Supporting assembly and semiconductor device

Abstract

The utility model discloses a supporting assembly and semiconductor equipment, the supporting assembly comprises a supporting pin and a balancing weight, the balancing weight is provided with a channel, the supporting pin is provided with a first end part and a second end part, the first end part is used for supporting a wafer, the second end part at least comprises a mounting part and an abutting part which are connected with each other, and the cross section area of the mounting part is smaller than that of the channel. The cross sectional area of at least part of the abutting part is larger than that of the channel, the installation part is located on the abutting part, and the balancing weight can be arranged on the installation part in a sleeving mode and abut against the abutting part. The structure design is simple, machining is easy, the overall hardness is higher, and the service life is longer; and the combination and installation are simpler and easier.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor technology, in particular to a support assembly and a semiconductor device. BACKGROUND

[0002] In the technical field of semiconductor technology, it is usually necessary to maintain a semiconductor device, such as a chemical vapor deposition device, to ensure the normal operation of the semiconductor device.

[0003] At present, when the chemical vapor deposition device is maintained, the components in the chamber are maintained, for example, the support components on the heating disc (also known as the chuck) in the chamber for supporting the wafer need to be disassembled and inspected, and then installed. The support components in the related art are further provided with counterweights, and the counterweights are used to increase the gravity at the end of the support components, so that the support components can normally land when the chuck is raised. However, when the support components are disassembled, the counterweights need to be removed from the support components. Due to the structural characteristics of the support components and the counterweights, the maintenance personnel have a large difficulty in installing in the limited operation space, and the counterweights are likely to fall into the chamber during the maintenance process, thereby affecting the product, and in severe cases, the product may be broken. SUMMARY

[0004] A series of simplified concepts are introduced in the summary part, which will be further described in detail in the detailed description part. The summary part of the present application does not mean to try to limit the key features and necessary technical features of the claimed technical solutions, nor to try to determine the protection scope of the claimed technical solutions.

[0005] In view of the existing problems, the present application provides a support assembly for supporting a wafer, which comprises:

[0006] a counterweight, the counterweight being provided with a passage;

[0007] a support pin, the support pin having a first end portion and a second end portion, wherein the first end portion is used to support the wafer, and the second end portion comprises at least a mounting portion and an abutting portion connected to each other, the mounting portion has a cross-sectional area smaller than that of the passage, at least part of the abutting portion has a cross-sectional area larger than that of the passage, the mounting portion is located above the abutting portion, and the counterweight can be sleeved on the mounting portion and abut against the abutting portion.

[0008] In some embodiments, the side surface of the counterweight has an opening, the opening is in communication with the passage, and the opening is used for the mounting portion to enter and exit the passage.

[0009] In some embodiments, the counterweight is in a columnar shape.

[0010] In some embodiments, the mounting portion is cylindrical, and the abutting portion is conical.

[0011] In some embodiments, the second end portion is conical.

[0012] In some embodiments, the second end portion further comprises a bottom cylindrical portion connected to the bottom surface of the abutting portion.

[0013] In some embodiments, the bottom cylindrical portion has the same diameter as the bottom surface of the abutting portion.

[0014] In some embodiments, the support pin further comprises a connecting portion between the first end portion and the second end portion, and the first end of the mounting portion is connected to the connecting portion.

[0015] In some embodiments, the connecting portion is cylindrical, and the connecting portion has a larger cross-sectional diameter than the mounting portion.

[0016] Another aspect of the present application provides a semiconductor device, which comprises a chuck, a driving member, and the support assembly described above. The chuck is provided with a mounting hole, the support assembly is mounted in the mounting hole, and the first end portion protrudes from the upper surface of the chuck. The driving member drives the chuck to move in the vertical direction, and the movement of the chuck drives the movement of the support assembly.

