Temperature-controllable test board card and test machine
By setting a temperature regulation component between the test chip and the liquid cooling plate, and using sensors and controllers to achieve active temperature control, the problem of signal stability being affected by temperature changes of the test chip is solved, temperature stability and output performance are improved, and the liquid cooling system is simplified.
Patent Information
- Application Number
- CN202423078241.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-12
- Publication Date
- 2025-12-16
- Estimated Expiration
- 2034-12-12
AI Technical Summary
In existing technologies, temperature changes in the test chip affect the stability of its output test signal, and the passive temperature control method of liquid cooling plate has limited temperature control performance.
A temperature regulation component is set between the test chip and the liquid cooling plate. The chip temperature is detected by a temperature sensor, and the temperature regulation plate (such as a thin-film heating plate or a TEC cooling plate) is controlled by a controller to achieve active temperature control, and the temperature is stabilized in conjunction with the liquid cooling plate.
It improves the temperature stability of the test chip, reduces temperature drift, enhances the output performance of the test board, and simplifies the complexity of the liquid cooling system.
Smart Images
Figure CN223679300U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the field of chip testing, and particularly to a temperature-controllable test board card and test machine. BACKGROUND
[0002] Chip testing refers to detecting various parameter indexes of a chip to be tested by using a test machine to control a test head of a test board card to output test signals, and removing defective products to control the quality of the chip. The test board card comprises a test chip for outputting test signals. Temperature change of the test chip will affect the stability of the test signals output by the test chip.
[0003] In the prior art, a liquid cooling plate is usually used to dissipate heat of the test chip, thereby realizing temperature control of the test chip. However, the temperature control performance of this passive temperature control method is limited. CONTENT OF THE UTILITY MODEL
[0004] Therefore, it is necessary to provide a temperature-controllable test board card and test machine in view of the above technical problems.
[0005] In a first aspect, the utility model provides a temperature-controllable test board card, comprising a PCB board, at least one test chip provided on the surface of the PCB board, and a controller, wherein the upper surfaces of the test chips are sequentially stacked with a temperature adjusting assembly and a liquid cooling plate.
[0006] The temperature adjusting assembly comprises a temperature adjusting sheet and a temperature sensor provided in the temperature adjusting sheet, wherein the temperature sensor detects the temperature of the test chip by detecting the temperature of the temperature adjusting sheet.
[0007] The controller is electrically connected with the temperature adjusting assembly, and is configured to control the temperature adjusting sheet according to the temperature of the test chip detected by the temperature sensor, so as to control the temperature stability of the test chip.
[0008] In some embodiments, the temperature adjusting sheet comprises a thin film heating sheet.
[0009] The controller controls the heating power of the thin film heating sheet according to the temperature of the test chip detected by the temperature sensor, so as to control the temperature stability of the test chip.
[0010] In some embodiments, the temperature adjusting sheet comprises a TEC cooling sheet.
[0011] The controller controls the refrigeration power of the TEC cooling sheet according to the temperature of the test chip detected by the temperature sensor, so as to control the temperature stability of the test chip.
[0012] In some embodiments, the liquid cooling plate is provided with a fin flow channel.
[0013] In some embodiments, further comprising: a first thermal conductive layer and a second thermal conductive layer;
[0014] The first thermal conductive layer is arranged between the test chip and the temperature adjusting component;
[0015] The second thermal conductive layer is arranged between the temperature adjusting component and the liquid cooling plate.
[0016] In some embodiments, the first thermal conductive layer and the second thermal conductive layer are both thermal interface materials.
[0017] In some embodiments, further comprising: a connector;
[0018] The connector is arranged on the PCB and electrically connected to the temperature adjusting component through a cable.
[0019] In some embodiments, the controller is an FPGA controller.
[0020] In a second aspect, an embodiment of the utility model provides a test machine, comprising the test board card of the first aspect.
