Liquid-cooled radiator

Abstract

The utility model relates to a liquid-cooled radiator, and belongs to the technical field of radiators. The liquid-cooled radiator comprises a vapor chamber, a capillary connecting piece, a heat pipe and a liquid cooling head, the vapor chamber is provided with a vacuum cavity, a working medium arranged in the vacuum cavity and a capillary structure arranged in the vacuum cavity, the vapor chamber is provided with a mounting hole used for being connected with the heat pipe, the mounting hole is provided with a supporting column extending in the radial direction, and the capillary connecting piece is connected with the liquid cooling head. The capillary connecting piece is provided with a concave structure matched with the supporting column, the heat pipe is communicated with the vapor chamber through the capillary connecting piece, the liquid cooling head is provided with a liquid cooling cavity, a liquid inlet and a liquid outlet, the liquid inlet and the liquid outlet are communicated with the liquid cooling cavity, and the heat pipe penetrates through the liquid cooling head and is surrounded by the liquid cooling cavity. According to the scheme provided by the invention, the liquid-cooled radiator which realizes heat transfer through the 3D uniform temperature plate and realizes heat dissipation through the liquid cooling head is built in a limited space, and the heat conduction requirement of higher power consumption or higher heat flux density can be met.

Description

TECHNICAL FIELD

[0001] The utility model relates to a radiator technical field especially relates to a liquid cooling radiator. BACKGROUND

[0002] In recent years, the global digital economy is booming, and people have higher requirements for data services, which further promotes the rapid development of the entire server industry. Since CPU is one of the core components of the server, it has a certain degree of importance to the quality and efficiency of the server.

[0003] Common heat dissipation technologies include air cooling and liquid cooling. Air cooling technology mainly uses a fan to provide a cooling airflow to the CPU fins. When applied to high-power CPUs, the fan speed needs to be increased to enhance the airflow, but this results in difficulty in reducing power usage effectiveness (PUE) and increases the noise generated by the fan operation, which is very inconvenient.

[0004] Liquid cooling technology mainly uses a cold plate to contact the CPU and uses the circulation of cooling liquid to guide the heat of the CPU to the outside for heat dissipation. However, the internal channels of the cold plate are narrow and have many changes in direction, resulting in high flow resistance for the liquid inside the cold plate. This requires a high-power pump to push the liquid flow, which increases the cost and makes the liquid cooling device complex with many joints. The liquid cooling plate is prone to leakage, which can cause the chip and the entire circuit board to be scrapped.

[0005] In addition to traditional air cooling and liquid cooling technologies, immersion cooling technology has emerged in recent years. This technology directly immerses the heat-generating components in non-conductive cooling liquid, allowing the heat generated by the components to be directly conducted to the liquid for heat dissipation. However, immersion cooling technology is not yet mature and has high technical difficulty, so its popularity rate is not high, and the application cost is relatively high.

[0006] In terms of existing technology, liquid cooling technology has the highest heat dissipation efficiency for high-power CPUs, and its low power usage effectiveness advantage also meets the current global warming and sustainable development goals. Therefore, it is necessary to improve the existing liquid cooling technology. INVENTION CONTENTS

[0007] In view of the heat dissipation ability and low PUE advantage of the existing liquid cooling heat dissipation technology, but there are problems of large channel resistance and complex structure of the liquid cooling device, the main purpose of the utility model is to provide a liquid cooling radiator, which is built in limited space to realize heat transfer by 3D uniform temperature plate and heat dissipation by liquid cooling head, and can meet the heat conduction demand of higher power consumption or higher heat flow density.

[0008] The utility model discloses a liquid cooling radiator, including the heat plate, capillary connecting piece, heat pipe and liquid cooling head, the heat plate has vacuum cavity, the working medium of being arranged in vacuum cavity and the capillary structure of being arranged in vacuum cavity, the heat plate is equipped with the mounting hole for connecting heat pipe, the mounting hole is equipped with the support column of radial extension, the capillary connecting piece is equipped with recess structure and the support column is matched with each other, the heat pipe is communicated heat plate through capillary connecting piece, the liquid cooling head has liquid cooling cavity and the liquid inlet and liquid outlet of communicating with liquid cooling cavity, the heat pipe is worn liquid cooling head and is surrounded by liquid cooling cavity.