[0017] The support assembly and the semiconductor device provided by the present application comprise a support pin and a counterweight. The support pin is provided with a mounting portion having a smaller cross-sectional area than the cross-sectional area of a channel of the counterweight, and an abutting portion having at least a part of a larger cross-sectional area than the cross-sectional area of the channel, so as to form a structure from small to large in the vertical direction. The counterweight can be sleeved on the mounting portion and abut against the abutting portion, so as to be locked by the part of the abutting portion having a larger cross-sectional area than the cross-sectional area of the channel. The structure of the present application is simple, and can be obtained by simple mechanical processing on a cylindrical structure. The processing is easy, the overall hardness is higher, and the service life is longer. Moreover, the combined mounting mode of the support pin and the counterweight is more simple and convenient. BRIEF DESCRIPTION OF DRAWINGS

[0018] The following drawings of the present application are hereby incorporated as a part of the present application for understanding the present application. The drawings show the embodiments of the present application and their descriptions, which are used to explain the principles of the present application.

[0019] In the drawings:

[0020] Figure 1 The structural schematic diagram of the support assembly of a specific embodiment of the present application is shown.

[0021] Figure 2 The structural schematic diagram of the support pin of the support assembly of a specific embodiment of the present application is shown.

[0022] Figure 3 A structural diagram of a weight of a support assembly according to an embodiment of the present application is shown.

[0023] Figure 4 A structural diagram of a semiconductor device according to an embodiment of the present application is shown.

[0024] In the drawings:

[0025] 10 support pin

[0026] 11 first end portion

[0027] 12 connecting portion

[0028] 13 second end portion

[0029] 131 mounting portion

[0030] 132 abutting portion

[0031] 133 bottom surface columnar portion

[0032] 20 weight

[0033] 21 opening

[0034] 30 wafer

[0035] 40 chuck

[0036] 50 mounting hole DETAILED DESCRIPTION

[0037] The present application will be described more fully hereinafter with reference to the accompanying drawings, in which embodiments of the application are shown. This application may, however, be embodied in different forms, and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the application to those skilled in the art. In the drawings, the sizes and relative sizes of layers and regions are exaggerated for clarity. Like reference numerals refer to like elements throughout.

[0038] It will be understood that when an element or layer is referred to as being "on" or "connected to" another element or layer, it can be directly on or connected to the other element or layer or intervening elements or layers can be present. In contrast, when an element is referred to as being "directly on" or "directly connected to" another element or layer, there are no intervening elements or layers present. It will also be understood that, although the terms first, second, third, etc. can be used herein to describe various elements, components, regions, layers and / or sections, these elements, components, regions, layers and / or sections should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of the present application.

[0039] Spatially relative terms, such as "beneath", "below", "lower", "under", "above", "upper" and the like, can be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if a device in the figures is turned over, elements described as "below" or "beneath" other elements or features would then be oriented "above" or "over" the other elements or features. Thus, the exemplary term "below" can encompass both an orientation of above and below. The device can be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

[0040] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the present application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and / or "comprising", when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof. As used herein the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0041] Embodiments of the application will be described herein with reference to cross-sectional illustrations that are schematic illustrations of ideal embodiments (and intermediate structures) of the application. As such, variations from the shapes of the illustrations as a result, for example, of manufacturing techniques and / or tolerances, are to be expected. Thus, embodiments of the application should not be construed as limited to the particular shapes of regions illustrated herein but are to include deviations in shapes that result from, for example, manufacturing. Thus, the regions illustrated in the figures are schematic in nature and their shapes are not intended to illustrate the precise shape of a region that would be formed through fabrication.

[0042] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and / or the

[0043] For a thorough understanding of the application, reference will be made to the following detailed description, in conjunction with the accompanying drawings, in which:

[0044] In the field of semiconductor technology, it is generally required to maintain semiconductor equipment, such as a chemical vapor deposition device, to ensure normal operation of the semiconductor equipment.

[0045] At present, the opening mode of some chemical vapor deposition device chambers is to vertically lift the upper cover by 80 cm, and all operations inside the chamber are completed in a space of 80 cm high.

