Device for measuring thickness of circuit board and thickness of dielectric layer
The circuit board thickness and interlayer thickness measurement device, which combines X-ray and laser interferometry, solves the problems of surface scratches and insufficient accuracy of circuit board measurement equipment, realizes non-contact precision measurement, and ensures the accuracy and reliability of the measurement.
Patent Information
- Application Number
- CN202520311958.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-26
- Publication Date
- 2025-12-16
- Estimated Expiration
- 2035-02-26
AI Technical Summary
Existing circuit board thickness and interlayer thickness measurement equipment suffers from problems such as scratching the circuit board surface and insufficient measurement accuracy, especially in complex multi-layer structures where it is difficult to accurately obtain interlayer thickness information.
An X-ray emitter and detector are used in conjunction with a laser interferometer. The three-axis movement is achieved through adjustment components. Non-contact measurement is performed by utilizing the penetrating power of X-rays and the precise focusing of lasers.
This technology enables transparent measurement of the internal structure of circuit boards, avoiding the risk of scratches, improving the accuracy and stability of measurements, isolating external environmental interference, and ensuring the reliability of measurement results.
Smart Images

Figure CN223678447U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to a circuit board thickness and interlayer thickness measuring device belongs to circuit board processing technical field. BACKGROUND
[0002] In the circuit board manufacturing process, accurate control board thickness and each interlayer thickness is very important. Circuit board thickness does not reach the standard and will affect its installation adaptability in electronic equipment, leading to poor connection, uneven heat dissipation and other problems. The deviation of interlayer thickness will affect the signal transmission quality, electrical insulation performance, and further affect the overall performance and reliability of electronic products.
[0003] At present, the common board thickness measuring instrument in the market is mostly contact or simple non-contact measuring equipment. Contact measurement is easy to scratch the surface of the circuit board, affecting product quality, and it is difficult to accurately measure the internal interlayer thickness. Traditional non-contact measurement methods, such as ultrasonic measurement, are greatly affected by the unevenness of the circuit board material, and the measurement accuracy is limited. Optical measurement is easy to be affected by light refraction, cross-section cutting quality and reflection interference when facing multi-layer complex structure, and cannot accurately obtain interlayer thickness information. UTILITY MODEL CONTENT
[0004] The utility model aims at overcoming the defects in the prior art, providing a circuit board thickness and interlayer thickness measuring device, which aims to realize accurate measurement of the circuit board and reduce scratches on the surface of the circuit board.
[0005] To achieve the above purpose, the utility model is implemented by the following technical scheme:
[0006] The utility model provides a circuit board thickness and interlayer thickness measuring device, comprising:
[0007] A measuring box;
[0008] A measuring mechanism is arranged in the measuring box and comprises an adjusting assembly, a laser interferometer mounted on the adjusting assembly, and an X-ray emitter and an X-ray detector arranged oppositely and adapted to each other. The adjusting assembly can drive the laser interferometer to move in the horizontal, vertical and vertical directions.
[0009] A placing mechanism is used to fix the circuit board to be measured. The placing mechanism is arranged in the measuring box and located below the laser interferometer and between the X-ray emitter and the X-ray detector.
[0010] Further, the adjusting assembly comprises:
[0011] Two fixed plates are oppositely arranged, and a first lead screw and a first guide rod are arranged between the two fixed plates in the transverse direction; the first lead screw is rotatably connected to the fixed plates, and one end is drivingly connected to an output shaft of a first motor;
[0012] A first sliding block is movably sleeved on the first guide rod and is screwed on the first lead screw, and the first lead screw can drive the first sliding block to move in the transverse direction when rotating;
[0013] A mounting plate is fixed to the first sliding block; the mounting plate has a top plate opposite to the first sliding block; a second lead screw and a second guide rod are arranged between the top plate and the first sliding block in the vertical direction; the second lead screw is rotatably connected to the first sliding block and the top plate, and one end is drivingly connected to an output shaft of a second motor;
[0014] A second sliding block is movably sleeved on the second guide rod and is screwed on the second lead screw;
[0015] A mounting frame is fixed to one side of the second sliding block; a third lead screw and a third guide rod are arranged in the longitudinal direction in the mounting frame; the third lead screw is rotatably connected to the mounting frame, and one end is drivingly connected to a third motor;
[0016] A third sliding block is movably sleeved on the third guide rod and is screwed on the third lead screw; the bottom of the third sliding block is provided with the laser interferometer.
