Wafer spacer and wafer delivery box

Abstract

The utility model relates to a wafer spacer and a wafer delivery box, and the wafer spacer comprises a main body, one side surface of the main body is provided with a flat circular area; the multiple protruding parts are arranged in the circular area at intervals, and deformation spaces are formed in the protruding parts; the protruding part is used for being supported in a pattern gap of a wafer and forming a buffering effect. When the spacer is in contact with the wafer, the protruding part and the pattern gap of the wafer are supported to form a supporting point, and the direct contact area between the wafer and the spacer is effectively reduced by dispersing the weight of the wafer and the external force borne by the wafer, so that the risk of scratching and breaking the wafer is reduced. Meanwhile, as the deformation space is arranged in the protruding part, when the wafer is subjected to external force, the protruding part can deform and absorb the external force for buffering, and the wafer is further protected from being damaged.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor manufacturing, in particular to wafer spacer and wafer shipping box. BACKGROUND

[0002] In the semiconductor manufacturing industry, especially in the manufacturing process of compound semiconductor wafers such as SIC (silicon carbide) and lithium carbonate, the protection and transportation of wafers are a crucial link. These compound wafers are more fragile than traditional silicon wafers due to their material properties, so after completing the front-end production and processing process, they need to be sent to packaging or other back-end processing points.

[0003] Traditional wafer shipping boxes mostly adopt slot design, but this design is prone to breakage during transportation, especially when encountering vibration due to the fragility of the wafers. To solve this problem, the industry generally uses the method of inserting a thin piece as a spacer between the wafers. Although this method reduces the direct contact between wafers to some extent and reduces the risk of breakage, the problem that follows is that traditional spacer designs often use round protrusions to prevent the spacer from being too tightly adsorbed with the wafer, thereby causing scratches and breakage when separated.

[0004] However, with the continuous development of wafer process and pattern design, the traditional round protrusion spacer design gradually exposes some problems. When the pattern gap on the wafer is exactly fitted with the round protrusions of the spacer, these round protrusions may form a tooth-like fit with the wafer pattern material. During handling, transportation and other operations, if the wafer is subjected to a large external force, the round protrusions and the wafer pattern will interact, which can easily scratch the existing pattern on the wafer, and in severe cases, even cause the wafer to be scrapped.

[0005] In summary, the existing spacer design still has the problem of insufficient wafer protection, easy scratching, and even breakage. INVENTION CONTENTS

[0006] Therefore, it is necessary to provide a wafer spacer and wafer shipping box to solve the problems of insufficient wafer protection, easy scratching and breakage of the existing spacer.

[0007] A wafer spacer, comprising:

[0008] a main body, one side surface of the main body is provided with a flat circular area;

[0009] a plurality of protruding parts are arranged at intervals in the circular area, and a deformation space is arranged in the protruding part; the protruding part is used to support in the pattern gap of the wafer and form a buffering effect.

[0010] In one of the embodiments, the spacing between any adjacent protrusions is uniform, and the protrusion height of the plurality of protrusions is uniform.

[0011] In one of the embodiments, the plurality of protrusions are arranged in a polygonal structure in the circular region.

[0012] In one of the embodiments, the protrusions include a plurality of levels of protruding rings, and gaps exist between the plurality of levels of protruding rings to form the deformation space, and the plurality of levels of protruding rings are arranged in a plurality of levels of annular structures diverging from the center of the protrusion to the periphery.

[0013] In one of the embodiments, gaps exist between the plurality of protrusions in each level of protruding rings, and the plurality of protrusions are arranged in an annular structure.

[0014] In one of the embodiments, the plurality of protrusions in each level of protruding rings are cylindrical structures protruding outward from the surface of the body.

[0015] In one of the embodiments, the diameters of the plurality of protrusions in the adjacent two levels of protruding rings are uniform or non-uniform.

[0016] In one of the embodiments, the contact part of the protrusion with the pattern gap of the wafer is provided with a buffer material.

