Water-cooling heat dissipation structure based on underwater electronic equipment

Abstract

The utility model relates to a water-cooling heat dissipation structure based on underwater electronic equipment, the water-cooling heat dissipation structure realizes liquid circulation heat dissipation through a miniature water pump, and the water-cooling heat dissipation structure comprises an electronic cabin which is a main body structure of a watertight cabin body, accommodates a liquid cooling heat dissipation device and a circuit board, is provided with an opening on the side surface, and is provided with a sealing structure; the liquid cooling heat dissipation device comprises a water cooling plate, a liquid cooling pipeline and a micro water pump, the water cooling plate is additionally arranged on a circuit board chip, the liquid cooling pipeline is welded and laid on the water cooling plate, the micro water pump is arranged at a water inlet at one end of the liquid cooling pipeline, and the other end of the liquid cooling pipeline is a water outlet. According to the water-cooling heat dissipation structure, on-site environment water serves as a direct-cooling cold source, liquid circulation heat dissipation is achieved through the micro water pump, and heat dissipation efficiency is high. The liquid cooling heat dissipation device directly utilizes a water source of a working environment where equipment is located, and the chip temperature can be effectively reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field about underwater electronic equipment heat dissipation in sonar, especially point to a kind of water cooling heat dissipation structure based on underwater electronic equipment. BACKGROUND

[0002] Underwater electronic equipment structure design is the most critical, most important design stage of underwater electronic product, it involves the quality of product and the benefit of product.And its heat dissipation design involves the reliability index of complete machine, is extremely important part.At present stage, underwater electronic equipment is mostly used cold plate heat dissipation, and heat dissipation effect is limited, and there are problems such as high maintenance difficulty in oil-filled heat dissipation.

[0003] Therefore, it is urgent to design a kind of efficient and convenient heat dissipation technology to meet the heat dissipation demand of underwater electronic equipment. UTILITY MODEL CONTENT

[0004] To solve the above technical problems, a kind of water cooling heat dissipation structure based on underwater electronic equipment of the utility model, the water cooling heat dissipation structure realizes liquid circulation heat dissipation by micro water pump, including:

[0005] Electronic cabin, the main structure of watertight cabin body, and electronic cabin contains liquid cooling heat dissipation device and circuit board, and the side is equipped with opening, and is equipped with sealing structure;

[0006] Liquid cooling heat dissipation device, including water cooling plate, liquid cooling pipeline and micro water pump, the water cooling plate is added on circuit board chip, liquid cooling pipeline is welded and laid on water cooling plate, micro water pump is arranged at the water inlet of one end of liquid cooling pipeline, and the other end of liquid cooling pipeline is water outlet.

[0007] In an embodiment of the utility model, the sealing structure includes sealing plate, sealing ring and screw, wherein the sealing plate is assembled between the sealing electronic cabin side opening by screw and sealing ring, and the other liquid cooling pipeline is passed through the sealing structure during assembly.

[0008] In an embodiment of the utility model, the circuit board chip and water cooling plate are further provided with thermal interface material, for reducing air thermal resistance.

[0009] In an embodiment of the utility model, the water inlet of liquid cooling heat dissipation device is connected with the water source of the working environment of equipment.

[0010] In an embodiment of the utility model, the power supply end of micro water pump is connected with the power supply in the cabin body of underwater electronic equipment.

[0011] Compared with the prior art, the above-mentioned technical solution of this utility model has the following advantages: The water-cooled heat dissipation structure of this utility model uses the ambient water on site as a direct cooling source and achieves liquid circulation heat dissipation through a micro water pump, resulting in high heat dissipation efficiency. The liquid cooling heat dissipation device directly utilizes the water source of the working environment of the equipment, has a simple structure, is efficient and convenient, can effectively reduce the chip temperature, improve the reliability of underwater electronic equipment, and is suitable for various underwater high heat-consuming electronic equipment. Attached Figure Description

[0012] To make the content of this utility model easier to understand, the present utility model will be further described in detail below with reference to specific embodiments and accompanying drawings.

[0013] Figure 1 This is a schematic diagram of the underwater electronic heat dissipation structure of this utility model;

[0014] Figure 2 This is a partial structural diagram of the underwater electronic heat dissipation structure of this utility model;

[0015] Figure 3 This is a schematic structural diagram of the liquid cooling heat dissipation device described in this utility model.