[0017] Further, the placing mechanism comprises:
[0018] A placing plate is provided with a limiting plate along one side edge;
[0019] A movable plate is used to cooperate with the limiting plate to clamp the circuit board; the movable plate is slidably mounted on the placing plate.
[0020] Further, the placing plate is provided with a fourth guide rod extending in the sliding direction of the movable plate;
[0021] The placing plate is slidably sleeved on the fourth guide rod;
[0022] A spring is sleeved on the fourth guide rod between the limiting plate and the movable plate.
[0023] Further, a sliding groove extending in the sliding direction of the movable plate is formed in the placing plate, and the guide rod is arranged in the sliding groove.
[0024] Further, the movable plate is provided with a movable block matched with the sliding groove; the movable block is slidably embedded in the sliding groove, and has a through hole through which the fourth guide rod passes.
[0025] Further, the placing plate is provided with two symmetrical sliding grooves; each sliding groove is provided with a fourth guide rod;
[0026] The movable plate is movably connected with the two fourth guide rods.
[0027] Further, the third screw rod is a bidirectional screw rod.
[0028] Further, one side of the measuring box is provided with a movable door.
[0029] Further, the movable door is provided with a handle.
[0030] Compared with the prior art, the utility model has the beneficial effects of:
[0031] The utility model provides a circuit board thickness and interlayer thickness measuring device, through X ray emitter and X ray detector cooperation, realized under the premise of not damaging circuit board surface, to the inside structure of circuit board carries out perspective measurement, the penetration ability of X ray ensures that the distribution of circuit board inside interlayer can be accurately captured, effectively avoids the scratch risk that contact type measurement can bring.
[0032] Secondly, through setting adjusting assembly, laser interferometer realizes three axial movement through adjusting assembly, makes laser beam accurate focus on circuit board surface and carries out board thickness measurement, and through adjusting the position of laser interferometer, further improves the stability and accuracy of measurement.
[0033] The utility model measuring device in the use process, whether X ray emission and reception or laser measurement execution, is completed in the closed measuring box, effectively isolates the interference of external environmental factors, guarantees the reliability of measurement result. ACCURACY
[0034] Figure 1 It is a kind of circuit board thickness and interlayer thickness measuring device's overall structure schematic drawing provided for the utility model embodiment;
[0035] Figure 2 It is a kind of circuit board thickness and interlayer thickness measuring device's internal structure schematic drawing provided for the utility model embodiment;
[0036] Figure 3 It is the structure schematic of adjusting assembly of a kind of circuit board thickness and interlayer thickness measuring device provided for the utility model embodiment Figure 1 ;
[0037] Figure 4The adjusting assembly of the circuit board thickness and interlayer thickness measuring device provided by the utility model provides a structure diagram of a placing plate Figure 2 ;
[0038] Figure 5 The adjusting assembly of the circuit board thickness and interlayer thickness measuring device provided by the utility model provides a structure diagram of a placing plate
[0039] Fig. 1, measuring box; 2, movable door; 3, adjusting assembly; 301, fixed plate; 302, first screw rod; 303, first guide rod; 304, first motor; 305, first sliding block; 306, mounting plate; 307, second screw rod; 308, second guide rod; 309, second motor; 310, second sliding block; 311, mounting frame; 312, third screw rod; 313, third guide rod; 314, third motor; 315, third sliding block; 316, laser interference measuring instrument; 317, X-ray emitter; 318, X-ray detector; 4, placing plate; 401, sliding groove; 402, fourth guide rod; 403, spring; 404, movable block; 405, movable plate; 406, limiting plate; 407, circuit board DETAILED DESCRIPTION
[0040] The utility model will be described further below in conjunction with the drawings. The following embodiments are only used for more clearly illustrating the technical scheme of the utility model, and cannot limit the protection scope of the utility model.
[0041] In the description of the utility model, it is understood that the orientation or position relationship indicated by the terms "center", "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like is based on the orientation or position relationship shown in the drawings, and is only for the convenience of describing the utility model and simplifying the description, and does not indicate or imply that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, therefore, it cannot be understood as the limitation of the utility model. In addition, the terms "first", "second" and the like are only used for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features limited by "first", "second" and the like can be explicitly or implicitly included one or more features. In the description of the utility model, unless otherwise specified, the meaning of "a plurality of" is two or more.
