Ball mounting device

Abstract

The utility model discloses a ball mounting device which comprises a bearing disc, a soldering flux printing jig and a ball mounting jig, the bearing disc is provided with a plurality of inwards concave mounting positions which are arranged at intervals, the mounting positions are used for mounting semiconductor packaging pieces to be subjected to ball mounting, and a plurality of bonding pads are arranged on the semiconductor packaging pieces in an array mode. The soldering flux printing jig comprises a plurality of printing parts arranged corresponding to the mounting positions, and a plurality of first meshes are formed in the printing parts corresponding to the bonding pads so as to print soldering flux onto the bonding pads; the ball mounting jig comprises a plurality of ball mounting parts arranged corresponding to the mounting positions, a plurality of second meshes corresponding to the bonding pads are formed in the ball mounting parts, and the size of each second mesh is larger than the diameter of each solder ball, so that the solder balls penetrate through the second meshes and are adhered to the bonding pads of the semiconductor packaging part through scaling powder. According to the utility model, the ball mounting device is designed and comprises the bearing disc, the soldering flux printing jig and the ball mounting jig, so that manual ball mounting can be conveniently completed, the use requirements of small-batch testing and the like are met, the cost is low, and the use is convenient.

Description

TECHNICAL FIELD

[0001] The utility model relates to the field of semiconductor packaging especially relates to a ball mounting device. BACKGROUND

[0002] With the development of electronic product technology, in order to improve the chip integration, at present, IC products mostly adopt BGA packaging. BGA is full name Ball Grid Array (ball grid array packaging), and it is widely used in the field of chip packaging due to the advantages such as small packaging area, large number of pins and good electrical performance. At present, in production, the dedicated ball mounting equipment is usually used to mount the ball on the substrate, and the delivery quality and delivery efficiency are relatively high, but the equipment purchase cost and use cost are also relatively high, and in the sample test stage, the chip quantity is small, if the dedicated ball mounting equipment is used to mount the ball, the cost is higher, which is not conducive to cost saving and is not convenient to use. SUMMARY

[0003] The utility model aims at providing a ball mounting device to solve the problems that the existing ball mounting equipment is not conducive to cost saving and is not convenient to use.

[0004] In order to realize the above-mentioned purpose, the utility model provides a ball mounting device, which comprises a bearing disc, a flux printing jig and a ball mounting jig, a plurality of inwardly recessed mounting positions are arranged at intervals on the bearing disc, each mounting position is used for mounting a semiconductor package to be ball mounted, a plurality of pads are arranged in an array on the semiconductor package, the flux printing jig comprises a plurality of printing parts corresponding to the mounting positions, a plurality of first mesh holes are arranged on each printing part corresponding to the pads to print flux onto the pads, and the ball mounting jig comprises a plurality of ball mounting parts corresponding to the mounting positions, a plurality of second mesh holes are arranged on each ball mounting part corresponding to the pads, and the size of each second mesh hole is greater than the diameter of the solder ball so that the solder ball passes through the second mesh hole and is adhered to the pad of the semiconductor package through the flux.

[0005] Preferably, the peripheral side of the mounting position is provided with a taking and placing notch, and the taking and placing notch is communicated with the mounting position.

[0006] Preferably, the semiconductor package is rectangular, the mounting position corresponds to a rectangle, and the four corner portions of the mounting position are each provided with an avoiding circular hole.

[0007] Preferably, the bottom of each mounting position is further provided with a communication hole, the inside of the bearing disc is further provided with a flow channel, the communication hole is communicated with the flow channel, and the flow channel is connected with an external negative pressure device.

[0008] Preferably, the soldering flux printing jig comprises a first main body part, a recessed groove recessed downward from a surface of the first main body part is arranged on the first main body part, and a plurality of the printing parts are arranged on a groove bottom of the recessed groove.

[0009] Preferably, the solder ball placement jig comprises a bottom plate and a cover plate connected with the bottom plate, the solder ball placement parts are arranged on the bottom plate, and a window exposing all the solder ball placement parts is arranged on the cover plate.

