Novel efficient cooling fin for electronic product

Abstract

The utility model discloses a novel efficient radiating fin for an electronic product. The novel efficient radiating fin is characterized by comprising a heat conducting plate and a radiating fin body arranged at the lower end of the heat conducting plate, a heat dissipation main hole is formed in the internal position of the heat dissipation fin body; when the novel efficient cooling fin for the electronic product is used, the novel efficient cooling fin for the electronic product is firstly fixed in a case through the mounting plate and the fastening nuts, and when the case is heated, the heat conduction plate transmits heat in the case to the cooling fin body to be dissipated out; the heat dissipation main holes, the heat dissipation branch holes, the heat dissipation pipes and the heat dissipation rings in the heat dissipation fin body can increase the heat dissipation area of the novel efficient heat dissipation fin for the electronic product, and therefore the heat dissipation effect of the novel efficient heat dissipation fin for the electronic product is improved; and the heat dissipation effect of the novel and efficient cooling fin for the electronic product is enhanced.

Description

Technical Field

[0001] This utility model belongs to the technical field of heat sinks, specifically relating to a new type of high-efficiency heat sink for electronic products. Background Technology

[0002] New, high-efficiency heat sinks for electronic products are mainly designed to address the high temperatures generated during operation, preventing overheating from affecting the performance and lifespan of electronic devices. Existing high-efficiency heat sinks for electronic products are primarily composed of components such as a heat-conducting plate, heat sink body, mounting plate, and mounting holes. However, the poor heat dissipation performance of existing high-efficiency heat sinks can negatively impact the performance and lifespan of electronic devices. Therefore, a new, high-efficiency heat sink for electronic products is essential. Utility Model Content

[0003] The purpose of this invention is to provide a new type of high-efficiency heat sink for electronic products, in order to solve the problem mentioned in the background art that the poor heat dissipation effect of existing high-efficiency heat sinks for electronic products affects the performance and lifespan of electronic devices.

[0004] To achieve the above objectives, this utility model provides the following technical solution: a novel high-efficiency heat sink for electronic products, characterized in that it includes:

[0005] A heat-conducting plate and a heat sink body disposed at the lower end of the heat-conducting plate;

[0006] A heat dissipation main hole is provided inside the heat sink body;

[0007] A heat dissipation support hole is provided inside the heat sink body and on the inner side of the main heat dissipation hole.

[0008] A heat dissipation pipe is installed inside the main heat dissipation hole, and a heat dissipation ring is installed inside the main heat dissipation hole and outside the heat dissipation pipe.

[0009] The heat dissipation effect of the new high-efficiency heat sink for electronic products is enhanced by the arrangement of the main heat dissipation hole, the branch heat dissipation hole, the heat dissipation pipe and the heat dissipation ring.

[0010] Preferably, the heat dissipation pipe and the heat dissipation ring are connected by welding, and the heat dissipation pipe is a hollow cylindrical structure.

[0011] Preferably, a placement groove is provided on the outer wall of the heat dissipation ring, and an extrusion ball is glued to the inside of the placement groove.

[0012] Preferably, the extrusion ball is made of rubber material, and the extrusion ball enhances the stability of the heat dissipation pipe and heat dissipation ring.

[0013] Preferably, mounting plates are provided on the left and right sides of the heat-conducting plate, and mounting holes are provided inside the mounting plates.

[0014] Preferably, the mounting hole penetrates the mounting plate, and the novel high-efficiency heat sink for electronic products is installed inside the chassis through the mounting plate, the mounting hole, and the fastening nut.

[0015] Preferably, a T-shaped slot is provided at the lower end of the heat-conducting plate, and a T-shaped block is connected inside the T-shaped slot and at the upper end of the heat sink body. The T-shaped block and the heat sink body are an integral structure.

[0016] Preferably, a magnet plate is embedded inside the T-shaped slot and at the upper end of the T-shaped card block, and the T-shaped card block and the magnet plate are connected by magnetic attraction.

[0017] Preferably, the T-shaped card block and the T-shaped card slot are connected by a snap-fit ​​mechanism, and the magnetic plate enhances the stability of the connection between the heat sink body and the heat-conducting plate.

[0018] Compared with the prior art, this utility model provides a novel and highly efficient heat sink for electronic products, which has the following beneficial effects:

[0019] 1. In this new high-efficiency heat sink for electronic products, when using it, the heat sink is first fixed inside the chassis using a mounting plate and fastening nuts. When the chassis heats up, the heat-conducting plate transfers the heat inside the chassis to the heat sink body for dissipation. The heat dissipation main holes, heat dissipation branch holes, heat dissipation pipes, and heat dissipation rings inside the heat sink body increase the heat dissipation area of ​​the new high-efficiency heat sink, thereby improving its heat dissipation effect. The arrangement of the heat dissipation main holes 5, heat dissipation branch holes 7, heat dissipation pipes 8, and heat dissipation rings 9 enhances the heat dissipation effect of the new high-efficiency heat sink, allowing it to be used more effectively.

