Single-mounting-hole semiconductor device with safety protection carrier
By using the snap-fit structure of the package shell and the package cover, the problem of low bolt fixing efficiency in the semiconductor device packaging process is solved, achieving a fast and convenient packaging effect.
Patent Information
- Application Number
- CN202522408684.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-11-13
- Publication Date
- 2025-12-16
- Estimated Expiration
- 2035-11-13
AI Technical Summary
Existing semiconductor devices require a large number of bolts for fixing during the packaging process, resulting in low installation efficiency.
It adopts a snap-fit structure of encapsulation shell and encapsulation cover, and achieves quick fixation through fixing rod, moving plate, fixing block and adjustment structure, reducing the use of bolts.
It greatly reduces the number of bolts, improves packaging efficiency, and facilitates device use.
Smart Images

Figure CN223680096U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to a semiconductor technology field especially a single mounting hole semiconductor device with safety protection carrier. BACKGROUND
[0002] With the development of science and technology, electronic products also develop, and the development of electronic products cannot be separated from the progress of semiconductor technology, and simultaneously due to the continuous upgrading of electronic product technology, such as computer system or multifunctional electronic product, it needs large capacity dynamic random access memory, in order to improve the memory capacity of memory, the memory unit needs higher integration, therefore, high integration semiconductor memory device is needed.
[0003] The existing semiconductor device needs to be fixed and installed at the corner through bolts during packaging, and a large number of bolt installations are inconvenient, which reduces the disassembly efficiency of the device, and is not conducive to the use of the device. UTILITY MODEL CONTENT
[0004] The utility model discloses a single mounting hole semiconductor device with safety protection carrier, which solves the problems in the prior art.
[0005] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme:
[0006] A single mounting hole semiconductor device with safety protection carrier, comprising:
[0007] The packaging shell and the packaging cover, the inside of the packaging shell is fixedly installed with a fixed rod, the fixed rod penetrates the packaging cover and extends above the packaging cover, and the semiconductor device is fixedly installed in the inside of the packaging shell.
[0008] The clamping structure comprises a moving plate slidably installed on the side wall of the packaging cover, the side wall of the moving plate is fixedly connected with a fixed plate, the side wall of the fixed plate is fixedly connected with a fixed clamping block, an installation block is fixedly installed on the packaging shell, a fixed clamping groove corresponding to the fixed clamping block is formed in the side wall of the installation block, corresponding adjusting plates are fixedly connected between the moving plates, and an adjusting structure is installed on the packaging cover.
[0009] Preferably, the adjusting structure comprises a connecting plate rotatably installed on the packaging cover, the connecting plate is sleeved on the outside of the fixed rod, a fixed cam is fixedly sleeved on the outside of the connecting plate, the position of the fixed cam corresponds to the adjusting plate, a fixed bolt is threadedly connected to the fixed rod, a rotating block is fixedly installed on the fixed bolt, and corresponding adjusting blocks are fixedly installed on the connecting plate and the rotating block.
[0010] Preferably, the outer side of the fixed cam and the adjusting plate are fixedly wrapped with soft protective layers, and the shape of the fixed cam matches the mounting block.
[0011] Preferably, the side wall of the moving plate is fixedly connected with a sliding block, a sliding groove corresponding to the sliding block is formed on the packaging cover, and a fixed spring is fixedly connected between the sliding block and the inner wall of the sliding groove.
[0012] Preferably, the bottom end of the packaging shell is fixedly installed with a heat conduction block, and the heat conduction block is fixedly connected with the semiconductor device.
[0013] Preferably, the packaging shell and the packaging cover are integrally made of plastic.
[0014] Compared with the prior art, the semiconductor device packaging device has the advantages that the number of required mounting bolts is greatly reduced, the device is fixed and packaged through the clamping block and other structures, the packaging of the device is more convenient, the efficiency of the semiconductor device packaging is effectively improved, and the use of the device is facilitated. BRIEF DESCRIPTION OF DRAWINGS
[0015] Figure 1 A three-dimensional structural schematic view of a single-mounting-hole semiconductor device with a safety protection carrier is provided in the utility model;
[0016] Figure 2 A three-dimensional structural schematic view of a single-mounting-hole semiconductor device with a safety protection carrier is provided in the utility model; Figure 1 An enlarged view of A in the middle;
[0017] Figure 3 A three-dimensional structural schematic view of a single-mounting-hole semiconductor device with a safety protection carrier is provided in the utility model.
