Communication equipment

Abstract

The utility model relates to the technical field of data communication, in particular to communication equipment. The communication equipment comprises a main board, a communication equipment chip arranged on the surface of the main board and M optical module connectors, any optical module connector is connected with the communication equipment chip through a plurality of signal line groups, and M is a positive integer greater than or equal to 1; the optical module connector is used for being detachably connected with an optical module, the optical module comprises a plurality of transmission channels, one signal line group is used for being in signal connection with one transmission channel, and the plurality of signal line groups correspond to the plurality of transmission channels. According to the communication equipment, on the premise that the size of a communication equipment cabinet is not changed, collection and interconnection between a communication equipment chip and a connector channel are realized, and the number of channels between a single optical module and the communication equipment chip is increased, so that the port density of the communication equipment can be improved, and the area occupied by the communication equipment is reduced.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of data communication, and particularly relates to a communication device. BACKGROUND

[0002] A communication device, such as a switch, is a network device used to connect computers, terminals and other devices in a network to realize data exchange and communication. With the expansion of the scale of data centers and the increase of applications, the demand for communication device ports is also increasing. High port density of communication devices means higher processing performance, which can support more device access and improve the overall performance of the network.

[0003] In a data center, rack-mounted communication devices are usually installed in a standard 19-inch or 23-inch wide cabinet. Taking a 19-inch communication device as an example, the height can be 1U, 3U, 5U, 10U, 20U, etc. U is a unit representing the external size of a server, which is the abbreviation of unit, 1U can be 4.445 cm, 3U is 3 times of 1U, which can be 13.335 cm, and so on, which can be converted to 5U, 10U, 20U, etc. In the above width of the communication device, for small form-factor pluggable (SFP) optical modules, the port number of the communication device can be up to 56. For quad small form-factor pluggable (QSF), quad small form-factor pluggable double density (QSF-DD) optical modules, the port number of the communication device can be up to 36. How to improve the port density of the communication device under the premise of fixed cabinet size becomes a difficulty in the design of the communication device. CONTENT OF THE UTILITY MODEL

[0004] The present application discloses a communication device and a communication device to improve the port density of the communication device under the premise of fixed cabinet size.

[0005] To achieve the above-mentioned purpose, the present application provides the following technical solutions:

[0006] In a first aspect, the present application provides a communication device, which comprises a mainboard, a communication device chip arranged on the surface of the mainboard, and M optical module connectors, any optical module connector and the communication device chip are connected through a plurality of signal line groups, wherein M is a positive integer greater than or equal to 1; the optical module connector is used for detachable connection with an optical module, the optical module comprises a plurality of transmission channels, one signal line group is used for signal connection with one transmission channel, and the plurality of signal line groups correspond to the plurality of transmission channels.

[0007] The communication device chip and the optical module connector are connected by a plurality of signal line groups, and one signal line group is only used for signal connection with one transmission channel of one optical module, so that the communication device chip and the connector channel are interconnected, the number of channels between the single optical module and the communication device chip is increased, the port density of the communication device is improved, and the area occupied by the communication device is reduced.

[0008] Further, the number of the plurality of signal line groups between any optical module connector and the communication device chip is 4N, N is a positive integer greater than or equal to 1; the number of the plurality of transmission channels of any optical module is 4N; any signal line group includes a first signal line and a second signal line, the first signal line is used to transmit signals from the communication device chip to the optical module connector, and the second signal line is used to transmit signals from the optical module connector to the communication device chip.

[0009] Further, the M optical module connectors include first gold finger pins and second gold finger pins, the first gold finger pins are used to transmit the first type of signals, the number of the first gold finger pins corresponds to the number of the transmission channels in the optical module; the second gold finger pins are used to transmit the second type of signals, the number of the second gold finger pins corresponds to the number of the optical modules.

[0010] Further, the communication device includes a first indicator light and a second indicator light, the first indicator light is used to indicate the running state of the optical module, and the second indicator light is used to indicate the running state of the plurality of transmission channels corresponding to each optical module.

[0011] Further, the communication device includes a plurality of optical module boxes, the optical module box has a containing cavity for containing the optical module and the optical module connector, the mainboard includes a first surface and a second surface arranged oppositely, and the first surface and the second surface are both provided with the optical module box.

