Thermal forming equipment for adhesive film
By using a temperature control module and a temperature regulating plate together, the problem of uneven temperature during the thermoforming process of EVA film was solved, achieving uniform heating of the upper and lower surfaces of the film, improving embossing quality and production efficiency, and reducing the defect rate and cost.
Patent Information
- Application Number
- CN202423266377.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-28
- Publication Date
- 2025-12-16
- Estimated Expiration
- 2034-12-28
AI Technical Summary
In the existing technology, the temperature control of the upper and lower surfaces of EVA film is not precise enough during the thermoforming process, especially during the embossing process. This leads to unstable embossing quality, which affects the overall performance and appearance of photovoltaic modules, and increases production costs and process complexity.
The temperature control module and the temperature regulating plate work together to control the temperature of the lower surface of the adhesive film, while the temperature regulating plate controls the temperature of the upper surface of the adhesive film, ensuring that the upper and lower surfaces of the adhesive film are heated evenly. The embossing component is used for embossing.
It achieves uniform heating of the upper and lower surfaces of the adhesive film, significantly improving embossing quality and production efficiency, and reducing defect rate and production costs.
Smart Images
Figure CN223671912U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of plastic film manufacturing, more particularly, to a hot forming equipment for plastic film. BACKGROUND
[0002] With the rapid development of the photovoltaic industry, the packaging technology of photovoltaic modules has become an indispensable part of the field. Currently, EVA plastic film is commonly used as the packaging material for photovoltaic modules due to its good sealing, insulation and bonding properties, which is considered as an ideal choice. However, during the hot forming process of EVA plastic film, especially when embossing process is performed simultaneously, the temperature control of the upper and lower surfaces of the plastic film becomes a key issue. In the prior art, the temperature control of the embossing roller is not accurate enough, often leading to unstable embossing quality, affecting the overall performance and appearance of the photovoltaic module. These problems not only limit the application effect of EVA plastic film in the packaging of photovoltaic modules, but also increase the production cost and process complexity. Therefore, it is urgent to develop a hot forming equipment for plastic film to solve the problem of inconsistent temperature of the upper and lower surfaces of the plastic film. SUMMARY
[0003] The present application provides a hot forming equipment for plastic film, which includes an extrusion device, a delivery shaft, a transmission shaft, a temperature control module, a temperature adjusting plate and an embossing assembly. The extrusion device is used to extrude molten plastic film, the delivery shaft is used to guide the just-extruded plastic film and relieve the stress of the plastic film. A plurality of transmission shafts are arranged in parallel and at intervals to form a transmission path for the plastic film, and a plurality of temperature control modules are arranged below the transmission path in the gaps between adjacent two transmission shafts to control the temperature of the lower surface of the plastic film. Each gap corresponds to the installation of one temperature control module. The temperature adjusting plate is arranged above the plastic film to control the temperature of the upper surface of the plastic film. The temperature control module and the temperature adjusting plate are used in cooperation to make the upper and lower surfaces of the plastic film evenly heated. The embossing assembly is used to emboss the plastic film.
[0004] In some embodiments, the gap between the delivery shaft and the transmission shaft is provided with the temperature control module, and the temperature adjusting plate is arranged at a position corresponding to the gap between the delivery shaft and the transmission shaft.
[0005] In some embodiments, the plastic film enters the delivery shaft at the tangent point of the highest point of the delivery shaft, and the angle of the corresponding arc of the path of the plastic film on the delivery shaft is greater than or equal to 30 degrees and less than or equal to 60 degrees.
[0006] In some embodiments, the temperature control module is provided with a temperature control hole along the axial direction of the transmission shaft for temperature adjustment, and the temperature adjusting plate is provided with a temperature adjusting hole along the axial direction of the transmission shaft for temperature adjustment.
[0007] In some embodiments, the upper surface of the temperature control module is parallel to the film, and the surface of the temperature control module corresponding to the transmission shaft is arranged as a circular arc surface corresponding to the surface of the transmission shaft.
[0008] In some embodiments, the temperature adjustment plate is provided with a temperature control hole for adjusting temperature along the axial direction of the transmission shaft.
[0009] In some embodiments, the distance between the temperature adjustment plate and the surface of the film is 3-10 cm; when the film needs to be heated, the temperature of the temperature adjustment plate is higher than that of the temperature control module, and when the film needs to be cooled, the temperature of the temperature adjustment plate is lower than that of the temperature control module.
[0010] In some embodiments, the temperature difference between the temperature adjustment plate and the temperature control module is 3-5 degrees Celsius.
[0011] In some embodiments, the embossing assembly comprises an upper embossing shaft 61 and a lower embossing shaft, and the center lines of the upper embossing shaft 61 and the lower embossing shaft are located on the same vertical plane.
