High-speed optocoupler

Abstract

The utility model relates to the technical field of high-speed optocouplers, in particular to a high-speed optocoupler. By arranging the bending pins, the distance between the two welding spots at the two ends of the gold wire is reduced, so that the length of the gold wire is reduced in the wire welding process, on one hand, the probability that the gold wire is broken after welding due to the fact that the gold wire is too long can be reduced, the probability that the gold wire is broken and fails due to shaking in the packaging process can be reduced, and meanwhile the production cost is reduced; by arranging the special bonding process press-fit positions, namely the press-fit pins, on part of the output pins, the probability that the output pins shake during wire welding can be reduced, the output pins are fixed through the multiple through holes and the packaging bodies solidified in the through holes, relative fixation of the positions of the pins can be achieved, and the yield of the output pins is improved. The stability of the product can be improved; the problem that a gold wire is disconnected and fails due to the fact that a GND pin of an existing high-speed optocoupler supporting base island and the base island are too long and shake easily in the packaging process is solved.

Description

TECHNICAL FIELD

[0001] The utility model relates to high -speed optical coupling technical field, concretely is a high -speed optical coupling. BACKGROUND

[0002] The traditional high -speed optical coupling lead design is connected with the support base island by GND pin, in order to prevent the chip VCC electrode and VCC pin and VE electrode and VE pin too far, the bonding gold wire makes its conducting wire arc too long and causes quality hidden danger, and the conductive gold wire is too long and causes cost increase, need to set the base island at the product center, because the GND pin of the support base island and the base island connection part are too long, easy to shake in the packaging process and cause the gold wire to break off and fail, or cause the dark crack to be unable to screen to the client and cause the product to fail through reflow soldering and other problems. SUMMARY

[0003] In view of the defects of the prior art, the utility model provides a high -speed optical coupling, solves the problem that the GND pin of the support base island of the prior art high -speed optical coupling and the base island connection part are too long, easy to shake in the packaging process and cause the gold wire to break off and fail.

[0004] To achieve the above object, the utility model provides the following technical scheme:

[0005] A high -speed optical coupling, including a plurality of input pins and a plurality of output pins, wherein one input pin is provided with a light emitting diode, and one output pin is provided with a photosensitive element cooperating with the light emitting diode for photoelectric conversion, further comprising a packaging body for packaging a plurality of input pins, a plurality of output pins, a light emitting diode and a photosensitive element, a plurality of output pins without the photosensitive element are provided with a bent pin bent to the photosensitive element, and the photosensitive element is connected with the bent pin through a lead wire.

[0006] Preferably, the bent pin is L-shaped.

[0007] Preferably, the bent pin is provided with a press-fit pin in the direction away from the photosensitive element.

[0008] Preferably, the base island of the output pin provided with the photosensitive element is provided with a cuttable extension rib connected with a plurality of remaining pins.

[0009] Preferably, the extension rib is provided with a cut-off part with a width smaller than the extension rib.

[0010] Preferably, the output pin provided with the photosensitive element is provided with a plurality of through holes.

[0011] Compared with the prior art, the utility model provides a high -speed optical coupling, which has the following beneficial effects:

[0012] 1. The bending pin is arranged, the distance between two soldering points at both ends of the gold wire is reduced, so that the length of the gold wire is reduced in the process of soldering, which can reduce the probability of gold wire breakage caused by too long gold wire after soldering, reduce the probability of gold wire breakage caused by shaking in the packaging process, and reduce the production cost.

[0013] 2. A dedicated bonding process pressing place, i.e. a pressing pin, is arranged on part of the output pin, so that the pressing pin is pressed before soldering, which can reduce the probability of shaking of the output pin during soldering, thereby improving the stability of soldering.

[0014] 3. A plurality of through holes are arranged, and the output pin is fixed by the packaging body solidified in the through hole, so that the relative position of each pin can be fixed, thereby improving the stability of the product. BRIEF DESCRIPTION OF DRAWINGS

[0015] The drawings described herein are used to provide further understanding of the present application, and form a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application, and do not constitute an improper limitation on the present application. In the drawings:

[0016] Figure 1 It is a top view of the utility model;

[0017] Figure 2 It is a side view of the utility model.

[0018] In the drawings: 1, input pin; 2, output pin; 3, light emitting diode; 4, photosensitive element; 5, packaging body; 6, bending pin; 7, pressing pin; 8, extension rib; 9, cutting part; 10, through hole. DETAILED DESCRIPTION

[0019] The embodiments of the present application will be described in detail below with reference to the drawings and examples, so that the realization process of how to apply technical means to solve technical problems and achieve technical effects of the present application can be fully understood and implemented.