[0010] Preferably, the solder ball placement parts are arranged in an array, a first interval is arranged between two adjacent columns of the solder ball placement parts, a connecting rib is further arranged on the window, and the connecting rib is arranged directly above the first interval.

[0011] Preferably, the connecting rib and the first interval have a preset interval in a vertical direction, and the preset interval is greater than the diameter of the solder ball.

[0012] Preferably, a recycling cavity is further arranged in an inner side of one end of the cover plate in a length direction, the recycling cavity is communicated with the window, a recycling opening is further arranged on the cover plate and corresponds to the recycling cavity, and the recycling opening is communicated with the recycling cavity.

[0013] Preferably, an inner side of the other end of the cover plate in the length direction is attached to the bottom plate.

[0014] Compared with the prior art, the solder ball placement device can conveniently complete manual solder ball placement, meet small batch testing and the like, has low cost and is convenient to use. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 FIG. 1 is a structural diagram of a bearing disc in a solder ball placement device according to an embodiment of the present application.

[0016] Figure 2 FIG. 2 is a structural diagram of a semiconductor package to be placed with solder balls in the solder ball placement device according to the embodiment of the present application.

[0017] Figure 3 FIG. 3 is a structural diagram of the semiconductor package to be placed with solder balls on the bearing disc in the solder ball placement device according to the embodiment of the present application.

[0018] Figure 4 FIG. 4 is a structural diagram of a soldering flux printing jig according to the embodiment of the present application.

[0019] Figure 5 FIG. 5 is a structural diagram of the soldering flux printing jig installed on the bearing disc according to the embodiment of the present application.

[0020] Figure 6 FIG. 6 is a structural diagram of a solder ball placement jig according to the embodiment of the present application.

[0021] Figure 7 A sectional view of the ball placement fixture of the embodiment of the present application.

[0022] Figure 8 A structure diagram of the ball placement fixture installed on the bearing disc of the embodiment of the present application.

[0023] Figure 9 For Figure 8 An enlarged view of A in the middle.

[0024] Figure 10 A structure diagram of a semiconductor package with balls. DETAILED DESCRIPTION

[0025] To make the technical content, structural features and effects of the present application clear, the following will be described in detail in combination with the embodiments and the accompanying drawings.

[0026] As Figures 1 to 10As shown, the utility model embodiment provides a kind of ball mounting device, including bearing disc 1, solder printing fixture 2 and ball mounting fixture 3, bearing disc 1 is equipped with multiple inward recessed mounting sites 11 of interval arrangement, each mounting site 11 is used to install the semiconductor package 10 of being planted ball, semiconductor package 10 is arrayed with several pads 101, solder printing fixture 2 includes the multiple printing parts 212 of corresponding mounting site 11 arrangement, each printing part 212 is equipped with several first mesh 2121 to print solder to pad 101 on corresponding pad 101;Ball mounting fixture 3 includes the multiple ball mounting parts 311 of corresponding mounting site 11 arrangement, and ball mounting part 311 is equipped with several second mesh 3111 corresponding several pads 101, the size of each second mesh 3111 is greater than the diameter of solder ball 102 to make solder ball 102 pass through second mesh 3111 and be pasted on the pad 101 of semiconductor package 10 by solder.The specific, the length direction of bearing disc 1 is equipped with buckle piece on both sides, and the length direction of solder printing fixture 2 is equipped with first matching piece corresponding buckle piece on both sides, and the length direction of ball mounting fixture 3 is equipped with second matching piece corresponding buckle piece on both sides, and first matching piece and second matching piece can be same or different, as long as it can be locked with buckle piece, ball mounting device when using, first, the semiconductor package 10 of being planted ball is installed in each mounting site 11 of bearing disc 1, then solder printing fixture 2 is installed in the upper of bearing disc 1 and is locked by buckle piece and first matching piece, and solder is printed on printing part 212, and solder flows to the pad 101 below by first mesh 2121 to print solder on pad 101, and solder can be rosin, and buckle piece and first matching piece are unlocked, and solder printing fixture 2 is removed, and ball mounting fixture 3 is installed in the upper of bearing disc 1 and is locked by buckle piece and second matching piece, and solder ball 102 is poured into ball mounting fixture 3, and ball mounting fixture 3 and bearing disc 1 are held by hand and swing ball mounting fixture 3 and bearing disc 1, to make solder ball 102 roll and enter second mesh 3111 to guarantee that each pad 101 can be planted with solder ball 102, and after planting solder ball 102, ball mounting fixture 3 is removed to expose semiconductor package 10 of planting solder ball 102, and semiconductor package 10 of planting solder ball 102 is specifically as Figure 10 As shown.

