Waterproof structure of power supply circuit board

By incorporating nano-coatings, waterproof walls, and waterproof adhesive layers onto the power circuit board, the problem of short circuits in humid environments is solved, achieving a waterproof effect and improving circuit stability.

CN223666534UActive Publication Date: 2025-12-12SHENZHEN ZHONGXUYUAN TECH CO LTD
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Patent Information

Application Number
CN202423154369.6
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-12-20
Publication Date
2025-12-12
Estimated Expiration
2034-12-20

AI Technical Summary

Technical Problem

Existing circuit boards are prone to short circuits in humid environments, especially outdoor equipment, which can cause control circuits to malfunction due to a lack of effective waterproof structures.

Method used

A nano-coating is applied to the main board and sub-board of the power circuit board, and a waterproof wall and waterproof adhesive layer are added around the inverter module which is prone to short circuit. Combined with the waterproof structure of sealing gaps with glue and spring pins, materials such as nano-coating, waterproof wall, waterproof adhesive layer and glue are used to improve waterproof performance.

Benefits of technology

It effectively prevents short circuits on the circuit board, improves the circuit board's waterproof capability, and enhances the stability and reliability of the circuit.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a waterproof structure of a power supply circuit board, the waterproof structure is respectively arranged on a main board and an auxiliary board, an element installation surface of the main board is provided with a plurality of first elements, and a first quick connection element, a capacitor bank, a second quick connection element and a secondary inversion module are sequentially arranged along a first direction of the element installation surface of the main board. And a plurality of second components are arranged on the component mounting surface of the auxiliary board. The waterproof structure comprises a nano coating covering the surfaces of the main board and the plurality of first components; the waterproof wall is arranged at the periphery of the secondary inversion module; a gap between the bottom end of the waterproof wall and the main board is blocked by glue; the waterproof glue layer is sprayed in the waterproof wall area and completely covers the upper end of the secondary inversion module; and the nano coating is coated on the surfaces of the auxiliary board and the plurality of second components. The power supply circuit board is good in waterproof effect, and waterproof glue is added to the main board and the auxiliary board in the inversion module which is prone to short circuit, so that the waterproof capability is enhanced.
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Description

TECHNICAL FIELD

[0001] The utility model relates to power supply circuit board, specifically relates to a waterproof structure of power supply circuit board. BACKGROUND

[0002] Circuit board can be called printed wiring board or printed circuit board, and it is the carrier of electrical connection of electronic components, and the consistency of the same kind of printed board avoids the error of manual wiring, and realizes automatic insertion or mounting of electronic components, automatic soldering, automatic detection, guarantees the quality of electronic equipment, improves the labor productivity, reduces the cost, and is convenient for maintenance.

[0003] Especially for outdoor equipment, the waterproof of the circuit board is particularly important. Since the outdoor equipment needs to consider the problem of heat dissipation, most of the cabinets have ventilation windows, and in the case of high humidity, the water vapor in the cabinet can easily cause the circuit board to short circuit.

[0004] Therefore, it is necessary to set a waterproof structure for the power supply circuit board to solve the above technical problems. CONTENT OF THE UTILITY MODEL

[0005] In view of the defects in the prior art, the utility model solves the technical problem and provides a waterproof structure of power supply circuit board. The purpose of designing the waterproof structure is to prevent the power supply circuit board from short circuiting.

[0006] In order to solve the above technical problems, the utility model realizes the following scheme: the utility model provides a waterproof structure of power supply circuit board, which is arranged on the main plate and the auxiliary plate, the element mounting surface of the main plate is provided with a plurality of first components, a first quick connecting element, a capacitor group, a second quick connecting element and a secondary inverter module are sequentially arranged along the first direction of the element mounting surface of the main plate, the element mounting surface of the auxiliary plate is provided with a plurality of second components, and the waterproof structure comprises:

[0007] A nano coating covering the main plate and the plurality of first components;

[0008] A waterproof wall arranged at the periphery of the secondary inverter module, and the gap between the bottom end of the waterproof wall and the main plate is sealed by glue;

[0009] A waterproof adhesive layer sprayed in the waterproof wall area and covering the upper end of the secondary inverter module;

[0010] A nano coating covering the auxiliary plate and the plurality of second components.

[0011] Further, the waterproof glue layer comprises three waterproof glue layers and a silica gel diaphragm distributed upwards and downwards.

[0012] Further, the glue is 704 glue.

[0013] Further, the main plate is also provided with spring pins serving as grounding, and the waterproof structure of the spring pin is that the pin foot of the spring pin is coated with waterproof glue.

[0014] Further, the coil on the auxiliary plate is a circular ring structure, and the middle part is filled with waterproof glue.

[0015] Compared with the prior art, the utility model has the advantages that the main plate and the auxiliary plate of the power circuit board are provided with nano coating, and waterproof glue is added to the inverter module which is prone to short circuit to enhance the waterproof capacity. BRIEF DESCRIPTION OF DRAWINGS

[0016] Fig. 1 It is the component mounting surface structure diagram of the main plate of the utility model.

[0017] Fig. 2 It is the component mounting surface structure diagram of the auxiliary plate of the utility model.

[0018] Fig. 3 It is the waterproof glue layer structure diagram of the utility model.

