Cleaning carrier

Abstract

The utility model provides a cleaning carrier which comprises a base plate, a cross-shaped partition piece is arranged on the top face of the base plate, the surface of the base plate is divided into four installation areas through the cross-shaped partition piece, a plurality of leakage holes are formed in the surface of the base plate, a clamping plate body is arranged on each of the four installation areas of the base plate, and the clamping plate bodies are arranged on the base plate. The clamping plate bodies are movably connected to the surface of the base plate through screws, the left clamping plate body and the right clamping plate body serve as a pair, the inner side faces of the left clamping plate body and the right clamping plate body are oppositely arranged, and the lower portions of the inner side faces of the clamping plate bodies extend outwards to be provided with step placing parts. And lifting frames are outwards arranged in the middles of two outer side edges of the base plate. The cleaning carrier is simple in structure and reasonable in design, can clean two wafers at the same time, stably clamps notches in the edges of the two sides of the wafers through the left clamping plate body and the right clamping plate body, guarantees the stability of the wafers in the ultrasonic cleaning process, and improves the cleaning efficiency. Therefore, the purposes of high cleaning efficiency and prevention of collision or damage of the wafer are achieved.

Description

TECHNICAL FIELD

[0001] The utility model relates to wafer ultrasonic cleaning technical field, specifically, it displays a kind of cleaning carrier. BACKGROUND

[0002] Wafer refers to the silicon wafer used for the manufacture of silicon semiconductor integrated circuit, since its shape is circular, it is called wafer, and usually the opposite two edges of wafer are provided with straight notches. Various circuit element structures can be processed and manufactured on the silicon wafer, and the wafer becomes an IC product with specific electrical properties. The raw material of the wafer is silicon. During wafer processing, the wafer needs to be cleaned. During cleaning, the wafer is usually cleaned by an ultrasonic cleaning device.

[0003] A semiconductor wafer ultrasonic cleaning machine is disclosed in the prior art patent CN222020247U. The cleaning machine main body is provided with a water inlet pipe on the right side, a water outlet pipe on the left side, and a protective door hinged on the left side of the cleaning machine main body. The left end of the water inlet pipe is connected with the cleaning cavity in the cleaning machine main body. The left bottom of the cleaning cavity is connected with the water outlet pipe. The periphery of the cleaning cavity in the cleaning machine main body is provided with a working cavity.

[0004] The problem with this scheme is that multiple wafers are placed in the cleaning basket at the same time, and then the cleaning basket is placed in the ultrasonic cleaning machine for cleaning. Although this method can clean many wafers at a time, the cleaning liquid in the ultrasonic cleaning machine will vibrate continuously during operation, which will cause the wafers in the cleaning basket to vibrate to some extent, and the wafers will accidentally collide with the inner wall of the cleaning basket, which may cause wear and tear to the wafers, thereby affecting product quality. UTILITY MODEL CONTENTS

[0005] The utility model aims to provide a cleaning carrier that can ensure the stability of the wafer position during cleaning.

[0006] The technical scheme is as follows:

[0007] A cleaning carrier includes a base plate, a cross-shaped partition is provided on the top surface of the base plate, the surface of the base plate is divided into four mounting areas by the cross-shaped partition, a plurality of leakage holes are formed in the surface of the base plate, and a clamping plate body is arranged on each of the four mounting areas of the base plate. The clamping plate body is movably connected to the surface of the base plate by screws. The left and right clamping plate bodies are a pair, and the inner sides of the left and right clamping plate bodies are oppositely arranged. The inner side of the clamping plate body extends outward to form a stepped resting portion at the lower part. A bracket is arranged outwardly in the middle of two outer sides of the base plate.

[0008] Further, the cross-shaped partition has four branches distributed in a cross shape, and the center of the cross-shaped partition coincides with the center of the base plate. The symmetrical design can bring visual balance and stability, and can make the base plate more stable and achieve better wafer placement balance.

[0009] Further, the base plate is square, and the branches of the cross-shaped partition are perpendicular to the side edges of the base plate. It can ensure that there is sufficient space on the surface of the base plate for clamping the wafer.

[0010] Further, one side edge of the clamping plate body abuts against one of the branches, and the inner side of the clamping plate body is parallel and spaced apart from the adjacent other branch. This can always ensure that the clamping surface of the clamping plate body is horizontal, better fits the wafer edge notch, and ensures the clamping tightness of the wafer.

[0011] Further, the thickness of the branch is consistent with the thickness of the stepped resting portion. The middle position of the bottom end of the wafer can well fit the top surface of the branch, forming a good supporting effect.