[0012] Further, the optical module box located on the first surface and the optical module box located on the second surface are arranged in mirror image symmetry along the mainboard.

[0013] Further, the optical module box has a first opening and a second opening, the first opening is used to allow the optical module to enter and exit the containing cavity, the first opening is an opening in the depth direction of the optical module box, and the second opening is arranged on the surface of the optical module box away from the mainboard, and the second opening is an opening in the height direction of the optical module box.

[0014] Further, the communication device further includes a heat sink, and the heat sink is arranged on the side of the optical module box away from the mainboard.

[0015] Further, the inner wall of the optical module box is provided with a sliding part, and the sliding part is used for sliding connection with the optical module.

[0016] Further, the sliding part comprises a first track and a second track, the optical module box comprises a first side wall and a second side wall which are vertically and oppositely arranged with respect to the main plate, the surface of the first side wall facing the second side wall is provided with the first track, and the surface of the second side wall facing the first side wall is provided with the second track, the first track and the second track both extend along a first direction, wherein the first direction is a direction in which the first opening points to the optical module connector. BRIEF DESCRIPTION OF DRAWINGS

[0017] Figure 1 A structural schematic diagram of a communication device according to an embodiment of the present application;

[0018] Figure 2 A front view of a communication device according to an embodiment of the present application;

[0019] Figure 3 A partial enlarged view of A shown in FIG. 4; Figure 2

[0020] Figure 4 An exploded view of a communication device according to an embodiment of the present application;

[0021] Figure 5 A structural schematic diagram of a heat sink mounted on an optical module box according to an embodiment of the present application;

[0022] Figure 6 An exploded view of an optical module box, a heat sink and an optical module according to an embodiment of the present application.

[0023] Corresponding reference numerals in the drawings indicate corresponding parts throughout the several figures. 100-main plate; 110-first surface; 120-second surface; 200-communication device chip; 300-optical module connector; 400-optical module; 410-optical module gold finger; 420-sliding part; 500-first level indicator light; 600-second level indicator light; 500a-key; 700-heat sink; 710-heat dissipation fin; 720-supporting plate; 800-limiting part; 810-clamping plate; 820-connecting plate; 900-sliding part; 910-first track; 920-second track;

[0024] 10-signal line group; 11-first signal line; 12-second signal line; 20-optical module box; 21-first side wall; 22-second side wall; 23-protrusion; 30-power supply; 40-fan; 50-housing; 51-first housing; 52-second housing;

[0025] 01-accommodation cavity; 02-first opening; 03-second opening; 04-limiting hole; 05-avoidance opening. DETAILED DESCRIPTION

[0026] ​With reference to the drawings of the embodiments of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described. Obviously, the described embodiments are only a part of the embodiments of the present application, but not all the embodiments of the present application. Based on the embodiments of the present application, all the other embodiments obtained by a person of ordinary skill in the art without creative effort are within the scope of the present application.

[0027] In a data center, the cabinet width of a rack-mounted communication device is a standard 19 inches (about 442.5 mm), and the height can be 1U, 3U, 5U, 10U, 20U, etc., and the width is usually between 440-442 mm. Taking the width of 442 mm as an example, when the optical module adopts a standard SFP package, the port number of the communication device can be up to 56; if the optical module adopts a QSF or QSF-DD package, the communication device can have up to 36 ports. Without changing the cabinet size, how to improve the port density of the communication device and obtain a better single-bit cabinet ratio becomes a problem that needs to be solved at present. Among them, the single-bit cabinet ratio refers to the proportion of a single data transmission channel in the cabinet space, which is usually used to measure the efficiency and density of a data center or a server room.