[0009] In some embodiments, the liquid cooling head includes a liquid cooling plate, the top surface and the bottom surface of the liquid cooling plate are provided with an outer shell, the outer shell is in sealing connection with the liquid cooling plate to form the liquid cooling cavity, the liquid cooling plate is provided with a channel, the channel penetrates through both ends of the liquid cooling plate, and the heat pipe penetrates through the channel.

[0010] In some embodiments, a plurality of fins are vertically arranged on the top surface and the bottom surface of the liquid cooling plate along the length direction of the heat pipe, and the fins cut the liquid cooling cavity into a plurality of liquid cooling flow channels.

[0011] In some embodiments, the liquid inlet and the liquid outlet are respectively located on the horizontal two sides of the liquid cooling plate, and the axis direction of the liquid inlet and the axis direction of the liquid outlet are perpendicular to the length direction of the heat pipe.

[0012] In some embodiments, the length direction of the fin is perpendicular to the length extension direction of the heat pipe.

[0013] In some embodiments, the heat plate includes a shell, a copper column, a capillary connecting ring and a cover plate, the shell and the cover plate are covered to form the vacuum cavity, the copper column is arranged in the shell and abuts against the cover plate, the shell and the cover plate are both provided with a capillary structure, and the capillary connecting ring is sleeved on the copper column.

[0014] The capillary connecting ring is in contact and connection with the capillary structure of the shell and the capillary structure of the cover plate respectively.

[0015] In some embodiments, the capillary structure of the shell, the capillary connecting ring and the capillary structure of the cover plate are the same or different.

[0016] In some embodiments, the capillary connector comprises a circular ring and two symmetrically arranged semi-circular rings coaxially arranged at the ends of the circular ring, and a radially extending gap is formed between the two semi-circular rings, which is used to match the support column.

[0017] In some embodiments, the circular ring and the two semi-circular rings are integrally formed, and the capillary connector has a capillary gap for attracting the working medium to facilitate the flow of the working medium between the heat pipe and the vapor chamber.

[0018] The technical scheme provided by the utility model can have the following beneficial effects:

[0019] (1) The liquid cooling radiator provided by the utility model can reduce the high heat flux density of the heat source device such as a chip to a balanced low heat flux density through the vapor chamber, and the working medium can be quickly cooled through the liquid cooling head when flowing in the heat pipe, so that the liquid cooling radiator has the advantages of good cooling effect, and the vapor chamber, the heat pipe and the liquid cooling head are basically on the same horizontal plane, so that the overall height of the liquid cooling radiator is lower, the applicability is stronger, and the cooling demand of the high-power server can be met.

[0020] (2) The liquid cooling radiator provided by the utility model can bridge the heat pipe and the vapor chamber through the capillary connector, the capillary structure surface of the capillary connector can reduce the contact thermal resistance between the heat pipe and the vapor chamber, improve the speed of the working medium flowing back from the heat pipe to the vapor chamber, and can also enhance the structural strength of the heat pipe through the capillary connector to avoid the problem of pipe deformation of the heat pipe during vacuumization, so that the liquid cooling radiator has the advantages of stable structure and good reliability. BRIEF DESCRIPTION OF DRAWINGS

[0021] The above and other objects, features and advantages of the present application will become more apparent from the following detailed description of exemplary embodiments of the present application taken in conjunction with the accompanying drawings, in which like reference characters refer to the like parts throughout the figures, and in which:

[0022] Figure 1 is a structural schematic view of the liquid cooling radiator shown in embodiment 1 of the present application;

[0023] Figure 2 is an exploded schematic view of the liquid cooling radiator shown in embodiment 1 of the present application;

[0024] Figure 3 is a structural schematic view of the shell shown in embodiment 1 of the present application;

[0025] Figure 4 is a structural schematic view of the capillary connector shown in embodiment 1 of the present application;

[0026] Figure 5 is a structural schematic view of the liquid cooling radiator shown in embodiment 2 of the present application;

[0027] Figure 6 is an exploded schematic view of a liquid cooling radiator shown in Embodiment 2 of the present application;

[0028] Figure 7 is a structural schematic view of a liquid cooling radiator shown in Embodiment 3 of the present application;

[0029] Figure 8 is a structural schematic view of a liquid cooling radiator shown in Embodiment 4 of the present application;

[0030] Figure 9 is a structural schematic view of a liquid cooling radiator shown in Embodiment 5 of the present application.