[0042] In the description of the utility model, need explanation, unless another explicit provision and limitation, term "installation", "link", "connection" should do broad sense understanding, for example, can be fixed connection, also can be detachable connection, or integrally connected;Can be mechanical connection, also can be electrical connection;Can be directly connected, also can pass through intermediate medium indirectly connected, can be two element inside the intercommunication.For ordinary skilled person in the art, can understand the concrete meaning of above-mentioned term in the utility model through specific circumstances.
[0043] Embodiment 1, this embodiment introduces a kind of circuit board thickness and interlayer thickness measuring device, including measurement box 1, measuring mechanism and placement mechanism.
[0044] Please refer to Figure 1 And Figure 2 Measurement box 1 is closed structure.For accommodating the various components of the circuit board 407 measurement, and measurement box 1 side is equipped with an activity door 2.
[0045] In order to facilitate operator to open and close activity door 2, handle is installed on activity door 2, operator can control activity door 2 by holding handle 2.
[0046] Measuring mechanism is set in measurement box 1, including adjusting assembly 3, laser interferometer 316 installed on adjusting assembly, and X-ray emitter 317 and X-ray detector 318 relatively set and mutually adapt, adjusting assembly 3 can drive laser interferometer 316 along transverse, longitudinal and vertical direction movement.Adjusting assembly 3 can pass through the position of laser interferometer 316 is adjusted to make the measurement range of laser interferometer 316 completely cover circuit board 407.X-ray emitter 317 and X-ray detector 318 are oppositely arranged, for realizing the measurement of circuit board 407.
[0047] Exemplary, please refer to Figure 3 And Figure 4As a specific embodiment, the adjusting assembly 3 comprises a fixed plate 301, a first sliding block 305, a mounting plate 306, a second sliding block 310, a mounting frame 311 and a third sliding block 315. The fixed plate 301 is provided with two opposite ones, and a first lead screw 302 and a first guide rod 303 are arranged between the two fixed plates 301 in the transverse direction; the first lead screw 302 is rotatably connected to the fixed plate 301, and one end is drivingly connected to an output shaft of a first motor 304. The two ends of the first guide rod 303 are fixedly connected to the two fixed plates 301, respectively. The first sliding block 305 has a through hole matched with the first guide rod 303 and a threaded hole matched with the first lead screw 302, and the first sliding block 305 is movably sleeved on the first guide rod 303 and is screwed on the first lead screw 302; the first motor 304 can drive the first lead screw 302 to rotate when started, and the first lead screw 302 can drive the first sliding block 305 to move in the transverse direction when rotating.
[0048] In addition, referring to Figure 3 and Figure 4 , one side of the fixed plate 301 is provided with a motor bracket, and the first motor 304 is fixed on the motor bracket. The mounting plate 306 is fixed to the rear side of the first sliding block 305; one end of the mounting plate 306 extends upward and is bent transversely to form a top plate opposite to the first sliding block 305. A second lead screw 307 and a second guide rod 308 are arranged between the top plate and the first sliding block 305 in the vertical direction; the second lead screw 307 is rotatably connected to the first sliding block 305 and the top plate, and one end is drivingly connected to an output shaft of a second motor 309. The upper side of the top plate is provided with a motor cover, and the second motor 309 is arranged in the motor cover.
[0049] Further, referring to Figure 3 and Figure 4The second sliding block 310 has a through hole matched with the second guide rod 308 and a threaded hole matched with the second screw rod 307, and is movably sleeved on the second guide rod 308 and screwingly sleeved on the second screw rod 307. The second motor 309 can drive the second screw rod 307 to rotate when started, and the second screw rod 307 can drive the second sliding block 310 to move up and down when rotating. The mounting frame 311 is fixed to one side of the second sliding block 310; the third screw rod 312 and the third guide rod 313 are arranged in the mounting frame 311 in the longitudinal direction; the third screw rod 312 is rotatably connected with the mounting frame 311 and is drivingly connected with a third motor 314 at one end. The third sliding block 315 has a through hole matched with the third guide rod 313 and a threaded hole matched with the third screw rod 312, and is movably sleeved on the third guide rod 313 and screwingly sleeved on the third screw rod 312; the bottom of the third sliding block 315 is provided with the laser interference measuring instrument 316. The third motor 314 can drive the third screw rod 312 to rotate when started, and the third screw rod 312 can drive the third sliding block 315 to move longitudinally when rotating, so as to adjust the longitudinal position of the laser interference measuring instrument 316.