[0028] Therefore, in the embodiments of the present application, a communication device is provided, Figure 1 For the structural schematic diagram of the communication device of an embodiment of the present application, please refer to Figure 1 The communication device includes a mainboard 100, a communication device chip 200 arranged on the surface of the mainboard 100, and M optical module connectors 300, any optical module connector 300 and the communication device chip 200 are connected through a plurality of signal line groups 10, wherein M is a positive integer greater than or equal to 1. The optical module connector 300 is used for detachable connection with an optical module 400, the optical module 400 includes a plurality of transmission channels, and one signal line group 10 is only used for signal connection with one transmission channel. Among them, the transmission channel refers to a physical transmission channel for transmitting optical signals or electrical signals, and the signal connection mode can be electrical connection or optical connection. Optionally, the channels in the optical module connector 300 can be Serdes channels or differential signal transmission channels.

[0029] Among them, the communication device in the present application can be a switch or a router, etc.

[0030] In the embodiments of the present application, for any optical module 400, the optical module 400 can include a plurality of transmission channels, and the optical module 400 is connected with the communication device chip 200 through a corresponding optical module connector 300. A plurality of signal line groups 10 are arranged between the communication device chip 200 and the corresponding optical module connector 300, and one signal line group 10 is used for signal connection with one transmission channel in the optical module 400, and the plurality of signal line groups 10 correspond to the plurality of transmission channels. Thus, the communication device chip 200 and any optical module 400 can be signal connected through the plurality of transmission channels. Compared with the conventional scheme in which one optical module is signal connected with the communication device chip through one transmission channel, the method of the present application can realize signal connection between the communication device chip 200 and the optical module 400 through more transmission channels without changing the size of the communication device cabinet, thereby improving the port number of the communication device for signal transmission.

[0031] Continuing to refer to Figure 1 One signal line group 10 includes a first signal line 11 and a second signal line 12, the first signal line 11 is used for transmitting signals from the communication device chip 200 to the optical module connector 300, and the second signal line 12 is used for transmitting signals from the optical module connector 300 to the communication device chip 200. The first signal line 11 can be a differential signal line, and the second signal line 12 can also be a differential signal line.

[0032] In some optional embodiments, the number of transmission channels in any optical module 400 is 4N, N is a positive integer greater than or equal to 1. For example, the number of transmission channels can be 4, 8, 12, 16, 20, etc. Correspondingly, the number of signal line groups between any optical module connector 300 and the communication device chip 200 is also 4N. Through the above scheme, the port density of the communication device can be improved to more than 4N times of the original. For example, under the 1U height size of the 19-inch standard cabinet, compared with the related communication device which has at most 56 SFP port channels, the communication device in the present application can have 256 SFP port channels. At the same time, the single-bit cabinet ratio of the communication device can also be improved by more than 4 times, which can significantly save the number of cabinets and reduce the area occupied by the machine room.

[0033] It should be noted that the port density improvement in the present application refers to the density improvement of virtual ports, i.e. the density improvement of port channels for signal transmission. In addition, because each optical module can include a plurality of transmission channels, the number of optical modules in the communication device can not increase or can decrease, and the number of sockets for plugging the optical modules can also not increase or decrease accordingly, i.e. the number of sockets on the front panel of the communication device in the present application can not increase.

[0034] Continuing to refer to Figure 1The optical module 400 includes a circuit board (not shown in the figure) and an optical module gold finger 410, the optical module gold finger 410 is electrically connected with the circuit board, and the optical module gold finger 410 includes a plurality of optical module gold finger pins. The optical module gold finger pins are used to transmit signals, and the signals can include data signals, control signals and power signals. For example, the optical module gold finger pins can be electrically connected with the gold finger pins of the optical module connector 300 to realize signal transmission between the optical module 400 and the communication device chip 200. The optical module connector 300 can be provided with an optical module connector gold finger (not shown in the figure) corresponding to the optical module 400.

[0035] The optical module 400 can be a high-density optical module. Referring to Table 1 below, the optical module 400 has a plurality of different types of signals, including but not limited to first type signals and second type signals. Correspondingly, the optical module connector 300 can include first gold finger pins and second gold finger pins, the first gold finger pins are used to transmit the first type signals, and the second gold finger pins are used to transmit the second type signals. The optical module connector 300 can also be provided with other types of gold finger pins, which are not limited by the embodiments of the present application.