[0018] In the drawing: 1, packaging shell; 2, packaging cover; 3, mounting block; 4, fixed clamping groove; 5, moving plate; 6, adjusting plate; 7, fixed plate; 8, fixed clamping block; 9, connecting plate; 10, fixed cam; 11, fixed bolt; 12, rotating block; 13, sliding block; 14, sliding groove; 15, fixed spring; 16, fixed rod; 17, adjusting block. DETAILED DESCRIPTION
[0019] Referring to Figures 1-3 A single-mounting-hole semiconductor device with a safety protection carrier comprises:
[0020] The packaging shell 1 is internally fixedly installed with a fixed rod 16, the fixed rod 16 penetrates through the packaging cover 2 and extends above the packaging cover 2, the semiconductor device is fixedly installed in the interior of the packaging shell 1, and the semiconductor device is fixedly packaged by the packaging shell 1 and the packaging cover 2.
[0021] The engagement structure comprises a moving plate 5 slidably mounted on the side wall of the package cover 2, the side wall of the moving plate 5 is fixedly connected with a fixed plate 7, the side wall of the fixed plate 7 is fixedly connected with a fixed clamping block 8, the package shell 1 is fixedly provided with a mounting block 3, the side wall of the mounting block 3 is provided with a fixed clamping groove 4 corresponding to the fixed clamping block 8, the corresponding moving plates 5 are fixedly connected with an adjusting plate 6, and the package cover 2 is provided with an adjusting structure;
[0022] Under the action of the adjusting structure, the moving plate 5 moves towards the mounting block 3, the fixed plate 7 fixedly connected with the moving plate 5 is driven to move, the fixed clamping block 8 moves together, the fixed clamping block 8 extends into the fixed clamping groove 4, and the package shell 1 and the package cover 2 are fixed together to be further fixed and packaged;
[0023] The adjusting structure comprises a connecting plate 9 rotatably mounted on the package cover 2, the connecting plate 9 is sleeved on the outer side of a fixed rod 16, the outer side of the connecting plate 9 is fixedly sleeved with a fixed cam 10, the position of the fixed cam 10 corresponds to the adjusting plate 6, the fixed rod 16 is screw-connected with a fixed bolt 11, the fixed bolt 11 is fixedly provided with a rotating block 12, and the connecting plate 9 and the rotating block 12 are both fixedly provided with corresponding adjusting blocks 17;
[0024] The rotating block 12 is rotated, the fixed bolt 11 fixedly connected with the rotating block 12 is driven to rotate, along with the rotation of the fixed bolt 11, the rotating block 12 moves towards the connecting plate 9, and finally abuts against the connecting plate 9, so that the package cover 2 and the package shell 1 are fixed, and meanwhile, in the movement process of the rotating block 12 towards the connecting plate 9, the adjusting blocks 17 on the connecting plate 9 and the rotating block 12 contact and press each other, so that the connecting plate 9 rotates, the rotation of the connecting plate 9 drives the fixed cam 10 fixedly connected with the connecting plate 9 to rotate, and after the rotation of the fixed cam 10, the adjusting plate 6 moves towards the connecting plate 8;
[0025] The outer sides of the fixed cam 10 and the adjusting plate 6 are fixedly wrapped with soft protective layers, so that the fixed cam 10 and the adjusting plate 6 are protected and are prevented from being damaged, and the shape of the fixed cam 10 matches the mounting block 3, so that the fixed cam 10 can extend into the fixed clamping groove 4 after the rotation;
[0026] The side wall of the moving plate 5 is fixedly connected with a sliding block 13, the package cover 2 is provided with a sliding groove 14 corresponding to the sliding block 13, and a fixed spring 15 is fixedly connected between the sliding block 13 and the inner wall of the sliding groove 14, in the initial state, the fixed cam 10 makes the moving plate 5 located at the outermost side, at this time, the fixed spring 15 is deformed, and after the rotation of the fixed cam 10, the elastic force of the fixed spring 15 drives the sliding block 13 to move, and the moving plate 5 fixedly connected with the sliding block 13 is driven to move;
[0027] The bottom end of the packaging shell 1 is fixedly provided with a heat conduction block, and the heat conduction block is fixedly connected with the semiconductor device, and the heat conduction block is used for heat dissipation during operation of the semiconductor device; the packaging shell 1 and the packaging cover 2 are integrally made of plastic, so that the packaging shell 1 and the packaging cover 2 are prevented from being corroded by external environment, and meanwhile, insulation effect is achieved.