[0017] In one of the embodiments, the body is a solid wafer or a hollow wafer, and the body is made of a soft material.

[0018] The wafer spacer described above, when the spacer is in contact with the wafer, the protrusions will be supported in the gap of the wafer pattern to form a support point, thereby effectively reducing the direct contact area between the wafer and the spacer by dispersing the weight and external force of the wafer, thereby reducing the risk of scratches and fragments. At the same time, since the protrusions are provided with a deformation space, when the wafer is subjected to an external force, the protrusions can deform and absorb the external force to provide further protection for the wafer.

[0019] According to another purpose of the present application, a wafer delivery box is also provided, which comprises the wafer spacer as described above.

[0020] The wafer delivery box described above significantly improves the safety and stability of the wafer during transportation and storage. The spacing and buffer protection of the wafer spacer provide comprehensive protection measures for the wafer. At the same time, the wafer delivery box has a simple structure and low manufacturing cost. BRIEF DESCRIPTION OF DRAWINGS

[0021] Figure 1 is a schematic view of the structure of the existing spacer.

[0022] Figure 2 Fig. 1 is a sectional view of a prior art spacer.

[0023] Figure 3 Fig. 2 is a structural view of a wafer spacer.

[0024] Figure 4 Fig. 3 is a sectional view of a wafer spacer.

[0025] Figure 5 Fig. 4 is a structural view of a protrusion Figure 1 .

[0026] Figure 6 Fig. 5 is a structural view of a protrusion Figure 2 .

[0027] Fig. 1 is a sectional view of a prior art spacer.

[0028] Fig. 2 is a structural view of a wafer spacer.

[0029] Fig. 1 is a sectional view of a prior art spacer. DETAILED DESCRIPTION

[0030] In order to make the above objectives, features and advantages of the present application more apparent, specific embodiments of the present application will be described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. It will be apparent, however, to one skilled in the art, that the present application can be practiced without using these specific details. In other instances, well-known structures and functions have not been described in detail in order to avoid obscuring the present application.

[0031] In the description of the present application, it should be understood that, if there are terms such as "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the purpose of facilitating the description of the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0032] In addition, the terms "first", "second", and the like, if any, are used herein for descriptive purposes only and should not be construed as indicating or implying relative importance or implicating the number of indicated technical features. Thus, a feature defined with "first", "second" may include at least one of the features explicitly or implicitly. In the description of the present application, if the term "a plurality of" appears, the meaning of "a plurality of" is at least two, for example, two, three, etc., unless otherwise explicitly specified and limited.

[0033] In the present application, unless otherwise explicitly specified and limited, if the terms "mounting", "connecting", "connecting", "fixing" and the like appear, these terms should be interpreted broadly. For example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise explicitly limited. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0034] In the present application, unless otherwise explicitly specified and limited, if the first feature is described as "on" or "under" the second feature and the like, it can mean that the first and second features are in direct contact, or the first and second features are indirectly in contact through an intermediate medium. Moreover, the first feature "above", "above" and "above" the second feature can be the first feature directly above or obliquely above the second feature, or it can only mean that the first feature is higher than the second feature in horizontal height. The first feature "below", "below" and "below" the second feature can be the first feature directly below or obliquely below the second feature, or it can only mean that the first feature is lower than the second feature in horizontal height.

[0035] It should be noted that if an element is referred to as "fixed to" or "disposed to" another element, it can be directly on another element or there can be a middle element. If an element is considered to be "connected" to another element, it can be directly connected to another element or there can be a middle element. If present, the terms "vertical", "horizontal", "up", "down", "left", "right" and similar expressions used in the present application are for illustrative purposes only and do not represent the only implementation.