[0046] When maintaining the chemical vapor deposition device, the components inside the chamber need to be maintained and repaired, for example, the maintenance personnel need to maintain and repair the support pins on the heating disc (i.e., the chuck) in the chamber for supporting the wafer, and the support pins need to be disassembled, inspected, cleaned, and then installed on the chuck during each maintenance and repair process. In some related technologies, a counterweight is also provided on the support pin, and the counterweight is usually installed at the end of the support pin to increase the gravity at the end of the support pin, so that the support pin can normally land when the chuck is lifted. When disassembling the support assembly, the counterweight needs to be removed from the support pin so that the support pin can be pulled out of the mounting hole. When disassembling and installing the counterweight, the maintenance personnel need to stretch their hands into the gap between the bottom of the chamber and below the chuck, and complete the related operations in a limited working space, such as the aforementioned 80 cm working space.

[0047] In the related art, the end of the support pin is in the shape of a triangular pyramid, the counterweight has a through hole matching the structure of the end of the support pin, and the front and back of the counterweight have different structures. The front of the counterweight is flat, and the back of the counterweight is provided with a groove for the support pin to be clamped in the groove after passing through the through hole. When installing the counterweight, the maintenance personnel need to insert the support pin from the small hole on the front of the counterweight under the chuck, and when the support pin reaches the groove position of the counterweight, the support pin is rotated so that the end of the support pin is clamped into the groove of the counterweight. Since the end of the support pin and the counterweight are both in the working space at the bottom of the chamber under the chuck when the counterweight is installed, the working space is in the blind area of the field of view of the maintenance personnel, and the front and back of the counterweight have different structures without a foolproof mechanism, so the installation is difficult, and the counterweight is prone to falling into the chamber during maintenance, which may affect the product wafer and even cause the product wafer to break.

[0048] Therefore, in view of the foregoing technical problems, the present application provides a support assembly and a semiconductor device, and the support assembly is used for supporting a wafer, and the support assembly comprises:

[0049] a counterweight, the counterweight being provided with a channel;

[0050] a support pin, the support pin having a first end and a second end, wherein the first end is used for supporting the wafer, and the second end comprises at least a mounting portion and an abutting portion connected to each other, the mounting portion has a cross-sectional area smaller than that of the channel, at least part of the abutting portion has a cross-sectional area larger than that of the channel, the mounting portion is located above the abutting portion, and the counterweight can be sleeved on the mounting portion and abut against the abutting portion.

[0051] The support assembly according to the present application comprises a support pin and a counterweight. The support pin is provided with a mounting portion having a cross-sectional area smaller than that of the channel of the counterweight, and an abutting portion having at least part of a cross-sectional area larger than that of the channel, to form a structure from small to large in the vertical direction. The counterweight can be sleeved on the mounting portion and abut against the abutting portion, so as to lock the counterweight through the part of the abutting portion having a cross-sectional area larger than that of the channel. The structure of the present application is simple and can be obtained by simple mechanical processing on a cylindrical structure, so it is easy to process and has higher overall hardness and longer service life. Moreover, the combined installation of the support pin and the counterweight is more convenient and easy to install.

[0052] In order to thoroughly understand the present application, the structure will be described in the following description in order to explain the technical solutions proposed by the present application. The preferred embodiments of the present application are described in detail as follows, however, in addition to these detailed descriptions, the present application can also have other implementation manners.

[0053] In the following, the support assembly of the present application will be described in detail. Figures 1 to 3 The support assembly of the present application will be described in detail.

[0054] This application provides a support component for supporting a wafer, such as... Figure 1 As shown, the support assembly includes a support pin 10 and a counterweight block 20, wherein, as Figure 3 As shown, the counterweight 20 is provided with a channel. For example, the counterweight 20 can be columnar, and the channel can be located in the middle of the columnar counterweight 20. Further, the channel is also a columnar channel.