[0020] 2. In this new high-efficiency heat sink for electronic products, when using it, the magnetic plate is first embedded in the T-shaped slot, and then the heat sink body is inserted into the T-shaped slot through the T-shaped clip. When the T-shaped clip enters the T-shaped slot, it is attracted by the magnetic plate inside the T-shaped slot, thus allowing the heat sink body to be installed at the lower end of the heat-conducting plate. Next, the new high-efficiency heat sink for electronic products is fixed inside the chassis by the mounting plate and fastening nuts. When the chassis heats up, the heat-conducting plate will transfer the heat inside the chassis to the heat sink body for dissipation. The T-shaped clip and T-shaped slot facilitate the installation and removal of the heat sink body, while the magnetic plate enhances the stability of the heat sink body installation. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the overall structure of the novel high-efficiency heat sink for electronic products according to this utility model.

[0022] Figure 2 This is a schematic diagram of the internal structure of the heat sink body of the novel high-efficiency heat sink for electronic products according to this utility model.

[0023] Figure 3 This is an enlarged structural diagram of the novel, high-efficiency T-shaped heat sink for electronic products according to this utility model.

[0024] Figure 4 This is an enlarged structural schematic diagram of the novel high-efficiency heat sink and heat dissipation ring for electronic products according to this utility model.

[0025] In the diagram: 1. Heat-conducting plate; 2. Mounting hole; 3. Mounting plate; 4. Heat sink body; 5. Main heat dissipation hole; 6. T-shaped clip; 7. Heat dissipation support hole; 8. Heat dissipation pipe; 9. Heat dissipation ring; 10. Magnet plate; 11. T-shaped slot; 12. Extrusion ball; 13. Placement slot. Detailed Implementation

[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0027] This utility model provides, for example Figure 1-4 The novel high-efficiency heat sink for electronic products includes a heat-conducting plate 1 and a heat sink body 4 disposed at the lower end of the heat-conducting plate 1. A main heat dissipation hole 5 is provided inside the heat sink body 4. A heat dissipation support hole 7 is provided inside the heat sink body 4 and inside the main heat dissipation hole 5. A heat dissipation pipe 8 is installed inside the main heat dissipation hole 5 and outside the heat dissipation pipe 8. The heat dissipation effect of the novel high-efficiency heat sink for electronic products is enhanced by the arrangement of the main heat dissipation hole 5, the heat dissipation support hole 7, the heat dissipation pipe 8 and the heat dissipation ring 9.

[0028] like Figure 1 and Figure 2As shown, in order to enhance the heat dissipation effect of the new high-efficiency heat sink for electronic products, when using the new high-efficiency heat sink for electronic products, it is first fixed inside the chassis by the mounting plate 3 and the fastening nut. When the chassis heats up, the heat conduction plate 1 will transfer the heat inside the chassis to the heat sink body 4 for dissipation. The heat dissipation main hole 5, heat dissipation branch hole 7, heat dissipation pipe 8 and heat dissipation ring 9 inside the heat sink body 4 will increase the heat dissipation area of ​​the new high-efficiency heat sink for electronic products, thereby improving the heat dissipation effect of the new high-efficiency heat sink for electronic products. Through the setting of the heat dissipation main hole 5, heat dissipation branch hole 7, heat dissipation pipe 8 and heat dissipation ring 9, the heat dissipation effect of the new high-efficiency heat sink for electronic products is enhanced, so that the new high-efficiency heat sink for electronic products can be used better.

[0029] The heat sink 8 and the heat sink ring 9 are connected by welding. The heat sink 8 is a hollow cylindrical structure. A placement groove 13 is provided on the outer wall of the heat sink ring 9. An extrusion ball 12 is glued to the inside of the placement groove 13. The extrusion ball 12 is made of rubber material. The extrusion ball 12 enhances the stability of the placement of the heat sink 8 and the heat sink ring 9.

[0030] like Figure 1 , Figure 2 and Figure 4 As shown, in order to enhance the stability of the placement of the heat sink 8 and the heat ring 9, when using the new high-efficiency heat sink for electronic products, the heat sink 8 and the heat ring 9 are first connected, and then the extrusion ball 12 is glued inside the placement groove 13 so that the extrusion ball 12 is installed on the outside of the heat ring 9. Then, the heat sink 8 is installed inside the heat dissipation main hole 5. When the heat sink 8 enters the heat dissipation main hole 5, the extrusion ball 13 at the outer wall of the heat ring 9 will extrude on the inner wall of the heat dissipation main hole 5. Through the setting of the extrusion ball 12, the stability of the placement of the heat sink 8 and the heat ring 9 is enhanced.

[0031] Mounting plates 3 are provided on the left and right sides of the heat conduction plate 1. Mounting holes 2 are provided inside the mounting plates 3. The mounting holes 2 penetrate the mounting plates 3. The new high-efficiency heat sink for electronic products is installed inside the chassis through the mounting plates 3, the mounting holes 2 and the fastening nuts.

