Double-sided cleaning device for monocrystalline silicon wafer

Abstract

The double-sided cleaning device comprises a cleaning tank, an overturning plate, a stop lever and a push plate, the overturning plate is arranged in the cleaning tank in an overturning mode, a rotating shaft is horizontally arranged in the cleaning tank, a connecting sleeve arranged on the rotating shaft in a sleeving mode is arranged at the tail end of the overturning plate, and the push plate is arranged on the rotating shaft. A guide groove extending in the direction perpendicular to the rotating shaft is formed in the turning plate, the push plate extends to the position above the turning plate from the position below the turning plate along the guide groove, a telescopic driving mechanism extending in the length direction of the guide groove is arranged at the bottom of the turning plate, and a sliding base connected with the bottom of the push plate is arranged at the end of the telescopic driving mechanism. The stop levers are arranged on the turning plate and located on the two sides of the guide groove. According to the double-sided cleaning device for the monocrystalline silicon wafer, overturning and double-sided cleaning of the monocrystalline silicon wafer are automatically carried out, and the cleaning effect and the cleaning efficiency are improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to single crystal silicon wafer cleaning equipment field especially relates to a single crystal silicon wafer's double -sided cleaning device. BACKGROUND

[0002] Single crystal silicon wafer needs to be cleaned in the production process, and the cutting fluid and silicon powder and other dirt remaining on the single crystal silicon wafer are removed. In order to improve the cleaning efficiency, ultrasonic cleaning tank can be used for the surface cleaning of single crystal silicon wafer, such as the utility model patent with application number 2019218739711, which discloses an ultrasonic single crystal silicon wafer cleaning tank.

[0003] Single crystal silicon wafer needs to be placed on the carrier during the cleaning process, so the back or the edge of the single crystal silicon wafer is covered, which is difficult to clean. During the cleaning process of single crystal silicon wafer, it is often necessary to stop cleaning, take out the single crystal silicon wafer, turn it over, and then put it into the subsequent cleaning tank for cleaning the back, so the efficiency of the cleaning work is low and needs to be improved. UTILITY MODEL CONTENTS

[0004] The utility model aims at providing a kind of single crystal silicon wafer's double -sided cleaning device, the automatic double -sided cleaning of single crystal silicon wafer is carried out, and the cleaning efficiency and cleaning effect are improved.

[0005] To achieve this purpose, the utility model adopts the following technical solutions:

[0006] A kind of single crystal silicon wafer's double -sided cleaning device, including: cleaning tank, flap, baffle rod and push plate, the flap is reversibly arranged in cleaning tank, horizontal setting is provided with pivot in the cleaning tank, the tail end of the flap is provided with the connecting sleeve of being set on pivot, the flap is provided with the guide slot extending along the vertical pivot direction, the push plate extends from the flap below along the guide slot to the flap above, the bottom of the flap is provided with the telescopic drive mechanism extending along the length direction of guide slot, the telescopic drive mechanism end is provided with the slide seat connected with the bottom of push plate, the baffle rod is arranged on the flap and is located on the both sides of guide slot.

[0007] Among them, the cleaning tank is provided with ultrasonic transducer.

[0008] Among them, the connecting sleeve is provided with screw connected with pivot.

[0009] Among them, the cleaning tank outside is provided with motor connected with one end of pivot.

[0010] Among them, the telescopic drive mechanism uses air cylinder or electric telescopic rod.

[0011] Among them, the top of the baffle rod extends obliquely to the rear of the flap, and the included angle between the baffle rod and the flap is less than 90 degrees.

[0012] The flap plate is provided with waist holes located on both sides of the guide groove.

[0013] The cleaning tank is equipped with a water inlet pipe on one side and a drain pipe at the bottom, with valves installed on both the water inlet pipe and the drain pipe.

[0014] The cleaning tank is equipped with a stop block located above the front end of the flip plate, and the front end of the flip plate contacts the stop block when it flips up to a horizontal state.