[0031] Reference signs:

[0032] 1, hot plate; 10, mounting hole; 11, support column; 12, shell; 13, copper column; 14, capillary connecting ring; 15, cover plate; 2, capillary connecting piece; 21, circular ring; 22, semicircular ring; 3, heat pipe; 4, liquid cooling head; 40, liquid cooling cavity; 41, liquid inlet; 42, liquid outlet; 43, liquid cooling plate; 44, shell; 45, channel; 46, fin. DETAILED DESCRIPTION

[0033] The preferred embodiments of the present application will be described in more detail by referring to the attached drawings. Although the preferred embodiments of the present application are shown in the drawings, it should be understood that the present application can be implemented in various forms and should not be limited by the embodiments described herein. On the contrary, these embodiments are provided in order to make the present application more thorough and complete, and to fully convey the scope of the present application to those skilled in the art.

[0034] In the description of the application, it should be understood that the terms "one end", "the other end", "outer side", "upper", "inner side", "horizontal", "coaxial", "central", "end", "length", "outer end" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation of the present application.

[0035] In addition, in the description of the present application, "a plurality of" means at least two, for example, two, three, etc., unless otherwise explicitly and specifically limited.

[0036] The standard of the server cabinet can be divided into 1U / 2U / 4U / 6U / 8U, among which the unit density of 1U is the highest, and the heat dissipation demand is also relatively high. The existing server has the characteristics of high integration, large chip power heat generation and low cabinet height, which leads to higher and higher heat dissipation pressure of the server.

[0037] At present, the highest power of the server using air cooling is 41KW / rack, and liquid cooling needs to be selected when the power exceeds this power. For example, the rack power of NVIDIA's GB200 1U server reaches 120KW. It can be predicted that the power consumption of future servers will be higher, and air cooling cannot meet the heat dissipation demand of the chip with higher and higher power consumption. Although the water cooling scheme can meet the demand, since the water cooling is directly applied to the chip, once the liquid leakage occurs, the entire cabinet will be scrapped, and hundreds of millions of devices will be at risk.

[0038] In addition, the implementation cost and maintenance cost of the immersion cooling scheme are extremely high, and it is not suitable for large-scale promotion.

[0039] In view of the defects of the liquid cooling head 4, the embodiment of the present application provides a liquid cooling radiator, which is built in a limited space to realize heat transfer by a 3D uniform temperature plate and realize heat dissipation by a liquid cooling head 4, and can meet the heat dissipation demand of higher power consumption or higher heat flow density.

[0040] The technical scheme of the embodiment of the present application is described in detail below with reference to the drawings.

[0041] As shown in the drawings, Figures 1 to 4 The liquid cooling radiator provided by the present application comprises a heat spreading plate 1, a capillary connecting piece 2, a heat pipe 3 and a liquid cooling head 4. The heat spreading plate 1 has a vacuum cavity, a working medium arranged in the vacuum cavity and a capillary structure arranged in the vacuum cavity. The heat spreading plate 1 is provided with a mounting hole 10 for connecting the heat pipe 3. The mounting hole 10 is provided with a support column 11 extending in the radial direction. The capillary connecting piece 2 is provided with a recess structure matched with the support column 11. The heat pipe 3 is connected to the heat spreading plate 1 through the capillary connecting piece 2. The liquid cooling head 4 has a liquid cooling cavity 40, an inlet 41 and an outlet 42 connected to the liquid cooling cavity 40. The heat pipe 3 penetrates the liquid cooling head 4 and is surrounded by the liquid cooling cavity 40.

