Dual-channel high-speed optocoupler packaging structure

Abstract

The utility model relates to the technical field of double-channel high-speed optocouplers, in particular to a double-channel high-speed optocoupler packaging structure. The output pin far away from one photosensitive element is connected with the expansion pin extending to the photosensitive element, so that the length of the corresponding gold wire can be greatly reduced, the expansion pin penetrates through the other signal transmission channel, and the position of the expansion pin does not influence the transmission of the optical signal, and therefore, through the arrangement of the expansion pin, the transmission of the optical signal is not influenced. The probability of breakage after wire bonding can be greatly reduced to a certain extent, optical signal transmission of the other signal transmission channel is not affected, a pressing plate pin is arranged on an expansion pin, an area used for pressing the expansion pin can be provided for equipment in the bonding process, and the stability of the expansion pin in the machining process is improved; the problems that according to an existing double-channel high-speed optocoupler, a gold wire in one channel is long, the gold wire is prone to breakage after wire welding, and optical signal transmission of the other channel is affected are solved.

Description

Technical Field

[0001] This utility model relates to the field of dual-channel high-speed optocoupler technology, specifically a dual-channel high-speed optocoupler packaging structure. Background Technology

[0002] A dual-channel high-speed optocoupler typically consists of two light-emitting diodes (LEDs) and two corresponding photosensitive devices (such as photodiodes, phototransistors, etc.). When the input electrical signal drives one of the LEDs, the light it emits is received by the corresponding photosensitive device and converted into an electrical signal, thereby realizing signal transmission in one channel. Similarly, the other channel works in the same way. The two channels are independent of each other and can transmit different signals simultaneously.

[0003] However, during the packaging process, in the bonding process, the VCC electrode of the photosensitive element in one of the channels needs to be connected to the VCC pin with an extra-long wire. The long length of the gold wire can easily cause breakage after bonding. At the same time, this gold wire also passes through the space of the other channel, which can easily block the light and affect the optical signal transmission of the other channel, resulting in inconsistent performance between the two channels. Utility Model Content

[0004] To address the shortcomings of existing technologies, this invention provides a dual-channel high-speed optocoupler packaging structure, which solves the problem that in existing dual-channel high-speed optocouplers, the gold wire in one channel is too long, making it prone to breakage after soldering and affecting the optical signal transmission of the other channel.

[0005] To achieve the above objectives, this utility model provides the following technical solution:

[0006] A dual-channel high-speed optocoupler package structure includes several input pins and several output pins. Two light-emitting diodes are disposed on the input pins, and two photosensitive elements are disposed on the output pins, which respectively cooperate with the two light-emitting diodes to perform photoelectric conversion. The package also includes a light-shielding body for encapsulating the input pins, output pins, light-emitting diodes and photosensitive elements. An extension pin extending to the photosensitive element is connected to the output pin furthest from one of the photosensitive elements. The extension pin is connected to the photosensitive element.

[0007] Preferably, the output pins include a VCC pin, a VE pin, a VO pin, and a GND pin, with one photosensitive element connected to the VCC pin, the VE pin, and the GND pin, and the other photosensitive element connected to the extension pin, the VO pin, and the GND pin. The two photosensitive elements are disposed on the GND pin.

[0008] Preferably, the end of the extension pin furthest from the VCC pin is provided with a pressure plate pin that intersects with it.

[0009] Preferably, the pressure plate pin is located on the side of the extension pin away from the photosensitive element.

[0010] Preferably, a cut-off pin is provided between the extended pin and the plurality of output pins.

[0011] Preferably, the cut-off pin is located at the middle position of several output pins.

[0012] Preferably, the cut-off pin is located on the output pin between the two photosensitive elements.

[0013] Compared with the prior art, this utility model provides a dual-channel high-speed optocoupler packaging structure, which has the following advantages:

[0014] 1. By connecting an extension pin that extends to the photosensitive element to the output pin of one of the photosensitive elements, the length of the corresponding gold wire can be greatly reduced. The extension pin passes through another signal transmission channel and its position does not affect the transmission of the optical signal. Therefore, by setting the extension pin, the probability of wire breakage after bonding can be greatly reduced to a certain extent, and the optical signal transmission of the other signal transmission channel is not affected.

[0015] 2. By setting pressure plate pins on the extension pins, an area for clamping the extension pins can be provided for the equipment during the bonding process, thereby improving the stability of the extension pins during this process and preventing vibration from affecting the welding quality.

[0016] 3. By setting the cut-off pin, the output pin can be used to support the expansion pin, which improves the stability of the expansion pin during processes such as die bonding and soldering. The cut-off pin is cut off before packaging, and the cut-off pin remaining in the light shield increases the contact area with the light shield, thereby further improving the position limiting strength of the expansion pin. Attached Figure Description

[0017] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments of this application and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings:

[0018] Figure 1 This is a front view of the present invention;

[0019] Figure 2 This is a schematic diagram of the ribs after cutting according to this utility model;

[0020] Figure 3 This is a schematic diagram of the present invention before rib cutting.

[0021] In the diagram: 1. Input pin; 2. Output pin; 3. Light-emitting diode; 4. Photosensitive element; 5. Light-shielding body; 6. Extension pin; 7. Pressure plate pin; 8. Cut-off pin. Detailed Implementation

[0022] The following will describe in detail the implementation of this application with reference to the accompanying drawings and embodiments, so that the implementation process of how this application uses technical means to solve technical problems and achieve technical effects can be fully understood and implemented accordingly.

