Distributed temperature control operation server

Abstract

The utility model provides a distributed temperature control operation server, which comprises a case, a plurality of module daughter cards and a controller, the rear ends of the plurality of module daughter cards are outwards inserted into the case, each module daughter card comprises a shell, a daughter card circuit board, a fan cover, a fan, an air duct, a fan driving chip and a temperature sensor, and the daughter card circuit board, the fan cover, the fan, the air duct, the fan driving chip and the temperature sensor are arranged in the shell. The independent fan, the fan driving chip and the temperature sensor are arranged on each module daughter card, the controller can adjust the rotating speed of the corresponding fan according to the temperature of each module daughter card, distributed temperature control is achieved, and compared with the prior art, noise is greatly reduced, and energy consumption is also saved.

Description

TECHNICAL FIELD

[0001] The utility model belongs to operation server technical field, especially related to a distributed temperature control's operation server. BACKGROUND

[0002] With the higher and higher chip technology, the integration is also high, thereby, the chassis of operation server often inserts various different module subcards, a plurality of chips are integrated on each module subcard, therefore, the power of each module subcard is higher.

[0003] In prior art, operation server usually only relies on the axial flow fan on the chassis to heat dissipation for multiple module subcards, however, due to the different positions of multiple module subcards, the axial flow fan needs to work at very high speed, can satisfy the heat dissipation demand of each subcard, this not only increases the energy consumption of fan, but also leads to the noise of operation server is very big. SUMMARY

[0004] Therefore, aiming at the above technical problems, a distributed temperature control's operation server is provided.

[0005] The utility model adopts the technical scheme as follows:

[0006] A distributed temperature control's operation server, including the chassis, a plurality of module subcards and the controller, the air inlet is formed on the chassis, the rear end of the plurality of module subcards is inserted in the chassis outward, the module subcard includes the shell and the subcard circuit board arranged in the shell, the subcard circuit board is electrically connected with the controller, characterized by, the module subcard further includes the fan cover, the fan, the air duct, the fan drive chip and the temperature sensor, the first air inlet is formed on the shell and located the lateral surface, and the air outlet is formed on the rear side, the fan cover is fixed in the shell, and the lateral surface has the second air inlet corresponding with the first air inlet, the rear side of the fan cover has the air guide, the fan is rotatably arranged in the fan cover, the air duct is in the front and rear direction, one end is connected with the air guide, and the other end extends to the air outlet, the fan drive chip and the temperature sensor are arranged on the subcard circuit board, the fan drive chip is electrically connected with the controller and the fan, and the temperature sensor is electrically connected with the controller.

[0007] The utility model sets up the independent fan, fan drive chip and temperature sensor on each module subcard, so that the controller can adjust the speed of corresponding fan according to the temperature of each module subcard, carries out the partition heat dissipation, can realize the distributed temperature control on the basis of small space, compared with prior art, greatly reduces the noise, and also saves the energy consumption. BRIEF DESCRIPTION OF DRAWINGS

[0008] The utility model discloses a kind of distributed temperature control's operation server of providing for the embodiment of the utility model, as shown in Figure 1, it includes chassis, module subcard, power supply, cooling system and operating system.

[0009] Figure 1 As shown in Figure 2, it is a front perspective structure schematic diagram of the operation server of providing for the embodiment of the utility model of distributed temperature control.

[0010] Figure 2 As shown in Figure 3, it is a rear perspective structure schematic diagram of the operation server of providing for the embodiment of the utility model of distributed temperature control.

[0011] Figure 3 As shown in Figure 4, it is the structure schematic diagram of the insertion channel of the chassis of the operation server of providing for the embodiment of the utility model of distributed temperature control.

[0012] Figure 4 As shown in Figure 5, it is the structure schematic diagram of the module subcard of the operation server of providing for the embodiment of the utility model of distributed temperature control.

[0013] Figure 5 As shown in Figure 6, it is the structure schematic diagram of the fan cover of the module subcard of the operation server of providing for the embodiment of the utility model of distributed temperature control.

