Test equipment and test system

Abstract

The utility model relates to test equipment and a test system. The test equipment comprises a test mechanism and a power conversion mechanism, the test mechanism is used for testing a semiconductor device, the power conversion mechanism comprises a mounting rack mounted on the test mechanism and a conversion circuit board mounted on the mounting rack, and the conversion circuit board is electrically connected with the test mechanism; and the conversion circuit board is used for reducing the voltage output by the voltage transformation equipment and transmitting the reduced voltage to the test mechanism. Therefore, the voltage provided by the power supply is reduced twice through the transformation device and the conversion circuit board in sequence, so that the voltage transmitted to the testing mechanism meets the requirement. As the conversion circuit board is integrally arranged on the testing mechanism, the voltage transformation amplitude of the voltage transformation equipment is reduced, heat generated by the voltage transformation equipment in the voltage transformation process is reduced, a cable high-temperature accident cannot occur even if a cable with a small diameter is adopted in the voltage transformation equipment, and the weight and the size of the voltage transformation equipment are reduced.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor equipment, in particular to a test equipment and a test system. BACKGROUND

[0002] With the continuous development of the chip industry, integrated circuit technology is also increasingly mature, and the automation degree of large electronic equipment is higher and higher, so it is necessary to configure functional modules containing a large number of PCB cards, such as chip test equipment. Each functional module needs 24V or 12V power supply, so it is necessary to use a voltage conversion device to convert 380V or 240V voltage into 24V and 12V voltage, and the voltage conversion range is large, so a large amount of heat will be generated during voltage conversion. In order to avoid cable high temperature accidents, the cable inside the voltage conversion device needs to use a large diameter cable, which greatly increases the weight and volume of the voltage conversion device. CONTENT OF THE UTILITY MODEL

[0003] Therefore, it is necessary to provide a test equipment and a test system which can reduce the diameter of the cable required by the voltage conversion device, thereby reducing the weight and volume of the voltage conversion device.

[0004] A test equipment, comprising a test mechanism and a power conversion mechanism, the test mechanism is used for testing semiconductor devices, the power conversion mechanism comprises a mounting rack mounted on the test mechanism and a conversion circuit board mounted on the mounting rack, and the conversion circuit board is electrically connected with the test mechanism.

[0005] The conversion circuit board is used for step-down voltage output by a voltage conversion device and delivers the step-down voltage to the test mechanism.

[0006] In some embodiments, the test mechanism comprises a support frame and a plurality of test board cards mounted on the support frame, each test board card is used for testing semiconductor devices.

[0007] The conversion circuit board is provided in a plurality, and each conversion circuit board is electrically connected with a corresponding test board card.

[0008] In some embodiments, the power conversion mechanism further comprises a busbar element electrically connected with each conversion circuit board, and the busbar element is used for electrical connection with the voltage conversion device.

[0009] In some embodiments, the power conversion mechanism further comprises a liquid cooling plate provided on the mounting rack, and the conversion circuit board is located on one side surface of the liquid cooling plate, so that the liquid cooling plate cools the conversion circuit board.

[0010] In some embodiments, the liquid cooling plate has a protrusion on a side surface of the converter circuit board;

[0011] The converter circuit board comprises a plate body and functional devices arranged on a side of the plate body facing the liquid cooling plate, and the protrusion and the functional devices are in contact with each other.

[0012] In some embodiments, a heat-conducting material is arranged between the protrusion and the functional devices.

[0013] In some embodiments, the functional devices comprise a power supply brick and a capacitor.

[0014] In some embodiments, the plate body is fixedly connected to the mounting frame at both longitudinal ends, and a fixing column is arranged on a side of the liquid cooling plate facing the plate body, and the plate body is fixedly connected to the fixing column.

[0015] In some embodiments, a support block is arranged on a side of the liquid cooling plate facing the plate body, and the support block supports the plate body.

[0016] A test system comprises the test device and the voltage conversion device as described in any one of the above embodiments, and the test device is electrically connected to the voltage conversion device through the converter circuit board therein.