[0055] The support pin 10 has a first end 11 and a second end 13. The first end 11 is used to support the wafer, while the second end 13 includes at least a mounting portion 131 and an abutment portion 132 connected to each other. The mounting portion 131 is located above the abutment portion 132, that is, the bottom surface of the mounting portion 131 is connected to the top surface of the abutment portion 132. The cross-sectional area of ​​the mounting portion 131 is smaller than the cross-sectional area of ​​the channel, and at least part of the cross-sectional area of ​​the abutment portion 132 is larger than the cross-sectional area of ​​the channel. That is, the mounting portion 131 is the second end 13 with the smaller cross-sectional area. The portion of the second end 13 with a larger cross-sectional area than the channel in the abutment portion 132 is the portion with a larger cross-sectional area, thus forming a structure that increases in size vertically. The counterweight 20 can be fitted onto the mounting portion 131 and can fall naturally from the mounting portion 131, then abut against the portion with a larger cross-sectional area, thereby connecting the counterweight 20 with the support pin 10. The second end 13 can lock the counterweight 20 in the support pin 10 through the abutment portion 132, which is convenient and simple to use.

[0056] It is worth mentioning that at least a portion of the abutment portion 132 has a cross-sectional area larger than the channel cross-sectional area of ​​the counterweight 20, thereby allowing the counterweight 20 to be locked in place by the abutment portion. The portion of the abutment portion 132 with a cross-sectional area larger than the channel cross-sectional area can be set as needed, and this application does not limit it. Preferably, the portion of the abutment portion 132 with a larger cross-sectional area is located at the end of the abutment portion 132, which helps to increase the gravity at the end of the support pin 10. For example, as Figure 2 As shown, the mounting part 131 is columnar, and the abutment part 132 is conical, with the cross-sectional area of ​​the conical end being larger than the cross-sectional area of ​​the channel.

[0057] In some embodiments, the second end is tapered, such as... Figure 1 and Figure 2 As shown, the mounting part 131 and the abutting part 132 are cone-shaped integral structures with cross-sectional areas ranging from small to large. The cone-shaped integral structure is simple to manufacture and can be formed by simple machining.

[0058] The counterweight 20 can be inserted into the mounting part 131 through its channel. In some embodiments, the counterweight 20 can be inserted into the mounting part 131 from the top surface of the mounting part 131 through its channel, and then the counterweight 20 will fall naturally to the abutment part 132, which has a cross-sectional area larger than that of the channel, and then be locked.

[0059] In some embodiments, the counterweight 20 can also be fitted into the mounting portion 131 from the side of the mounting portion 131. In this case, as shown in the figure... Figure 3 As shown, the counterweight 20 has an opening 21 on its side, which communicates with the channel. This opening 21 allows the mounting part to enter and exit the channel. After the counterweight 20 is fitted into the mounting part 131, it can move on the support pin 10 through the channel and lock onto the abutment part 132. During maintenance, the operator can remove the counterweight 20 from the support pin 10 through the opening 21 and leave the channel. When the counterweight 20 is a cylindrical tube structure, the cross-section of the counterweight 20 with the opening 21 is C-shaped.

[0060] The opening 21 allows the counterweight 20 to be fitted into the mounting portion 131 from the side. Therefore, the lateral width of the opening 21 needs to be greater than the cross-sectional diameter of the mounting portion 131. For example, the width of the opening is 2 mm, and the cross-sectional diameter of the mounting portion 131 is 1.8 mm, so that the opening 21 of the counterweight 20 engages with the support pin 10 from the side of the mounting portion 131. Moreover, the width of the opening 21 is smaller than the diameter of the larger portion of the cross-sectional area of ​​the abutment portion 132, for example, the bottom surface of the conical abutment portion 132. The diameter is adjusted so that the opening 21 of the counterweight 20 can be engaged with the abutment portion 132. Furthermore, in order to allow the counterweight 20 to be inserted into the support pin 10 of the mounting portion 131 through the opening 21, the longitudinal length of the counterweight 20 is less than or equal to the longitudinal length of the mounting portion 131. This avoids the situation where the opening 21 is blocked near the connection between the abutment portion 132 and the mounting portion 131 when the counterweight 20 is inserted into the support pin 10 through the opening 21, thus preventing it from being smoothly inserted into the support pin 10 from the side of the mounting portion 131.