[0012] In some embodiments, the temperature control module and the temperature adjustment plate are arranged in front of and behind the embossing assembly along the transmission path of the film.
[0013] The thermoforming equipment of the present application effectively solves the problem of unstable embossing quality caused by uneven temperature of the upper and lower surfaces of the film during the thermoforming process of the film in the prior art by using the temperature control module in cooperation with the temperature adjustment plate, realizes the technical effect of uniform heating of the upper and lower surfaces of the film, significantly improves the embossing quality and production efficiency, and greatly reduces the rate of defective products and production cost caused by uneven temperature.
[0014] Additional aspects and advantages of the embodiments of the present application will be given in part in the following description, some will become apparent from the following description, or will be learned by practice of the embodiments of the present application. BRIEF DESCRIPTION OF DRAWINGS
[0015] The above and / or additional aspects and advantages of the present application will become apparent and readily understood from the following description, in connection with the accompanying drawings, in which:
[0016] Figure 1 is a schematic diagram of the overall structure of the embodiment of the present application;
[0017] Figure 2 is an enlarged view of part I.
[0018] Main element symbol explanation: thermoforming equipment 100, extrusion device 10, induction shaft 20, transmission shaft 30, temperature control module 40, temperature control hole 41, circular arc surface 42, temperature adjustment plate 50, temperature adjustment hole 51, embossing assembly 60, upper embossing shaft 61, lower embossing shaft 62, winding shaft 63. DETAILED DESCRIPTION
[0019] The embodiments of the present application will be further described below with reference to the drawings. The same or similar reference numerals are used throughout the drawings to represent the same or similar elements or elements having the same or similar functions.
[0020] In addition, the embodiments of the present application described below in conjunction with the drawings are exemplary and are only used to explain the embodiments of the present application, and cannot be understood as a limitation of the present application.
[0021] In the present application, unless otherwise explicitly specified and limited, the first feature is "on" or "under" the second feature, which can be direct contact between the first and second features, or indirect contact through an intermediate medium. Moreover, the first feature "above", "over" and "on" the second feature can be directly above or obliquely above the first feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature "below", "under" and "under" the second feature can be directly below or obliquely below the first feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.
[0022] Please refer to Figure 1 The present application is a kind of film thermoforming equipment 100, for Eva film production, thermoforming equipment 100 includes extrusion device 10, induction shaft 20, transmission shaft 30, temperature control module 40, temperature adjustment plate 50 and embossing assembly 60. Extrusion device 10 is used to extrude the molten film. Induction shaft 20 is used to guide the just extruded film 200, and remove the stress of the film. A plurality of transmission shafts 30 are arranged in parallel and at intervals, forming a transmission path of the film. A plurality of temperature control modules 40 are arranged below the transmission path, located in the gap between adjacent two transmission shafts 30, for temperature control of the lower surface of the film. Temperature adjustment plate 50 is arranged above the film, for temperature control of the upper surface of the film; temperature control module 40 and temperature adjustment plate 50 are used in cooperation, so that the upper and lower surfaces of the film are evenly heated, and embossing assembly 60 is used for embossing the film.
[0023] The thermoforming equipment 100 of the present application cooperates with the temperature control module 40 and the temperature adjustment plate 50 to effectively solve the problem of unstable embossing quality caused by uneven temperature of the upper and lower surfaces of the film in the process of film thermoforming in the prior art, realize the technical effect of uniform heating of the upper and lower surfaces of the film, significantly improve the embossing quality and production efficiency, and greatly reduce the rate of defective products and production cost caused by uneven temperature.
[0024] The extradition axis 20 is installed at the outlet position of the extrusion device 10, and the tangent point of the highest point of the extradition axis 20 is tangent to the outlet direction of the extrusion device 10. After the rubber film is extruded by the extrusion device 10, the rubber film is placed on the extradition axis 20 from the tangent point, and the extradition axis 20 rotates to transport the rubber film, and the rubber film rotates along the surface of the extradition axis 20. The extradition axis 20 is a rotating shaft that can be heated, and the stress of the rubber film is eliminated by the curved surface of the rotating shaft and the heat effect. In order to effectively eliminate the stress, in the embodiment of the application, the arc angle A of the corresponding arc of the path of the rubber film on the extradition axis 20 is greater than or equal to 30 degrees and less than or equal to 60 degrees. The heating mode of the rotating shaft is not described in detail in the prior art.
[0025] The transmission axis 30 is provided in multiple, and the multiple transmission axes 30 are arranged in parallel and spaced apart along the horizontal plane to form a transmission path of the rubber film. The number shown is not fixed, and can be determined according to the actual transmission distance. The transmission axes 30 are arranged in a close arrangement, and the distance B between the surfaces of two adjacent transmission axes 30 is [0.5, 3] cm.