[0027] The utility model embodiment designs ball mounting device, and ball mounting device includes bearing disc 1, solder printing fixture 2 and ball mounting fixture 3, can very conveniently complete manual ball mounting, satisfies small batch test and so on use, low in cost, convenient to use.

[0028] In the utility model embodiment, the circumferential side of mounting site 11 is equipped with taking and placing notches 12, and the taking and placing notches 12 are communicated with mounting site 11. Figures 1 to 3As shown, four pick-and-place notches 12 are arranged on the peripheral side of each mounting position 11, and the four pick-and-place notches 12 are symmetrically arranged in pairs, and the size of the pick-and-place notches 12 corresponds to the size of a human hand to facilitate manual installation and removal of the semiconductor package 10.

[0029] In the embodiment of the utility model, the semiconductor package 10 is rectangular, and the mounting position 11 is correspondingly rectangular, and the four corners of the mounting position 11 are each provided with a clearance hole 14. Figures 1 to 3 As shown, the clearance hole 14 can avoid damaging the semiconductor package 10.

[0030] In the embodiment of the utility model, as shown in Figure 1 As shown, the bottom of each mounting position 11 is further provided with a communication hole 13, and the inside of the bearing disc 1 is further provided with a flow channel, the communication hole 13 is in communication with the flow channel, and the flow channel is connected with an external negative pressure device. Specifically, the communication hole 13 is a circular hole, and the flow channel can be a hole arranged inside the bearing disc 1, and the communication hole 13 is in communication with the negative pressure device through the flow channel, so that the semiconductor package 10 can be better adsorbed on the mounting position 11, and the semiconductor package 10 can be prevented from moving in the printing of the flux and the ball placement process, thereby affecting the printing of the flux and the ball placement effect.

[0031] In the embodiment of the utility model, as shown in Figure 4 and Figure 5 As shown, the flux printing jig 2 comprises a first main body 21, the first main body 21 is provided with a recessed groove 211 recessed downward from the surface of the first main body 21, and a plurality of printing parts 212 are arranged on the groove bottom of the recessed groove 211. Specifically, the material of the flux printing jig 2 can be steel, and the flux printing jig 2 can be used repeatedly, effectively saving the cost, and by arranging the printing parts 212 on the groove bottom of the recessed groove 211, the brush coated with flux can be conveniently coated on the groove bottom, and the printing effect is good.

[0032] In the embodiment of the utility model, as shown in Figures 6 to 9 As shown, the ball placement jig 3 comprises a bottom plate 31 and a cover plate 32 connected with the bottom plate 31, the bottom plate 31 is provided with a ball placement part 311, and the cover plate 32 is provided with a window 324, and the window 324 exposes all the ball placement parts 311. Specifically, the cover plate 32 can be a plastic steel material, which can effectively prevent static electricity, and the bottom plate 31 can be steel, which can be used repeatedly, effectively saving the cost, the ball placement jig 3 is divided into two parts of the bottom plate 31 and the cover plate 32, which can better prevent static electricity and better balance the service life of the ball placement jig, and the setting is ingenious.

[0033] Further, the plurality of ball mounting portions 311 are arranged in an array, and a first interval 312 is provided between two adjacent rows of ball mounting portions 311. The window 324 is further provided with a connecting rib 321, and the connecting rib 321 is arranged directly above the first interval 312. When the first interval 312 is two, the connecting rib 321 is also two, further strengthening the structural strength of the cover plate 32.

