Chip mounting device and electric connector

Abstract

The utility model provides a chip mounting device and an electric connector. The chip mounting device comprises a mounting plate, a socket, an upper cover plate, a rotating part and a supporting frame, the mounting plate is connected with the socket, the mounting plate is used for being connected with a circuit board, the socket is provided with a connecting terminal, the connecting terminal is used for being connected with the circuit board, the upper cover plate is rotationally connected with the mounting plate, and the rotating part is arranged on the upper cover plate. One end of the rotating part is rotationally connected to the upper cover plate, the other end of the rotating part is rotationally connected with the supporting frame, a plurality of elastic buckles arranged at intervals are arranged on the side, close to the mounting plate, of the supporting frame, and the elastic buckles and the supporting frame jointly form an inserting groove; the elastic buckle is used for being buckled with the clamping plate when the upper cover plate rotates and presses downwards, and when the upper cover plate rotates to a preset position relative to the mounting plate, an included angle exists between the supporting frame and the upper cover plate so that the chip and the clamping plate can be pulled out of the inserting groove.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the field of electrical connectors, and in particular to a chip mounting device and an electrical connector. BACKGROUND

[0002] An electrical connector, often referred to as an electric connector or an electronic connector, is a conductor device that bridges two conductors on a circuit, allowing current or signals to flow from one conductor to another. It is an indispensable element in electronic systems, playing a role in connecting and disconnecting current or signals.

[0003] When assembling the electrical connector, the socket needs to be connected with the circuit board and the chip respectively, that is, the connection terminal of the socket is connected with the circuit board, and the connection terminal of the socket also needs to be connected with the chip. In the prior art, the assembly method of the electrical connector is as follows: first, connect the circuit board with the connection terminal of the socket, then assemble and fix the chip with the clamping piece and the buckle of the rotating support, rotate the rotating support relative to the socket, and then assemble the chip into the cavity in the socket, so that the chip and the circuit board are connected through the socket.

[0004] However, the structure design of the existing electrical connector has the following problems in use:

[0005] When the chip needs to be repaired or replaced, the chip needs to be rotated by rotating the rotating support to be taken off from the buckle of the rotating support. However, since the chip is clamped with the rotating support through the buckle, the chip needs to be forced outward from the rotating support when disassembled, so that the chip may fall and damage the connection terminal when manually disassembled. On the other hand, the chip and the clamping piece are assembled and transported on the production line, so that the chip and the clamping piece need to be inserted into the buckle of the rotating support, which increases the process and reduces the production efficiency.

[0006] Therefore, there is an urgent need for an electrical connector that can avoid damage to the terminal and is suitable for automatic assembly of the chip and has high production efficiency. INVENTION CONTENTS

[0007] The purpose of the present disclosure is to overcome the deficiencies in the prior art, and to provide a chip mounting device and an electrical connector that can avoid damage to the terminal and is suitable for automatic assembly of the chip and has high production efficiency.

[0008] The purpose of the present disclosure is achieved by the following technical solutions:

[0009] A chip mounting device, comprising:

[0010] a mounting plate and a socket, the mounting plate is connected with the socket, the mounting plate is used to connect with a circuit board, the socket is provided with a connection terminal, the connection terminal is used to connect with the circuit board,

[0011] The chip mounting device further comprises an upper cover plate, a rotating member and a support frame, one end of the rotating member is rotatably connected to the upper cover plate, the other end of the rotating member is rotatably connected to the support frame, the support frame is provided with a plurality of elastic buckles arranged at intervals adjacent to one side of the mounting plate, the elastic buckles and the support frame jointly form a plug-in slot, the elastic buckles are used for buckling with the clamping plate when the upper cover plate is pressed downward, and when the upper cover plate is rotated to a preset position relative to the mounting plate, an included angle exists between the support frame and the upper cover plate, so that the chip and the clamping plate are separated from the plug-in slot.

[0012] In one of the embodiments, each of the elastic buckles comprises a connecting portion, an arc-shaped clamping portion and a guide portion connected in sequence, the connecting portion is fixedly connected to the support frame, the arc-shaped clamping portion is used for abutting against the clamping plate, and the guide portion has a guide slope, the guide portion is used for the clamping plate to enter the plug-in slot along the guide slope when the upper cover plate is pressed downward.