[0028] In the utility model, when the device is used, the packaging shell 1 and the packaging cover 2 are combined together, then the rotating block 12 is rotated, the fixed bolt 11 fixedly connected with the rotating block 12 is rotated, along with the rotation of the fixed bolt 11, the rotating block 12 is close to the connecting plate 9, finally abuts against the connecting plate 9, the packaging cover 2 and the packaging shell 1 are fixed, meanwhile, in the process that the rotating block 12 moves to the connecting plate 9, the adjusting block 17 on the connecting plate 9 and the rotating block 12 will contact and extrude each other, so that the connecting plate 9 is rotated, the rotation of the connecting plate 9 will make the fixed cam 10 fixedly connected with the connecting plate 9 rotate together, after the rotation of the fixed cam 10, the elastic force of the fixed spring 15 pushes the sliding block 13 to move, drives the moving plate 5 fixedly connected with the sliding block 13 to move, makes the moving plate 5 move to the direction of the mounting block 3, drives the fixed plate 7 fixedly connected with the moving plate 5 to move, makes the fixed clamping block 8 move together, makes the fixed clamping block 8 extend into the fixed clamping groove 4, so that the packaging shell 1 and the packaging cover 2 are fixed together, further fixed and packaged.
Claims
1. A single-mount-hole semiconductor device with a safety protection carrier, characterized in that, include: The package includes a housing (1) and a cover (2). A fixing rod (16) is fixedly installed inside the housing (1). The fixing rod (16) passes through the cover (2) and extends above the cover (2). The semiconductor device is fixedly installed inside the housing (1). The locking structure includes a movable plate (5) that is slidably mounted on the side wall of the encapsulation cover (2). A fixed plate (7) is fixedly connected to the side wall of the movable plate (5). A fixed locking block (8) is fixedly connected to the side wall of the fixed plate (7). An installation block (3) is fixedly mounted on the encapsulation shell (1). A fixing slot (4) corresponding to the fixed locking block (8) is opened on the side wall of the installation block (3). An adjustment plate (6) is fixedly connected between the corresponding movable plates (5). An adjustment structure is installed on the encapsulation cover (2).
2. A single-mount-hole semiconductor device with a safety protection carrier according to claim 1, characterized in that, The adjustment structure includes a connecting plate (9) rotatably mounted on the encapsulation cover (2). The connecting plate (9) is sleeved on the outside of the fixing rod (16). A fixing cam (10) is fixedly sleeved on the outside of the connecting plate (9), and the position of the fixing cam (10) corresponds to the adjustment plate (6). A fixing bolt (11) is threadedly connected to the fixing rod (16). A rotating block (12) is fixedly installed on the fixing bolt (11). A corresponding adjustment block (17) is fixedly installed on both the connecting plate (9) and the rotating block (12).
3. A single-mount-hole semiconductor device with a safety protection carrier according to claim 2, characterized in that, The outer sides of the fixed cam (10) and the adjusting plate (6) are both fixedly wrapped with a soft protective layer, and the shape of the fixed cam (10) matches the mounting block (3).
4. A single-mount-hole semiconductor device with a safety protection carrier according to claim 1, characterized in that, A sliding block (13) is fixedly connected to the side wall of the movable plate (5), and a sliding groove (14) corresponding to the sliding block (13) is opened on the encapsulation cover (2). A fixing spring (15) is fixedly connected between the inner wall of the sliding block (13) and the sliding groove (14).
5. A single-mount-hole semiconductor device with a safety protection carrier according to claim 1, characterized in that, A heat-conducting block is fixedly installed at the bottom of the encapsulation shell (1), and the heat-conducting block is fixedly connected to the semiconductor device.
6. A single-mount-hole semiconductor device with a safety protection carrier according to claim 1, characterized in that, The encapsulation shell (1) and encapsulation cover (2) are made entirely of plastic.