and external circuit, for example, the frame body 1 can connect the circuit lead-out end inside device chip 5 and external lead wire by bonding metal wire (such as gold wire, aluminum wire and copper wire etc.), to form electric circuit.On the other hand, the frame body 1 can also be used to support and fix discrete device device chip 5, to provide support and fixing effect for device chip 5, to determine the stability of device chip 5 in packaging process and use process.Again, the device body made of copper material has good heat conduction performance, can transfer the heat generated by device chip 5 to outside through the device body, to prevent the device chip 5 from overheating and damaging.

[0043] Referring to Figure 3 , Figure 4 And Figure 5 As shown, electroplating layer 4 is located on the upper surface of frame body 1, which can be obtained by electroplating pure tin material, silver material, tin alloy material or silver alloy material etc.on frame body 1.Tin material and silver material have high chemical stability, and the setting of electroplating layer 4 can prevent the frame body 1 from reacting with oxygen and water vapor in external environment, causing the frame body 1 to be corroded.

[0044] As a preferred embodiment, the electroplated layer 4 can be made of pure tin material, which can improve the soldering contact performance of the surface of the frame body 1.

[0045] The surface of the frame body 1 is provided with a frame groove 2, wherein the frame groove 2 can be processed on the surface of the frame body 1 by laser or etching, and can be distributed on the surface of the frame body 1. When the electroplated layer 4 is electroplated on the surface of the frame body 1, the electroplated thickness is generally uniformly distributed. Therefore, the electroplated layer 4 can cover the surface of the frame body 1 and also cover the groove wall of the frame groove 2. In other words, the electroplated layer 4 at the frame groove 2 can be considered as extending into the frame groove 2 or recessed into the surface of the frame body 1. The surface of the electroplated layer 4 on the frame groove 2 forms a mounting groove 3, so that when the device is plastic encapsulated by a plastic encapsulation body 7, the plastic encapsulation body 7 can extend into the mounting groove 3 and cooperate with the shape of the plastic encapsulation body 7 to improve the connection strength between the plastic encapsulation body 7 and the frame body 1, reduce the cavity rate of the device, improve the air tightness of the discrete device, and improve the performance reliability of the device.

[0046] At the same time, while improving the air tightness of the discrete device, the delamination of the frame body 1 and the plastic encapsulation body 7 can be reduced, and the heat dissipation efficiency of the discrete device can be improved.

[0047] An optional utility model embodiment, referring to Figure 1 、 Figure 2 and Figure 6 , the frame groove 2 is spirally extended from the inner side close to the center of the frame body 1 to the edge of the frame body 1.

[0048] In the embodiment of the utility model, the frame groove 2 is spirally extended from the inner side close to the center of the frame body 1 to the edge of the frame body 1, which can also be understood as that the frame groove 2 is spirally extended from the edge of the frame body 1 to the center of the frame body 1. Wherein, the spiral extension can be in the form of a curve or in the form of a straight line. It can be intermittently or continuously set during the spiral process. For example, the frame groove 2 can be provided with a plurality of frame grooves 2, and the plurality of frame grooves 2 are close to each other at the head and tail, that is, intermittently set to form a spiral.

[0049] The spiral extension of the frame groove 2 can increase the distribution area of the frame groove 2 on the frame body 1, thereby expanding the shape matching area between the plastic package 7 and the mounting groove 3, and improving the bonding force between the plastic package 7 and the frame body 1. The void rate of the device can be further reduced, thereby improving the air tightness of the discrete device and improving the performance reliability of the device.

[0050] An optional utility model embodiment, referring to Figure 9 The frame groove 2 includes at least two first grooves 201 and at least two second grooves 202, wherein the at least two first grooves 201 are arranged in parallel, the at least two second grooves 202 are arranged in parallel, the first grooves 201 and the second grooves 202 are arranged at an angle, and are matched on the frame body 1 to form a mesh structure.