[0036] Referring to Figure 1 and Figure 2 , Figure 1 and Figure 2The structure and cross-sectional view of the existing spacer 3 are shown. When the round protrusions of the existing spacer 3 are just fitted into the pattern gaps 41 on the wafer 4, if the wafer 4 is subjected to a large external force during handling, transportation and other operations, the force between the round protrusions and the wafer pattern will easily scratch the existing pattern on the wafer 4, and in severe cases, even cause the wafer 4 to be scrapped.

[0037] Referring to Figure 3 and Figure 4 shown, Figure 3 and Figure 4 The structure and cross-sectional view of the wafer spacer in an embodiment of the present application are shown. The wafer spacer provided in an embodiment of the present application forms an effective buffer between the wafer 4 and the spacer, thereby protecting the wafer 4 from scratches and fragmentation risks during transportation and storage.

[0038] Specifically, the wafer spacer includes a main body 1 and protrusions 2, and the side surface of the main body 1 is provided with a flat circular area 10. The protrusions 2 are provided with a deformation space 21, and a plurality of protrusions 2 are arranged at intervals in the circular area 10. The protrusions 2 are used to support in the pattern gaps 41 of the wafer 4 and form a buffering effect.

[0039] In the specific implementation process, when the spacer is in contact with the wafer 4, the protrusions 2 will form a support point with the pattern gaps 41 of the wafer 4, and by dispersing the weight and external force of the wafer 4, the direct contact area between the wafer 4 and the spacer is effectively reduced, thereby reducing the risk of scratches and fragmentation. At the same time, since the protrusions 2 are provided with a deformation space 21, when the wafer 4 is subjected to an external force, the protrusions 2 can deform and absorb the external force to buffer, further protecting the wafer 4 from damage.

[0040] In one embodiment, the wafer spacer includes a main body 1, and the shape and size of the main body 1 match the shape and size of the wafer 4, so as to provide uniform support when the wafers 4 are stacked.

[0041] In one embodiment, a flat circular area 10 is provided on one side surface of the main body 1. The circular area 10 is used to directly contact the surface of the wafer 4 and provide a stable support surface. The diameter and shape of the circular area 10 match the diameter and shape of the wafer 4 to ensure that the wafer 4 can completely cover the area when placed, and to avoid shaking or displacement during transportation.

[0042] In one embodiment, a plurality of protrusions 2 are provided in the circular region 10. These protrusions 2 are used to support the pattern gaps 41 of the wafer 4 to form a supporting fit and provide a cushioning effect when the wafer 4 is subjected to external forces. The shape and size of the protrusions 2 are adapted to the pattern gaps 41 of the wafer 4 to ensure that the protrusions 2 can be embedded in the pattern gaps 41 of the wafer 4 when the wafer 4 is placed, thereby increasing the number of contact points between the wafer 4 and the spacer and improving the stability of the support.

[0043] As shown in the accompanying drawings, Figure 5 Figure 5 The structure of the protrusions 200 provided in an embodiment of the present application is shown in the accompanying drawings. In some embodiments, a deformation space 21 is provided in the protrusions 2, so that the protrusions 2 can deform to a certain extent when subjected to external forces, thereby absorbing and dispersing the external forces and protecting the wafer 4 from damage.

[0044] In one embodiment, the plurality of protrusions 2 are arranged at intervals in the circular region 10 of the spacer to ensure that they can be uniformly distributed and provide effective support. The arrangement of the protrusions 2 can be adjusted according to the complexity and density of the pattern of the wafer 4 to ensure that the protrusions 2 can form a good fit with the pattern of the wafer 4 when the wafer 4 is placed.

[0045] As described above, by forming an effective cushioning effect between the wafer 4 and the spacer, the risk of scratches and chipping of the wafer 4 during transportation and storage is reduced. The structure of the spacer is simple, easy to use, and has good cushioning effect.

[0046] As shown in the accompanying drawings, Figure 3 Figure 3 The structure of the wafer spacer provided in an embodiment of the present application is shown in the accompanying drawings. In some embodiments, the spacing between any adjacent protrusions 2 of the plurality of protrusions 2 is uniform, and the protrusion height of the plurality of protrusions 2 is uniform.