[0019] Markings in the drawings: main plate 1, first quick connecting component 2, capacitor group 3, waterproof glue layer 4, waterproof wall 5, spring pin 6, coil 7, partition plate 8, inverter group 9, auxiliary plate 10, three waterproof glue layers 41, silica gel diaphragm 42. DETAILED DESCRIPTION

[0020] The technical scheme in the embodiments of the utility model will be described clearly and completely below with reference to the drawings in the embodiments of the utility model, so that the advantages and characteristics of the utility model can be more easily understood by those skilled in the art, and the protection scope of the utility model can be more clearly and definitely defined. Obviously, the described embodiments of the utility model are only a part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the utility model.

[0021] In addition, the technical features involved in different embodiments of the utility model described below can be combined with each other as long as there is no conflict.

[0022] Embodiment 1: the specific structure of the utility model is as follows:

[0023] Please refer to the drawings Figs. 1-3The utility model discloses a waterproof structure of power supply circuit board, this waterproof structure is equipped with respectively in mainboard 1 and vice board 10, the element mounting surface of mainboard 1 is equipped with a plurality of first component, is equipped with first quick -connect component 2, capacitor group 3, second quick -connect component and secondary inverter module in order along the first direction of element mounting surface of mainboard 1, along the second direction of element mounting surface of mainboard 1: six groups of first quick -connect component 2 linear distribution, 16 capacitor double -row wire array distribution, four groups of second quick -connect component linear distribution, double -row 8 groups of secondary inverter module linear distribution. The first direction and the second direction of above are perpendicular.

[0024] The element mounting surface of vice board 10 is equipped with a plurality of second component, and the second component includes two groups of coils 7 and three groups of inverter groups 9.

[0025] The waterproof structure includes:

[0026] The nanometer coating is coated on the surface of the plurality of first components of the mainboard 1. The operation method is to place the mainboard 1 into the nanometer waterproof agent for 3-5 seconds, so that the surface of the mainboard 1 is coated with a nanometer coating with a thickness of 5-50 microns, which has waterproof and moisture-proof capabilities.

[0027] The waterproof wall 5 is arranged on the periphery of the secondary inverter module. The gap between the bottom end of the waterproof wall 5 and the mainboard 1 is sealed by glue. The waterproof wall 5 is a silica gel shell with heat conduction capability, which is sleeved on the waterproof wall 5. The bottom of the silica gel shell is fixed by 704 glue. After the 704 glue is cured, the waterproof structure is formed.

[0028] The waterproof glue layer 4 is sprayed in the area of the waterproof wall 5 and fully covers the upper end of the secondary inverter module. The waterproof glue layer 4 includes three waterproof glue layers 41 and silica gel diaphragms 42 distributed upward and downward. The three waterproof glue layers 41 are glue layers formed after the three waterproof glues are cured, which have good waterproof performance. The silica gel diaphragms 42 are laid on the three waterproof glue layers 41 before the three waterproof glues are cured. The silica gel diaphragms 42 have a buffering effect, which prevents the secondary inverter module from being deformed by impact, thereby increasing the operation stability of the secondary inverter module.

[0029] The nanometer coating is coated on the surface of the plurality of second components of the vice board 10. The coils 7 on the vice board 10 are circular ring structures, and the middle parts are filled with three waterproof glues. Fig. 2 As shown in the drawing, the two groups of coils 7 are separated by a partition block to prevent induction. The inverter groups 9 and the two groups of coils 7 are provided with a partition plate 8, which is a metal partition plate and has a shielding effect.

[0030] The mainboard 1 is also provided with a plurality of spring needles 6 for grounding. The waterproof structure of the spring needle 6 is to coat three waterproof glues around the pin of the spring needle 6.

[0031] In summary, the power supply circuit board has good waterproof effect, and the waterproof glue is added to the inverter module prone to short circuit to strengthen the waterproof capacity of the main plate 1 and the auxiliary plate 10.

[0032] The above merely describes the preferred embodiments of the present application, and does not limit the patent scope of the present application, and any equivalent structure or equivalent process conversion, or direct or indirect application in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A waterproof structure of a power supply circuit board, the waterproof structure is respectively arranged on a main board (1) and a sub-board (10), a component mounting surface of the main board (1) is provided with a plurality of first components, a first quick-connection component (2), a capacitor group (3), a second quick-connection component and a secondary inverter module are sequentially arranged along a first direction of the component mounting surface of the main board (1), a component mounting surface of the sub-board (10) is provided with a plurality of second components, characterized in that, The waterproof structure comprises: A nano coating covering the surface of the main board (1) and the surface of the plurality of first components; A waterproof wall (5) arranged at the periphery of the secondary inverter module, and a gap between the bottom end of the waterproof wall (5) and the main board (1) is sealed by glue; A waterproof adhesive layer (4) sprayed in the area of the waterproof wall (5) and fully covering the upper end of the secondary inverter module; A nano coating covering the surface of the sub-board (10) and the surface of the plurality of second components.

2. The waterproof structure of a power supply circuit board according to claim 1, wherein The waterproof adhesive layer (4) comprises a three-proof adhesive layer (41) and a silica gel diaphragm (42) distributed in an up-down manner.

3. The waterproof structure of a power supply circuit board according to claim 1, wherein The glue is 704 glue.

4. The waterproof structure of a power supply circuit board according to claim 1, wherein The main board (1) is also distributed with a plurality of spring pins (6) serving as ground, and the waterproof structure of the spring pin (6) is to coat three-proof glue around the pin of the spring pin (6).

5. The waterproof structure of a power supply circuit board according to claim 1, wherein The coil (7) on the sub-board (10) is a circular ring structure, and the middle part is filled with three-proof glue.