[0051] In the utility model embodiment, the frame groove 2 can include at least two first grooves 201 and at least two second grooves 202. Among them, the first groove 201 and the second groove 202 are arranged at an angle, which can be understood as that the first groove 201 and the second groove 202 are not arranged in parallel. Correspondingly, all the first grooves 201 are arranged in parallel, and all the second grooves 202 are arranged in parallel, so that the at least two first grooves 201 and the at least two second grooves 202 can be arranged alternately and matched on the frame body 1 to form a mesh structure groove. Therefore, the distribution area of the frame groove 2 on the frame body 1 can be increased, so that the shape matching area between the plastic package 7 and the mounting groove 3 can be expanded, and the bonding force between the plastic package 7 and the frame body 1 is improved. The void rate of the device can be further reduced, thereby improving the air tightness of the discrete device and improving the performance reliability of the device.

[0052] An optional utility model embodiment, referring to Figure 8 As shown in the figure, in the case that the frame groove 2 is at least two, the at least two frame grooves 2 are arranged in parallel, and are distributed on the surface of the frame body 1 at equal intervals.

[0053] In the embodiment of the utility model, when the frame groove 2 is at least two, at least two frame grooves 2 are arranged in parallel and are distributed at equal intervals on the surface of the frame body 1. The equal interval distribution can be understood as that the distance between every two adjacent frame grooves 2 in all frame grooves 2 is equal. The equal interval distribution and parallel arrangement can facilitate the processing of the frame groove 2, and the distribution area of the frame groove 2 on the surface of the frame body 1 can be increased by arranging multiple frame grooves 2 on the surface of the frame body 1, so that the shape matching area between the plastic package 7 and the mounting groove 3 can be enlarged, and the bonding force between the plastic package 7 and the frame body 1 is improved. The air cavity rate of the device can be further reduced, so that the air tightness of the discrete device is improved, and the performance reliability of the device is improved.

[0054] An optional embodiment of the utility model, the cross-sectional shape of the frame groove 2 includes long strip, wave and sawtooth.

[0055] In the embodiment of the utility model, the cross-sectional shape of the frame groove 2 can include long strip, wave and sawtooth. The long strip can be understood as a shape with a length more than N times of the width, for example, N can be an integer greater than or equal to 2. The wave shape can include but is not limited to sinusoidal wave and other curve shapes with the same peak amplitude and different peak amplitudes. The cross-sectional shape of the frame groove 2 can be determined by the actual processing requirements of the frame groove 2, such as convenience, and other requirements, which is not limited here.

[0056] An optional embodiment of the utility model, referring to Figure 7 When the cross-sectional shape of the frame groove 2 is a target shape and at least two, at least two frame grooves 2 are distributed in a matrix on the surface of the frame body 1.

[0057] In the embodiment of the utility model, when the cross-sectional shape of the frame groove 2 is a target shape and at least two, it can be considered that multiple frame grooves 2 are distributed in a point on the surface of the frame body 1. Therefore, at least two frame grooves 2 can be distributed in a matrix on the surface of the frame body 1. Since the matrix distribution has a certain distribution, and the interval between two adjacent frame grooves 2 is equal, the processing efficiency of the frame groove 2 can be improved.

[0058] In some optional embodiments of the utility model, the target shape is one of the following: circular, elliptical and regular polygon. The regular polygon can include triangle, rectangle, pentagon and hexagon, etc. The specific cross-sectional shape of the frame groove 2 can be determined by the actual design requirements of the skilled in the art, which is not limited here.

[0059] The frame grooves 2 are arranged in a matrix on the surface of the frame body 1, which can increase the distribution area of the frame grooves 2 on the frame body 1, thereby expanding the shape matching area between the plastic package body 7 and the mounting groove 3, and improving the bonding force between the plastic package body 7 and the frame body 1. The cavity rate of the device can be further reduced, thereby improving the air tightness of the discrete device and improving the performance reliability of the device.

[0060] In an optional embodiment, the depth of the frame groove 2 is set to be between 0.008 and 0.012 mm.

[0061] In the embodiment, the depth of the frame groove 2, that is, the depth between the surface of the frame body 1 and the groove bottom of the frame groove 2. The depth of the frame groove 2 can be set to be between 0.008 and 0.012 mm. As a preferred mode, the depth of the frame groove 2 can be set to 0.01 mm, and the above depth range can be understood as the processing error reserved for the frame groove 2.