[0026] Please refer to Figure 2 The temperature control module 40 is used for temperature control of the lower surface of the rubber film. Specifically, the temperature control module 40 is arranged below the transmission path and located in the gap between the two adjacent transmission axes 30, and the upper surfaces of the transmission axes 30 and the temperature control module 40 combine to form a transmission plane for the rubber film. The temperature control module 40 is provided with temperature control holes 41 for adjusting the temperature along the axial direction of the transmission axis 30, and the temperature control holes 41 are connected by external pipelines. The cross section of the temperature control module 40 is roughly triangular, the upper surface of the temperature control module 40 is parallel to the rubber film, and the upper surface of the temperature control module 40 is tangent to the transmission axis 30. The corresponding surface of the temperature control module 40 and the transmission axis 30 is provided as a circular arc surface 42, and the circular arc surface 42 corresponds to the axial surface of the transmission axis 30. The circular arc surface 42 helps to increase the contact area and can accelerate heat conduction. The temperature control module 40 is made of heat-conducting materials such as metal, ceramic or composite materials.
[0027] The temperature adjusting plate 50 is arranged on the upper surface of the film for temperature control of the upper surface of the film. The temperature control module 40 and the temperature adjusting plate 50 are used in cooperation with each other to make the upper and lower surfaces of the film evenly heated. Specifically, the temperature adjusting plate 50 is horizontally arranged parallel to the film, and the temperature adjusting plate 50 is provided with a plurality of temperature adjusting holes 51 for adjusting temperature along the axial direction of the transmission shaft 30, and the plurality of temperature adjusting holes 51 are communicated with each other (for example, the temperature adjusting plate can be communicated with a pipeline outside the temperature adjusting plate, or the temperature adjusting plate can be communicated with each other by punching holes in the temperature adjusting plate). The distance C between the temperature adjusting plate 50 and the surface of the film is 3-10 cm. When the film needs to be heated, the temperature of the temperature adjusting plate 50 is higher than that of the temperature control module, and the temperature difference between the two is 3-5°C. When the film needs to be cooled, the temperature of the temperature adjusting plate 50 is lower than that of the temperature control module, and the temperature difference between the two is 3-5°C. The reason for setting the temperature difference is that the lower surface of the film is directly contacted, and the heat conduction is fast, while the upper surface is spaced, and the heat conduction is not so fast, so that the temperature difference is set to balance the temperature of the upper and lower surfaces of the film.
[0028] In order to balance the temperature of the upper and lower surfaces of the film when the film is transferred from the extradition shaft 20 to the transmission shaft 30, the upper and lower surfaces of the film on the transmission path of this distance are provided with the temperature control module 40 and the temperature adjusting plate 50. Specifically, the gap between the extradition shaft 20 and the transmission shaft 30 is provided with the temperature control module 40, and the temperature adjusting plate 50 is arranged at the position corresponding to the gap between the extradition shaft 20 and the transmission shaft 30. The temperature control module 40 and the temperature adjusting plate 50 are arranged in the same way as described above, and will not be repeated here. The temperature adjusting plate here is relatively independent of the temperature adjusting plate 50 of the transmission plane, mainly because this part is for temperature control of the just-out film.
[0029] The temperature adjusting mode of the temperature control module 40 and the temperature adjusting plate 50 is the same, and one or more of the following modes can be used in combination:
[0030] Please continue to refer to Figure 1 and Figure 2 1. In the temperature control holes 41 and the temperature adjusting holes 51, fluid medium is introduced, and the cooling and heating of the medium can be changed to cool or heat the temperature control module 40 and the temperature adjusting plate 50, so as to cool or heat the film. The fluid medium can be water, air, heat-conducting oil, silicon oil, nanofluid, etc., and the embodiments of the present application use water or air. The temperature control holes 41 and the temperature adjusting holes 51 can be communicated, or the fluid medium can be introduced separately.
[0031] 2. In the temperature control holes 41 and the temperature adjusting holes 51, a heat-conducting rod is inserted to achieve temperature control by changing the temperature of the heat-conducting rod. This way of heat-conducting rod is more effective for heating, for example, the heat-conducting rod is powered to achieve rapid heating.
[0032] The embossing assembly 60 comprises an upper embossing shaft 61 and a lower embossing shaft 62, the center lines of which are located on the same vertical plane. The upper embossing shaft 61 and the lower embossing shaft 62 are tangent to the transmission path of the adhesive film. The upper embossing shaft 61 and the lower embossing shaft 62 are provided with embossing lines and are embossed by hot pressing. The temperature control module 40 and the temperature adjusting plate 50 are arranged before and after the embossing assembly 60 along the transmission path of the adhesive film.