[0047] Specifically, a plurality of protrusions 2 are provided in the circular region 10 of the spacer, and these protrusions 2 are used to form uniform spacing when the wafers 4 are stacked. In this embodiment, the spacing between any adjacent protrusions 2 is uniform in size, ensuring that each wafer 4 can obtain the same support effect, and avoiding stress concentration or insufficient support caused by uneven spacing.

[0048] Further, the protrusion height of each protrusion 2 is also kept uniform, ensuring the uniformity of the supporting fit of the protrusions 2 with the pattern gaps 41 of the wafer 4, while reducing the risk of wafer 4 warping or damage caused by height differences of the protrusions 2.

[0049] In one embodiment, the plurality of protrusions 2 are arranged in a polygonal structure in the circular region 10 of the spacer.​​

[0050] Specifically, the arrangement of the protrusions 2 can be selected as a regular hexagon, a square or other high-symmetry polygonal layout. Such arrangement maximizes the use of the spacer surface space, provides uniform support points, and also helps to form a stable structure when the wafer 4 is stacked, reducing displacement caused by vibration or handling.

[0051] As described above, the uniform and consistent protrusions 2 design helps to maintain the flatness of the wafer 4, control the spacing and thickness of the protrusions 2, and adopt a polygonal structure arrangement to improve the reliability of the spacer.

[0052] In combination Figure 5 as shown, Figure 5 is a schematic diagram of the structure of the protrusions 200 provided in an embodiment of the present application. In some embodiments, the protrusions 2 include multiple levels of protrusion rings 20, and gaps exist between the multiple levels of protrusion rings 20 to form the deformation space 21. The multiple levels of protrusion rings 20 are arranged radially from the center of the spacer 2 to form a multi-level ring structure.

[0053] Specifically, the protrusions 2 are composed of multiple concentric ring-shaped protrusions 200, which are arranged radially from the center of the spacer to the periphery, forming a multi-level ring structure. Preferably, the height of each level of protrusion rings 20 is consistent. In this embodiment, the height of the protrusion rings 20 can be adjusted according to actual needs.

[0054] Further, gaps are left between the multiple levels of protrusion rings 20 to form the deformation space 21. These gaps can reduce the overall weight of the spacer. When the wafers 4 are stacked, even if there is a slight unevenness or deformation caused by thermal expansion and contraction between the wafers 4, the gaps can allow the spacer to deform to a certain extent, thereby avoiding hard contact between the wafers 4 and reducing the risk of scratches and damage.

[0055] Further, the multiple levels of protrusion rings 20 are preferably made of materials with high elastic modulus, good wear resistance and chemical stability, such as special formula silicone, thermoplastic elastomer (TPE) or high-performance polymers, etc. The selection of these materials ensures that the spacer can still maintain good performance in long-term use and is not prone to aging or deformation.

[0056] As described above, through the unique multi-level protrusion ring 20 design, not only the support capacity of the spacer is enhanced, but also an effective deformation space 21 is created through the gaps between the multiple levels of protrusion rings 20, effectively solving the problem of scratches or damage caused by mutual contact during transportation or storage of the wafers 4.

[0057] In one of the embodiments, the main body 1 is a solid disc or a hollow disc, and the main body 1 is made of a soft material.

[0058] Specifically, the spacer body 1 is provided in a circular shape, which can be a solid circular plate, depending on the required rigidity and weight requirements. The body 1 is made of a soft material, such as silicone, thermoplastic elastomer (TPE), or polyimide (PI), to ensure that the spacer has a certain elasticity and recovery, and can adapt to the slight deformation between the wafer plates 4.

[0059] Further, the spacer body 1 is provided in a circular shape, which is a hollow circular plate. The surface of the body 1 is provided with a flat circular area, and the inside is hollow. Under the premise of ensuring the covering effect of the spacer on the wafer plates 4, the weight of the spacer is reduced, the lightweight design is realized, and the use cost is controlled.