[0012] Further, the surface of the clamping plate body is symmetrically provided with two inward strip-shaped grooves, the inner lower end of the strip-shaped groove is provided with an annular inner edge blocking portion, and a through hole corresponding to the strip-shaped groove is formed on the surface of the base plate. The strip-shaped groove and the through hole are connected by screw and nut, and the relative position between the strip-shaped groove and the through hole can be adjusted to change the distance between the two clamping plate bodies, so as to realize the clamping effect of wafers of different sizes. The inner edge blocking portion in the strip-shaped groove is designed to hide the installation of the screw.

[0013] Further, a soft pad layer is arranged at the angle position between the clamping plate body and the stepped resting portion. The design of the soft pad layer is to form clamping protection for the wafer and avoid excessive clamping deformation of the notch of the wafer edge by the clamping plate body.

[0014] Further, the lifting frame includes a pair of lifting rods and a cross beam connected between the top ends of the pair of lifting rods. The design of the lifting frame is to facilitate labor saving.

[0015] Further, the middle position of the outer side edge of the base plate is recessed inward to form a reserved slot, and the bottom end of the lifting rod is welded in the reserved slot. It avoids the abnormal protrusion of the connection part between the lifting frame and the base plate.

[0016] Further, the base plate, the cross-shaped partition, the clamping plate body, and the lifting frame are made of Teflon material. The chemical corrosion resistance of the carrier is improved, and the stability is good.

[0017] Compared with the prior art, the utility model has the advantages of simple structure, reasonable design and convenient operation. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 A simple structure schematic view of the cleaning carrier of the utility model embodiment is shown in the figure.

[0019] Figure 2 A sectional view schematic view of the utility model embodiment about the substrate is shown in the figure.

[0020] Figure 3 An enlarged schematic view of the connecting part between the substrate and the bracket of the utility model embodiment is shown in the figure.

[0021] The related marks in the figure are as follows: 1 - substrate, 2 - cross type spacer, 3 - clamping plate body, 4 - bracket; 11 - leakage hole, 12 - through hole, 13 - reserved slot, 21 - branch, 31 - step resting part, 32 - strip-shaped groove, 33 - inner edge blocking part, 34 - soft pad layer, 41 - lifting rod, 42 - cross beam. DETAILED DESCRIPTION

[0022] The technical scheme in the utility model embodiment will be clearly and completely described below with reference to the drawings in the utility model embodiment. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the utility model.

[0023] The utility model embodiment provides a kind of cleaning carrier, to solve the technical problem proposed in background art.

[0024] As shown in Figure 1 , Figure 2 And Figure 3 . The cleaning carrier includes a horizontal substrate 1, a cross type spacer 2 is arranged on the top surface of the substrate 1, the surface of the substrate 1 is divided into four mounting areas by the arrangement of the cross type spacer 2; the cross type spacer 2 has four branch bodies 21 distributed in cross shape, the center of the cross type spacer 2 coincides with the center of the substrate 1, and the height symmetry design can bring visual balance and stability first, and secondly can make the substrate more stable, realize better wafer placement balance; the substrate 1 is square, the branch body 21 of the cross type spacer 2 is perpendicular to the side edge of the substrate 1, which ensures that there is sufficient space for clamping wafers in the mounting area on the substrate surface.

[0025] A plurality of leakage holes 11 are formed on the surface of the substrate 1, which are evenly distributed on the four mounting areas to form a better liquid leakage effect and ensure that the bottom surface of the wafer can be cleaned by ultrasonic waves.

[0026] Each of the four mounting areas of the substrate 1 is provided with a clamping plate body 3, and there are four clamping plate bodies 3. The clamping plate body 3 is movably connected to the surface of the substrate 1 by screws, that is, two inward strip grooves 32 are symmetrically formed on the surface of the clamping plate body 3. An annular inner edge stop 33 is arranged at the inner bottom of the strip groove 32. The inner edge stop 33 in the strip groove 32 is designed to hide the installation of the screw, and a through hole 12 corresponding to the strip groove 32 is formed on the surface of the substrate 1. The strip groove and the through hole are connected by screw nut mode, so that the distance between the left and right clamping plate bodies can be changed by adjusting the relative position between the strip groove and the through hole, so as to realize the clamping effect of the two sides of the wafer of different sizes.

[0027] Among them, the left and right clamping plate bodies 3 are a pair, and the inner sides of the left and right clamping plate bodies 3 are oppositely arranged. The inner side of the clamping plate body 3 extends outward at the lower part to form a stepped resting part 31, which is used to place the edge of the wafer, that is, the two side edges of the wafer are placed on the stepped resting parts on the left and right sides, and then the inner side of the left and right clamping plate bodies is used to form the clamping effect of the two side edges of the wafer. The middle of two outer sides of the substrate is outwardly arranged as a bracket, which facilitates the delivery of the cleaning carrier into the cleaning tank of the ultrasonic cleaner through the bracket, and also facilitates the removal, thereby improving the efficiency.