[0062] In an optional embodiment, the width of the frame groove 2 is set to be between 0.028 and 0.032 mm.

[0063] In the embodiment, the width of the frame groove 2 can be 0.03 mm, and the width range can be understood as the processing error reserved for the frame groove 2. The width of the frame groove 2 here can be set for the long strip-shaped frame groove 2.

[0064] In summary, the embodiment of the utility model discloses a semiconductor device frame, which can include a frame body 1 and an electroplated layer 4, and the surface of the frame body 1 is provided with a frame groove 2. The electroplated layer 4 covers the surface of the frame body 1 and extends into the frame groove 2 to form a mounting groove 3 on the surface of the electroplated layer 4 located in the frame groove 2, and the mounting groove 3 is fixed by shape matching with the plastic package body 7 of the discrete device. Therefore, when the device is packaged, the plastic package body 7 can extend into the mounting groove 3, the connection strength between the plastic package body 7 and the frame body 1 can be improved, and the cavity rate of the device can be reduced, thereby improving the air tightness of the discrete device and improving the performance reliability of the device.

[0065] The embodiment of the utility model further provides a discrete device, which includes the semiconductor device frame according to any one of the above embodiments.

[0066] The utility model discloses an embodiment, including the discrete device of semiconductor device frame can include diode, triode, thyristor and power semiconductor device etc.. The semiconductor device frame includes frame body 1 and plating layer 4, wherein, frame body 1 can be made of copper material. The semiconductor device frame can include frame body 1 and plating layer 4, the surface of frame body 1 is provided with frame groove 2, plating layer 4 covers the surface of frame body 1, and extends to the inside of frame groove 2 and is arranged to form mounting groove 3 on the surface of plating layer 4 located on frame groove 2, mounting groove 3 and the shape cooperation of the plastic package body 7 of discrete device forms fixed.

[0067] Frame body 1 can be used for connecting device chip 5 and external circuit, for example, frame body 1 can be connected by bonding metal wire (such as gold wire, aluminum wire and copper wire etc.), the circuit lead-out end in device chip 5 and external lead wire are connected, thereby forming electric circuit. On the other hand, frame body 1 can also be used for supporting and fixing the device chip 5 of discrete device, provides support and fixed action for device chip 5, determines the stability of device chip 5 in the process of packaging and use. In another aspect, the device body made of copper material has good heat conduction performance, can pass through device body to the heat generated by device chip 5 outward transmission, thereby can prevent device chip 5 from overheating and damage.

[0068] Plating layer 4 is located on the upper surface of frame body 1, which can be made of pure tin material, silver material, tin alloy material or silver alloy material etc. on frame body 1. Tin material and silver material have higher chemical stability, the setting of plating layer 4 can prevent frame body 1 from reacting with oxygen and water vapor in the external environment, resulting in the problem of corrosion of frame body 1.

[0069] As a preferred embodiment, plating layer 4 can be made of pure tin material, which can improve the welding contact performance of the surface of frame body 1.

[0070] The surface of frame body 1 is provided with frame groove 2, wherein, frame groove 2 can be machined on the surface of frame body 1 by laser or etching etc., which can be distributed on the surface of frame body 1. When plating layer 4 is plated on the surface of frame body 1, the plating thickness is usually uniformly distributed. Therefore, plating layer 4 can cover the groove wall of frame groove 2 while covering the surface of frame body 1, in other words, plating layer 4 at frame groove 2 can be regarded as extending into frame groove 2 or recessing into the surface of frame body 1. The surface of plating layer 4 located on frame groove 2 forms mounting groove 3.

[0071] The discrete device further comprises a plastic package 7 covering the surface of the frame body 1 and extending into the mounting groove 3. When the discrete device is plastic packaged by the plastic package 7, the connection strength between the plastic package 7 and the frame body 1 can be improved by extending the plastic package 7 into the mounting groove 3 and matching the shape of the plastic package 7, and the cavity rate of the device can be reduced, so that the air tightness of the discrete device is improved and the performance reliability of the device is improved.

