Two-channel optocoupler lead frame

Abstract

The utility model relates to the technical field of two-channel optocoupler lead frames, in particular to a two-channel optocoupler lead frame. The extension pin is connected to the second pin far away from the GND pin, so that the length of the corresponding gold wire can be greatly reduced, the extension pin passes through the other signal transmission channel, and the position of the extension pin does not affect the transmission of the optical signal, and therefore, through the arrangement of the extension pin, the transmission of the optical signal can be greatly improved. The probability of breakage after wire bonding can be greatly reduced to a certain extent, optical signal transmission of another signal transmission channel is not affected, and the pressing plate pins are arranged on the expansion pins, so that an area for pressing the expansion pins can be provided for equipment in the bonding process, the stability of the expansion pins in the process can be improved, and the production efficiency of the equipment is improved. The welding quality is prevented from being influenced by position vibration; the problems that according to an existing dual-channel optocoupler lead frame structure, in the bonding process, a gold wire is prone to breakage, and optical signal transmission of the other channel is affected are solved.

Description

TECHNICAL FIELD

[0001] The utility model relates to double -channel light coupling lead frame technical field, concretely is a double -channel light coupling lead frame. BACKGROUND

[0002] Double -channel high -speed light coupling usually by two light emitting diode (LED), two corresponding photosensitive devices (such as photodiode, phototriode etc.) and as the mounting carrier double -channel light coupling lead frame is composed, when the electrical signal of input end drives one light emitting diode, the light that it emits is received by corresponding photosensitive device and is converted into electrical signal, thereby realizes the signal transmission of one channel, and similarly, another channel also works in the same way, two channels are independent of each other, and different signals can be transmitted simultaneously.

[0003] However, in the existing double -channel light coupling lead frame packaging process, in the bonding process, the VCC electrode of the photosensitive element of one channel of the double -channel light coupling lead frame needs to be connected to the VCC pin by a super-long jumper, and the length of the gold wire is relatively long, which may cause the gold wire to break after welding, and the gold wire also passes through the space position of another channel, so it is easy to block the light generated by the LED in another channel, thereby affecting the optical signal transmission of another channel and causing inconsistent performance of the two channels. UTILITY MODEL CONTENT

[0004] In view of the deficiencies of the prior art, the utility model provides a double -channel light coupling lead frame, which solves the problem of easy breakage of gold wire and influence on optical signal transmission of another channel in the bonding process of the existing double -channel light coupling lead frame structure.

[0005] To achieve the above purpose, the utility model provides the following technical scheme:

[0006] A double -channel light coupling lead frame, comprising an IR support and an IP support arranged on each other, the IR support comprises two IR frames arranged symmetrically, a plurality of IR vertical ribs are arranged between the two IR frames, two groups of IR pins for setting LED are arranged on the IR vertical ribs;

[0007] The IP support comprises two IP frames arranged symmetrically, a plurality of IP vertical ribs are arranged between the two IP frames, a plurality of groups of IP pins are arranged on the IP vertical ribs, each group of IP pins contains a GND pin for setting two photosensitive chips, each group of IP output pins contains three second pins connected with the photosensitive chip, the second pin away from the GND pin is connected with an expansion pin, and the expansion pin extends to the photosensitive element away from the second pin provided with the expansion pin.

[0008] The second pin comprises a VCC pin, a VE pin and a VO pin, wherein one photosensitive element is connected with the VCC pin, the VE pin and the GND pin, and another photosensitive element is connected with the extension pin, the VO pin and the GND pin, and the two photosensitive elements are arranged on the GND pin.

[0009] The extension pin is provided with a pressing plate pin which is arranged crosswise to the extension pin at the end away from the VCC pin.

[0010] The pressing plate pin is located on the side of the extension pin away from the photosensitive element.

[0011] The extension pin is provided with a cut-off pin which is arranged between the second pin and the second pin.

[0012] The cut-off pin is arranged at the middle position of the second pin.

[0013] The VE pin and the VO pin are provided with an extension pin which is arranged crosswise to the VE pin and the VO pin, and the photosensitive element is connected with the VE pin and the VO pin through the wire and the extension pin.

[0014] Compared with the prior art, the utility model provides a double -channel light coupling lead frame has the following beneficial effects:

[0015] 1. The second pin away from the GND pin is connected with the extension pin, thereby the length of the corresponding gold wire can be greatly reduced, the extension pin passes through another signal transmission channel, and the position of the extension pin does not affect the transmission of the optical signal, so that the probability of breakage after soldering can be greatly reduced to a certain extent through the arrangement of the extension pin, and the optical signal transmission of another signal transmission channel is not affected.