[0028] Based on the above scheme, the cleaning work of two wafers can be realized at the same time, and the left and right clamping plate bodies form a stable clamping effect on the two side edges of the wafer, which ensures the stability of the wafer during ultrasonic cleaning, and further improves the cleaning efficiency and prevents the wafer from being bumped or damaged.

[0029] In this embodiment, one side edge of the clamping plate body 3 can abut against one of the support bodies 21, and the inner side of the clamping plate body 3 is parallel and spaced apart from the other adjacent support body 21. In this way, the clamping surface of the clamping plate body can always be horizontal, better matching the edge cut of the wafer, and ensuring the clamping tightness of the wafer.

[0030] Among them, the thickness of the support body 21 is consistent with the thickness of the stepped resting part 31. When the two side edges of the wafer are just placed on the stepped resting part, the middle position of the bottom end of the wafer can also be well matched with the top surface of the support body, thereby forming a good supporting effect on the wafer and making the wafer balanced.

[0031] In the embodiment, the soft pad layer 34 is arranged at the angle position between the clamping plate body 3 and the stepped resting portion 31, the soft pad layer can be made of perfluorinated rubber, and the corrosion resistance is improved. The soft pad layer is designed to protect the wafer from being clamped and deformed excessively due to the notch of the wafer edge.

[0032] In the embodiment, the lifting frame 4 comprises a pair of lifting rods 41 and a cross beam 42 connected between the top ends of the pair of lifting rods 41, and the lifting frame is designed to be convenient and labor-saving. Moreover, the reserved recess 13 is arranged in the middle of the outer side of the substrate 1 and recessed inwardly, and the bottom end side of the lifting rod 41 is arranged in the reserved recess 13 by welding. The abnormal protrusion of the connecting position between the lifting frame and the substrate is avoided.

[0033] It should be noted that the substrate 1, the cross-shaped spacer 2, the clamping plate body 3 and the lifting frame 4 are all made of Teflon material. In this way, the chemical corrosion resistance of the cleaning carrier is improved, the stability is good, and the service life is prolonged.

[0034] The above only describes some embodiments of the present application. For those skilled in the art, without departing from the inventive concept, a number of modifications and improvements can be made, which all belong to the protection scope of the present application.

Claims

1. A cleaning vehicle, characterized by The utility model provides a kind of substrate, the top surface of the substrate is provided with cross partition, by the setting of cross partition, the surface of the substrate is divided into four mounting areas, the surface of the substrate is provided with a plurality of leakage holes, the four mounting areas of the substrate are each provided with a clamping plate body, the clamping plate body is movably connected to the surface of the substrate by screw, left and right clamping plate bodies are a pair, and the inner side of left and right clamping plate bodies is oppositely arranged, the inner side of the clamping plate body is outwardly extended and provided with a stepped rest portion at lower part;Two outer sides of the substrate are outwardly provided with a bracket.

2. A cleaning vehicle according to claim 1, wherein, The cross partition has four branch bodies distributed in cross shape, and the center of the cross partition coincides with the center of the substrate.

3. A cleaning vehicle according to claim 2, wherein, The substrate is square, and the branch bodies of the cross partition are perpendicular to the side edges of the substrate.

4. A cleaning vehicle according to claim 3, wherein, One side edge of the clamping plate body abuts against one of the branch bodies, and the inner side of the clamping plate body is parallelly and spacedly arranged with another adjacent branch body.

5. A cleaning vehicle as claimed in claim 4, wherein the cleaning vehicle is configured to clean the surface by moving the cleaning vehicle in a direction substantially parallel to the surface. The thickness of the branch body is consistent with the thickness of the stepped rest portion.

6. The cleaning vehicle of claim 1, wherein, The surface of the clamping plate body is symmetrically provided with two inward strip-shaped grooves, the inner lower end of the strip-shaped groove is provided with an annular inner edge stop portion, and the surface of the substrate is provided with a through hole corresponding to the strip-shaped groove.

7. The cleaning vehicle of claim 1, wherein, A soft pad layer is arranged at the angle position between the clamping plate body and the stepped rest portion.

8. The cleaning vehicle of claim 1, wherein, The bracket includes a pair of lifting rods and a cross beam connected and arranged between the top ends of the pair of lifting rods.

9. A cleaning vehicle according to claim 8, wherein, The outer side of the substrate is inwardly recessed and provided with a reserved slot at the middle position, and the bottom end of the lifting rod is welded in the reserved slot.

10. The cleaning vehicle of claim 1, wherein, The substrate, cross partition, clamping plate body and bracket are made of Teflon material.

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