[0020] In order to solve the problem that the GND pin of the existing high-speed optocoupler support base island is too long and easy to shake in the packaging process, causing the gold wire to break, the utility model provides a high-speed optocoupler, as shown in Figure 1 and Figure 2 It comprises a plurality of input pins 1 and a plurality of output pins 2, and the GND pin is a kind of output pin 2, Figure 1The middle light coupling left side is input pin 1, and the right side is output pin 2, one of the input pins 1 is provided with a light emitting diode 3, one of the output pins 2 is provided with a photosensitive element 4 cooperating with the light emitting diode 3 for photoelectric conversion, and further comprises a packaging body 5 for packaging a plurality of input pins 1, a plurality of output pins 2, the light emitting diode 3 and the photosensitive element 4, the remaining plurality of output pins 2 without the photosensitive element 4 are provided with a bent pin 6 bent to the photosensitive element 4, the photosensitive element 4 is connected with the bent pin 6 through a wire, and the subsequent gold wire is welded on the bent pin 6 which is closer to the photosensitive element 4, thereby reducing the length of the gold wire, reducing the probability of disconnection of the gold wire caused by shaking during packaging, and reducing the production cost.

[0021] In order to reduce the processing difficulty of the bent pin 6 and the processing difficulty of the related stamping parts, the bent pin 6 is L-shaped, which is more convenient for processing of related parts.

[0022] The area of part of the output pin 2 is small, and there is no dedicated bonding process pressing place, which is easy to press and shake in the bonding process, and is easy to cause phenomena such as not being able to be pressed and false welding, and the pressing pin 7 is arranged in the direction away from the photosensitive element 4 on the bent pin 6, so as to improve the stability of the solder wire in the bonding process.

[0023] In order to improve the stability of the input pin 1 on the island during soldering, prevent it from shaking, the island of the output pin 2 provided with the photosensitive element 4 is provided with a cuttable extension rib 8 connected with a plurality of remaining pins, the fixed crystal and soldering process is completed first, the fixed crystal and soldering quality is improved, and the extension rib 8 is cut after the fixed crystal and soldering process.

[0024] In order to facilitate the cutting of the extension rib 8, and at the same time, after the extension rib 8 is cut, part of the remaining in the subsequent packaging body 5 can assist in improving the stability of the output pin 2 under the action of the solidified packaging body 5, the extension rib 8 is provided with a cutting part 9 with a width smaller than the extension rib 8.

[0025] In order to further improve the stability of the position of the input pin 1 and the output pin 2 after packaging, prevent the input pin 1 and the output pin 2 from shaking and sliding in the use process, and cause abnormal conditions such as disconnection, the output pin 2 provided with the photosensitive element 4 is provided with a plurality of through holes 10, and after the solidified packaging body 5 is filled into the through holes 10, the input pin 1 and the output pin 2 can be further positioned.

[0026] It should be noted that, in this document, the terms "comprise", "comprising", or any other variation thereof, are intended to cover a non-exclusive inclusion, such that processes, methods, articles, or apparatuses that comprise a list of elements are not limited to those elements, but can include other elements not expressly listed or inherent to such processes, methods, articles, or apparatuses.

[0027] While the embodiments of the present application have been illustrated and described, it will be understood by those skilled in the art that various changes, modifications, substitutions, and alterations can be made therein without departing from the spirit and scope of the present application, which is defined by the appended claims and their equivalents.

Claims

1. A high-speed optocoupler, comprising a plurality of input pins (1) and a plurality of output pins (2), wherein a light-emitting diode (3) is disposed on one of the input pins (1), and a photosensitive element (4) is disposed on one of the output pins (2) in cooperation with the light-emitting diode (3) for photoelectric conversion, and further comprising a package (5) for encapsulating the plurality of input pins (1), the plurality of output pins (2), the light-emitting diode (3) and the photosensitive element (4), characterized in that, The remaining output pins (2) that are not equipped with the photosensitive element (4) are provided with bent pins (6) that bend and extend to the photosensitive element (4), and the photosensitive element (4) is connected to the bent pins (6) by wires.

2. The high-speed optocoupler according to claim 1, characterized in that, The bent pin (6) is L-shaped.

3. A high-speed optocoupler according to claim 1, characterized in that, A pressing pin (7) is provided on the bent pin (6) in a direction away from the photosensitive element (4).

4. A high-speed optocoupler according to claim 1, characterized in that, The base island on which the output pin (2) of the photosensitive element (4) is provided is provided with a cut-off extension rib (8) that is connected to several other pins.

5. A high-speed optocoupler according to claim 4, characterized in that, The extension rib (8) is provided with a cut-off portion (9) with a width smaller than that of the extension rib (8).

6. A high-speed optocoupler according to claim 1, characterized in that, The output pin (2) of the photosensitive element (4) is provided with several through holes (10).

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