[0050] Based on the above, Figure 3 and Figure 4 In the embodiment, when the first sliding block 305 moves transversely, the laser interference measuring instrument 316 can move transversely; when the second sliding block 310 moves vertically under the driving of the second screw rod 307, the laser interference measuring instrument 316 can move vertically; and finally, when the third sliding block 315 moves longitudinally under the driving of the third screw rod 312, the laser interference measuring instrument 316 can move longitudinally with the third sliding block 315. Therefore, the adjusting mechanism 3 of the embodiment can drive the laser interference measuring instrument 316 to move transversely, longitudinally and vertically, so as to realize comprehensive measurement of the circuit board 407.
[0051] The placing mechanism is arranged in the measuring box 1 and includes a placing plate 4 for bearing the circuit board 407. The placing plate 4 is located below the laser interference measuring instrument 316 and between the X-ray emitter 317 and the X-ray detector 318, and is used for fixing the circuit board 407 to be measured. The utility model combines X-ray transmission imaging technology and laser interference measurement technology. X-rays have strong penetration and can penetrate the multi-layer structure of the circuit board 407. Different materials have different absorption degrees of X-rays. The X-ray intensity distribution penetrating the circuit board 407 is received by the X-ray detector 318, and the contour information of each layer structure inside the circuit board 407 can be obtained through image processing algorithm, so as to calculate the interlayer thickness. Meanwhile, the distance between the upper and lower surfaces of the circuit board 407 is measured by the laser interference measuring instrument 316, and the overall board thickness is obtained.
[0052] Specifically, the one side edge of the placing plate 4 is provided with a limiting plate 406; the movable plate 405 is slidably installed on the placing plate; the sliding direction of the movable plate 405 is perpendicular to the limiting plate 406; the movable plate 405 and the limiting plate 406 are matched with each other to clamp the circuit board 407.
[0053] Further, referring to Figure 5 , the placing plate 4 is provided with a fourth guide rod 402 extending along the sliding direction of the movable plate 405; the placing plate is slidably sleeved on the fourth guide rod; the fourth guide rod is sleeved with a spring 403 between the limiting plate 406 and the movable plate 405.
[0054] It should be noted that the placing plate is provided with two symmetrical sliding grooves 401 extending along the sliding direction of the movable plate 405; the fourth guide rod 402 is arranged in the sliding groove 401, and one fourth guide rod 402 is arranged in each sliding groove 401. The movable plate 405 is provided with a movable block 404 matched with the sliding groove 401; the movable block 404 is slidably embedded in the sliding groove 401 and has a through hole for the fourth guide rod 402 to pass through. The circuit board 407 is placed between the limiting plate 406 and the movable plate 405 to achieve clamping and fixing, and the spring 403 applies a pulling force to the movable plate 405 to move towards the limiting plate 406, thereby stably clamping the circuit board 407. Embodiment
[0055] The difference between the embodiment and the embodiment 1 is that the third lead screw 312 is a bidirectional lead screw, so that when the third lead screw 312 rotates in one direction, the third sliding block 315 matched with the third lead screw 312 can reciprocate, thereby realizing sufficient detection of the circuit board 407.
[0056] In summary, the utility model provides a kind of circuit board thickness and interlayer thickness measuring device, with the following characteristics:
[0057] 1, by X-ray emitter 317 and X-ray detector 318 cooperation, realize the premise of not damaging the surface of circuit board 407, to the internal structure of circuit board 407 Perspective measurement, the penetration ability of X-ray ensures that the distribution of internal interlayer of circuit board 407 can be accurately captured, effectively avoid the scratch risk that contact type measurement can bring.
[0058] 2, second, by setting the adjusting assembly 3 including the lead screw along three directions, laser interferometer 316 is moved in three axial directions by adjusting assembly 3, so that laser beam is accurately focused on the surface of circuit board 407 to measure the thickness, and by adjusting the position of laser interferometer 316, further improve the stability and accuracy of measurement.