[0021] Compared with the prior art, the test board card and the test machine, by arranging a temperature adjusting component between the test chip and the liquid cooling plate, using a temperature sensor to detect the temperature of the test chip by detecting the temperature of the temperature adjusting sheet, and using a controller to control the temperature adjusting sheet according to the temperature of the test chip detected by the temperature sensor, the temperature of the test chip is controlled to be stable. The active temperature control of the liquid cooling plate coupled with the temperature adjusting component can improve the temperature stability of the test chip, reduce the temperature drift of the test chip in actual work, and further improve the output performance of the test board card. On the other hand, the complexity of the flow channel in the liquid cooling plate and the whole machine liquid cooling system can be reduced. BRIEF DESCRIPTION OF DRAWINGS
[0022] Figure 1 It is a structure schematic view of the temperature-controllable test board card in the first embodiment of the utility model;
[0023] Figure 2 It is a three-dimensional structure schematic view of the temperature-controllable test board card in the first embodiment of the utility model;
[0024] Figure 3 It is a structure schematic view of the temperature-controllable test board card in the second embodiment of the utility model.
[0025] In the drawings, 1 is a PCB, 2 is a test chip, 3 is a controller, 4 is a liquid cooling plate, 5 is a fin flow channel, 6 is a second thermal conductive layer, 7 is a first thermal conductive layer, 8 is a temperature adjusting sheet, 9 is a temperature sensor, 10 is a cable, and 11 is a connector. DETAILED DESCRIPTION
[0026] In order to make the purposes, technical solutions and advantages of the present application clearer, the present application will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and should not be used to limit the present application.
[0027] Obviously, the accompanying drawings in the following description are only some examples or embodiments of the present application, and for those skilled in the art, the present application can also be applied to other similar scenarios without paying creative labor on the basis of the drawings. In addition, it can also be understood that although the efforts made in this development process can be complex and lengthy, for those skilled in the art related to the content disclosed in the present application, some designs, manufacturing or production changes on the basis of the technical content disclosed in the present application are only routine technical means, and should not be understood as insufficient disclosure of the present application.
[0028] In the present application, the phrase "embodiments" means that the specific features, structures or characteristics described in conjunction with the embodiments can be included in multiple embodiments of the present application. The appearance of this phrase at various places in the specification does not necessarily mean that it refers to the same embodiments, nor is it independent or alternative embodiments to other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described in the present application can be combined with other embodiments without conflict.
[0029] Unless otherwise defined, technical terms and scientific terms used in the present application shall have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains. The terms "a", "an", "one", "this", and similar referents in the context of describing the application are to be construed to be inclusive, not exclusive. For example, the use of the term "comprises" or "comprising" or "includes" or "including" or "has" or "having" or "contains" or "containing" or "consists" or "consisting" or "consists of" or "consisting of" to describe certain steps or modules (units) of the processes, methods, systems, products, or devices described herein, is not intended to preclude the presence of additional steps or modules (units) or additional steps or modules (units) inherent to the processes, methods, products, or devices. The terms "connected", "coupled", and "coupling" are not limited to direct or physical connections, but can include electrical connections, whether direct or indirect. The term "plurality" means two or more. The term "and / or" describes association between name objects, and means that there are three possible circumstances: one alone, both, or neither. The character " / " is generally used to represent an "or" relationship between the associated objects. The terms "first", "second", "third", and the like are merely used to distinguish similar objects, and do not represent a specific order.
[0030] As shown in Figures 1-2 The first embodiment of the present application provides a temperature-controllable test board card, which comprises a PCB board 1, at least one test chip 2 provided on the surface of the PCB board 1, and a controller 3. The upper surfaces of the test chips 2 are sequentially stacked with temperature adjusting components and liquid cooling plates 4.
[0031] The test board card can be a digital board card, a mixed signal board card, or a radio frequency board card, etc. having a temperature control requirement of test chips 2 with high power consumption or high heat consumption difference. In some embodiments, the present application takes a digital board card as an example, and the rest of the types of board cards are not described again.
[0032] The test chip 2 is, for example, a PE chip, which is the core device of the digital board card. The PE chip has heat consumption difference in different working states, and the signal output of the PE chip is very sensitive to temperature. It should be noted that the test chip 2 in the present embodiment can also be other types of chips.
[0033] The liquid cooling plate 4 can dissipate heat for all devices on the PCB board 1.