[0013] In one of the embodiments, an end of the support frame is provided with an arc-shaped chamfer structure, the arc-shaped chamfer structure is used for abutting against the clamping plate when the clamping plate is inserted.

[0014] In one of the embodiments, a periphery of the support frame is provided with a rotating boss, one end of the rotating member is provided with a sleeving hole, the rotating boss is located in the sleeving hole, so that the rotating member is rotatably connected to the support frame; and / or,

[0015] A side surface of the upper cover plate is provided with a first rotating hole, one end of the rotating member is provided with a second rotating hole, the first rotating hole and the second rotating hole are used for a rotating shaft to pass through, so that the upper cover plate is rotatably connected to the rotating member.

[0016] In one of the embodiments, the mounting plate is provided with a rotating structure, the rotating structure comprises a rotating seat and a connecting shaft, the rotating seat is arranged on a surface of the mounting plate, the connecting shaft is mounted in the rotating seat, the upper cover plate is provided with a third rotating hole, and a part of the connecting shaft is located in the third rotating hole, so that the upper cover plate is rotatably connected to the mounting plate.

[0017] In one of the embodiments, the rotating structure further comprises an elastic member, the elastic member is sleeved in the connecting shaft, and the elastic member is connected to the mounting plate and the upper cover plate respectively.

[0018] In one of the embodiments, the chip mounting device further comprises a bottom plate, the bottom plate is connected to a side of the mounting plate away from the upper cover plate, and the bottom plate and the mounting plate are used for clamping a circuit board together.

[0019] In one embodiment, the upper cover plate has a first screw hole and the mounting plate has a second screw hole. The first screw hole and the second screw hole are for screws to pass through so that the mounting plate and the upper cover plate are screwed together.

[0020] In one embodiment, the cross-section of the insertion slot is U-shaped.

[0021] An electrical connector includes a chip, a clamping plate, and a chip mounting device as described in any of the above embodiments, wherein the chip is fastened to the clamping plate, and the clamping plate is inserted into the insertion slot.

[0022] Compared with the prior art, this disclosure has at least the following advantages:

[0023] In the aforementioned chip mounting device, the socket is connected to the mounting plate, and the socket's connection terminals are connected to the circuit board. The upper cover is rotatably connected to the mounting plate, and rotating components are rotatably connected to both the upper cover and the support frame. During installation, the assembled chip and clamping plate are placed on the mounting plate by a robotic arm. The upper cover rotates along the mounting plate, causing the elastic clips of the support frame to engage with the clamping plate, thus securing the clamping plate into the insertion slot. This ensures tight contact between the chip and the socket's connection terminals. This reduces the need to assemble the chip and clamping plate onto the upper cover, making it more suitable for automated assembly on production lines and improving production efficiency. Furthermore, during chip removal, the upper cover rotates away from the mounting plate. At this point, there is an angle between the upper cover and the support frame, meaning the support frame is tilted relative to the upper cover. The chip and clamping plate can then be pulled out along the tilt direction of the insertion slot, thus avoiding the problem of damaged terminals when removing the chip due to traditional fastening methods. Attached Figure Description

[0024] To more clearly illustrate the technical solutions of the embodiments of this disclosure, the accompanying drawings used in the embodiments will be briefly described below. It should be understood that the following drawings only show some embodiments of this disclosure and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0025] Figure 1 This is a schematic diagram of the structure of a chip mounting device according to one embodiment;

[0026] Figure 2 for Figure 1 Another schematic diagram of the chip mounting device shown;

[0027] Figure 3 for Figure 2 A partially enlarged schematic diagram of the chip mounting device at point A;

[0028] Figure 4 for Figure 1 Another schematic diagram of the chip mounting device shown;

[0029] Figure 5 This is a schematic diagram of the structure of an electrical connector according to one embodiment;

[0030] Figure 6 for Figure 5 The diagram shown illustrates the electrical connector during chip assembly.

[0031] Figure 7 for Figure 5 The diagram shows the electrical connector during chip removal. Detailed Implementation

[0032] To facilitate understanding of this disclosure, a more complete description will be given below with reference to the accompanying drawings, which illustrate preferred embodiments of the present disclosure. However, this disclosure can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and complete understanding of the disclosure.