[0034] Further, the connecting rib 321 and the first interval 312 have a preset interval in the vertical direction, and the preset interval is greater than the diameter of the solder ball 102. Specifically, the preset interval ensures that the solder ball 102 can roll on the bottom plate 31 at will and will not be blocked by the connecting rib 321.

[0035] In the embodiment of the utility model, the inside of one end of the length direction of the cover plate 32 is further provided with a recycling cavity 322, and the recycling cavity 322 is communicated with the window 324. The cover plate 32 is further provided with a recycling port 323 corresponding to the recycling cavity 322, and the recycling port 323 is communicated with the recycling cavity 322. Specifically, the solder ball 102 can be a tin ball. When the ball mounting is performed, a plurality of solder balls 102 can be poured on the bottom plate 31. After all the solder balls 102 are implanted on the solder pad 101, the remaining solder balls 102 are moved to the recycling cavity 322 and recycled through the recycling port 323.

[0036] In the embodiment of the utility model, the inside of the other end of the length direction of the cover plate 32 is attached to the bottom plate 31, ensuring that the movable area of the solder ball 102 is small, and the ball mounting can be conveniently performed.

[0037] The above disclosure is only a preferred embodiment of the utility model, and of course cannot limit the scope of the utility model. Therefore, equivalent changes made in the scope of the utility model patent application still belong to the scope covered by the utility model.

Claims

1. A ball-planting device, characterized in that The application relates to a bearing disc, a flux printing jig and a ball mounting jig, wherein the bearing disc is provided with a plurality of inwardly recessed mounting positions arranged at intervals, each of the mounting positions being used for mounting a semiconductor package to be ball mounted, and a plurality of printing parts corresponding to the mounting positions are arranged on the flux printing jig, each of the printing parts being provided with a plurality of first meshes corresponding to the pads so as to print flux onto the pads. The ball mounting jig is provided with a plurality of ball mounting parts corresponding to the mounting positions, and each of the ball mounting parts is provided with a plurality of second meshes corresponding to the pads, each of the second meshes being larger than the diameter of the solder balls so that the solder balls can pass through the second meshes and be adhered to the pads of the semiconductor package through the flux.

2. The ball implantation device of claim 1, wherein The mounting position is provided with a pick-and-place recess on the circumferential side, and the pick-and-place recess is communicated with the mounting position.

3. The ball implantation device of claim 1, wherein The semiconductor package is in a rectangular shape, the mounting position is also in a rectangular shape, and each of the four corner portions of the mounting position is provided with an avoiding circular hole.

4. The ball implantation device of claim 1, wherein The bottom of each of the mounting positions is further provided with a communicating hole, the inside of the bearing disc is further provided with a flow channel, the communicating hole is communicated with the flow channel, and the flow channel is connected with an external negative pressure device.

5. The ball implantation device of claim 1, wherein The flux printing jig comprises a first main body part, the first main body part is provided with a recessed groove recessed downward from the surface of the first main body part, and a plurality of the printing parts are arranged on the groove bottom of the recessed groove.

6. The ball implantation device of claim 1, wherein The ball mounting jig comprises a bottom plate and a cover plate connected with the bottom plate, the bottom plate is provided with the ball mounting parts, the cover plate is provided with a window, and the window exposes all the ball mounting parts.

7. The ball implantation device of claim 6, wherein A plurality of the ball mounting parts are arranged in an array, a first interval is arranged between two adjacent columns of the ball mounting parts, the window is further provided with a connecting rib, and the connecting rib is arranged directly above the first interval.

8. The ball implantation device of claim 7, wherein The connecting rib and the first interval have a preset interval in the vertical direction, and the preset interval is larger than the diameter of the solder balls.

9. The ball implantation device of claim 6, wherein An inside of one end of the cover plate in the length direction is further provided with a recycling cavity, the recycling cavity is communicated with the window, the cover plate is further provided with a recycling opening corresponding to the recycling cavity, and the recycling opening is communicated with the recycling cavity.

10. The ball implantation device of claim 9, wherein An inside of the other end of the cover plate in the length direction is attached with the bottom plate.

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