[0059] 3、The utility model discloses measuring device in the use process, whether X ray emission and reception or the execution of laser measurement, all complete in the closed measuring box 1, effectively isolate the interference of outside environmental factor, guarantee the reliability of measurement result.
[0060] Finally, it should be noted that: the above examples are only used to illustrate the technical solutions of the present disclosure, but not to limit the scope of protection, although the present disclosure has been described in detail with reference to the above examples, those skilled in the art should understand that: after reading the present disclosure, those skilled in the art can still make various changes, modifications or equivalent replacements to the specific embodiments of the utility model, but these changes, modifications or equivalent replacements are all within the protection scope of the disclosed claims.
Claims
1. A circuit board board thickness and interlayer thickness measuring device, characterized by, The utility model relates to a kind of X-ray measurement device, including: Measuring box; Measuring mechanism is arranged in measuring box, including adjusting assembly and laser interferometer installed on the adjusting assembly, and X-ray emitter and X-ray detector are oppositely arranged and mutually adapted, the adjusting assembly can drive the laser interferometer to move in transverse direction, longitudinal direction and vertical direction; Placement mechanism is used to fix the circuit board to be measured;The placement mechanism is arranged in the measuring box, and is located below the laser interferometer and between X-ray emitter and X-ray detector.
2. The circuit board board thickness and interlayer thickness measuring apparatus according to claim 1, wherein, The adjusting assembly includes: Two fixed plates are oppositely arranged, and first lead screw and first guide rod are arranged between the two fixed plates in transverse direction;The first lead screw is rotatably connected with the fixed plate, and one end is drivingly connected with the output shaft of a first motor; First sliding block is movably sleeved on the first guide rod and is screwed on the first lead screw, and the first lead screw can drive the first sliding block to move in transverse direction when rotating; Mounting plate is fixed to the first sliding block;The mounting plate has a top plate opposite to the first sliding block;Second lead screw and second guide rod are arranged between the top plate and the first sliding block in vertical direction;The second lead screw is rotatably connected with the first sliding block and the top plate, and one end is drivingly connected with the output shaft of a second motor; Second sliding block is movably sleeved on the second guide rod and is screwed on the second lead screw; Mounting frame is fixed to one side of the second sliding block;Third lead screw and third guide rod are arranged in longitudinal direction in the mounting frame;The third lead screw is rotatably connected with the mounting frame, and one end is drivingly connected with a third motor; Third sliding block is movably sleeved on the third guide rod and is screwed on the third lead screw;The bottom of the third sliding block is provided with the laser interferometer.
3. The circuit board board thickness and interlayer thickness measuring apparatus according to claim 1, wherein The placement mechanism includes: Placement plate, one side edge of which is provided with a limiting plate; Movable plate is used to clamp circuit board in cooperation with the limiting plate;The movable plate is slidably mounted on the placement plate.
4. The circuit board board thickness and interlayer thickness measuring apparatus according to claim 3, wherein The placement plate is provided with fourth guide rod extending in the sliding direction of the movable plate; The placement plate is slidably sleeved on the fourth guide rod; Spring is sleeved on the fourth guide rod between the limiting plate and the movable plate.
5. The board thickness and interlayer thickness measuring apparatus according to claim 4, wherein The placement plate is provided with sliding groove extending in the sliding direction of the movable plate, and the guide rod is arranged in the sliding groove.
6. The circuit board board thickness and interlayer thickness measurement device according to claim 5, wherein, The movable plate is provided with movable block matched with the sliding groove;The movable block is slidably embedded in the sliding groove, and has through hole for the fourth guide rod to pass through.
7. The circuit board board thickness and interlayer thickness measuring apparatus according to claim 5, wherein The placement plate is provided with two symmetrical sliding grooves;Each sliding groove is provided with a fourth guide rod; The movable plate is movably connected with two fourth guide rods.
8. The board thickness and interlayer thickness measuring apparatus according to claim 2, wherein The third lead screw is bidirectional lead screw.
9. The board thickness and interlayer thickness measuring apparatus according to claim 1, wherein One side of the measuring box is provided with a movable door.
10. The board thickness and interlayer thickness measuring apparatus according to claim 1, wherein The movable door is provided with handle.