Bus communication device and electronic system

Abstract

The utility model relates to a bus communication device and an electronic system, and the bus communication device comprises a substrate and at least one daughter board. The substrate is provided with a substrate processing module and a host communication module; the substrate processing module is connected with the host communication module, and the host communication module is used for being connected with a host; each daughter board is provided with at least one external communication module, and the external communication module is used for being externally connected with a target object; wherein at least one external communication module of at least one daughter board is a bus communication module; the daughter board is installed on the substrate through a connector, and when the daughter board is installed on the substrate, the external communication module of the daughter board can communicate with the substrate processing module and communicate with the host through the substrate processing module and the host communication module.

Description

TECHNICAL FIELD

[0001] The present application relates to bus communication technology, in particular to a bus communication device and an electronic system. BACKGROUND

[0002] In the process of collecting data of equipment carried by a vehicle, or testing a controller or software under development, a host (such as an industrial computer or a host computer) and an electronic device (such as a controller under development, a vehicle-mounted sensor, a vehicle-mounted controller, etc.) based on a bus need to communicate based on a bus. Therefore, a bus communication device (which can also be understood as a bus interface device) needs to be introduced between the host and the electronic device.

[0003] The bus communication device in the prior art usually includes a circuit board, and the interface and modules for communicating with the host and the bus are all arranged on the same circuit board. This often leads to the need to customize the entire circuit board according to requirements for different projects, needs and customers, resulting in high cost. SUMMARY

[0004] Therefore, it is necessary to provide a bus communication device and an electronic system to solve the above technical problems.

[0005] In a first aspect, the present application provides a bus communication device, comprising a substrate and at least one sub-board.

[0006] The substrate is provided with a substrate processing module and a host communication module. The substrate processing module is connected to the host communication module, and the host communication module is used to connect a host.

[0007] Each of the sub-boards is provided with at least one external communication module, which is used to connect to a target object. At least one external communication module of at least one sub-board is a bus communication module. The target object includes at least one of the following: a measured object, an auxiliary device for testing, an electronic device loaded on a vehicle, and an actuator controlled by a measured software.

[0008] The sub-boards are installed on the substrate through connectors. When the sub-boards are installed on the substrate, the external communication modules of the sub-boards can communicate with the substrate processing module, and communicate with the host through the substrate processing module and the host communication module.

[0009] Optionally, the bus communication module arranged on the sub-board includes at least one of the following: a CAN bus communication module, a LIN bus communication module, a Flexray bus communication module, a vehicle-mounted Ethernet bus communication module, a DSI bus communication module, a PSI bus communication module, and a SENT bus communication module.

[0010] Optionally, the at least two sub-boards are each provided with a bus communication module, and the bus types of the bus communication modules of different sub-boards are different in some or all of the sub-boards provided with the bus communication modules.

[0011] Optionally, the substrate is further provided with a vehicle-mounted Ethernet communication module, which is configured to connect to the target object through a vehicle-mounted Ethernet.

[0012] Optionally, the substrate is further provided with a power supply module, which is configured to supply power to the circuit on the substrate and the circuit on the sub-board.

[0013] Optionally, the sub-board is further provided with a sub-board processing module, which is configured to be communicatively connected to the substrate processing module.

[0014] Optionally, the at least one external communication module of the at least one sub-board is any one of the following: an emulation module, a serial communication module, an analog quantity communication module, a digital quantity communication module, a transmission module of a customized characteristic signal, and a transmission module of a non-standard special signal.

[0015] In a second aspect, an electronic system is provided, which includes the bus communication device of the first aspect and the host.

[0016] The electronic system is a test system or a data acquisition system loaded on a vehicle.

[0017] Optionally, the electronic system further includes a selective connection device; each external communication module provides one or more communication channels;

[0018] At least part of the communication channels are connected to a first connection part of the selective connection device, different communication channels are connected to different first connection parts, and different second connection parts of the selective connection device are configured to correspond to different communication lines of the target object.