[0017] The test device and the test system described above, the voltage provided by the power supply is reduced twice by the voltage conversion device and the converter circuit board, so that the voltage delivered to the test mechanism meets the demand. Since the converter circuit board is integrated on the test mechanism, the voltage conversion range of the voltage conversion device is reduced, the heat generated by the voltage conversion device during voltage conversion is reduced, and even if the diameter of the cable used to connect the voltage conversion device inside or between the test device is small, the cable high-temperature accident will not occur, and at the same time, it is beneficial to reduce the weight and volume of the voltage conversion device. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 FIG. 1 is a structural schematic diagram of a test device according to an embodiment of the present application;

[0019] Figure 2 FIG. 2 is a structural schematic diagram of a power supply conversion mechanism of the test device shown in FIG. 1; Figure 1 FIG. 3 is a structural schematic diagram of a liquid cooling plate of the power supply conversion mechanism shown in FIG. 2;

[0020] Figure 3 FIG. 4 is a structural schematic diagram of a converter circuit board of the power supply conversion mechanism shown in FIG. 2. Figure 2 FIG. 5 is a structural schematic diagram of a test device according to another embodiment of the present application;

[0021] Figure 4 FIG. 6 is a structural schematic diagram of a power supply conversion mechanism of the test device shown in FIG. 5; Figure 2 FIG. 7 is a structural schematic diagram of a converter circuit board of the power supply conversion mechanism shown in FIG. 6. DETAILED DESCRIPTION

[0022] In order to make the above objectives, features and advantages of the present application more clear and easily understood, the detailed description of the specific embodiments of the present application is made below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. However, the present application can be practiced in a number of different ways without the specific details described herein, and it is understood that similar improvements and modifications can be made without departing from the spirit and scope of the present application, therefore the present application is not limited to the specific embodiments disclosed below.

[0023] In the description of the present application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the purpose of facilitating the description of the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation of the present application.

[0024] In addition, the terms "first", "second" are only for descriptive purpose, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined with "first", "second" can explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "a plurality of" is at least two, for example, two, three, etc., unless otherwise explicitly specified and limited.

[0025] In the present application, unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connecting", "fixing" and the like should be understood in a broad sense, for example, can be fixedly connected, or can be detachably connected, or can be integrated; can be mechanically connected, or can be electrically connected; can be directly connected, or can be indirectly connected through an intermediate medium; can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise explicitly limited. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0026] In the present application, unless specifically stated and limited otherwise, a first feature "on" or "under" a second feature can be directly in contact with the second feature, or indirectly in contact with the second feature through an intermediate medium. Moreover, the first feature "over", "above" and "on top of" the second feature can be directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature "under", "below" and "underneath" the second feature can be directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0027] It should be noted that when an element is referred to as being "fixed to" or "set to" another element, it can be directly on the other element or there can be an intermediate element. When an element is considered to be "connected" to another element, it can be directly connected to the other element or there can be an intermediate element. The terms "vertical", "horizontal", "up", "down", "left", "right" and similar expressions used herein are for illustrative purposes only and are not intended to be the only implementation.

[0028] Referring to Figure 1 and Figure 2 , the present application provides a test system, which comprises a voltage transformation device and a test device 100. The voltage transformation device is connected to a power supply and is used to perform first voltage reduction on the voltage provided by the power supply. The test device 100 comprises a test mechanism 10 and a power conversion mechanism 20. The power conversion mechanism 20 comprises a mounting frame 21 and a conversion circuit board 23, the mounting frame 21 is fixedly installed on the test mechanism 10, the conversion circuit board 23 is fixedly installed on the mounting frame 21, and the conversion circuit board 23 is electrically connected to the test mechanism 10. The voltage transformation device is electrically connected to the conversion circuit board 23 through a wire, so that the voltage transformation device delivers the voltage after the first voltage reduction to the conversion circuit board 23. The conversion circuit board 23 is used to perform second voltage reduction on the voltage delivered by the voltage transformation device, and deliver the voltage after the second voltage reduction to the test mechanism 10. The test mechanism 10 is driven by the voltage delivered by the conversion circuit board 23 to test a semiconductor device.