[0033] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly attached to the other element or there may be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0034] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of this disclosure. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0035] This disclosure provides a chip mounting device, including a mounting plate, a socket, a top cover, a rotating component, and a support frame. The mounting plate is connected to the socket and is used to connect to a circuit board. The socket is provided with a connection terminal for connecting to the circuit board. The top cover is rotatably connected to the mounting plate. One end of the rotating component is rotatably connected to the top cover, and the other end of the rotating component is rotatably connected to the support frame. The support frame has a plurality of spaced elastic buckles on one side adjacent to the mounting plate. The elastic buckles and the support frame together form an insertion groove. The elastic buckles are used to engage with a clamping plate when the top cover rotates and presses down. When the top cover rotates relative to the mounting plate to a preset position, there is an angle between the support frame and the top cover, so that the chip and the clamping plate are pulled out of the insertion groove.

[0036] In the aforementioned chip mounting device, the socket is connected to the mounting plate, and the socket's connection terminals are connected to the circuit board. The upper cover is rotatably connected to the mounting plate, and rotating components are rotatably connected to both the upper cover and the support frame. During installation, the assembled chip and clamping plate are placed on the mounting plate by a robotic arm. The upper cover rotates along the mounting plate, causing the elastic clips of the support frame to engage with the clamping plate, thus securing the clamping plate into the insertion slot. This ensures tight contact between the chip and the socket's connection terminals. This reduces the need to assemble the chip and clamping plate onto the upper cover, making it more suitable for automated assembly on production lines and improving production efficiency. Furthermore, during chip removal, the upper cover rotates away from the mounting plate. At this point, there is an angle between the upper cover and the support frame, meaning the support frame is tilted relative to the upper cover. The chip and clamping plate can then be pulled out along the tilt direction of the insertion slot, thus avoiding the problem of damaged terminals when removing the chip due to traditional fastening methods.

[0037] To better understand the technical solutions and beneficial effects of this disclosure, the following detailed description is provided in conjunction with specific embodiments:

[0038] like Figure 1 and Figure 2As shown, a chip mounting device 10a according to one embodiment includes a mounting plate 100, a socket 200, a top cover plate 300, a rotating member 400, and a support frame 500. The mounting plate 100 is connected to the socket 200 and is used to connect to a circuit board 10b. The socket 200 is provided with connection terminals for electrical connection to the circuit board 10b. The top cover plate 300 is rotatably connected to the mounting plate 100. One end of the rotating member 400 is rotatably connected to the top cover plate 300, and the other end of the rotating member 400 is connected to the top cover plate 300. The support frame 500 is rotatably connected. On the side of the support frame 500 adjacent to the mounting plate 100, there are multiple spaced elastic buckles 510. The elastic buckles 510 and the support frame 500 together form an insertion groove 520. The elastic buckles 510 are used to engage with the clamping plate 700 when the upper cover plate 300 is rotated and pressed down. When the upper cover plate 300 is rotated relative to the mounting plate 100 to a preset position, there is an angle between the support frame 500 and the upper cover plate 300, so that the chip 600 and the clamping plate 700 are pulled out of the insertion groove 520.

[0039] In this embodiment, the mounting plate 100 has a hollowed-out groove, the socket 200 is located in the hollowed-out groove and connected to the mounting plate 100, the connecting terminal passes through the hollowed-out groove and is connected to the circuit board 10b located below the mounting plate 100, the upper cover plate 300 is rotatably connected to the mounting plate 100, and the rotating component 400 is rotatably connected to the support frame 500 and the upper cover plate 300 respectively, so that when the upper cover plate 300 rotates, there is an angle between the support frame 500 and the upper cover plate 300. The assembly process of chip 600 is as follows: First, chip 600 and clamping plate 700 are fastened together as a whole. The production line robot places chip 600 and clamping plate 700 on mounting plate 100. The upper cover plate 300 rotates along the direction close to mounting plate 100, so that the elastic buckle 510 of support frame 500 is fastened to clamping plate 700, thereby making chip 600 and the connection terminal of socket 200 in close contact, so as to realize the conduction between circuit board 10b, socket 200 and chip 600. Finally, the upper cover plate 300 and mounting plate 100 are locked with fasteners, so that chip 600 and connection terminal are in close contact. This reduces the steps required to assemble chip 600 and clamping plate 700 on upper cover plate 300, making the device more suitable for automated assembly on the production line. Furthermore, the chip 600 disassembly process is as follows: Open the fasteners and rotate the upper cover 300 away from the mounting plate 100. Since the two ends of the rotating component 400 are rotatably connected to the upper cover 300 and the support frame 500 respectively, an angle exists between the upper cover 300 and the support frame 500 during rotation. When the upper cover 300 rotates to the predetermined position, the support frame 500 is tilted against the upper cover 300. At this point, the chip 600 and the clamping plate 700 are pulled out along the tilt direction of the insertion slot 520, thus avoiding the problem of damaging the terminals when removing the chip 600 due to traditional fastening methods. Furthermore, during reassembly, the chip 600 can be directly placed on the mounting plate 100, or the chip 600 and the clamping plate 700 can be directly inserted into the insertion slot 520, and the chip 600 can be guided into the socket 200 by rotating the upper cover 300.