[0014] Figure 6 As shown in Figure 7, it is the internal structure schematic diagram of the fan cover of the module subcard of the operation server of providing for the embodiment of the utility model of distributed temperature control.

[0015] Figure 7 As shown in Figure 8, it is the structure schematic diagram of the notch of the shell of the module subcard of the operation server of providing for the embodiment of the utility model of distributed temperature control.

[0016] Figure 8 As shown in Figure 9, it is the structure schematic diagram of the movable buckle of the module subcard of the operation server of providing for the embodiment of the utility model of distributed temperature control.

[0017] Figure 9 As shown in Figure 10, it is the schematic diagram that the protrusion of the movable buckle of the module subcard of the operation server of providing for the embodiment of the utility model of distributed temperature control is buckled to the buckle hole of chassis.

[0018] Figure 10 As shown in Figure 11, it is the electrical schematic diagram of the operation server of providing for the embodiment of the utility model of distributed temperature control. DETAILED DESCRIPTION

[0019] The embodiments of the utility model will be described below in conjunction with the drawings of the specification. It should be noted that the embodiments involved in the specification are not exhaustive, and do not represent the only embodiment of the utility model. The following examples are only for the purpose of clearly explaining the utility model content of the utility model patent, and are not limited to the embodiments. For ordinary skilled persons in the field, different forms of changes and modifications can be made on the basis of the example description, and any changes or modifications within the technical concept and utility model content of the utility model and obvious changes or modifications are also within the protection scope of the utility model.

[0020] As shown in Figures 1-3 , the embodiment of the application provides a distributed temperature control operation server, which comprises a case 1100, a backboard 1200, a main control board 1300 and two module subcards 1400.

[0021] The case 1100 has an air inlet, as shown in Figure 1 and Figure 2 , the air inlet is composed of a plurality of first air inlets 1110 formed on the front side plate of the case 1100 and second air inlets 1120 formed on the left and right side plates of the case 1100, so that air can be inhaled through the front side and the left and right sides of the case 1100.

[0022] Among them, the plurality of first air inlets 1110 are composed of the hollow structure on the front side plate of the case 1100, and the wind resistance is small.

[0023] As shown in Figure 3 , the case 1100 has two front and rear direction insertion channels 1130 arranged symmetrically, the insertion channel 1130 includes a jack 1131 formed on the rear side plate of the case 1100 and a slot 1132 formed on the inner side of the front side plate of the case 1100, and the jack 1131 and the slot 1132 are respectively matched with the rear end and the front end of the module subcard 1400.

[0024] Among them, the upper hole wall of the jack 1131 has a buckle hole 1131a, see Figure 9 .

[0025] The backboard 1200 and the main control board 1300 are both circuit boards, as shown in Figure 3 , the backboard 1200 is vertically arranged on the inner side of the front side plate of the case 1100, and the main control board 1300 is horizontally arranged, and the main control board 1300 is connected with the backboard 1200 through the gold finger, and the main control board 1300 is provided with a controller 1310, see Figure 10 .

[0026] As shown in Figure 2As shown in the figure, two module sub-cards 1400 are respectively inserted into two insertion channels 1130 with the rear end outward, and the front end of the module sub-card 1400 is located in the slot 1132 and the rear end is located in the jack 1131.

[0027] As shown in the figure, Figure 4 , Figure 5 and Figure 10 , the module sub-card 1400 includes a shell 1410, a fan cover 1420, a fan 1430, a sub-card circuit board 1440, a plurality of heat dissipation fins 1450, a fan drive chip 1460, a temperature sensor 1470 and a movable buckle 1480.

[0028] As shown in the figure, Figure 4 , the shell 1410 has a first air inlet hole 1411 on the outer side and an air outlet hole 1412 on the rear side, wherein the outer side refers to the side away from each other of the two module sub-cards 1400. Taking the module sub-card 1400 on the left side of the figure as an example, the outer side of the shell 1410 refers to the left side of the shell 1410, and the air outlet hole 1412 is a plurality of air outlet holes 1412 arranged in an up-down direction.