[0016] 2. The pressing plate pin is arranged on the extension pin, so that the device can provide the area for pressing the extension pin during the bonding process, thereby the stability of the extension pin during the process can be improved, and the position of the extension pin is prevented from vibrating to affect the welding quality.

[0017] 3. The cut-off pin can support the extension pin through the output pin, improve the stability of the extension pin during the high fixed crystal and welding processes, cut off the pin before packaging, and the cut-off pin remaining in the light shielding body increases the contact area with the light shielding body, thereby the position limiting strength of the extension pin is further improved. BRIEF DESCRIPTION OF DRAWINGS

[0018] The drawings described herein are used to provide further understanding of the present application, and constitute a part of the present application, and the illustrative embodiments of the present application and the description thereof are used to explain the present application, and do not constitute improper limitation on the present application. In the drawings:

[0019] Figure 1It is a schematic view of the IR support of the utility model;

[0020] Figure 2 It is a schematic view of the IP support of the utility model. Figure 1 It is an enlarged schematic view of position A in the middle;

[0021] Figure 3 It is a schematic view of the IP support of the utility model;

[0022] Figure 4 It is a schematic view of the IP support of the utility model. Figure 3 It is an enlarged schematic view of position B in the middle;

[0023] Figure 5 It is a schematic view of the IP support of the utility model.

[0024] In the figure: 1, IR support; 11, IR frame; 12, IR vertical rib; 13, IR pin; 2, IP support; 21, IP frame; 22, IP vertical rib; 23, IP pin; 231, GND pin; 232, second pin; 24, expansion pin; 25, pressing plate pin; 26, cutting pin; 27, extension pin. DETAILED DESCRIPTION

[0025] The embodiment of the application will be described in detail below with the accompanying drawings and examples, so that the realization process of how to apply technical means to solve technical problems and achieve technical effects of the application can be fully understood and implemented.

[0026] In order to solve the problem that the gold wire is easy to break and affects the transmission of optical signals of another channel during the bonding process in the existing double-channel optical coupling lead frame structure, a double-channel optical coupling lead frame is provided, as shown in Figures 1-5 The length of the gold wire is reduced, and the gold wires of the two channels do not interfere with each other, so that the performance balance of the two channels is ensured.

[0027] The IR support 1 includes two symmetrically arranged IR frames 11, a plurality of IR vertical ribs 12 are arranged between the two IR frames 11, and two groups of IR pins 13 for arranging LEDs are arranged on the IR vertical ribs 12.

[0028] The IP support 2 comprises two IP frames 21 arranged symmetrically, a plurality of IP vertical ribs 22 arranged between the two IP frames 21, a plurality of groups of IP pins 23 arranged on the IP vertical ribs 22, each group of IP pins 23 comprising a GND pin 231 for arranging two photosensitive chips, and each group of IP output pins comprising three second pins 232 for connecting with the photosensitive chips, the second pin 232 away from the GND pin 231 being connected with an extension pin 24, the extension pin 24 extending to the photosensitive element away from the second pin 232 where the extension pin 24 is arranged, and in the subsequent bonding process, the distance between the photosensitive element away from the second pin 232 where the extension pin 24 is arranged and the extension pin 24 is closer, so that the length of the gold wire can be greatly reduced during welding, and the gold wire does not cross the area of another group of LEDs and the photosensitive element corresponding to the channel, thereby avoiding affecting the light signal transmission on another group of channels.

[0029] In order to further illustrate the structure of the second pin 232 and the connection mode with the photosensitive element, the second pin 232 comprises a VCC pin, a VE pin and a VO pin, wherein one photosensitive element is connected with the VCC pin, the VE pin and the GND pin 231, and the other photosensitive element is connected with the extension pin 24, the V0 pin and the GND pin 231, and the two photosensitive elements are arranged on the GND pin 231.

[0030] Since the extension pin 24 lacks a specific area for the related equipment to press the extension pin 24 during the bonding process, it is easy to cause false welding and other phenomena, therefore, the end of the extension pin 24 away from the VCC pin is provided with a pressing plate pin 25 arranged transversely therewith as a region for the related equipment to press, thereby realizing the position fixation of the extension pin 24 connected therewith.

[0031] When the related equipment of the bonding process presses at the pressing plate pin 25, it may interfere with the gold wire between the photosensitive element and the extension pin 24, and may cause the two to contact and cause the gold wire to break, therefore, the pressing plate pin 25 is located on the side of the extension pin 24 away from the photosensitive element.