[0034] The temperature adjusting component comprises a temperature adjusting sheet 8 and a temperature sensor 9 provided in the temperature adjusting sheet 8. The temperature sensor 9 detects the temperature of the test chip 2 by detecting the temperature of the temperature adjusting sheet 8.
[0035] The controller 3 is electrically connected with the temperature adjusting assembly, and is configured to control the temperature adjusting sheet 8 according to the temperature of the test chip 2 detected by the temperature sensor 9, so as to control the temperature stability of the test chip 2.
[0036] The controller 3 is, for example, an FPGA controller 3. The FPGA controller 3 includes all logic controls of a digital board card, including the above-mentioned active temperature control logic of the test chip 2.
[0037] In the embodiment, the temperature adjusting assembly is arranged between the test chip 2 and the liquid cooling plate 4, the temperature of the test chip 2 is detected by the temperature sensor 9 through detecting the temperature of the temperature adjusting sheet 8, and the controller 3 controls the temperature adjusting sheet 8 according to the temperature of the test chip 2 detected by the temperature sensor 9, so as to control the temperature stability of the test chip 2. The active temperature control of the liquid cooling plate 4 coupled with the temperature adjusting assembly can improve the temperature stability of the test chip 2, reduce the temperature drift of the test chip 2 in actual work, and further improve the output performance of the digital board card, and on the other hand, can reduce the complexity of the flow channel in the liquid cooling plate 4 and the whole machine liquid cooling system.
[0038] The test board card usually includes a plurality of test chips 2, and each test chip 2 has a corresponding temperature adjusting assembly and a liquid cooling plate 4, so as to realize independent active temperature control of each test chip 2.
[0039] In some embodiments, the test board card further includes a connector 11 arranged on the PCB board 1 and electrically connected with the temperature adjusting assembly through a cable 10. The temperature of the test chip 2 detected by the temperature sensor 9 is transmitted to the controller 3 on the PCB board 1 through the connector 11, and the control signal output by the controller 3 is transmitted to the temperature adjusting assembly through the connector 11. Meanwhile, the PCB board 1 can also supply power to the temperature adjusting assembly through the connector 11.
[0040] In some embodiments, the position corresponding to the test chip in the liquid cooling plate 4 is provided with a higher-density fin flow channel 5, so as to improve the heat exchange performance between the liquid cooling plate 4 and the test chip 2.
[0041] In some embodiments, the temperature adjusting sheet 8 includes a thin-film heating sheet. The controller 3 controls the heating power of the thin-film heating sheet according to the temperature of the test chip 2 detected by the temperature sensor 9, so as to control the temperature stability of the test chip 2.
[0042] Specifically, when the heat consumption of the test chip 2 changes, the temperature sensor 9 transmits the collected temperature signal to the controller 3 of the PCB board 1. After the controller 3 analyzes the signal into temperature, it is determined whether the temperature is greater than the threshold value. If it is greater than the threshold value, the power duty cycle of the thin film heating sheet is calculated to be reduced by the PID algorithm. The thin film heating sheet changes the heat consumption to suppress the surface temperature change of the test chip 2. If it is less than the threshold value, the power duty cycle of the thin film heating sheet is calculated to be increased by the PID algorithm. The stability of the surface temperature of the test chip 2 is ensured by multiple temperature control, and the relative stability of the temperature of the test chip 2 is further controlled.
[0043] In some embodiments, the temperature regulating sheet 8 includes a TEC cooling sheet. The controller 3 controls the cooling power of the TEC cooling sheet according to the temperature of the test chip 2 detected by the temperature sensor 9, to control the temperature stability of the test chip 2.
[0044] The temperature control logic thereof is basically the same as that of the above-mentioned embodiments, that is, the output of the TEC cooling sheet is controlled by detecting the temperature of the test chip 2, so as to control the relative stability of the temperature of the test chip 2.
[0045] As shown in Figure 3 The second embodiment of the present application proposes a temperature-controllable test board card, which is different from the first embodiment in that the test board card further includes a first heat-conducting layer 7 and a second heat-conducting layer 6. The first heat-conducting layer 7 is arranged between the test chip 2 and the temperature regulating assembly; and the second heat-conducting layer 6 is arranged between the temperature regulating assembly and the liquid cooling plate 4.