[0042] Specifically, the heat plate 1 is provided in a plate structure, has a vacuum cavity inside, and the working medium in the vacuum cavity can be pure water or a low-boiling-point solvent. The surface of the vacuum cavity is provided with a capillary structure. The heat plate 1 and the liquid cooling head 4 are both made of metal materials, such as copper or aluminum. In order to ensure the heat conduction capacity of the heat plate 1 and the liquid cooling head 4, in some embodiments, the heat plate 1 is made of pure copper, the capillary structure on the heat plate 1 is formed by sintering copper powder, and the capillary connecting piece 2 is formed by filling copper powder in a mold and sintering. The heat plate 1 has a top surface, a bottom surface, and four side surfaces. The bottom surface serves as an action surface for abutting against a heat source. One or more mounting holes 10 can be arranged on the four side surfaces and the top surface. A support column 11 extends radially in the mounting hole 10. The capillary connecting piece 2 is arranged in the mounting hole 10 and is clamped with the support column 11. The open end of the heat pipe 3 is embedded with the capillary connecting piece 2. In this arrangement, the assembly difficulty of the heat pipe 3 and the heat plate 1 can be reduced, and the structural strength of the heat pipe 3 can be improved. During assembly, the capillary connecting piece 2 is first assembled into the mounting hole 10, the recessed structure of the heat pipe 3 is aligned with the support column 11, and then the heat pipe 3 is assembled into the mounting hole 10 of the heat plate 1. The capillary connecting piece 2 is used to improve the structural strength of the heat pipe 3, so that the heat pipe 3 will not be deformed during vacuumization and will not have a sealing problem. The capillary connecting piece 2 is sintered from copper powder. The capillary structure of the capillary connecting piece 2 can reduce the contact thermal resistance between the heat pipe 3 and the heat plate 1, improve the speed of the working medium flowing back to the heat plate 1 from the heat pipe 3, and avoid the problem of dry burning caused by insufficient working medium in the heat plate 1. The heat pipe 3 penetrates the liquid cooling head 4 and is surrounded by the liquid cooling cavity 40. The cooling working medium enters the liquid cooling cavity 40 through the liquid inlet 41 and performs forced heat exchange with the heat pipe 3, so that the temperature of the working medium in the heat pipe 3 can be quickly reduced to make it quickly condense and flow back. The cooled working medium flows out of the liquid outlet 42.

[0043] When the liquid cooling heat sink is used on a power device such as a server, the heat distribution of the heat source such as a chip is in a diffusion type, that is, the heat source has a hot spot with the highest temperature. The heat of the heat source diffuses outward from the hot spot, and the temperature of the heat source is distributed in a gradient. The working medium in the vacuum cavity of the heat plate 1 is vaporized by heat and flows into the heat pipe 3 from the vacuum cavity, and then the heat pipe 3 is quickly cooled by the liquid cooling head 4. The working medium increases the speed of the working medium flowing back to the heat plate 1 from the heat pipe 3 through the capillary connecting piece 2 during the process of flowing back to the heat pipe 3. In order to improve the abutting effect of the heat plate 1 and the chip device, the heat plate 1 should be designed in a profiled manner according to the chip device, so that the heat plate 1 can be in contact with the heat source surface of the chip device as much as possible. In some cases, the chip has a flat and slightly convex structure on the circuit board, and the upper surface of the chip device is a flat and slightly convex heat dissipation surface. Therefore, the heat plate 1 can be arranged on the upper side of the chip device, and the lower surface of the heat plate 1 has a structure matched with the chip device to achieve close contact.