[0036] The number of first gold finger pins for transmitting the first type signals in the communication device is related to the number of transmission channels in the optical module 400. The first type signals can be SERDES signals. The SERDES signal is a signal that converts parallel data into serial data for transmission and converts received serial data into parallel data. As shown in Table 1 below, when the optical module of the communication device is a normal optical module, such as 4N normal optical modules, each normal optical module includes one transmission channel, each transmission channel corresponds to 2 SERDES TX signals and 2 SERDES RX signals, and the communication device transmits 2×4N SERDES TX signals and 2×4N SERDES RX signals. In the communication device of the present application, the optical module 400 is a high-density module, the number of transmission channels in each high-density module is 4N, each transmission channel corresponds to 2 SERDES TX signals and 2 SERDES RX signals, and the number of transmission channels is unchanged. The number of high-density modules included in the communication device of the present application is less than the number of normal optical modules, and the communication device of the present application transmits 2×4N SERDES TX signals and 2×4N SERDES RX signals. Wherein, N is a positive integer greater than or equal to 1. Therefore, the number of transmission channels in the communication device of the present application is unchanged, the number of SERDES signals is unchanged, and the number of first gold finger pins corresponds to the number of transmission channels in the optical module. When the number of first type signals is unchanged, the number of first gold finger pins of the optical module connector 300 for transmitting the first type signals in the communication device is unchanged.

[0037] The second type of signal can be used to reflect the operating state of the optical module 400, such as temperature, voltage, bias current, speed, etc. Because each optical module 400 has its own operating state parameter, each optical module 400 has a corresponding second type of signal. The number of second gold finger pins for transmitting the second type of signal in the communication equipment is related to the number of optical modules 400. Compared with ordinary optical modules, in the case that the number of transmission channels remains unchanged, the optical module 400 in the present application can improve the density of the port channel by setting multiple transmission channels, and the number of optical modules 400 is reduced, so the number of second type of signals is also reduced, that is, the signal merging is realized. As shown in Table 1, the signal types corresponding to serial numbers 2-8 can be the second type of signal. Taking the SDA signal and the SCL signal as an example for illustration. When the optical module of the communication equipment is an ordinary optical module, for example, 4N ordinary optical modules, each ordinary optical module includes one transmission channel, and each ordinary optical module corresponds to one SDA signal and one SCL signal. The communication equipment transmits 1x4N SDA signals and 1x4N SCL signals. In the communication equipment of the present application, the optical module 400 is a high-density module, and the number of transmission channels in each high-density module is 4N. In the case that the number of transmission channels remains unchanged, the communication equipment in the present application includes one high-density module, which corresponds to one SDA signal and one SCL signal. The communication equipment in the present application transmits 1 SDA signal and 1 SCL signal. It can be understood that the number of optical modules 400 in the communication equipment of the present application is reduced, the number of second type of signals is reduced, the number of second gold finger pins corresponds to the number of optical modules, and the number of second gold finger pins is also reduced. That is, the communication equipment of the present application can reduce the number of second gold finger pins of the optical module connector 300 through signal merging.

[0038] Table 1

[0039]

[0040]

[0041] Continuing to refer to Table 1, the optical module can also reduce the number of pins by reducing the signals. Take the receiving end power supply (VCCRX) and the transmitting end power supply (VCCTX) pins as an example. When the optical module of the communication device is a common optical module, such as 4N common optical modules, each common optical module includes one transmission channel, and each common optical module needs a 0.1-volt power supply. However, considering the voltage fluctuation in actual use, in order to ensure the stability and reliability of the power supply, each common optical module needs to be provided with a basic unit of power supply, i.e., each common optical module needs one VCCRX pin and one VCCTX pin. Therefore, the optical module connector corresponding to the common optical module in the communication device includes 4N VCCRX pins and 4N VCCTX pins. However, in the communication device of the present application, the optical module 400 is a high-density module, and the number of transmission channels in each high-density module is 4N. In the case where the number of transmission channels remains unchanged, the communication device of the present application includes one high-density module, each high-density module needs a 0.1×4N-volt power supply, and in order to ensure the stability and reliability of the power supply, two basic units of power supply can meet the needs of each high-density module for a 0.1×4N-volt power supply. Therefore, the high-density module only needs two VCCRX pins and two VCCTX pins to meet the power supply requirements. Therefore, the optical module connector corresponding to the high-density module in the communication device only needs two VCCRX pins and two VCCTX pins to meet the power supply requirements, i.e., the communication device of the present application can reduce the number of VCCRX pins and VCCTX pins. It can be understood that the communication device of the present application can also reduce the number of ground (GND) pins. The specific principle is described above in the description of the reduction of the number of VCCRX pins and VCCTX pins, and will not be described here.