[0019] The selective connection device is configured to selectively connect the first connection part and the second connection part, so that the corresponding communication channel and the communication line are connected.

[0020] Optionally, the electronic system further includes a backboard, and the host and the bus communication device are both arranged on the backboard and communicate through the backboard.

[0021] In the above bus communication device and electronic system, the bus communication device is designed as a split type of substrate and sub-board. Since it is split, and the host communication module in the substrate usually does not change with different requirements, it is convenient to realize the design and production of batch standardization, and thus it is not necessary to customize the design and production of the whole board for each requirement change, which helps to avoid the high cost caused by the customization of the whole circuit board. BRIEF DESCRIPTION OF DRAWINGS

[0022] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the related art, the drawings needed to be used in the description of the embodiments of the present application or the related art will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other related drawings can also be obtained without creative labor on the basis of these drawings;

[0023] Figure 1 is a schematic diagram of an application scenario in an embodiment of the present application;

[0024] Figure 2 is a structure schematic diagram of a bus communication device in an embodiment of the present application; Figure 1 ;

[0025] Figure 3 is a structure schematic diagram of a bus communication device in an embodiment of the present application; Figure 2 ;

[0026] Figure 4 is a structure schematic diagram of a bus communication device in an embodiment of the present application; Figure 3 ;

[0027] Figure 5 is a structure schematic diagram of a bus communication device in an embodiment of the present application; Figure 4 ;

[0028] Figure 6 is a structure schematic diagram of a bus communication device in an embodiment of the present application; Figure 5 ;

[0029] Figure 7 is a structure schematic diagram of a bus communication device in an embodiment of the present application; Figure 6 ;

[0030] Figure 8 is a structure schematic diagram of a bus communication device in an embodiment of the present application;

[0031] Among them: 1-substrate; 2-subboard; 3-connector;

[0032] Figure 9 is a structure schematic diagram of an electronic system in an embodiment of the present application. DETAILED DESCRIPTION

[0033] For the purpose of understanding the present application, the present application will be described in more detail below with reference to the attached drawings. The embodiments of the present application are shown in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, the purpose of the embodiments is to make the disclosure of the present application more thorough and comprehensive.

[0034] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

[0035] It should be understood that the terms "first", "second" and the like used herein do not limit the nature or the number of the elements to which these terms refer, but are used to distinguish one element from another. It should be understood that the terms "first", "second" and the like are used herein to distinguish one element from another.

[0036] It should be noted that when an element is considered to be "connected" to another element, it can be directly connected to the other element or connected to the other element through an intermediate element. In addition, "connected" in the following embodiments should be understood as "electrically connected", "communicatively connected" and the like if there is a transmission of electrical signals or data between the connected objects.

[0037] As used herein, the singular forms "a", "an" and "the" can include plural forms unless the context clearly indicates otherwise. It should also be understood that the terms "comprise / comprises" or "have / have" specify the presence of the stated features, integers, steps, operations, components, parts or combinations thereof, but do not exclude the presence or addition of one or more other features, integers, steps, operations, components, parts or combinations thereof.

[0038] The application scenario of the embodiments of the present application can be, for example Figure 1 As shown, the bus communication device is arranged between the target object and the host, and the bus communication device can communicate with the target object based on the bus, thereby realizing information transmission between the host and the target object. For example, the host can send information to the bus communication device, and the bus communication device can communicate with the target object based on the bus protocol, thereby sending data to the target object. For another example, the bus communication device can obtain information sent by the target object through the bus based on the bus protocol, and then feed back the information to the host. Further, the embodiments of the present application can be understood as providing a bus communication device, and further providing an electronic system which can include the bus communication device and the host shown in the figure. The bus communication device and the host can realize communication. In addition, the bus communication device can be connected to one target object, and can also be understood as being connected to multiple target objects.

[0039] The target object can be any object or combination of objects that needs to interact with the host through the bus. The object generally refers to a hardware object.