[0029] In some embodiments of the present application, the high voltage provided by the high-voltage power supply is reduced twice by the voltage transformation device and the conversion circuit board 23 in sequence, so that the voltage delivered to the test mechanism 10 meets the requirements. Since the conversion circuit board 23 is integrated on the test mechanism 10, the voltage transformation range of the voltage transformation device is reduced, the heat generated by the voltage transformation device during voltage transformation is reduced, and even if the diameter of the cable used to connect the inside of the voltage transformation device and the test device is small, the high-temperature accident of the cable will not occur, which is beneficial to reduce the weight and volume of the voltage transformation device.

[0030] It should be noted that the voltage provided by the power supply is a first voltage value, the voltage provided by the power supply is stepped down to a second voltage value by the voltage conversion device, and the voltage provided by the voltage conversion device is stepped down to a third voltage value by the conversion circuit board 23. The first voltage value (referred to as high voltage) is greater than the second voltage value (referred to as medium voltage), and the second voltage value is greater than the third voltage value (referred to as low voltage). Alternatively, the first voltage value can be 380V or 240V, the second voltage value can be 48V, and the third voltage value can be 24V or 12V. Of course, in other embodiments, the first voltage value, the second voltage value, and the third voltage value can also be other values, which are not particularly limited herein.

[0031] In some other embodiments of the present application, the test device 100 can be directly electrically connected to the medium voltage power supply through the conversion circuit board 23, and the voltage provided by the conversion circuit board 23 is stepped down to a low voltage for use by the test mechanism 10. In this way, the connection cable between the test device 100 and the medium voltage power supply can be reduced to avoid high temperature accidents.

[0032] The test device 100 of the present application will be described in detail below.

[0033] In the embodiments of the present application, the test mechanism 10 includes a support frame (not shown in the figure) and a plurality of test board cards (not shown in the figure) mounted on the support frame. Each test board card is used to test a semiconductor device. The conversion circuit board 23 is provided in a plurality, and each conversion circuit board 23 is electrically connected to a corresponding test board card, so that each conversion circuit board 23 provides the required voltage to the corresponding test board card, ensuring that each test board card can obtain the required voltage and can test a semiconductor device respectively.

[0034] It should be noted that the number of power conversion mechanisms 20 can be one, of course, it can also be two or more. When the power conversion mechanism 20 is provided as one, the number of conversion circuit boards 23 of the power conversion mechanism 20 is equal to the number of test board cards of the test mechanism 10, and they are electrically connected to each other one by one, to ensure that all test board cards are provided with the required voltage. When the power conversion mechanism 20 is provided as two or more, the sum of the conversion circuit boards 23 of all power conversion mechanisms 20 is equal to the number of test board cards of the test mechanism 10, and the conversion circuit boards 23 of all power conversion mechanisms 20 are electrically connected to each test board card of the test mechanism 10 one by one, to ensure that all test board cards are provided with the required voltage.

[0035] Specifically Figure 1In the embodiment shown, the test device 100 includes two power conversion mechanisms 20, each of which includes 8 conversion circuit boards 23, so that the two power conversion mechanisms 20 include 16 conversion circuit boards 23 in total. The test mechanism 10 includes 16 test board cards, which are electrically connected to the 16 conversion circuit boards 23 of the two power conversion mechanisms 20 one by one.

[0036] It should also be noted that the semiconductor devices can be chips, and the test board cards are used to perform electrical performance tests on the chips. Of course, in other embodiments, the semiconductor devices can also be other elements, and the test board cards can also perform other types of tests (such as burn-in tests) on the semiconductor devices, which are not particularly limited herein.

[0037] In the embodiment, the power conversion mechanism 20 further includes a busbar element 27 mounted on the mounting frame 21. The busbar element 27 is electrically connected to each conversion circuit board 23 and connected to the voltage output terminal of the voltage conversion device through a wire, so as to transmit the voltage output by the voltage conversion device to each conversion circuit board 23. In this way, the provision of the busbar element 27 avoids the need to separately connect wires from each conversion circuit board 23 to the voltage conversion device, thereby simplifying the wiring structure. Alternatively, the busbar element 27 can be a copper bar. Of course, in other embodiments, the busbar element 27 can also be made of other conductive materials, as long as it can transmit the voltage output by the voltage conversion device to each conversion circuit board 23, which is not particularly limited herein.