[0029] As shown in the figure, Figure 7 , the upper rear corner of the shell 1410 has a notch 1413, the upper part of the rear side of the shell 1410 has a positioning groove 1414 connected with the notch 1413, and the notch 1413 is provided with a hinge shaft in the left-right direction and two positioning holes 1413a symmetrically arranged in the left-right direction, Figure 7 as shown in the figure.

[0030] The fan cover 1420 is fixed in the shell 1410, as shown in the figure, Figure 6 , the outer side of the shell 1410 (taking the module sub-card 1400 on the left side of the figure as an example, the outer side of the shell 1410 is the left side of the shell 1410) has three second air inlet holes 1421, and the inner surface of the outer side has a shaft 1422 in the left-right direction. The rear side of the fan cover 1420 has an air guide port (not shown in the figure).

[0031] The fan 1430 is arranged in the fan cover 1420 by rotating forward and backward through the shaft, as shown in the figure. Figure 5 .

[0032] After the module sub-card 1400 is inserted into the case 1100, the sub-card circuit board 1440 is connected with the back plate 1200 through the sata connector, so that it is electrically connected with the controller 1310.

[0033] As shown in the figure, Figure 4As shown, the sub-card circuit board 1440 is fixed to the outer side of the fan cover 1420 by bolts, and has a third air inlet hole 1441 on it, the second air inlet hole 1120, the first air inlet hole 1411, the second air inlet hole 1421 and the third air inlet hole 1441 are opposite to each other, and a plurality of chips are integrated on the sub-card circuit board 1440.

[0034] As shown in Figure 5 and Figure 6 , a plurality of heat dissipation fins 1450 are arranged between the air guide hole and the air outlet hole 1412, the plurality of heat dissipation fins 1450 are arranged in the front-rear direction and spaced apart in the up-down direction, forming a plurality of front-rear direction air ducts, the front end of each air duct is connected with the air guide hole, and the rear end extends to the air outlet hole 1412, so that air can be discharged from the rear side of the case 1100.

[0035] The fan driving chip 1460 and the temperature sensor 1470 are arranged on the sub-card circuit board 1440, as shown in Figure 10 , the fan driving chip 1460 is electrically connected with the controller 1310 and the fan 1430, and the temperature sensor 1470 is used for detecting the temperature of the module sub-card 1400, and is electrically connected with the controller 1310, so that the controller 1310 can adjust the rotating speed of the corresponding fan 1430 according to the detection value of the temperature sensor 1470 in each module sub-card 1400.

[0036] As shown in Figure 8 , the movable buckle 1480 includes a vertical plate 1481 in the up-down direction and a horizontal plate 1482 in the front-rear direction, the upper end of the vertical plate 1481 is connected with the rear end of the horizontal plate 1482 at 90 degrees, and a reinforcing part 1483 is formed therebetween, the shaft hole 1483a on the reinforcing part 1483 is penetrated by the hinge shaft, forming a hinge with the upper rear corner of the shell 1410, so that the movable buckle 1480 can be flipped forward and backward around the hinge shaft as the center.

[0037] The lower end of the vertical plate 1481 has a handle part 1481a, the horizontal plate 1482 has a protrusion 1482a, and the reinforcing part 1483 has two positioning heads 1483b arranged symmetrically left and right, when the vertical plate 1481 is flipped down to the vertical position, the handle part 1481a is just inserted into the positioning slot 1414, and the protrusion 1482a is just buckled to the buckle hole 1131a, see Figure 9 , forming the fixation of the module sub-card 1400 and the case 1100, at the same time, the two positioning heads 1483b are just inserted into the two positioning holes 1413a, so that the fixation relationship between the module sub-card 1400 and the case 1100 is more firm.