[0040] In one example, the target object can be a device under test, which can be a hardware under test, such as a controller in a development process and / or a verification stage. The controller can be a controller suitable for application to a vehicle after development, such as a domain controller of a vehicle, or a domain controller of a low-altitude aircraft or a drone. In a further example, the device under test can refer to a device under test in a hardware-in-the-loop (HIL) test, and the host can be a real-time processor controller (RTPC) in the HIL test, which can also be understood as an industrial computer, which is generally configured with an embedded operating system. In another further example, even if the target object is a device under test, the host can be a host computer running a desktop operating system (such as a Windows operating system), which interacts with the device under test through the bus communication device to implement simulation testing.

[0041] In another example, the target object can be an actuator in rapid control prototyping (RCP) testing, and the host can be an industrial computer in RCP testing, which is generally configured with an embedded operating system. The software under test (such as an algorithm or a model) can be provided in the industrial computer, which needs to control the actuator to test the function of the software.

[0042] In one example, the target object can also be a test auxiliary device that provides corresponding auxiliary functions for the industrial computer in a test process (such as HIL testing or RCP testing), such as a test bench, a simulation device, a simulation bench, or the like, which simulates corresponding sensors or structural functions.

[0043] In another example, the target object can be an electronic device provided in a vehicle, such as a vehicle-mounted device, and the industrial computer can be an industrial computer configured with an embedded operating system, which is used to collect and store data generated by the electronic device during operation of the vehicle.

[0044] As can be seen, the host can be an industrial computer configured with an embedded operating system, or a host computer configured with a desktop operating system. The target object includes at least one of the following: a device under test, a test auxiliary device that assists in testing (such as testing of the device under test), an electronic device loaded in a vehicle, and an actuator controlled by software under test.

[0045] The host can be any circuit, circuit board, or device with a processor, such as a circuit board or a combination of multiple circuit boards with a processor, or a host that includes a circuit board with a processor and a mechanical structure such as a housing. The processor refers to a processor that can be used to run an operating system.

[0046] For the convenience of description, an application scenario can be limited to a target object being a vehicle-mounted device (for example, at least one of an ECU, a domain controller, a sensor, etc. as a DUT in a development and verification process), or an auxiliary device (for example, a test bench) participating in testing of the DUT, or a vehicle-mounted device (for example, a sensor, a controller, etc. that has been put into use).

[0047] When a host needs to interact with a target object through a bus, the bus here is a bus that can be commonly applied to a vehicle, and a common host (for example, an IPC, an RTPC, a real-time machine, etc.) usually does not have a bus communication capability, so a bus communication device needs to be introduced to complete bus-based communication.

[0048] In one scenario, the bus communication device can be applied to implement data collection, and the target object can be, for example, a sensor, an ECU, etc. of a vehicle, which can communicate based on a bus. At this time, the host can be an IPC for data collection, which collects data from the bus through the bus communication device for storage, analysis, display, etc.

[0049] In another scenario, the bus communication device can be applied to simulate testing, analysis, etc. of a DUT, and the target object can include, for example, a DUT (for example, an ECU in development) and other devices (for example, a simulation test bench for testing) participating in testing. At this time, the host can be a host computer for simulation testing and analysis, or a real-time machine, an IPC, an RTPC, etc. for simulation testing and analysis.

[0050] Please refer to Figure 2 The bus communication device of the embodiment of the present application includes a substrate and at least one sub-board (for example, a plurality of sub-boards).

[0051] The substrate is provided with a substrate processing module and a host communication module; the substrate processing module is connected to the host communication module, and the host communication module is used to connect a host.

[0052] The substrate processing module can be any circuit module that can realize communication between the host communication module and the sub-board. In one example, the substrate processing module can be an FPGA circuit.