[0061] The support pin 10 in the support assembly of this application embodiment can be formed by simple machining of a cylindrical structure, such as turning a cylindrical structure. The shape of the cylinder can be changed by rotating the cylindrical structure and the cutting motion of the cutting tool. Specifically, by adjusting the movement trajectory and cutting parameters of the tool, a cone can be cut into one end of the cylindrical structure, thereby forming an integral structure with the cylindrical and cone structures connected. Therefore, the structure of this application embodiment is simple in design, easy to process, and has higher overall hardness and longer service life after processing.

[0062] In some embodiments, the counterweight 20 can be provided with the same upper surface and lower surface structure to prevent errors, so as to avoid installation errors due to inconsistent front and back surface structures, thereby preventing the counterweight 20 from falling. The foolproof design can prevent maintenance personnel from making mistakes during installation, so that they no longer need to rely on "experience" to install, and the possibility of affecting the product due to improper installation is reduced.

[0063] In some embodiments, the cross-sectional diameter of the mounting portion is the same as the diameter of the top surface of the abutting portion, so that the mounting portion and the abutting portion are connected smoothly, so as to avoid the connection between the mounting portion and the abutting portion from having a stepped protrusion or depression, thereby avoiding adverse effects on the up and down movement of the counterweight on the second end portion.

[0064] In some embodiments, the inner diameter of the channel of the counterweight is greater than the cross-sectional diameter of the mounting portion and the diameter of the top surface of the abutting portion, and is less than the diameter of the bottom surface of the abutting portion.

[0065] For example, the inner diameter of the channel is 3.8 mm, and the diameter of the bottom surface of the abutting portion is 4 mm, so that the counterweight can move up and down on the second end portion after being combined with the support pin through the mounting portion, and can be locked in the abutting portion, so as to realize the counterweight being sleeved on the part of the second end portion with a larger cross-sectional area, so as to lock the counterweight to avoid it from sliding off the bottom of the abutting portion.

[0066] In the related art, a fixed limiting point is used, and when the limiting is not in place, the counterweight has the risk of falling off. However, in the embodiments of the present application, the counterweight is locked by limiting the cross-sectional area of the abutting portion and the cross-sectional area of the channel, so as to overcome the problem of the counterweight falling off due to the limiting not being in place in the related art.

[0067] In some embodiments, as shown in Figure 1 and Figure 2 The support pin 10 further includes a connecting portion 12 between the first end portion 11 and the second end portion 13. One end of the connecting portion 12 is connected to the first end portion 11, and the other end of the connecting portion 12 is connected to the first end of the mounting portion 131. Further, the connecting portion 12 is in a columnar shape, so as to facilitate the connection between the connecting portion 12 and the first end of the mounting portion 131, and the cross-sectional diameter of the connecting portion 12 is greater than the cross-sectional diameter of the mounting portion 131, so that the counterweight 20 is combined with the support pin 10 by passing through the mounting portion 131.

[0068] In some embodiments, as shown in Figure 2 The second end portion 133 further includes a bottom surface columnar portion 133 connected to the bottom surface of the abutting portion 132. The bottom surface columnar portion 133 increases the contact area of the edge of the bottom of the support pin 10, and improves the hardness of the support pin 10, so as to avoid the end of the support pin 10 being easily damaged.

[0069] In some embodiments, in order to facilitate processing and manufacturing, the cross-sectional diameter of the bottom columnar portion 133 is the same as the diameter of the bottom surface of the abutting portion 132.

[0070] So far, the support assembly of the present application has been introduced, and other components of the complete support assembly are not described here.