[0032] Since the length of the extension pin 24 is relatively long, in order to further improve the stability of the extension pin 24 during the processes of die bonding and welding, and to improve the stability of the extension pin 24 after packaging, a cuttable cutting pin 26 is arranged between the extension pin 24 and the plurality of second pins 232, the relative position between the extension pin 24 and the plurality of second pins 232 is fixed through the cutting pin 26, and before packaging, the cutting pin 26 is cut, and the cutting pin 26 remaining in the package also increases the contact area with the package, thereby improving the position stability of the extension pin 24 after packaging by means of the cutting pin 26.

[0033] In order to facilitate cutting off the cutting-off pin 26, avoid the gold wire, and according to the structural distribution characteristics in the optocoupler, the cutting-off pin 26 is arranged at the middle position of the second pins 232, the space is relatively large at this position, and the gold wire is relatively far away, so that the vibration or the cutting-off workpiece in the cutting-off process does not affect the gold wire.

[0034] In order to ensure the stability of the VE pin and the VO pin during the welding process and after the packaging, the VE pin and the VO pin are both provided with the extension pin 27 which is arranged cross with the VE pin and the VO pin, the photosensitive element is connected with the VE pin and the VO pin through the wire and the extension pin 27, at this time, the photosensitive element is no longer connected to the VE pin or the VO pin through the wire, but is connected to the extension pin 27 which is connected with the corresponding VE pin or VO pin, the area on the extension pin 27 facilitates the compression of the equipment during the bonding process, or is directly compressed on the corresponding VE pin or VO pin, at the same time, after the packaging, through the interaction between the extension pin 27 and the packaging body, the VE pin and the VO pin are also prevented from sliding out of the packaging body, and the fixing effect of the VE pin and the VO pin is improved.

[0035] It should be noted that, in the present document, relational terms such as first and second and the like can be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises", "comprising", or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but can include other elements not expressly listed or inherent to such process, method, article, or apparatus.

[0036] Although the embodiments of the present application have been shown and described, it should be understood by those ordinary skilled in the art that various changes, modifications, replacements and variations can be made to the embodiments without departing from the principles and spirits of the present application, and the scope of the present application is defined by the appended claims and their equivalents.

Claims

1. A double-channel optical coupling lead frame comprising an IR support (1) and an IP support (2) arranged on top of each other, characterized in that, the IR support (1) comprises two IR side frames (11) arranged symmetrically, a plurality of IR vertical ribs (12) are arranged between the two IR side frames (11), and two groups of IR pins (13) for arranging LEDs are arranged on the IR vertical ribs (12); the IP support (2) comprises two IP side frames (21) arranged symmetrically, a plurality of IP vertical ribs (22) are arranged between the two IP side frames (21), a plurality of groups of IP pins (23) are arranged on the IP vertical ribs (22), each group of IP pins (23) contains one GND pin (231) for arranging two photosensitive chips, each group of IP output pins contains three second pins (232) for connecting with the photosensitive chips, the second pin (232) away from the GND pin (231) is connected with an extension pin (24), and the extension pin (24) extends to the photosensitive element away from the second pin (232) where the extension pin (24) is arranged.

2. A dual channel optical coupling leadframe according to claim 1, wherein, The second pin (232) comprises a VCC pin, a VE pin and a VO pin, one photosensitive element is connected with the VCC pin, the VE pin and the GND pin (231), another photosensitive element is connected with the extension pin (24), the VO pin and the GND pin (231), and the two photosensitive elements are arranged on the GND pin (231).

3. A dual channel optical coupling leadframe according to claim 2, wherein, The extension pin (24) is provided with a pressing plate pin (25) arranged crosswise at one end away from the VCC pin.

4. A dual channel optical coupling leadframe according to claim 3, wherein, The pressing plate pin (25) is located on the side of the extension pin (24) away from the photosensitive element.

5. A dual channel optical coupling leadframe according to claim 1, wherein, The extension pin (24) is provided with a cut-off pin (26) arranged crosswise between the plurality of second pins (232).

6. A dual channel optical coupling leadframe according to claim 5, wherein, The cut-off pin (26) is arranged at the intermediate position of the plurality of second pins (232).

7. A dual channel optical coupling leadframe according to claim 2, wherein, The VE pin and the VO pin are each provided with an extension pin (27) arranged crosswise, and the photosensitive element is connected with the VE pin and the VO pin through a wire and the extension pin (27).

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