[0053] The host communication module can be any circuit module that can realize communication with a host. The host communication module can be realized through a network port (and a corresponding network chip), for example, an RJ45 module, or through a USB module, or through PCIe or other communication modes. The host communication module can also include, for example, an RS233 module, an I2C module, etc.

[0054] Each of the sub-boards is provided with at least one external communication module, which is used to connect to the target object; the connection can be a direct connection or an indirect connection through a connector, gateway, etc. (as long as communication can be achieved through a direct or indirect connection, it can be understood as a connection here). At least one external communication module of at least one sub-board is a bus communication module.

[0055] The number of sub-boards can be as follows: Figure 2 One shown can also be like... Figure 3 The number of external communication modules in the sub-board can be one, two, or any number greater than or equal to three.

[0056] A bus communication module can be understood as any circuit module capable of communicating with a target object in a manner that satisfies the bus protocol of the corresponding bus, thereby realizing information exchange. The bus communication module located on the daughterboard may include at least one of the following: a CAN bus communication module, a LIN bus communication module, a Flexray bus communication module, an automotive Ethernet bus communication module, a DSI bus communication module, a PSI bus communication module, or a SENT bus communication module. A single bus communication module may provide only one bus channel or may provide multiple bus channels.

[0057] by Figure 4 , Figure 5 The example shown illustrates various daughterboards and the possible combinations of different bus communication modules. This is merely an example; actual implementations may vary. As can be seen, a single daughterboard can contain one or more bus communication modules. The types of bus communication modules on a single daughterboard can be the same or different. Bus communication modules on different daughterboards can be identical, different, or completely different. In one example, to save space and minimize daughterboard size, each daughterboard can be designed to provide at most N bus channels, where N is, for example, 2, 3, or 4. For instance, if each bus communication module can have one bus channel, the daughterboard can have at most N bus communication modules; conversely, if each bus communication module can have N bus channels, the daughterboard can have only one bus communication module.

[0058] In one embodiment, to enable coverage of multiple bus communication modules using different daughterboard combinations, at least two daughterboards are equipped with bus communication modules. Furthermore, among the daughterboards equipped with these bus communication modules, the bus types of the bus communication modules differ between the different daughterboards. This difference can refer to complete disparities or partial similarities and differences. Moreover, requirements that cannot be met by a single daughterboard can be fulfilled using other daughterboards.

[0059] Of course, the same number and type of multiple daughter boards can also be connected to the substrate at the same time, thereby meeting the overall demand.

[0060] In one embodiment, the daughter board is mounted to the substrate through a connector, and when the daughter board is mounted to the substrate, the external communication module of the daughter board can communicate with the substrate processing module, and communicate with the host through the substrate processing module and the host communication module.

[0061] The daughter board can be mounted to the substrate in a connector manner. In one example, the connector manner can only realize mechanical connection and not realize electrical signal transmission through the connector. At this time, the electrical signal transmission between the daughter board and the substrate, such as the electrical signal transmission between the daughter board and the substrate processing module, can be realized through other means, such as FPC. In another example, the connector manner can also realize mechanical connection and electrical signal transmission through the connector. The substrate and the daughter board are both provided with a circuit part for realizing electrical signal transmission after connection. In one example, the substrate and the daughter board can be connected in the PCIe slot and connector manner, thereby realizing communication based on PCIe, and the PCIe-based communication can be realized through the substrate processing module and the daughter board processing module. Of course, other standard or non-standard communication methods can also be realized through the substrate processing module and the daughter board processing module.

[0062] In the above bus communication device and electronic system, the bus communication device is designed in a split type of substrate and daughter board. Since it is split, the host communication module in the substrate usually does not change with different demands, which facilitates batch standardized design and production, thereby avoiding the high cost of customized design and production of the entire circuit board.