[0044] In this embodiment, the liquid-cooled heat sink composed of the heat spreader 1, heat pipe 3, and liquid cooling head 4 adopts a planar structure. The relatively low height of the liquid-cooled heat sink allows it to match the heat flow of highly integrated servers and chips, which is planar. Replacing the liquid cooling head 4 with the heat spreader 1 directly acting on the heat source, such as the chip, avoids the problem of liquid leakage from the liquid cooling head 4 damaging components. The heat spreader 1 reduces the high heat flux density of the chip heat source to a balanced low heat flux density. The working fluid flows through the heat pipe 3 and achieves rapid heat transfer through the liquid cooling head 4, resulting in good heat dissipation performance. It is adapted to the heat dissipation requirements of high-power servers; the heat pipe 3 and the heat spreader 1 are bridged by the capillary connector 2. On the one hand, the capillary connector 2 reduces the contact thermal resistance between the heat pipe 3 and the heat spreader 1, and increases the speed of the liquid working fluid in the capillary structure of the heat pipe 3 flowing back to the heat spreader 1. On the other hand, the capillary connector 2 can improve the structural strength of the heat pipe 3 and reduce the deformation of the heat spreader 1 and the heat pipe 3 when vacuuming. It has the advantages of structural stability and high reliability. When diffusion welding is performed on the shell 12 and the cover plate 15, the support column 11 can also ensure that the welding does not leak.

[0045] In a preferred embodiment, the liquid cooling head 4 includes a liquid cooling plate 43, and the top and bottom surfaces of the liquid cooling plate 43 are provided with a shell 44. The shell 44 is sealed to the liquid cooling plate 43 to form the liquid cooling cavity 40. The liquid cooling plate 43 is provided with a channel 45, which passes through both ends of the liquid cooling plate 43, and the heat pipe 3 passes through the channel 45.

[0046] Furthermore, the top and bottom surfaces of the liquid cooling plate 43 are provided with a number of fins 46 arranged vertically at intervals along the length of the heat pipe 3. The fins 46 cut the liquid cooling cavity 40 into a number of liquid cooling channels. The fins 46 are arranged in a sheet shape and are arranged in parallel at equal intervals on the upper and lower surfaces of the liquid cooling head 4. With this arrangement, when the cooling medium passes through multiple fins 46, it can uniformly carry away the heat, avoid the accumulation of heat in a certain area, and thus improve the overall heat dissipation efficiency.

[0047] Furthermore, the liquid inlet 41 and the liquid outlet 42 are located on the horizontal sides of the liquid cooling plate 43, and the axial direction of the liquid inlet 41 and the axial direction of the liquid outlet 42 are perpendicular to the length direction of the heat pipe 3.

[0048] Furthermore, the length direction of the fin 46 is perpendicular to the length extension direction of the heat pipe 3.

[0049] In the embodiment, the heat pipe 3 is a long strip-shaped tubular structure, the closed end of the heat pipe 3 penetrates the length direction of the two ends of the liquid cooling head 4, the cooling working medium flows into the liquid cooling cavity 40 through the liquid inlet 41 and flows out of the liquid cooling cavity 40 through the liquid outlet 42, the flow direction of the cooling working medium in the liquid cooling cavity 40 is perpendicular to the direction of the heat pipe 3, which can improve the flow rate of the cooling working medium in the liquid cooling cavity 40 and improve the heat exchange efficiency of the cooling working medium and the heat pipe 3.

[0050] In another implementable scheme, the liquid cooling head 4 can also perform liquid cooling heat dissipation on other components of the server by increasing the number of heat pipes 3, that is, an additional branch is formed in the liquid cooling cavity 40 of the liquid cooling head 4, the branch can be provided with a heat pipe 3 or a miniaturized 3DVC, thereby realizing heat dissipation of other devices of the server, so as to improve the versatility of the liquid cooling heat sink.

[0051] In a preferred embodiment, the above-mentioned uniform heating plate 1 comprises a shell 12, a copper column 13, a capillary connecting ring 14 and a cover plate 15, the shell 12 and the cover plate 15 are covered to form the vacuum cavity, the copper column 13 is arranged in the shell 12 and abuts against the cover plate 15, the shell 12 and the cover plate 15 are both provided with a capillary structure, and the capillary connecting ring 14 is sleeved on the copper column 13.

[0052] The capillary connecting ring 14 is connected in contact with the capillary structure of the shell 12 and the capillary structure of the cover plate 15, and in addition, a flange surrounding the mounting hole 10 is further arranged on the side surface of the shell 12, which extends outward to improve the connection strength of the heat pipe 3 and the shell 12.