[0046] By arranging the first heat-conducting layer 7 and the second heat-conducting layer 6, the contact thermal resistance between the test chip 2 and the temperature regulating assembly, and the contact thermal resistance between the temperature regulating assembly and the liquid cooling plate 4 can be reduced, so as to reduce the temperature fluctuation of the test chip 2.
[0047] The first heat-conducting layer 7 and the second heat-conducting layer 6, for example, both adopt a thermal interface material with high thermal conductivity.
[0048] There are very fine concave-convex gaps between the surface of the test chip 2 and the temperature regulating assembly and the liquid cooling plate 4. If they are directly installed together, there is an air gap between them, which causes the contact thermal resistance to be very large, seriously hindering the conduction of heat. The thermal interface material with high thermal conductivity is used to fill these gaps and exclude the air therein, so as to establish an effective heat conduction channel, which can greatly reduce the contact thermal resistance and make the liquid cooling plate 4 and the temperature regulating assembly fully function.
[0049] The third embodiment of the present application further proposes a test machine, which includes the test board card in the above-mentioned embodiments.
[0050] Since the test machine comprises the test board card in the above embodiment, the same technical problems can be solved, and the same technical effects can be achieved, and details are not described herein.
[0051] The technical features of the above embodiments can be combined in any manner. In order to make the description simple, all possible combinations of the technical features in the above embodiments are not described, however, as long as the combinations of the technical features do not exist contradictions, it should be considered that the combinations are within the scope of the present disclosure.
[0052] The above embodiments only express several implementation manners of the present application, and the description is relatively specific and detailed, but it should not be understood as a limitation on the scope of the utility model patent. It should be pointed out that for ordinary skilled in the art, without departing from the concept of the present application, a number of modifications and improvements can be made, which are all within the protection scope of the present application. Therefore, the protection scope of the patent of the present application should be subject to the appended claims.
Claims
1. A temperature controllable test board card, characterized by, The test board card comprises a PCB board, at least one test chip provided on a surface of the PCB board, and a controller, wherein upper surfaces of the test chips are sequentially stacked with a temperature adjusting assembly and a liquid cooling plate; The temperature adjusting assembly comprises a temperature adjusting sheet and a temperature sensor provided in the temperature adjusting sheet, wherein the temperature sensor detects the temperature of the test chip by detecting the temperature of the temperature adjusting sheet; The controller is electrically connected with the temperature adjusting assembly, and is configured to control the temperature adjusting sheet according to the temperature of the test chip detected by the temperature sensor, so as to control the temperature of the test chip to be stable.
2. The temperature-controlled test board card of claim 1, wherein, The temperature adjusting sheet comprises a thin film heating sheet. The controller controls the heating power of the thin film heating sheet according to the temperature of the test chip detected by the temperature sensor, so as to control the temperature of the test chip to be stable.
3. The temperature-controlled test board card of claim 1, wherein, The temperature adjusting sheet comprises a TEC cooling sheet. The controller controls the cooling power of the TEC cooling sheet according to the temperature of the test chip detected by the temperature sensor, so as to control the temperature of the test chip to be stable.
4. The temperature-controlled test board card of claim 1, wherein, The liquid cooling plate is provided with a fin flow channel corresponding to the position of the test chip.
5. The temperature-controlled test board card of claim 1, wherein, Further comprising: a first heat conduction layer and a second heat conduction layer; the first heat conduction layer is arranged between the test chip and the temperature adjusting assembly; the second heat conduction layer is arranged between the temperature adjusting assembly and the liquid cooling plate.
6. The temperature-controlled test board card of claim 5, wherein, Both the first heat conduction layer and the second heat conduction layer adopt a thermal interface material.
7. The temperature-controlled test board card of claim 1, wherein, Further comprising: a connector; the connector is arranged on the PCB board and is electrically connected with the temperature adjusting assembly through a cable.
8. The temperature-controlled test board card of claim 1, wherein, The controller is an FPGA controller.
9. The temperature-controlled test board card of claim 1, wherein, The test board card is a digital board card.
10. A testing machine characterized by, The test board card comprises any one of the test board cards according to claims 1 to 9.