[0063] In addition, since the substrate and the daughter board are designed in a split type, different daughter boards can be selected to assemble into a bus communication device for different demands. In other words, the split type architecture makes it no longer necessary to customize the entire circuit board to solve differentiated customization needs. Customization of the daughter board and assembly become another optional solution to meet customization needs, which is lower in cost compared to the scheme of customizing the entire circuit board. At the same time, it is also convenient to adaptively disassemble and change the daughter board on the substrate to adaptively meet the demand.

[0064] For example, some sub-boards a are provided with CAN bus communication module and LIN bus communication module, some sub-boards b are provided with CAN bus communication module and Flexray bus communication module, and some sub-boards c are provided with DSI3 bus communication module, PSI5 bus communication module and SENT bus communication module.

[0065] Then, assuming that each bus communication module can provide two bus channels, if the demand of some projects or customers requires 10 CAN bus channels, 8 LIN bus channels and 6 Flexray bus channels, at least 4 sub-boards a and 3 sub-boards b can be selected to be assembled with the base board to form a bus communication device that can meet the demand; if the demand of some other projects or customers requires 6 CAN bus channels, 4 LIN bus channels and 5 DSI3 bus channels, at least 3 sub-boards a and 3 sub-boards c can be selected to be assembled with the base board to form a bus communication device that can meet the demand.

[0066] Different from the prior art, for the two demands of “10 CAN bus channels, 8 LIN bus channels and 6 Flexray bus channels” and “6 CAN bus channels, 4 LIN bus channels and 5 DSI3 bus channels”, two complete circuit boards are often required, for example, one circuit board provides at least 10 CAN bus channels, 8 LIN bus channels and 6 Flexray bus channels, and the other circuit board provides at least 6 CAN bus channels, 4 LIN bus channels and 5 DSI3 bus channels. Further, different demands require different circuit boards to be designed and produced.

[0067] As can be seen, the specific scheme of the present application can be adapted to meet the demand by combining sub-boards, without the need to redesign the entire circuit board each time.

[0068] In addition, the circuit part in the base board particularly includes unified functions shared by the sub-boards, such as communication with the host, and also includes power supply, etc. By integrating these functions in the base board, it can be ensured that the base board can cover various demands, and therefore the base board is suitable for standardized and mass production, and the production cost is reduced due to the standardized and mass production.

[0069] In one embodiment, please refer to Figures 4 to 6In the substrate, a vehicle-mounted Ethernet communication module can also be provided, which can be used for communication with the target object based on the vehicle-mounted Ethernet, that is, the substrate is also provided with a vehicle-mounted Ethernet communication module, and the vehicle-mounted Ethernet communication module is used to connect with the target object through the vehicle-mounted Ethernet. It can be seen that in some examples, it is possible that the vehicle-mounted Ethernet bus communication module is provided in the daughter board, and the vehicle-mounted Ethernet communication module is also provided in the substrate, both of which can communicate with the target object through the vehicle-mounted Ethernet, and the vehicle-mounted Ethernet bus communication module and the vehicle-mounted Ethernet communication module can be the same or different (for example, for vehicle-mounted Ethernet of different rates). In another example, the vehicle-mounted Ethernet communication module can be provided in the substrate, and the vehicle-mounted Ethernet bus communication module is not provided in the daughter board, for example, because the interface of some vehicle-mounted Ethernet communication modules occupies a large space, and therefore, only providing the vehicle-mounted Ethernet communication module in the substrate can reduce the occupied space of the daughter board.

[0070] In an embodiment, please refer to Figure 4 and Figure 5 , the substrate can also be provided with a power supply module, which can be used to supply power to the circuits on the substrate and the circuits on the daughter board, so that the power supply module can not only supply power to the circuit modules (such as at least one of the substrate processing module, the host communication module, the vehicle-mounted Ethernet communication module, etc.) in the substrate, but also supply power to the daughter board through the connector, for example, the connector can be provided with a power supply line for realizing power supply of the daughter board by the power supply module. In other embodiments, the power supply of the substrate and the daughter board can be independent. The power of the power supply module can be provided by a power supply board or other power sources.