[0023] To address the problem of existing dual-channel high-speed optocouplers where the gold wire in one channel is too long, leading to breakage after soldering and affecting the optical signal transmission in the other channel, this invention provides a dual-channel high-speed optocoupler packaging structure, such as... Figures 1-3 As shown, the device includes several input pins 1 and several output pins 2. Two light-emitting diodes 3 are disposed on the input pins 1, and two photosensitive elements 4 are disposed on the output pins 2, which cooperate with the two light-emitting diodes 3 to perform photoelectric conversion. It also includes a light-shielding body 5 for encapsulating the input pins 1, output pins 2, light-emitting diodes 3 and photosensitive elements 4. An extension pin 6 extending to the photosensitive element 4 is connected to the output pin 2 furthest from one of the photosensitive elements 4. The extension pin 6 is connected to the photosensitive element 4 and is closer to the photosensitive element 4, which can greatly reduce the length of the gold wire. In addition, the extension pin 6 passes through another signal transmission channel, and its position does not affect the transmission of the optical signal. Therefore, by setting the extension pin 6, the probability of wire breakage after bonding can be greatly reduced to a certain extent, and the optical signal transmission of the other signal transmission channel is not affected.

[0024] To further describe the positional relationship of each pin in the output pin 2 and its connection relationship with the photosensitive element 4, the output pin 2 includes a VCC pin, a VE pin, a VO pin and a GND pin. One photosensitive element 4 is connected to the VCC pin, the VE pin and the GND pin, and the other photosensitive element 4 is connected to the extension pin 6, the V0 pin and the GND pin. The two photosensitive elements 4 are set on the GND pin.

[0025] Since the extension pin 6 lacks an area for the equipment to press the extension pin 6 during the bonding process, it is prone to phenomena such as false soldering. Therefore, the end of the extension pin 6 away from the VCC pin is provided with a pressure plate pin 7 that is intersected with it, thereby improving the stability of the bonding wire during the bonding process.

[0026] When components on the bonding equipment are pressed against the pressure plate pin 7, they may interfere with the welding of the gold wire between the photosensitive element 4 and the extension pin 6. The pressure plate pin 7 is located on the side of the extension pin 6 away from the photosensitive element 4, thereby avoiding interference between the components on the equipment and the gold wire and improving the welding quality.

[0027] To further improve the stability of the extended pin 6 during die bonding and soldering processes, and also to improve the stability of the extended pin 6 after packaging, a cut-off pin 8 is provided between the extended pin 6 and several output pins 2. In this way, during die bonding and soldering processes, several output pins 2 can indirectly limit and fix the extended pin 6 through the cut-off pin 8. Furthermore, the cut-off pin 8 is cut off before packaging, and the cut-off pin 8 remaining in the light shield 5 increases the contact area with the light shield 5, thereby further improving the positional limiting strength of the extended pin 6.

[0028] To facilitate the cutting of pin 8 and avoid the gold wire, and based on the structural distribution characteristics within the optocoupler, pin 8 is positioned in the middle of several output pins 2, where the space is relatively large and relatively far from the gold wire, thus avoiding the impact of vibration or the workpiece being cut on the gold wire during the cutting process.

[0029] Before being cut off, the output pin 2 needs to support the extension pin 6 to ensure the stability of the positions of the two photosensitive elements 4, thereby ensuring the stability of subsequent processes. Therefore, the cut-off pin 8 is set on the output pin 2 between the two photosensitive elements 4.

[0030] It should be noted that, in this document, the terms “comprising,” “including,” or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0031] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A dual-channel high-speed optocoupler packaging structure, comprising a plurality of input pins (1) and a plurality of output pins (2), wherein two light-emitting diodes (3) are disposed on the plurality of input pins (1), and two photosensitive elements (4) are disposed on the plurality of output pins (2) respectively cooperating with the two light-emitting diodes (3) for photoelectric conversion, and further comprising a light-shielding body (5) for packaging the plurality of input pins (1), output pins (2), light-emitting diodes (3) and photosensitive elements (4), characterized in that, An extension pin (6) extending to the photosensitive element (4) is connected to the output pin (2) away from one of the photosensitive elements (4). The extension pin (6) is connected to the photosensitive element (4).

2. The dual-channel high-speed optocoupler packaging structure according to claim 1, characterized in that, The output pin (2) includes a VCC pin, a VE pin, a VO pin and a GND pin. One photosensitive element (4) is connected to the VCC pin, the VE pin and the GND pin, and the other photosensitive element (4) is connected to the extension pin (6), the V0 pin and the GND pin. The two photosensitive elements (4) are located on the GND pin.

3. The dual-channel high-speed optocoupler packaging structure according to claim 2, characterized in that, The extension pin (6) has a pressure plate pin (7) that is arranged intersecting with the VCC pin at the end away from it.

4. The dual-channel high-speed optocoupler packaging structure according to claim 3, characterized in that, The pressure plate pin (7) is located on the side of the extension pin (6) away from the photosensitive element (4).

5. The dual-channel high-speed optocoupler packaging structure according to claim 1, characterized in that, A cut-off pin (8) is provided between the extended pin (6) and several output pins (2).

6. The dual-channel high-speed optocoupler packaging structure according to claim 5, characterized in that, The cut-off pin (8) is located in the middle of several output pins (2).

7. The dual-channel high-speed optocoupler packaging structure according to claim 5, characterized in that, The cut-off pin (8) is located on the output pin (2) between the two photosensitive elements (4).

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