[0040] The aforementioned chip mounting device 10 has a socket 200 connected to the mounting plate 100, with the socket 200's connection terminals connected to the circuit board 10b. The upper cover 300 is rotatably connected to the mounting plate 100, and the rotating component 400 is rotatably connected to both the upper cover 300 and the support frame 500. During installation, the assembled chip 600 and clamping plate 700 are placed on the mounting plate 100 by a robotic arm. The upper cover 300 rotates along the mounting plate 100, causing the elastic buckle 510 of the support frame 500 to engage with the clamping plate 700, and the clamping plate 700 to be inserted into the insertion slot 520. This ensures that the chip 600 and the socket 200's connection terminals are in close contact. This reduces the steps required to assemble the chip 600 and clamping plate 700 onto the upper cover 300, making it more suitable for automated assembly on the production line and thus improving production efficiency. Furthermore, when chip 600 is disassembled, the upper cover plate 300 rotates away from the mounting plate 100. At this time, there is an angle between the upper cover plate 300 and the support frame 500, that is, the support frame 500 is tilted on the upper cover plate 300. Chip 600 and clamping plate 700 can be pulled out along the tilt direction of the insertion slot 520. This avoids the problem of damaging the terminals when chip 600 is removed due to the traditional fastening method.

[0041] like Figure 3 As shown, in one embodiment, each of the elastic buckles 510 includes a connecting part 511, an arc-shaped snap-fit ​​part 512, and a guide part 513 connected in sequence. The connecting part 511 is fixedly connected to the support frame 500. The arc-shaped snap-fit ​​part 512 is used to abut against the clamping plate 700. The guide part 513 has a guide slope. When the upper cover plate 300 is pressed down, the guide part 513 is used for the clamping plate 700 to enter the insertion groove 520 along the guide slope. Understandably, during chip 600 assembly, chip 600 and clamping plate 700 are located on mounting plate 100. The upper cover plate 300 rotates along the mounting plate 100. Clamping plate 700 first contacts guide part 513, allowing clamping plate 700 to enter along the guide slope of guide part 513. When clamping plate 700 contacts arc-shaped snap-fit ​​part 512, arc-shaped snap-fit ​​part 512 undergoes elastic deformation, thereby snapping clamping plate 700 into insertion slot 520. In this way, the upper cover plate 300 presses clamping plate 700 tightly onto mounting plate 100, thereby making chip 600 and socket 200 connection terminals in close contact.

[0042] like Figure 3As shown, in one embodiment, the end of the support frame 500 is provided with an arc-shaped chamfer structure 530, which is used to abut against the clamping plate 700 when it is inserted. It is understood that when the chip 600 needs to be reassembled after being removed from the insertion slot 520, the replaced chip 600 is engaged with the clamping plate 700. At this time, the chip 600 and the clamping plate 700 can be manually inserted into the insertion slot 520. When the clamping plate 700 enters the insertion slot 520, the arc-shaped chamfer structure 530 acts as a guide, allowing the clamping plate 700 to be inserted more accurately into the insertion slot 520. After the clamping plate 700 and the chip 600 enter the insertion slot 520, the arc-shaped chamfer structure 530 provides support for the clamping plate 700.

[0043] like Figure 3 As shown, in one embodiment, the support frame 500 has a rotating boss 540 protruding from its periphery, and one end of the rotating member 400 has a sleeve hole. The rotating boss 540 is located in the sleeve hole so that the rotating member 400 is rotatably connected to the support frame 500. The upper cover plate 300 has a first rotating hole on its side, and one end of the rotating member 400 has a second rotating hole. The first rotating hole and the second rotating hole are used for the passing of a rotating shaft so that the upper cover plate 300 is rotatably connected to the rotating member 400. In this embodiment, the socket hole is opened on one side of the end of the rotating member 400, and the rotating boss 540 is located inside the socket hole and extends partially outside the socket hole, so that the support frame 500 is rotatably connected to the rotating member 400. The second rotating hole is opened at the end of the rotating member 400 away from the socket hole. The rotating shaft passes through the first rotating hole and the second rotating hole, so that the upper cover plate 300 is rotatably connected to the rotating member 400, thereby achieving an angle between the support frame 500 and the upper cover plate 300 when the upper cover plate 300 rotates to a preset predetermined position.