[0071] In an embodiment, please refer to Figure 6 , the external communication module in the daughter board can also not be limited to the bus communication module, for example, at least one external communication module of at least one daughter board is any one of the following: an emulation module, a serial communication module, an analog communication module, a digital communication module, a transmission module of a signal with customized features, and a transmission module of a special signal that is not standard. Figure 6 In the example in , it is shown that the bus communication device has a daughter board with a custom function module, an emulation module, a serial communication module, a bus communication module, and a transmission module of a signal with customized features, which is only to facilitate as many modules as possible to be displayed. In actual bus communication devices, only one or more of them can be provided.

[0072] The simulation module can realize simulation processing of any circuit module, such as a resistance simulation module, a sensor simulation module, a motor simulation module, a load simulation module, a battery simulation module, etc. The simulation module is mainly used for testing, that is, the electronic system is a test system, and at least one external communication module of at least one sub-board in the test system is a simulation module, which can feed back simulation results to an industrial computer and / or a measured piece for testing.

[0073] The serial communication module can be any circuit module that realizes serial communication, such as a Uart module.

[0074] The analog communication module can be an analog input module, an analog output module, or a module that combines analog input and output. The digital communication module can be a digital input module, a digital output module, or a module that combines digital input and output. In addition, the digital communication module and the analog transmission module can be integrated into the same external communication module as two states of the same external communication module. At this time, as long as analog communication can be realized, whether it has the state of communicating digital quantity or not, it can be understood as an analog communication module. As long as digital communication can be realized, whether it has the state of communicating analog quantity or not, it can be understood as a digital communication module.

[0075] The non-standard special signal transmission module and the customized characteristic signal transmission module can refer to the same transmission module or different transmission modules. The non-standard special signal transmission module and the customized characteristic signal transmission module can be, for example, a PWM signal input and / or output module with a specific voltage (such as a very small voltage), or a high-precision signal input and / or output module.

[0076] The non-standard special signal transmission module can be understood as a signal input and / or output module without industry standards (such as no voltage size standard, frequency standard).

[0077] The customized characteristic signal transmission module can be understood as a signal input and / or output module designed based on user needs. It can meet certain industry standards or not.

[0078] In one embodiment, please refer to Figure 7The sub-plate is further provided with a sub-plate processing module, which is configured to be communicatively connected with the base-plate processing module. Further, the base-plate and the sub-plate can communicate based on the respective processing modules, so as to facilitate the construction of a unified and standardized communication mode between the base-plate and the sub-plate. In an example, the base-plate processing module includes a base-plate FPGA circuit, and the sub-plate processing module includes a sub-plate FPGA circuit. In other examples, the base-plate processing module can further include other peripheral circuits, and can further include an MCU, a memory, etc. The sub-plate processing module can also include other peripheral circuits, and can further include an MCU, a memory, etc.

[0079] In an embodiment, referring to Figure 8 The sub-plate 2 can be connected to one side surface of the base-plate 1 through the connector 3. The sub-plate 2 can be arranged on one side of the base-plate 1. In other examples, the sub-plate 2 can be arranged on both sides of the base-plate 1. The arrangement of the sub-plate 2 on the base-plate 1 does not deviate from the scope of the embodiments of the present application.

[0080] In addition, the base-plate and the sub-plate can be arranged in parallel to form two layers of circuit boards, or the sub-plate can be vertically connected to the base-plate. Regardless of the arrangement, the base-plate can be provided with a plurality of sub-plates in the length direction. The size of each sub-plate can be the same. The circuit part of the sub-plate can be connected to the circuit part of the base-plate through the connector, so as to realize the transmission of power supply and signals. At the same time, the sub-plate and the base-plate can be assembled together through any assembly part. In other examples not shown in the figure, the circuit board can be three layers, four layers or more layers, and the sub-plates can be arranged in sequence along one direction.