[0071] The support assembly provided by the present application includes a support pin and a counterweight, by setting the mounting portion of the support pin to have a smaller cross-sectional area than the channel cross-sectional area of the counterweight, and the abutting portion to have a cross-sectional area larger than the channel cross-sectional area in at least some areas, to form a structure from small to large in the vertical direction, and the counterweight can be sleeved on the mounting portion and abutted on the abutting portion, so as to realize the locking of the counterweight through the part of the abutting portion with a larger cross-sectional area than the channel cross-sectional area. The structure of the present application is simple, and can be obtained by simple mechanical processing on a cylindrical structure, which is easy to process, has higher overall hardness, and longer service life. Moreover, the combined installation method of the support pin and the counterweight of the present application is more simple and convenient to install. In addition, the present application also has a foolproof design, which is not easy to make mistakes during installation, and no longer needs to rely on "experience" for installation, reducing the possibility of affecting the product due to improper installation.

[0072] The structure of the support assembly in Figure 4 A semiconductor device according to another aspect of the present application is described. Figure 4 The structural schematic diagram of the semiconductor device according to the embodiment of the present application is shown. It is worth mentioning that, Figure 4 The structure of the support assembly in

[0073] The semiconductor device according to the embodiment of the present application, as shown in Figure 4 The semiconductor device includes a chuck 40, a driving member (not shown) and a support assembly, the chuck 40 is used to carry a wafer 30 and also used to heat the wafer 30, the chuck 40 is provided with a mounting hole 50, the support assembly is installed in the mounting hole 50, and the first end of the support pin 10 protrudes from the upper surface of the chuck 40, wherein the driving member drives the chuck 40 to move in the vertical direction, and the movement of the chuck 40 drives the movement of the support assembly.

[0074] Exemplarily, the semiconductor device can be a chemical vapor deposition apparatus. The semiconductor device is exemplified below with the chemical vapor deposition apparatus. The chemical vapor deposition apparatus includes a reaction chamber including a cavity and a reaction machine located in the cavity. In one embodiment of the present application, the support pin 10 passes through the mounting hole in the chuck so that the first end 11 of the support pin 10 is on one side of the top surface of the chuck and at least part of the second end 13 is on one side of the bottom surface of the chuck. The counterweight 20 abuts against the second end 13 of the support pin 10, and the counterweight 20 can move up and down along the second end 13.

[0075] The support assembly of the embodiments of the present application is applied to the chemical vapor deposition apparatus in which the driving member drives the chuck 40 to move in the vertical direction, and the support assembly moves relatively with the movement of the chuck 40. In other words, the support assembly in the embodiments of the present application is not driven by a power source itself, and the power is provided to the support assembly by the chuck 40 to make the support assembly move.

[0076] In one specific embodiment, when the chuck 40 is located at the bottom of the reaction chamber, the bottom of the support assembly is in contact with the bottom of the reaction chamber, and the first end of the support pin 10 and at least part of the connecting portion are located on one side of the top surface of the chuck 40. For example, the first end of the support pin 10, the connecting portion, and part of the second end are located on one side of the top surface of the chuck 40. When the chuck 40 is raised from the bottom of the reaction chamber, the chuck 40 moves upward relative to the support assembly, and the support assembly does not move until the top surface of the chuck 40 contacts the first end of the support assembly. At this time, the chuck 40 drives the support assembly to move upward, and the counterweight 20 in the support assembly can increase the gravity at the end of the support pin 10 to make the center of gravity of the support pin 10 move downward, so that the support pin 10 can normally fall when the chuck 40 drives the support assembly to move upward. Thus, the phenomenon that the support pin 10 slides unsmoothly or even tilts due to the resistance of the deposits on the inner wall of the mounting hole is avoided, and the wafer is ensured to be not tilted and stably supported. When the chuck 40 falls back to the bottom of the reaction chamber, the bottom of the support assembly is in contact with the bottom of the reaction chamber, at least part of the second end is in the mounting hole 50, and the first end and at least part of the connecting portion are exposed on the upper surface of the chuck. The first end is used to support the wafer.