[0033] In the embodiments of the present application, the temperature control module 40 and the temperature adjusting plate 50 between the extradition shaft 20 and the first transmission shaft 30 heat the upper and lower surfaces of the adhesive film to eliminate the stress of the adhesive film. The temperature control module 40 and the temperature adjusting plate 50 between the first transmission shaft 30 and the embossing assembly 60 cool the upper and lower surfaces of the adhesive film so that the adhesive film can be shaped and embossed. The temperature control module 40 and the temperature adjusting plate 50 after the embossing assembly 60 are used to cool the embossed adhesive film so that the embossing can be quickly shaped and the adhesive film can be quickly cooled, which facilitates the subsequent winding shaft 63 to wind.
[0034] It can be understood that in other embodiments, the temperature control module and the temperature adjusting plate between the first transmission shaft and the embossing assembly can be arranged in two half sections in front and back, the front half section heats the adhesive film to continue to eliminate stress or for other purposes, and the rear half section cools the adhesive film to shape. Alternatively, the front half section cools the adhesive film to shape, and the rear half section heats the adhesive film to preheat the adhesive film to facilitate embossing.
[0035] In the description of the present specification, the description of the terms "certain embodiments", "one embodiment", "some embodiments", "illustrative embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in connection with the described embodiments or examples are included in at least one embodiment or example of the present application. In the present specification, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the described specific features, structures, materials or characteristics can be combined in any one or more embodiments or examples in a suitable manner.
[0036] In addition, the terms "first", "second" are only for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first", "second" can explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "multiple" is at least two, for example, two, three, unless otherwise specifically limited.
[0037] Although the embodiments of the present application have been shown and described above, it is understood that the above-described embodiments are exemplary and are not to be construed as limiting the present application, and that changes, modifications, substitutions and variations can be made by those skilled in the art without departing from the scope of the present application, which is defined by the claims and their equivalents.
Claims
1. A heat forming apparatus for a film, characterized by, The device comprises: an extrusion device for extruding molten adhesive film; an induction shaft for guiding the just-extruded adhesive film and relieving the stress of the adhesive film; a plurality of transmission shafts arranged in parallel and at intervals to form a transmission path of the adhesive film; a plurality of temperature control modules arranged below the transmission path and in the gaps between adjacent transmission shafts, for controlling the lower surface of the adhesive film, with one temperature control module corresponding to each gap; a temperature adjusting plate arranged above the adhesive film, for controlling the upper surface of the adhesive film; the temperature control module and the temperature adjusting plate are used in cooperation to make the upper and lower surfaces of the adhesive film evenly heated; a embossing assembly for embossing the adhesive film.
2. The hot forming apparatus of claim 1, wherein The gaps between the induction shaft and the transmission shaft are provided with the temperature control modules, and the temperature adjusting plate is arranged at the position corresponding to the gaps between the induction shaft and the transmission shaft.
3. The hot forming apparatus of claim 1, wherein The adhesive film enters the induction shaft at the highest point of the induction shaft, and the angle of the corresponding arc of the adhesive film on the induction shaft is greater than or equal to 30 degrees and less than or equal to 60 degrees.
4. The hot forming apparatus of claim 1, wherein The temperature control module is provided with a temperature control hole along the axial direction of the transmission shaft for adjusting the temperature; the temperature adjusting plate is provided with a temperature adjusting hole along the axial direction of the transmission shaft for adjusting the temperature.
5. The hot forming apparatus of claim 4, wherein, The upper surface of the temperature control module is parallel to the adhesive film, the surface of the temperature control module corresponding to the transmission shaft is arranged as a circular arc surface, and the circular arc surface corresponds to the axial surface of the transmission shaft.
6. The hot forming apparatus of claim 1, wherein The temperature adjusting plate is provided with a temperature control hole along the axial direction of the transmission shaft for adjusting the temperature.
7. The hot forming apparatus of claim 1, wherein The distance between the surface of the temperature adjusting plate and the adhesive film is 3-10 cm; when the adhesive film needs to be heated, the temperature of the temperature adjusting plate is higher than that of the temperature control module, and when the adhesive film needs to be cooled, the temperature of the temperature adjusting plate is lower than that of the temperature control module.
8. The hot forming apparatus of claim 7, wherein, The temperature difference between the temperature adjusting plate and the temperature control module is 3-5 degrees Celsius.
9. The hot forming apparatus of claim 1, wherein, The embossing assembly comprises an upper embossing shaft and a lower embossing shaft, and the center lines of the upper embossing shaft and the lower embossing shaft are located on the same vertical plane.
10. The hot forming apparatus of claim 8, wherein, Along the transmission path of the adhesive film, the embossing assembly is provided with the temperature control module and the temperature adjusting plate in front and back.