[0081] The electronic system provided by the embodiments of the present application includes the bus communication device related to the above-mentioned optional schemes, and the host computer;

[0082] The electronic system is a test system or a data acquisition system loaded on a vehicle.

[0083] In an embodiment, referring to Figure 9 The electronic system further includes a selective connection device. Each external communication module provides one or more communication channels.

[0084] At least part of the communication channels are connected to the first connection part of the selective connection device. Different communication channels are connected to different first connection parts. Different second connection parts of the selective connection device are used to communicate with different communication lines of the target object.

[0085] The selective connection device is configured to selectively connect the first connection part and the second connection part, so that the corresponding communication channel and the communication line are connected.

[0086] The selective connection includes at least two cases. In one case, all the first connection parts can be selectively connected with all the second connection parts, i.e., each first connection part can be selectively connected with any second connection part. In another case, the selective connection can be realized within a certain range. For example, the total number of the first connection parts is K1, and the total number of the second connection parts is K2. K1 can be equal to K2 or not. Furthermore, for L1 first connection parts in K1, the selective connection can be realized with L2 second connection parts in K2, L1 < K1, L2 < K2. That is, the free selective connection can be realized between the L1 first connection parts and the L2 second connection parts, and the connection cannot be realized with other second connection parts except the L2 second connection parts.

[0087] The second connection part can be understood as any structure or medium that can be directly or indirectly connected with the communication line of the target object. For example, it can be an interface on the cabinet of an electronic system for connecting the target object externally. For another example, if the selective connection device is realized through a circuit board of the selective connection device, the second connection part can also be an interface or a terminal on the circuit board of the selective connection device. For another example, the second connection part can also be a connection line or a connecting piece between the interface on the circuit board and the interface on the cabinet. For another example, the second connection part can include part or all of the above-mentioned interface, connecting piece, connection line, and terminal.

[0088] The first connection part can be understood as any structure or medium that can be directly or indirectly connected with the communication channel of the bus communication device. For example, it includes a line on a backboard, a connection line realized through a flying wire, or an FPC.

[0089] The selective connection device can be understood as any device whose circuit can freely connect the first connection part with the second connection part. For example, it can be realized through a switch matrix or a relay matrix, or through an FPGA. The selective connection device can include one circuit board or a combination of multiple circuit boards. The selective connection device can be controlled by an upper computer and / or an industrial computer to configure the connection relationship between the first connection part and the second connection part. The connection relationship can also be automatically controlled or manually controlled by other devices (such as an upper computer or a server connected to an electronic system). The control process can be realized through a host computer or directly controlled through other interfaces of the electronic system without passing through the host computer.

[0090] Wherein, by the selective connection device, the communication connection relationship between the communication channel of each external communication module in the bus communication device and the communication line of the target object can be freely switched, so as to facilitate the target object to be connected more freely, and especially the processing efficiency when the target object is replaced can be improved. Only the routing mode (i.e. which first connection part is connected to which second connection part) of the selective connection device is configured according to the connection result, compared with the embodiment not using the selective connection device, each external connection target object (e.g. a DUT) medium (e.g. an interface) in the electronic system (e.g. a test system) needs to be externally marked as being used for connecting which communication line, and the corresponding serial number (e.g. using CAN1 identification to represent the first CAN channel) is connected to the corresponding communication channel (e.g. connected to a certain CAN channel) of the bus communication device. At this time, the connection relationship between the medium (e.g. the interface) externally connected to the target object and the communication channel of the bus communication device is fixed, which leads to that the external connection must be made according to this relationship, and if the connection is wrong, the communication cannot be normally made. After the selective connection device is used, this limitation can be avoided. For example, no matter which medium the CAN communication line of the target object (e.g. a DUT) is connected to when the external connection is made, and which second connection part it is connected to, it can be connected to the required CAN channel through the selective connection device.