[0016] As shown in the figure, 1. Electronic compartment, 2. Liquid cooling heat dissipation device, 3. Sealing structure, 4. Thermal interface material, 5. Sealing plate, 6. Circuit board, 7. Water inlet, 8. Water outlet, 2.1. Water cooling plate, 2.2. Liquid cooling pipe, 2.3. Miniature water pump. Detailed Implementation

[0017] like Figure 1 and Figure 2 As shown, this embodiment provides a water-cooled heat dissipation structure for underwater electronic devices. The water-cooled heat dissipation structure achieves liquid circulation heat dissipation through a micro water pump, including:

[0018] Electronic compartment 1 is the main structure of the watertight compartment, and electronic compartment 1 houses liquid cooling heat dissipation device 2 and circuit board 6, with openings on the side and a sealing structure 3.

[0019] like Figure 3 As shown, the liquid cooling heat dissipation device 2 includes a water cooling plate 2.1, a liquid cooling pipe 2.2, and a micro water pump 2.3. The water cooling plate 2.1 is mounted on the chip of the circuit board 6, the liquid cooling pipe 2.2 is welded and laid flat on the water cooling plate 2.1, the micro water pump 2.3 is located at the water inlet 7 at one end of the liquid cooling pipe 2.2, and the other end of the liquid cooling pipe 2.2 is the water outlet 8.

[0020] Specifically, the sealing structure 3 includes a sealing plate 5, a sealing ring, and screws. The sealing plate 5 is assembled with the side opening of the sealed electronic compartment 1 by screws and the sealing ring. The liquid cooling pipe 2.2 passes through the sealing structure 3 during the assembly process.

[0021] Specifically, a thermal interface material 4 is provided between the circuit board 6 chip and the water-cooled plate 2.1 to reduce air thermal resistance.

[0022] Specifically, the inlet 7 of the liquid cooling heat dissipation device 2 is connected to the water source of the working environment where the equipment is located.

[0023] Specifically, the power supply terminal of the micro water pump 2.3 is connected to the power supply inside the underwater electronic equipment compartment.

[0024] In the water-cooled heat dissipation structure described in this embodiment, when the temperature of the circuit board chip rises during the operation of the underwater electronic equipment, the micro water pump 2.3 is activated. The water pump introduces water from the working environment of the equipment. The water flows into the liquid cooling pipe 2.2 through the inlet 7, and dissipates heat from the circuit board 6 chip, which is fitted with the water cooling plate 2.1 and coated with thermal interface material 4, through the liquid cooling pipe 2.2 welded to the water cooling plate 2.1. The heated water is then discharged directly outside the chamber through the outlet 8 at the other end of the pipe. This continuous liquid flow process carries the heat from the chip out of the chamber, achieving the purpose of reducing the chip temperature. The electronic chamber 1 has a watertight structure to ensure the normal operation of the equipment underwater. The sealing structure 3 effectively prevents water from entering the chamber and damaging the equipment, and the thermal interface material 4 reduces air thermal resistance and improves heat dissipation efficiency.

[0025] Obviously, the above embodiments are merely illustrative examples for clear explanation and are not intended to limit the implementation. Those skilled in the art will recognize that other variations or modifications can be made based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. However, obvious variations or modifications derived therefrom are still within the protection scope of this invention.

Claims

1. A water-cooled heat dissipation structure for underwater electronic devices, wherein the water-cooled heat dissipation structure achieves liquid circulation heat dissipation through a micro water pump, characterized in that, include: The electronic compartment (1) is the main structure of the watertight compartment, and the electronic compartment (1) contains a liquid cooling heat dissipation device (2) and a circuit board (6), with an opening on the side and a sealing structure (3); The liquid cooling heat dissipation device (2) includes a water cooling plate (2.1), a liquid cooling pipe (2.2) and a micro water pump (2.3). The water cooling plate (2.1) is mounted on the chip of the circuit board (6). The liquid cooling pipe (2.2) is welded and laid flat on the water cooling plate (2.1). The micro water pump (2.3) is located at the water inlet (7) at one end of the liquid cooling pipe (2.2) and the water outlet (8) at the other end of the liquid cooling pipe (2.2).

2. The water-cooled heat dissipation structure according to claim 1, characterized in that: The sealing structure (3) includes a sealing plate (5), a sealing ring and screws. The sealing plate (5) is assembled with the side opening of the sealed electronic compartment (1) by screws and sealing rings. The other liquid cooling pipe (2.2) passes through the sealing structure (3) during the assembly process.

3. The water-cooled heat dissipation structure according to claim 1, characterized in that: A thermal interface material (4) is also provided between the circuit board (6) chip and the water cooling plate (2.1) to reduce air thermal resistance.

4. The water-cooled heat dissipation structure according to claim 1, characterized in that: The inlet (7) of the liquid cooling heat dissipation device (2) is connected to the water source of the working environment where the equipment is located.

5. The water-cooled heat dissipation structure according to claim 1, characterized in that: The power supply terminal of the micro water pump (2.3) is connected to the power supply inside the underwater electronic equipment compartment.

Images