[0015] The beneficial effects of this utility model are as follows: A double-sided cleaning device for monocrystalline silicon wafers places the monocrystalline silicon wafer on a flip plate, and cleans the front side as the flip plate flips down. The monocrystalline silicon wafer can be reversed during the flipping process, and the back side of the monocrystalline silicon wafer is automatically cleaned, thereby achieving double-sided cleaning, improving the cleaning effect, avoiding cleaning dead corners, and having a high degree of automation and improving cleaning efficiency. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of this utility model;

[0017] Figure 2 yes Figure 1 Top view;

[0018] Figure 3 yes Figure 1 A schematic diagram of the structure for cleaning the front side of a monocrystalline silicon wafer by flipping down the flip plate;

[0019] Figure 4 yes Figure 3 The diagram shows the structure of the flip plate continuing to flip down to clean the back of the monocrystalline silicon wafer. Detailed Implementation

[0020] The following is combined Figures 1 to 4 The technical solution of this utility model will be further illustrated through specific embodiments.

[0021] like Figure 1 and Figure 2 The double-sided cleaning device for monocrystalline silicon wafers shown includes: a cleaning tank 1, a flip plate 2, a baffle 10, and a push plate 6. A water inlet pipe 8 is provided on one side of the cleaning tank 1 to introduce cleaning solution into the cleaning tank 1. A drain pipe 11 is provided at the bottom of the cleaning tank 1 to discharge wastewater. In this embodiment, valves 15 are respectively provided on the water inlet pipe 8 and the drain pipe 11 for easy operation.

[0022] The flip plate 2 is rotatably installed in the cleaning tank 1. A rotating shaft 9 is horizontally installed in the cleaning tank 1. A connecting sleeve 3 is provided at the tail end of the flip plate 2 and sleeved on the rotating shaft 9. The tail end of the flip plate 2 is welded and fixed to the connecting sleeve 3, and the flipping synchronization is good.

[0023] In this embodiment, the connecting sleeve 3 is provided with screws 16 that connect to the rotating shaft 9, which facilitates assembly and allows the connecting sleeve 3 to rotate with the rotating shaft 9. A motor 17 is provided on the outside of the cleaning tank 1 and connected to one end of the rotating shaft 9. The motor 17 is a servo motor and can be controlled by a PLC to ensure rotational accuracy.

[0024] A stop block 7 is provided in the cleaning tank 1, located above the front end of the flap 2. When the front end of the flap 2 is flipped up to a horizontal state, it contacts the stop block 7. Figure 1 As shown, ensure that flap 2 remains horizontal in the initial state.

[0025] A guide groove 14 extending along the vertical axis 9 is provided on the flip plate 2. The push plate 6 extends from below the flip plate 2 along the guide groove 14 to above the flip plate 2. By moving laterally in the guide groove 14, the push plate 6 moves the monocrystalline silicon wafer 5 to the right and resets it on the flip plate 2. After the monocrystalline silicon wafer 5 is cleaned, the flip plate 2 flips up to a horizontal position. The push plate 6 moves the monocrystalline silicon wafer 5 to the right and resets it on the flip plate 2, avoiding the stop bar 10, which facilitates the smooth unloading of the monocrystalline silicon wafer 5.

[0026] like Figure 1 As shown, the bottom of the flip plate 2 is provided with a telescopic drive mechanism 4 extending along the length direction of the guide groove 14. The end of the telescopic drive mechanism 4 is provided with a slide block 12 connected to the bottom of the push plate 6. The slide block 12 can drive the movement of multiple push plates 6, reducing costs. In this embodiment, the telescopic drive mechanism 4 adopts a cylinder or an electric telescopic rod, which can be telescopically controlled by a PLC to drive the left and right movement of the slide block 12.

[0027] The stop bar 10 is mounted on the flap 2 and positioned on both sides of the guide groove 14, as follows: Figure 3 As shown, after the flip plate 2 flips down, the monocrystalline silicon wafer 5 is immersed in the cleaning solution. The monocrystalline silicon wafer 5 slides down along the tilt angle of the flip plate 2 and is limited by the stop bar 10 to prevent it from falling off the flip plate 2.