[0044] like Figure 4 As shown, in one embodiment, the mounting plate 100 is provided with a rotating structure 110, which includes a rotating seat 111 and a connecting shaft 112. The rotating seat 111 is disposed on the surface of the mounting plate 100, and the connecting shaft 112 is mounted on the rotating seat 111. The upper cover plate 300 has a third rotating hole, and part of the connecting shaft 112 is located in the third rotating hole, so that the upper cover plate 300 is rotatably connected to the mounting plate 100. It can be understood that the connecting shaft 112 is mounted on the rotating seat 111, and part of the connecting shaft 112 is located in the third rotating hole of the upper cover plate 300, so that the upper cover plate 300 is sleeved on the connecting shaft 112, allowing the upper cover plate 300 to rotate relative to the connecting shaft 112.

[0045] like Figure 4As shown, in one embodiment, the rotating structure 110 further includes an elastic element 113, which is sleeved within the connecting shaft 112 and connected to both the mounting plate 100 and the upper cover plate 300. It can be understood that the elastic element 113, sleeved within the connecting shaft 112 and connected to both the mounting plate 100 and the upper cover plate 300, means that when the upper cover plate 300 rotates in the direction closer to the mounting plate 100, the elastic element 113 is in a compressed state; when the locked upper cover plate 300 is opened, the elastic element 113 relaxes, causing the upper cover plate 300 to rotate in the direction away from the mounting plate 100. In this embodiment, the elastic element 113 is a spring.

[0046] like Figure 4 As shown, in one embodiment, the chip mounting device 10a further includes a base plate 600, which is connected to the mounting plate 100 on the side opposite to the upper cover plate 300. The base plate 600 and the mounting plate 100 together are used to clamp the circuit board 10b. It can be understood that the base plate 600 is connected to the mounting plate 100 on the side opposite to the upper cover plate 300, and the circuit board 10b is clamped between the base plate 600 and the mounting plate 100. That is, the base plate 600 is located at the bottom of the circuit board 10b, which improves the structural strength of the circuit board 10b and thus prevents the circuit board 10b from being crushed when subjected to large forces.

[0047] like Figure 1 As shown, in one embodiment, the upper cover plate 300 has a first screw hole 310, and the mounting plate 100 has a second screw hole 120. The first screw hole 310 and the second screw hole 120 are for screws to pass through, so that the mounting plate 100 and the upper cover plate 300 are screwed together. It can be understood that after the upper cover plate 300 presses the clamping plate 700 onto the mounting plate 100, the mounting plate 100 and the upper cover plate 300 are then locked together by screws, ensuring that the chip 600 on the clamping plate 700 is in close contact with the connection terminal of the socket 200.

[0048] like Figure 1 and Figure 2 As shown, in one embodiment, the cross-section of the insertion slot 520 is U-shaped. It is understood that the U-shaped insertion slot 520 facilitates the assembly of the clamping plate 700 and the chip 600 into the support frame 500.

[0049] like Figure 5 As shown, this application also provides an electrical connector 10, including a chip 600, a clamping plate 700 and a chip mounting device 10a as described in any of the above embodiments, wherein the chip 600 is fastened to the clamping plate 700 and the clamping plate 700 is inserted into the insertion slot 520.