[0060] In combination with Figure 5 as shown, Figure 5 is a structure diagram of the protrusion 200 part provided in an embodiment of the present application. In some embodiments, there are gaps between the plurality of protrusions 200 in each level of the protrusion ring 20, and the plurality of protrusions 200 are arranged in a ring shape.

[0061] Specifically, a plurality of concentric protrusion rings 20 are provided on the body 1 of the spacer, forming a multi-level structure. The plurality of protrusions 200 in each level of the protrusion ring 20 are arranged in a ring shape, and there is a gap between each protrusion 200. These gaps provide additional deformation space 21 when the wafer plates 4 are stacked, which helps to reduce direct contact and damage between the wafer plates 4.

[0062] In one of the embodiments, the plurality of protrusions 200 in each level of the protrusion ring 20 are cylindrical structures protruding outward from the surface of the body 1.

[0063] Specifically, the plurality of protrusions 200 in each level of the protrusion ring 20 are preferably cylindrical structures. The cylindrical protrusions 200 not only are easy to manufacture and process, but also can provide uniform support force to ensure that the wafer plates 4 remain flat and stable during stacking.

[0064] In one of the embodiments, the diameters of the plurality of cylindrical protrusions 200 in the two adjacent levels of the protrusion ring 20 can be consistent, so that the spacer can provide stable support and buffering effect.

[0065] In combination with Figure 6 as shown, Figure 6 is a structure diagram of the protrusion 200 part provided in an embodiment of the present application. In some embodiments, the diameters of the plurality of cylindrical protrusions 200 in the two adjacent levels of the protrusion ring 20 are inconsistent.

[0066] Specifically, in the two adjacent levels of the convex ring 20, the diameters of the plurality of cylindrical convexes 200 can be inconsistent. For example, in the two levels of the convex ring 20, the convexes 200 in the outer layer of the convex ring 20 have a first diameter, and the convexes 200 in the inner layer of the convex ring 20 have a second diameter, and the first diameter or the second diameter is not equal. Such design flexibility enables the spacer to adapt to wafers 4 of different sizes and weights, providing more accurate support and cushioning effects. For example, in order to enhance the support for larger wafers 4, the outer layer of the convex ring 20 can be designed to have a larger diameter and a higher height.

[0067] In one embodiment, the contact portion of the convex 200 with the pattern gap 41 of the wafer 4 is provided with a cushioning material.

[0068] Specifically, the contact portion of the convex 200 with the pattern gap 41 is provided with a cushioning material. These cushioning materials can be selected from foam pads, rubber layers, or special formula silicon gels, etc., to further reduce the friction and wear between the pattern gap 41 and the convex 200. The provision of the cushioning material not only improves the protection effect of the wafer 4, but also enhances the comfort and durability of the spacer.

[0069] In the specific implementation process, the spacer is placed between adjacent wafers 4, which can effectively prevent scratches, contamination or damage of the wafers 4 due to mutual contact. At the same time, the soft material and the multi-level convex ring 20 design of the spacer can also adapt to the slight deformation of the wafers 4 during processing, ensuring the flatness and precision of the wafers 4.

[0070] As described above, the wafer 4 spacer described above can significantly improve the safety and stability of the wafer 4 during transportation, storage and processing. Through the design of the multi-level convex ring 20 and the gap therebetween, uniform support and cushioning protection are provided for the wafers 4, effectively reducing the risk of direct contact and damage between the wafers 4. At the same time, the wafer 4 spacer of the present embodiment also has the advantages of simple structure, reasonable design, easy manufacturing, low cost, etc.

[0071] According to another purpose of the present application, a wafer delivery box is also provided, which comprises the wafer spacer as described above.