[0032] like Figure 1 As shown, in order to facilitate the installation and disassembly of the new high-efficiency heat sink for electronic products, when using the new high-efficiency heat sink for electronic products, first install the mounting plate 3 on the left and right sides of the heat conduction plate 1, and then fix the new high-efficiency heat sink for electronic products inside the chassis through the mounting plate 3 and the fastening nut. The mounting plate 3, the mounting hole 2 and the fastening nut facilitate the installation and disassembly of the new high-efficiency heat sink for electronic products, making the installation and disassembly of the new high-efficiency heat sink for electronic products more convenient.

[0033] A T-shaped slot 11 is provided at the lower end of the heat-conducting plate 1. A T-shaped block 6 is connected inside the T-shaped slot 11 and at the upper end of the heat sink body 4. The T-shaped block 6 and the heat sink body 4 are an integral structure. A magnetic plate 10 is embedded inside the T-shaped slot 11 and at the upper end of the T-shaped block 6. The T-shaped block 6 and the magnetic plate 10 are connected by magnetic adsorption. The T-shaped block 6 and the T-shaped slot 11 are connected by a snap-fit ​​method. The setting of the magnetic plate 10 enhances the stability of the connection between the heat sink body 4 and the heat-conducting plate 1.

[0034] like Figure 1 and Figure 3 As shown, to enhance the stability of the heat sink body 4 during installation, when using the new high-efficiency heat sink for electronic products, the magnetic plate 10 is first embedded inside the T-shaped slot 11, and then the heat sink body 4 is inserted into the T-shaped slot 11 via the T-shaped clip 6. When the T-shaped clip 6 enters the T-shaped slot 11, it is attracted by the magnetic plate 10 inside the T-shaped slot 11, thereby allowing the heat sink body 4 to be installed at the lower end of the heat-conducting plate 1. Then, the new high-efficiency heat sink for electronic products is fixed inside the chassis by the mounting plate 3 and the fastening nut. When the chassis heats up, the heat-conducting plate 1 will transfer the heat inside the chassis to the heat sink body 4 for dissipation. The T-shaped clip 6 and the T-shaped slot 11 facilitate the installation and removal of the heat sink body 4, while the magnetic plate 10 enhances the stability of the heat sink body 4 during installation.

[0035] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A novel, high-efficiency heat sink for electronic products, characterized in that: include Heat-conducting plate (1) and heat sink body (4) disposed at the lower end of the heat-conducting plate (1); The heat sink body (4) is provided with a heat dissipation main hole (5) at an internal position; A heat dissipation support hole (7) is provided inside the heat sink body (4) and on the inner side of the heat dissipation main hole (5); A heat dissipation pipe (8) is installed inside the heat dissipation main hole (5), and a heat dissipation ring (9) is installed inside the heat dissipation main hole (5) and outside the heat dissipation pipe (8). The heat dissipation effect of the new high-efficiency heat sink for electronic products is enhanced by the arrangement of the main heat dissipation hole (5), the branch heat dissipation hole (7), the heat dissipation pipe (8) and the heat dissipation ring (9).

2. The novel high-efficiency heat sink for electronic products according to claim 1, characterized in that: The heat dissipation pipe (8) and the heat dissipation ring (9) are connected by welding. The heat dissipation pipe (8) is a hollow cylindrical structure.

3. The novel high-efficiency heat sink for electronic products according to claim 2, characterized in that: A placement groove (13) is provided on the outer wall of the heat dissipation ring (9), and an extrusion ball (12) is glued to the inside of the placement groove (13).

4. A novel high-efficiency heat sink for electronic products according to claim 3, characterized in that: The extrusion ball (12) is made of rubber material. The extrusion ball (12) enhances the stability of the heat dissipation tube (8) and heat dissipation ring (9).

5. A novel high-efficiency heat sink for electronic products according to claim 1, characterized in that: Mounting plates (3) are provided on the left and right sides of the heat-conducting plate (1), and mounting holes (2) are provided inside the mounting plates (3).

6. A novel high-efficiency heat sink for electronic products according to claim 5, characterized in that: The mounting hole (2) penetrates the mounting plate (3), and the new high-efficiency heat sink for electronic products is installed inside the chassis through the mounting plate (3), the mounting hole (2) and the fastening nut.

7. A novel high-efficiency heat sink for electronic products according to claim 5, characterized in that: A T-shaped slot (11) is provided at the lower end of the heat-conducting plate (1). A T-shaped block (6) is connected inside the T-shaped slot (11) and at the upper end of the heat sink body (4). The T-shaped block (6) and the heat sink body (4) are an integral structure.

8. A novel high-efficiency heat sink for electronic products according to claim 7, characterized in that: A magnet plate (10) is embedded inside the T-shaped slot (11) and at the upper end of the T-shaped block (6). The T-shaped block (6) and the magnet plate (10) are connected by magnetic adsorption.

9. A novel high-efficiency heat sink for electronic products according to claim 8, characterized in that: The T-shaped card block (6) and the T-shaped card slot (11) are connected by a snap-fit ​​method. The setting of the magnet plate (10) enhances the stability of the connection between the heat sink body (4) and the heat conduction plate (1).

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