[0053] On the basis of the above-mentioned specific embodiments, the capillary structure of the shell 12, the capillary connecting ring 14 and the capillary structure of the cover plate 15 are the same or different. That is, the capillary structure of the inner surface of the shell 12, the capillary structure of the upper surface of the cover plate 15 and the capillary structure of the outer surface of the copper column 13 are powder sintered bodies, which are obtained by powder sintering the shell 12, the copper column 13 and the cover plate 15 by using corresponding molds, and the copper column 13 is placed on the cover plate 15 and sintered. In specific implementation, the shell 12, the cover plate 15 and the copper column 13 can also be selected to have different capillary structures (such as metal woven mesh, groove, powder sintered body or any combination of the foregoing), and can all be powder sintered bodies to form capillary structures with different porosities and permeabilities.

[0054] Further, the above-mentioned capillary connecting piece 2 comprises a circular ring 21 and two symmetrically arranged semicircular rings 22, the two semicircular rings 22 are coaxially arranged at the end of the circular ring 21, and a radially extending gap is formed between the two semicircular rings 22, which is used to match the support column 11. In the manufacture of the capillary connecting piece 2, copper powder is loaded into a corresponding mold, and the capillary connecting piece 2 with a capillary structure is manufactured by sintering.

[0055] Furthermore, the aforementioned circular ring 21 and the two semi-circular rings 22 are integrally formed, and the capillary connector 2 has a capillary gap, which is used to attract the working fluid to promote the flow of the working fluid between the heat pipe 3 and the heat spreader 1.

[0056] In summary, the liquid-cooled heat sink provided by this embodiment reduces the high heat flux density of heat source devices such as chips to a balanced low heat flux density through the heat spreader 1. The working fluid achieves rapid heat dissipation through the liquid cooling head 4 while flowing through the heat pipe 3, resulting in good heat dissipation. Furthermore, the heat spreader 1, heat pipe 3, and liquid cooling head 4 are basically on the same horizontal plane, making the overall height of the liquid-cooled heat sink lower and more versatile, suitable for the heat dissipation requirements of high-power servers. The heat pipe 3 and the heat spreader 1 are bridged by the capillary connector 2. The capillary structure of the capillary connector 2 can reduce the contact thermal resistance between the heat pipe 3 and the heat spreader 1, increase the speed at which the working fluid flows back from the heat pipe 3 to the heat spreader 1, and also enhance the structural strength of the heat pipe 3 through the capillary connector 2, avoiding the problem of tube collapse and deformation of the heat pipe 3 during vacuuming. It has the advantages of structural stability and high reliability.

[0057] Example 2

[0058] like Figure 5 and Figure 6 As shown, the difference between Embodiment 2 and Embodiment 1 is that one or more mounting holes 10 are provided on one side of the heat spreader 1. These mounting holes 10 connect to heat pipes 3, which pass through the liquid cooling plate 43. The liquid cooling plate 43 is housed within a housing 44. Compared to Embodiment 1, the liquid-cooled heat sink provided in Embodiment 2 achieves a miniaturized structure, enabling its application in heat dissipation for other server components. The other structures and working principles of Embodiment 2 are the same as in Embodiment 1 and will not be repeated here.

[0059] Example 3

[0060] like Figure 7 As shown, the difference between Embodiment 3 and Embodiment 2 is that the heat spreader 1 has multiple mounting holes 10 on each of its four sides. Each mounting hole 10 connects to a heat pipe 3, and the heat pipes 3 are bent in the same direction to allow all heat pipes 3 to pass through the through-hole on the same end face of the liquid cooling head 4 simultaneously. This configuration significantly improves the heat dissipation efficiency of the liquid-cooled radiator. The other structures and working principles of Embodiment 3 are the same as in Embodiment 1 and will not be repeated here.

[0061] Example 4

[0062] like Figure 8As shown, the difference between Embodiment 4 and Embodiment 3 is that the heat pipes 3 on each mounting hole 10 are installed in the same direction on the same end face of the liquid cooling head 4, and the height of the heat pipes 3 penetrating the liquid cooling head 4 is crisscrossed, so that the cooling medium can contact the surface of each heat pipe 3 as much as possible, thereby improving the heat diffusion effect of the heat pipes 3 in the liquid cooling cavity 40. The other structures and working principles of Embodiment 3 are the same as those of Embodiment 1, and will not be described again here.