[0038] It can be understood that the power conversion mechanism 20 includes two busbar elements 27, which are used as positive busbar elements and negative busbar elements, respectively. The positive busbar element is electrically connected to the positive terminal on the conversion circuit board 23 and connected to the positive terminal of the voltage conversion device through a wire. The negative busbar element is electrically connected to the negative terminal on the conversion circuit board 23 and connected to the negative terminal of the voltage conversion device through a wire.

[0039] Please refer to Figures 2 to 4 In the embodiment of the present application, the power conversion mechanism 20 further includes a liquid cooling plate 25 arranged on the mounting frame 21. The conversion circuit board 23 is located on one side surface of the liquid cooling plate 25, so that the liquid cooling plate 25 cools the conversion circuit board 23. In this way, since the conversion circuit board 23 generates heat during operation, the liquid cooling plate 25 is used to cool the conversion circuit board 23 to avoid excessive temperature of the conversion circuit board 23. Compared with air cooling, the liquid cooling plate 25 is used to cool the conversion circuit board 23 in the embodiment, and the cooling effect is better.

[0040] Further, the liquid cooling plate 25 has an inlet, a cooling liquid flow channel and an outlet, the inlet and the outlet are communicated with the cooling liquid flow channel. The inlet is used for the external cooling liquid to enter the cooling liquid flow channel, the cooling liquid in the cooling liquid flow channel carries away the heat generated by the conversion circuit board 23, and then is output to the outside of the liquid cooling plate 25 through the outlet, so as to realize the cooling of the conversion circuit board 23. It should be noted that the inlet is communicated with the external cooling liquid source through a pipeline, and the outlet is also communicated with the external cooling liquid source through a pipeline, so as to form a cooling liquid circulation loop. That is to say, the cooling liquid provided by the cooling liquid source enters the cooling liquid flow channel through the inlet, and the cooling liquid in the cooling liquid flow channel flows out through the outlet and returns to the cooling liquid source again.

[0041] Further, the liquid cooling plate 25 has a boss 251 on the side surface facing the conversion circuit board 23. The conversion circuit board 23 includes a plate body 231 and a functional device 232 arranged on the side of the plate body 231 facing the liquid cooling plate 25. The boss 251 on the liquid cooling plate 25 is in contact with the functional device 232 on the plate body 231. In this way, the main source of heat of the conversion circuit board 23 during work is the functional device 232, so that the boss 251 on the liquid cooling plate 25 is directly in contact with the functional device 232, so that the heat generated by the functional device 232 can be directly transmitted to the liquid cooling plate 25 and carried away by the cooling liquid in the liquid cooling plate 25, greatly improving the cooling effect of the functional device 232 on the plate body 231 and avoiding overheating of the functional device 232 on the plate body 231. Alternatively, the functional device 232 includes a power brick 233 and a capacitor 235. Of course, in other embodiments, the functional device 232 can also include other components, which are not specially limited here.

[0042] Further, a heat-conducting material is arranged between the boss 251 and the functional device 232, which is beneficial to improve the heat exchange efficiency between the boss 251 and the functional device 232 and further improve the cooling effect of the functional device 232.

[0043] It should be noted that since the conversion circuit board 23 is arranged in multiple, the side surface of the liquid cooling plate 25 facing the conversion circuit board 23 has multiple bosses 251, and the functional device 232 on each conversion circuit board 23 is in contact with the corresponding boss 251, so that the functional device 232 on each conversion circuit board 23 is cooled.

[0044] Specific to the embodiment, the longitudinal two ends of the conversion circuit board 23 are fixedly connected with the mounting frame 21. Alternatively, the longitudinal two ends of the conversion circuit board 23 are fixedly connected on the mounting frame 21 by screws. The liquid cooling plate 25 is provided with a fixed column 253 on the side facing the plate body 231, and the plate body 231 is fixedly connected with the fixed column 253. On the one hand, the fixed column 253 is used to realize the fixed connection between the plate body 231 and the liquid cooling plate 25, and on the other hand, the fixed column 253 is used to support the plate body 231, thereby reducing the risk of bending deformation or even fracture of the plate body 231 under external force. Further, a plurality of fixed columns 253 are arranged between the plate body 231 of each conversion circuit board 23 and the liquid cooling plate 25, so that each region of the plate body 231 of the conversion circuit board 23 is supported and fixed by the fixed column 253.