[0072] Meanwhile, while improving the air tightness of the discrete device, the delamination of the frame body 1 and the plastic package 7 can be reduced, and the heat dissipation efficiency of the discrete device can be improved.

[0073] An optional utility model embodiment, referring to Figure 4 and Figure 5 The discrete device can further comprise a device chip 5 and a connecting layer 6, wherein the device chip 5 is located on the surface of the frame body 1. The connecting layer 6 is located between the device chip 5 and the frame body 1 to fix the device chip 5 on the frame body 1, wherein the connecting layer 6 extending into the mounting groove 3 is flush with the slot of the mounting groove 3, or the connecting layer 6 extending into the mounting groove 3 is provided outwardly protruding to the slot of the mounting groove 3.

[0074] In the utility model embodiment, the device chip 5 can be fixed by the connecting layer 6 and the frame body 1, for example, the connecting layer 6 can be made of tin paste. During the fixing process of the device chip 5, the connecting layer 6 can fill the mounting groove 3. Therefore, the connecting layer 6 extending into the mounting groove 3 can be flush with the slot of the mounting groove 3, that is, flush with the surface of the frame body 1. For another example, the connecting layer 6 in the mounting groove 3 can also be provided outwardly protruding to the slot of the mounting groove 3, that is, outwardly protruding to the surface of the frame body 1. Therefore, the setting of the frame groove 2 can not only reduce the cavity rate of the device, but also ensure the mounting flatness of the device chip 5.

[0075] During the manufacturing process of the discrete device, the frame groove 2 can be machined on the frame body 1 in advance, then the frame body 1 is electroplated to form the electroplating layer 4. Then the device chip 5 is bonded to the corresponding position on the surface of the frame body 1 through the connecting layer 6. After the device chip 5 is fixed, the electrical connection between the frame body 1 and the device chip 5 is realized through the metal bonding wire, and then the device chip 5 is wrapped by the plastic package 7 and completely covers the surface of the frame body 1, so that the discrete device is obtained.

[0076] Based on the third aspect of the utility model, a power module is also provided, which comprises the discrete device as described in the above utility model embodiments.

[0077] In the utility model embodiment, the power module can include but is not limited to IGBT (Insulate-Gate Bipolar Transistor, Insulated Gate Bipolar Transistor) module and IPM (Intelligent Power Module, Intelligent Power Module) module and the like, and the power module can include the discrete device as described in the above utility model embodiments. The power device can include a frame body 1 and an electroplated layer 4, and the surface of the frame body 1 is provided with a frame groove 2. The electroplated layer 4 is covered on the surface of the frame body 1 and extends into the frame groove 2 to form a mounting groove 3 on the surface of the electroplated layer 4 located on the frame groove 2, and the mounting groove 3 is fixedly connected with the plastic package body 7 of the discrete device. Therefore, when the device is packaged, the plastic package body 7 can extend into the mounting groove 3, the connection strength between the plastic package body 7 and the frame body 1 can be improved, and the cavity rate of the device can be reduced, thereby improving the air tightness of the discrete device and improving the performance reliability of the device.

[0078] Based on the fourth aspect of the utility model, a controller is also provided, which comprises the power module as described in the above utility model embodiments.

[0079] In the utility model embodiment, the controller can be integrated with the power module as described in the above utility model embodiments, and the controller can be applied to electric appliances such as variable frequency air conditioners, thereby improving the operation stability of the electric appliances, avoiding the delamination of the device body and the plastic package body 7, and the performance failure caused by low device air tightness.

[0080] In summary, the utility model discloses a kind of semiconductor device frame, discrete device, power module and controller, and the utility model embodiment can include frame body 1 and electroplating layer 4, the surface of the frame body 1 is provided with frame groove 2.Electroplating layer 4 is covered on the surface of the frame body 1, and extend to the frame groove 2 and be provided with, to form mounting groove 3 on the surface of electroplating layer 4 located in the frame groove 2, the mounting groove 3 is fixed with the shape cooperation of discrete device's plastic package 7.Formulation. Thus, when device packaging is carried out, it can be extended to the mounting groove 3 by plastic package 7, the connection strength between plastic package 7 and the frame body 1 can be improved, and the cavity rate of device is reduced, so as to improve the air tightness of discrete device, and improve the performance reliability of device.Each embodiment in the specification is described in a progressive manner, and each embodiment focuses on the difference from other embodiments, and the same or similar parts between each embodiment can be referred to.