[0091] In an embodiment, as shown in Figure 9 , the electronic system further comprises a backplane, and the host and the bus communication device are arranged on the backplane and communicate through the backplane. In addition, if the selective connection device is included, the selective connection device can also be arranged on the backplane. The communication connection between the selective connection device and the bus communication device can be realized through the backplane, or realized through other wiring, or partially realized through the backplane and partially realized through other wiring.

[0092] In a non Figure 9 example, part or all of the communication channels of the bus communication device can also be externally connected (e.g. externally connected to the backplane or externally connected to the electronic system) without the selective connection device. In another example, the electronic system includes both the bus communication device externally connected through the selective connection device and the bus communication device externally connected without the selective connection device. In yet another example, one or more communication channels of the bus communication device can also be configured to be selectively connected to the second connection part of the communication selective connection device or externally connected without bypassing the selective connection device.

[0093] In addition, in each figure, each external communication module is shown as being connected to the same target object. In other examples not shown, each external communication module can also be connected to different target objects.

[0094] Any technical features in the above embodiments can be combined, and for the sake of brevity, not all possible combinations are described above, however, any combination of these technical features is deemed to be within the scope of the present application.

[0095] The above embodiments only express several implementation manners of the present application, and the description is relatively specific and detailed, but it should not be understood as a limitation on the patent scope of the present application. It should be pointed out that, for ordinary skilled persons in the art, several modifications and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the appended claims.

Claims

1. A bus communication device, characterized by comprising: include: Substrate and at least one sub-board; The substrate is provided with a substrate processing module and a host communication module; the substrate processing module is connected to the host communication module, and the host communication module is used to connect to a host. Each of the sub-boards is provided with at least one external communication module, which is used to connect to the target object; wherein at least one external communication module of at least one sub-board is a bus communication module; the target object includes at least one of the following: device under test, auxiliary equipment for testing, electronic equipment mounted on a vehicle, and actuator controlled by the software under test; The sub-board is mounted on the substrate via connectors. When the sub-board is mounted on the substrate, its external communication module can communicate with the substrate processing module, and communicate with the host via the substrate processing module and the host communication module.

2. The bus communication device according to claim 1, wherein The bus communication module located on the daughterboard includes at least one of the following: CAN bus communication module, LIN bus communication module, Flexray bus communication module, vehicle Ethernet bus communication module, DSI bus communication module, PSI bus communication module, and SENT bus communication module.

3. The bus communication device according to claim 1, wherein At least two of the sub-boards are equipped with a bus communication module, and the bus types of the bus communication modules of different sub-boards are different in some or all of the sub-boards equipped with the bus communication module.

4. The bus communication device according to claim 1, wherein The substrate is also equipped with an in-vehicle Ethernet communication module, which is used to connect to the target object via in-vehicle Ethernet.

5. The bus communication device according to claim 1, wherein The substrate is also provided with a power supply module, which is used to supply power to the circuits on the substrate and the circuits on the sub-board.

6. The bus communication device according to claim 1, wherein The sub-board also includes a sub-board processing module, which is configured to communicate with the substrate processing module.

7. The bus communication device according to any one of claims 1 to 6, wherein At least one of the external communication modules of at least one of the sub-boards is any one of the following: simulation module, serial communication module, analog communication module, digital communication module, signal transmission module with custom features, or non-standard special signal transmission module.

8. An electronic system, characterized by Includes the bus communication device according to any one of claims 1 to 7, and the host; The electronic system is a testing system or a data acquisition system installed on a vehicle.

9. The electronic system of claim 8, wherein, It also includes a selective connection device; each external communication module provides one or more communication channels to the outside world; At least a portion of the communication channels are connected to the first connection portion of the selective connection device, different communication channels are connected to different first connection portions, and different second connection portions of the selective connection device are used to communicate with different communication lines of the target object; The selective connection device is configured to selectively connect the first connection part and the second connection part, so that the corresponding communication channel and communication line are connected.

10. The electronic system of claim 8, wherein, It also includes a backplane, on which the host and the bus communication device are both located and communicate via the backplane.

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