[0028] like Figure 2 As shown, the monocrystalline silicon wafer 5 is first placed on the flip plate 2, and then immersed in the cleaning solution below for front-side cleaning as the flip plate 2 flips down. The cleaning tank 1 is equipped with an ultrasonic transducer 18 to achieve ultrasonic cleaning of the monocrystalline silicon wafer 5, improving the cleaning effect. Furthermore, in this embodiment, the flip plate 2 is provided with waist holes 13 located on both sides of the guide groove 14. The waist holes 13 increase the contact between the cleaning solution and the back side of the monocrystalline silicon wafer 5, improving the cleaning effect on the back side.

[0029] like Figure 1 As shown, the top of the stop bar 10 extends obliquely behind the flip plate 2, and the angle between the stop bar 10 and the flip plate 2 is less than 90 degrees, thus limiting the flipping of the monocrystalline silicon wafer 5. Figure 4As shown, after the flap 2 is flipped over 90° from horizontal downward, the single crystal silicon wafer 5 is automatically flipped over and contacts the stop lever 10 to limit the flipping, and the back of the single crystal silicon wafer 5 is cleaned, so that the degree of automation is high, and the cleaning efficiency is improved.

[0030] The above merely describes the preferred embodiments of the present application, and for those skilled in the art, according to the idea of the present application, the specific implementation manner and application range can be changed, and the content of the specification should not be understood as limiting the present application.

Claims

1. A double-side cleaning apparatus for single crystal silicon wafers, characterized by comprising: The utility model relates to a cleaning tank, a flap, a blocking rod and a push plate, the flap is reversibly arranged in the cleaning tank, a rotating shaft is horizontally arranged in the cleaning tank, a connecting sleeve is arranged on the tail end of the flap and sleeved on the rotating shaft, a guide groove is arranged on the flap and extends along the vertical direction of the rotating shaft, the push plate extends from below the flap to above the flap along the guide groove, a telescopic drive mechanism is arranged on the bottom of the flap and extends along the length direction of the guide groove, a sliding seat is arranged on the end of the telescopic drive mechanism and connected with the bottom of the push plate, and the blocking rod is arranged on the flap and located on both sides of the guide groove. The cleaning tank is provided with an ultrasonic vibrator.

2. The apparatus for cleaning both surfaces of a single crystal silicon wafer according to claim 1, wherein The connecting sleeve is provided with a screw connected with the rotating shaft.

3. The apparatus for cleaning both surfaces of a single crystal silicon slice according to claim 1, wherein The cleaning tank is provided with a motor connected with one end of the rotating shaft.

4. The apparatus for cleaning both surfaces of a single crystal silicon slice according to claim 1, wherein The telescopic drive mechanism adopts a pneumatic cylinder or an electric telescopic rod.

5. The apparatus for cleaning both surfaces of a single crystal silicon slice according to claim 1, wherein The top of the blocking rod extends obliquely to the back of the flap, and the included angle between the blocking rod and the flap is less than 90 degrees.

6. The apparatus for cleaning both surfaces of a single crystal silicon slice according to claim 1, wherein The flap is provided with waist holes located on both sides of the guide groove.

7. The apparatus for cleaning both surfaces of a single crystal silicon slice according to claim 1, wherein One side of the cleaning tank is provided with a water inlet pipe, and the bottom of the cleaning tank is provided with a drain pipe, and the water inlet pipe and the drain pipe are respectively provided with valves.

8. The apparatus for cleaning both surfaces of a single crystal silicon slice according to claim 1, wherein The cleaning tank is provided with a stop block located above the front end of the flap, and the front end of the flap is in contact with the stop block when it is turned up to the horizontal state.

9. The apparatus for cleaning both surfaces of a single crystal silicon slice according to claim 1, wherein ​

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