[0045] Specific to the embodiment, the liquid cooling plate 25 is provided with a support block 255 on the side facing the plate body 231, which supports the plate body 231 and further reduces the risk of bending deformation or even fracture of the plate body 231 of the conversion circuit board 23 under external force. Further, a plurality of support blocks 255 are arranged between the plate body 231 of each conversion circuit board 23 and the liquid cooling plate 25, so that each region of the plate body 231 of the conversion circuit board 23 is supported.

[0046] It should be noted that the number and arrangement position of the fixed column 253 and the support block 255 are related to the arrangement position of each functional device 232 on the plate body 231, and the fixed column 253 and the support block 255 need to avoid the functional device 232 on the plate body 231.

[0047] The technical features of the above-described embodiments can be combined arbitrarily. In order to make the description simple, not all possible combinations of the technical features in the above-described embodiments are described, however, as long as the combinations of the technical features do not exist contradictory, they should be considered as the scope of the present application.

[0048] The above-described embodiments only express several implementation manners of the present application, and the description is more specific and detailed, but it should not be understood as a limitation on the patent scope of the application. It should be noted that for ordinary skilled in the art, without departing from the concept of the present application, a number of modifications and improvements can be made, which are within the scope of the present application. Therefore, the patent protection scope of the present application should be subject to the appended claims.

Claims

1. A test apparatus, characterized by, The test device (100) comprises a test mechanism (10) for testing semiconductor devices and a power conversion mechanism (20) comprising a mounting rack (21) mounted on the test mechanism (10) and a conversion circuit board (23) mounted on the mounting rack (21) and electrically connected with the test mechanism (10). The conversion circuit board (23) is configured to step down the voltage output by the voltage conversion device and deliver the stepped-down voltage to the test mechanism (10).

2. The test apparatus of claim 1, wherein, The test mechanism (10) comprises a support rack and a plurality of test board cards mounted on the support rack, each of which is configured to test semiconductor devices. The conversion circuit board (23) is provided in a plurality of forms, each of which is electrically connected with a corresponding test board card.

3. The test apparatus of claim 2, wherein, The power conversion mechanism (20) further comprises a busbar element (27) electrically connected with each conversion circuit board (23), which is configured to be electrically connected with the voltage conversion device.

4. The test apparatus of claim 1, wherein, The power conversion mechanism (20) further comprises a liquid cooling plate (25) provided on the mounting rack (21), and the conversion circuit board (23) is located on one side surface of the liquid cooling plate (25) to be cooled by the liquid cooling plate (25).

5. The test apparatus of claim 4, wherein, The liquid cooling plate (25) has a boss (251) on one side surface facing the conversion circuit board (23). The conversion circuit board (23) comprises a board body (231) and a functional device (232) provided on one side of the board body (231) facing the liquid cooling plate (25), and the boss (251) and the functional device (232) are in contact with each other.

6. The test apparatus of claim 5, wherein, Thermal conductive material is provided between the boss (251) and the functional device (232).

7. The test apparatus of claim 5, wherein, The functional device (232) comprises a power supply brick (233) and a capacitor (235).

8. The test apparatus of claim 5, wherein, The board body (231) is fixedly connected with the mounting rack (21) at both longitudinal ends, and the liquid cooling plate (25) is provided with a fixing column (253) on one side facing the board body (231), and the board body (231) is fixedly connected with the fixing column (253).

9. The test apparatus of claim 8, wherein, The liquid cooling plate (25) is provided with a support block (255) on one side facing the board body (231), and the support block (255) supports the board body (231).

10. A test system, characterized by The test device (100) is electrically connected with the voltage conversion device through the conversion circuit board (23) therein.

Images