[0081] It is easy for those skilled in the art to think that any combination of the above embodiments is feasible, so any combination of the above embodiments is an embodiment of the utility model, but due to the limitation of the length, the specification will not be described in detail here.

[0082] In the specification provided herein, a large number of specific details are described. However, it can be understood that the embodiments of the utility model can be practiced without these specific details. In some examples, well-known methods, structures and techniques are not shown in detail in order not to obscure the understanding of the specification.

[0083] Similarly, it should be understood that, in order to simplify the utility model and help understand one or more of the various inventive aspects, in the above description of the exemplary embodiments of the utility model, various features of the utility model are sometimes grouped together in a single embodiment, figure, or description thereof.

[0084] In addition, those skilled in the art can understand that, although some embodiments described herein include certain features included in other embodiments rather than other features, the combination of features of different embodiments means that it is within the scope of the utility model and forms different embodiments. For example, in the claims, any one of the claimed embodiments can be used in any combination.

Claims

1. A semiconductor device frame, characterized in that, The semiconductor device framework includes: A frame body (1) has frame grooves (2) on its surface; An electroplated layer (4) is applied to the surface of the frame body (1) and extends into the frame groove (2) to form a mounting groove (3) on the surface of the electroplated layer (4) located in the frame groove (2). The mounting groove (3) is shaped to fit the molded body (7) of the discrete device to form a fixed shape.

2. The semiconductor device frame according to claim 1, characterized in that, The frame groove (2) is provided to spiral outward from the inner side near the center of the frame body (1) toward the edge of the frame body (1).

3. The semiconductor device frame according to claim 1, characterized in that, The frame groove (2) includes at least two first grooves (201) and at least two second grooves (202), wherein at least two first grooves (201) are arranged in parallel and at least two second grooves (202) are arranged in parallel. The first grooves (201) and the second grooves (202) are arranged at an angle and cooperate to form a mesh structure on the frame body (1).

4. The semiconductor device frame according to claim 1, characterized in that, When there are at least two frame grooves (2), the at least two frame grooves (2) are arranged in parallel and are evenly distributed on the surface of the frame body (1).

5. The semiconductor device frame according to claim 4, characterized in that, The cross-sectional shape of the frame groove (2) includes a long strip, a wave shape, and a sawtooth shape.

6. The semiconductor device frame according to claim 1, characterized in that, When the cross-sectional shape of the frame groove (2) is the target shape and there are at least two of them, the at least two frame grooves (2) are distributed in a matrix on the surface of the frame body (1).

7. The semiconductor device frame according to claim 6, characterized in that, The target shape is one of the following: circle, ellipse, and regular polygon.

8. The semiconductor device frame according to claim 1, characterized in that, The depth of the frame groove (2) is set between 0.008 and 0.012 mm.

9. The semiconductor device frame according to claim 1, characterized in that, The width of the frame groove (2) is set between 0.028 and 0.032 mm.

10. A discrete device, characterized in that, The discrete device includes a semiconductor device frame as described in any one of claims 1-9.

11. The discrete device according to claim 10, characterized in that, The discrete device also includes a molding compound (7) that covers the surface of the frame body (1) and extends into the mounting groove (3).

12. The discrete device according to claim 10, characterized in that, The discrete device also includes: Device chip (5), the device chip (5) is located on the surface of the frame body (1); A connecting layer (6) is located between the device chip (5) and the frame body (1) to fix the device chip (5) onto the frame body (1). The connecting layer (6) extending into the mounting groove (3) is flush with the opening of the mounting groove (3), or the connecting layer (6) extending into the mounting groove (3) protrudes outward from the opening of the mounting groove (3).

13. A power module, characterized in that, The power module includes discrete devices as described in any one of claims 10-12.

14. A controller, characterized in that, The controller includes the power module as described in claim 13.

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