[0050] Compared with the prior art, this disclosure has at least the following advantages:

[0051] The aforementioned chip mounting device 10 has a socket 200 connected to the mounting plate 100, with the socket 200's connection terminals connected to the circuit board 10b. The upper cover 300 is rotatably connected to the mounting plate 100, and the rotating component 400 is rotatably connected to both the upper cover 300 and the support frame 500. During installation, the assembled chip 600 and clamping plate 700 are placed on the mounting plate 100 by a robotic arm. The upper cover 300 rotates along the mounting plate 100, causing the elastic buckle 510 of the support frame 500 to engage with the clamping plate 700, and the clamping plate 700 to be inserted into the insertion slot 520. This ensures that the chip 600 and the socket 200's connection terminals are in close contact. This reduces the steps required to assemble the chip 600 and clamping plate 700 onto the upper cover 300, making it more suitable for automated assembly on the production line and thus improving production efficiency. Furthermore, when chip 600 is disassembled, the upper cover plate 300 rotates away from the mounting plate 100. At this time, there is an angle between the upper cover plate 300 and the support frame 500, that is, the support frame 500 is tilted on the upper cover plate 300. Chip 600 and clamping plate 700 can be pulled out along the tilt direction of the insertion slot 520. This avoids the problem of damaging the terminals when chip 600 is removed due to the traditional fastening method.

[0052] The embodiments described above are merely illustrative of several implementations of this disclosure, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this disclosure, and these all fall within the protection scope of this disclosure. Therefore, the protection scope of this patent should be determined by the appended claims.

Claims

1. A chip mounting device, comprising a mounting plate and a socket, wherein the mounting plate is connected to the socket, the mounting plate is used for connecting to a circuit board, and the socket is provided with connection terminals for electrically connecting to the circuit board, characterized in that... The chip mounting device further includes an upper cover plate, a rotating component, and a support frame. The upper cover plate is rotatably connected to the mounting plate. One end of the rotating component is rotatably connected to the upper cover plate, and the other end of the rotating component is rotatably connected to the support frame. The support frame has a plurality of spaced elastic buckles on one side adjacent to the mounting plate. The elastic buckles and the support frame together form an insertion groove. The elastic buckles are used to engage with the clamping plate when the upper cover plate rotates and presses down. When the upper cover plate rotates relative to the mounting plate to a preset position, there is an angle between the support frame and the upper cover plate, so that the chip and the clamping plate are pulled out of the insertion groove.

2. The chip mounting apparatus according to claim 1, characterized in that, Each of the elastic buckles includes a connecting part, an arc-shaped snap-fit ​​part, and a guide part connected in sequence. The connecting part is fixedly connected to the support frame. The arc-shaped snap-fit ​​part is used to abut against the clamping plate. The guide part has a guide slope. When the upper cover plate is pressed down, the clamping plate enters the insertion groove along the guide slope.

3. The chip mounting apparatus according to claim 1, characterized in that, The end of the support frame is provided with an arc-shaped chamfer structure, which is used to abut against the clamping plate when the clamping plate is inserted.

4. The chip mounting apparatus according to claim 1, characterized in that, The support frame has a rotating boss protruding from its periphery, and one end of the rotating component has a sleeve hole. The rotating boss is located within the sleeve hole, so that the rotating component is rotatably connected to the support frame; and / or, The upper cover plate has a first rotating hole on its side, and the rotating component has a second rotating hole at one end. The first rotating hole and the second rotating hole are used for the shaft to pass through, so that the upper cover plate and the rotating component are rotatably connected.

5. The chip mounting apparatus according to claim 1, characterized in that, The mounting plate is provided with a rotating structure, which includes a rotating seat and a connecting shaft. The rotating seat is disposed on the surface of the mounting plate, and the connecting shaft is mounted on the rotating seat. The upper cover plate has a third rotating hole, and the connecting shaft is partially located in the third rotating hole, so that the upper cover plate is rotatably connected to the mounting plate.

6. The chip mounting apparatus according to claim 5, characterized in that, The rotating structure also includes an elastic element, which is sleeved inside the connecting shaft and is connected to the mounting plate and the upper cover plate respectively.

7. The chip mounting apparatus according to claim 1, characterized in that, The chip mounting device also includes a base plate, which is connected to the mounting plate on the side opposite to the top cover plate. The base plate and the mounting plate are used together to clamp the circuit board.

8. The chip mounting apparatus according to claim 1, characterized in that, The upper cover plate has a first screw hole, and the mounting plate has a second screw hole. The first screw hole and the second screw hole are used for screws to pass through so that the mounting plate and the upper cover plate are screwed together.

9. The chip mounting apparatus according to claim 1, characterized in that, The cross-section of the insertion slot is U-shaped.

10. An electrical connector, characterized in that, The device includes a chip, a clamping plate, and a chip mounting device according to any one of claims 1 to 9, wherein the chip is fastened to the clamping plate, and the clamping plate is inserted into the insertion slot.

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