[0077] In some embodiments, as shown in Figure 1 and 2 the cross-sectional diameter of the first end 11 is greater than the cross-sectional diameter of the connecting portion 12, and the cross-sectional diameter of the first end 11 is greater than the inner diameter of the mounting hole 50. Thus, after the chuck 40 is raised to contact the first end 11, the first end 11 can protrude from the upper surface of the chuck 40, and the support pin 10 can fall from the mounting hole 50.

[0078] It is worth mentioning that in the embodiment in which the counterweight 20 has no opening on the side, the counterweight 20 needs to be sleeved into the support pin 10 from the top surface of the support pin 10, in which case, in order to meet the requirements that the support assembly is prevented from falling out of the mounting hole 50 after being lifted away from the bottom of the reaction chamber, and the support assembly can be mounted into the mounting hole 50, the first end portion 11 should be detachably arranged on the support pin 10.

[0079] The semiconductor device of the present application is introduced so far, and the complete semiconductor device can also include other components, which are not described here

[0080] The semiconductor device of the embodiment of the present application includes the support assembly described above, and therefore has the corresponding beneficial effects of the support assembly. In particular, when the operating personnel dismounts and mounts the support assembly in the case that the operation space of the chamber is limited, the simple mounting method and the foolproof design of the present application can effectively guarantee the maintenance operation of the operating personnel and the stable operation of the reaction machine.

[0081] Although a number of embodiments have been described herein, it is understood that the skilled person can conceive many other modifications and embodiments, which will all fall within the spirit and scope of the inventive concept disclosed. More particularly, various modifications and changes in the arrangement and / or components of the subject matter combinations can be made within the scope of the present disclosure, the drawings, and the appended claims. In addition to modifications and changes in the components and / or arrangement, the use of alternative means will also be apparent to those skilled in the art.

Claims

1. A support assembly for supporting a wafer, characterized in that, The support assembly comprises: a counterweight provided with a passage; a support pin having a first end portion for supporting the wafer and a second end portion comprising an installation portion and an abutting portion connected to each other, wherein a cross-sectional area of the installation portion is smaller than that of the passage, a cross-sectional area of at least a part of the abutting portion is larger than that of the passage, the installation portion is located above the abutting portion, and the counterweight can be sleeved on the installation portion and abut against the abutting portion.

2. The support assembly of claim 1, wherein, A side surface of the counterweight is provided with an opening in communication with the passage, and the opening is used for the installation portion to enter and exit the passage.

3. A support assembly as claimed in claim 1 or 2, wherein, The counterweight is in a columnar shape.

4. The support assembly of claim 1 or 2, wherein, The installation portion is in a columnar shape, and the abutting portion is in a conical shape.

5. The support assembly of claim 1, wherein, The second end portion is in a conical shape.

6. The support assembly of claim 4, wherein, The second end portion further comprises a bottom surface columnar portion connected to a bottom surface of the abutting portion.

7. The support assembly of claim 6, wherein, A cross-sectional diameter of the bottom surface columnar portion is the same as that of the bottom surface of the abutting portion.

8. The support assembly of claim 4, wherein, The support pin further comprises a connecting portion between the first end portion and the second end portion, and a first end of the installation portion is connected to the connecting portion.

9. The support assembly of claim 8, wherein, The connecting portion is in a columnar shape, and a cross-sectional diameter of the connecting portion is larger than that of the installation portion.

10. A semiconductor device, characterized by comprising: The semiconductor device comprises a chuck provided with a mounting hole, a support assembly as claimed in any one of claims 1-9 mounted in the mounting hole, and a first end portion of the support pin protruding from an upper surface of the chuck, wherein a driving member drives the chuck to move in a vertical direction, and the movement of the chuck drives the support assembly to move.

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