[0063] Example 5

[0064] like Figure 9 As shown, the difference between Embodiment 5 and Embodiment 2 is that after the heat pipe 3 is bent in the same direction toward the same end face of the liquid cooling head 4, the heat pipe 3 is bent upward again and installed onto the liquid cooling head 4. With this configuration, the design height of the liquid cooling head 4 can be increased, thereby increasing the volume of the liquid cooling cavity 40 and improving the heat diffusion effect of the liquid cooling head 4. The other structures and working principles of Embodiment 4 are the same as those of Embodiment 1, and will not be repeated here.

[0065] The liquid-cooled radiator provided in this embodiment of the utility model can be installed in, for example, a server host, which can be used for artificial intelligence (AI) computing, edge computing, etc., and can also be used as a 5G server, cloud server, or vehicle networking server.

[0066] The various embodiments of the present invention have been described above. These descriptions are exemplary and not exhaustive, nor are they limited to the disclosed embodiments. Many modifications and variations will be apparent to those skilled in the art without departing from the scope and spirit of the described embodiments. The terminology used herein is chosen to best explain the principles, practical application, or improvement of the technology in the market, or to enable others skilled in the art to understand the embodiments disclosed herein.

Claims

1. A liquid-cooled heat sink, comprising: The heat plate, the capillary connecting piece, the heat pipe and the liquid cooling head, the heat plate has a vacuum cavity, a working medium arranged in the vacuum cavity and a capillary structure arranged in the vacuum cavity, the heat plate is provided with a mounting hole for connecting the heat pipe, the mounting hole is provided with a support column extending in the radial direction, the capillary connecting piece is provided with a recess structure matched with the support column, the heat pipe is connected with the heat plate through the capillary connecting piece, and the liquid cooling head has a liquid cooling cavity and a liquid inlet and a liquid outlet connected with the liquid cooling cavity.

2. The liquid-cooled heat sink of claim 1, wherein, The liquid cooling head comprises a liquid cooling plate, the top surface and the bottom surface of the liquid cooling plate are provided with shells, the shells are sealingly connected with the liquid cooling plate to form the liquid cooling cavity, the liquid cooling plate is provided with a channel, and the channel penetrates through both ends of the liquid cooling plate.

3. The liquid-cooled heat sink of claim 2, wherein, The top surface and the bottom surface of the liquid cooling plate are provided with a plurality of fins vertically arranged along the length direction of the heat pipe, and the fins cut the liquid cooling cavity into a plurality of liquid cooling flow channels.

4. The liquid-cooled heat sink of claim 3, wherein, The liquid inlet and the liquid outlet are respectively located on the horizontal two sides of the liquid cooling plate, and the axis direction of the liquid inlet and the axis direction of the liquid outlet are perpendicular to the length direction of the heat pipe.

5. The liquid-cooled heat sink of claim 3, wherein, The length direction of the fin is perpendicular to the length direction of the heat pipe.

6. The liquid-cooled heat sink of claim 1, wherein, The heat plate comprises a shell, a copper column, a capillary connecting ring and a cover plate, the shell and the cover plate are covered to form the vacuum cavity, the copper column is arranged in the shell and abuts against the cover plate, the shell and the cover plate are provided with capillary structures, and the capillary connecting ring is sleeved on the copper column. The capillary connecting ring is connected with the capillary structures of the shell and the cover plate.

7. The liquid-cooled heat sink of claim 6, wherein, The capillary structures of the shell, the capillary connecting ring and the capillary structures of the cover plate are the same or different.

8. The liquid-cooled heat sink of claim 1, wherein, The capillary connecting piece comprises a ring and two symmetrically arranged semicircular rings, the two semicircular rings are coaxially arranged at the end of the ring, a radial gap is formed between the two semicircular rings, and the gap is used for matching the support column.

9. The liquid-cooled heat sink of claim 8, wherein, The ring and the two semicircular rings are integrally formed, the capillary connecting piece has a capillary gap, and the capillary gap is used for attracting the working medium to promote the flow of the working medium between the heat pipe and the heat plate.

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