[0072] Specifically, the wafer delivery box comprises one or more partition chambers, each chamber being provided with a groove or a bracket matching the size of the wafer 4, so as to stably place the wafer 4 therein. Between adjacent wafers 4, the wafer spacer as described above is provided to ensure the spacing and cushioning protection between the wafers 4.

[0073] Further, the material of the main body 1 of the wafer shipping box can be hard plastic, metal or composite material, etc. to ensure the strength and durability of the box body. At the same time, the inner wall of the box body can be coated with an anti-static material to prevent the wafer 4 from being damaged by static electricity during transportation and storage.

[0074] Further, the wafer shipping box is also designed with a sealing structure, such as a sealing strip, a sealing cover, etc. to ensure the cleanliness and humidity control inside the box body. This helps to prevent the wafer 4 from being contaminated and damaged by external factors such as dust and moisture.

[0075] During the shipping process of the wafer 4, the wafer 4 is placed in the cavity of the shipping box and is spaced and buffered by the wafer spacer, which can effectively prevent the wafer 4 from being scratched, contaminated or damaged due to mutual contact or external factors.

[0076] As described above, the wafer shipping box can significantly improve the safety and stability of the wafer 4 during transportation and storage. Through the spacing and buffering protection of the spacer, as well as the sealing performance and portability design of the shipping box, the wafer 4 is provided with comprehensive protection measures. At the same time, the wafer shipping box also has the advantages of simple structure, reasonable design, easy manufacturing and low cost.

[0077] The technical features of the above-described embodiments can be combined in any manner. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described, but as long as the combinations of the technical features do not contradict, they should be considered within the scope of the present disclosure.

[0078] The above-described embodiments only express several implementation manners of the present application, and the description is more specific and detailed, but it should not be understood as a limitation on the patent scope of the application. It should be noted that for ordinary skilled persons in the art, without departing from the concept of the present application, a number of modifications and improvements can be made, which are all within the protection scope of the present application. Therefore, the patent protection scope of the present application should be subject to the appended claims.

Claims

1. A wafer spacer, comprising: The utility model relates to a wafer spacer, comprising: a main body (1) provided with a flat circular area (10) on one side surface thereof; a plurality of protrusions (2) are arranged at intervals in the circular area (10), and a deformation space (21) is arranged in each protrusion (2); the protrusions (2) are used for supporting in a pattern gap (41) of a wafer (4) and forming a buffering effect.

2. The wafer spacer of claim 1, wherein In the plurality of protrusions (2), the spacing between any adjacent protrusions (2) is uniform, and the protrusion heights of the plurality of protrusions (2) are uniform.

3. The wafer spacer of claim 2, wherein, The plurality of protrusions (2) are arranged in a polygonal structure in the circular area (10).

4. The wafer spacer of claim 2, wherein, The protrusion (2) comprises a plurality of stepped raised rings (20), and gaps exist between the stepped raised rings (20) to form the deformation space (21); the plurality of stepped raised rings (20) are arranged in a stepped ring structure from the center of the protrusion (2) to the periphery.

5. The wafer spacer of claim 4, wherein, Gaps exist between a plurality of protrusions (200) in each stepped raised ring (20), and the plurality of protrusions (200) are arranged in a ring shape.

6. The wafer spacer of claim 4, wherein, The plurality of protrusions (200) in each stepped raised ring (20) are cylindrical structures protruding outward from the surface of the main body (1).

7. The wafer spacer of claim 6, wherein, The diameters of the plurality of protrusions (200) in adjacent two stepped raised rings (20) are uniform or non-uniform.

8. The wafer spacer of claim 4, wherein, The contact part of the protrusion (200) with the pattern gap (41) of the wafer (4) is provided with a buffer material.

9. The wafer spacer of claim 1, wherein, The main body (1) is a solid wafer or a hollow wafer, and the main body (1) is made of a soft material.

10. A wafer shipper, comprising: The utility model further relates to a wafer spacer assembly comprising the wafer spacer.

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