[0038] As shown in Figure 8As shown, the handle 1481a has a handle hole 1481b, after the vertical plate 1481 is turned up, the fingers pass through the handle hole 1481b can facilitate the lifting and moving of the module sub-card 1400, in addition, the handle hole 1481b can also facilitate the user to break out the handle 1481a from the positioning groove 1414.

[0039] From the above, the distributed temperature control operation server provided by the embodiment of the application sets an independent fan, a fan driving chip and a temperature sensor on each module sub-card, so that the controller can adjust the rotating speed of the corresponding fan according to the temperature of each module sub-card, and the partition heat dissipation can be performed, the distributed temperature control can be realized on the basis of a small space, compared with the prior art, the noise is greatly reduced, and the energy consumption is also saved.

[0040] Obviously, those skilled in the art can make various modifications and variations to the present application without departing from the scope of the present application. Thus, if these modifications and variations of the present application belong to the scope of the claims of the present application and the equivalent technologies thereof, the present application also intends to include these modifications and variations.

Claims

1. A distributed temperature-controlled computing server, comprising a chassis, multiple module daughter cards, and a controller, wherein the chassis has an air inlet, the multiple module daughter cards are inserted into the chassis with their rear ends facing outwards, each module daughter card includes a shell and a daughter card circuit board disposed within the shell, the daughter card circuit board being electrically connected to the controller, characterized in that, The module subcard further comprises a fan cover, a fan, an air duct, a fan driving chip and a temperature sensor, the shell has a first air inlet on the outer side and an air outlet on the rear side, the fan cover is fixed in the shell and has a second air inlet on the outer side corresponding to the first air inlet, the rear side of the fan cover has a wind guide opening, the fan is rotatably arranged in the fan cover, the air duct is arranged in the front-rear direction and has one end connected to the wind guide opening and the other end extended to the air outlet, the fan driving chip and the temperature sensor are arranged on the subcard circuit board, the fan driving chip is electrically connected to the controller and the fan, and the temperature sensor is electrically connected to the controller.

2. The distributed temperature-controlled computing server of claim 1, wherein, The cabinet has two insertion channels arranged symmetrically left and right, the insertion channel comprises a socket formed on the rear side plate of the cabinet and a slot formed on the inner side of the front side plate of the cabinet, the socket and the slot are respectively matched with the rear end and the front end of the module subcard, and the number of the module subcards is two.

3. The distributed temperature-controlled computing server of claim 2, wherein, The air inlet comprises a plurality of first air inlets formed on the front side plate of the cabinet and a second air inlet formed on the left and right side plates of the cabinet.

4. The distributed temperature-controlled computing server of claim 3, wherein, The subcard circuit board is fixed on the outer side of the fan cover and has a third air inlet, the second air inlet, the second air inlet and the third air inlet are arranged left and right.

5. The distributed temperature-controlled computing server of claim 2, wherein, The wind guide opening of the fan cover and the air outlet of the shell have a plurality of heat dissipation fins, the plurality of heat dissipation fins are arranged in the front-rear direction and spaced apart in the up-down direction, and form a plurality of air ducts.

6. The distributed temperature-controlled computing server of claim 2, wherein, The upper hole wall of the socket has a buckle hole, the rear upper corner of the shell of the module subcard has a notch, the upper part of the rear side of the shell has a positioning groove connected to the notch, the notch is hingedly connected with a movable buckle which can be flipped forward and backward, the movable buckle has a vertical plate in the up-down direction and a horizontal plate in the front-rear direction, the upper end of the vertical plate is connected to the rear end of the horizontal plate at an angle of 90 degrees, the lower end of the vertical plate has a handle part which is embedded in the positioning groove when the vertical plate is flipped to a vertical position, and the horizontal plate has a protrusion which is embedded in the buckle hole when the handle part of the vertical plate is embedded in the positioning groove.

7. The distributed temperature-controlled computing server of claim 6, wherein, The handle part has a handle hole.

Images