[0042] In one possible implementation, the plurality of transmission channels in the optical module can be configured to have different rates, such as 1G for A channel, 2.5G for B channel, 10G for C channel, 25G for D channel, 50G for E channel, etc.

[0043] Figure 2 a front view of the communication device of one embodiment of the present application, Figure 3 a front view of the communication device of one embodiment of the present application, Figure 2 a front view of the communication device of one embodiment of the present application, Figure 2 to Figure 3The communication device in the present application includes primary indicator lights 500 and secondary indicator lights 600. The primary indicator lights 500 are used to indicate the running state of the optical modules 400. Specifically, one primary indicator light 500 corresponds to at least one optical module 400. For example, one primary indicator light 500 can correspond to one, two or multiple optical modules 400. The secondary indicator lights 600 are used to indicate the running state of multiple transmission channels corresponding to each optical module 400. Specifically, one secondary indicator light 600 can correspond to one transmission channel in one optical module 400. Compared with the design of one indicator light corresponding to each transmission channel of each optical module 400, the communication device in the present application can significantly reduce the number of indicator lights and save space.

[0044] As shown in Figure 2 and Figure 3 , the port indicator lights of the communication device can be centrally arranged at the left end of the front panel of the communication device. The communication device includes five columns of optical modules 400, each column of optical modules 400 includes two optical modules 400 arranged in an up-down manner, and the front panel of the communication device is only provided with five primary indicator lights 500 (as shown in the dashed box in Figure 3 ), each primary indicator light 500 is used to indicate the running state of one column of optical modules 400. In addition, the front panel of the communication device is also provided with 32 secondary indicator lights 600, which are divided into two groups C1 and C2, each group includes 16 secondary indicator lights 600. The secondary indicator lights 600 in the C1 group can be used to indicate the running state of 16 transmission channels in one optical module 400 in each column of optical modules 400, and the secondary indicator lights 600 in the C2 group can be used to indicate the running state of 16 transmission channels in the other optical module 400 in each column of optical modules 400.

[0045] As shown in Figure 2 and Figure 3 , the communication device further includes a button 500a, which can be used to switch the corresponding relationship between the primary indicator lights 500 and the secondary indicator lights 600. As shown in Figure 2As shown, in the initial state, the first indicator light 500(m) corresponds to a plurality of second indicator lights 600, i.e. the plurality of second indicator lights 600 are respectively used to indicate the running states of the plurality of transmission channels in the two optical modules 400(m) located in the first column on the left side; by pressing the button 500a, the correspondence between the first indicator light 500 and the second indicator light 600 can be switched to the first indicator light 500(n) corresponding to a plurality of second indicator lights 600, i.e. the plurality of second indicator lights 600 are respectively used to indicate the running states of the plurality of transmission channels in the two optical modules 400(n) located in the second column on the left side; by analogy, the correspondence between the first indicator light 500 and the second indicator light 600 can be switched by the button 500a, which facilitates the small-area focused identification of the communication equipment during the later operation and maintenance, so that the running states of the transmission channels in each optical module can still be effectively identified under the premise of reducing the number of indicator lights, and moreover, the reduction of the indicator lights increases the available space inside the cabinet, which helps to improve the air circulation and thus improve the heat dissipation effect.

[0046] Figure 4 An exploded view of the communication equipment according to an embodiment of the present application is shown in Figure 4 The communication equipment includes a housing 50, the housing 50 includes a first shell 51 and a second shell 52, and the first shell 51 and the second shell 52 enclose a cavity. The housing 50 is provided with a fan 40 and a power supply 30. The fan 40 is used to dissipate heat from the mainboard 100, the optical module connector 300 and the optical module 400.

[0047] Continuing to refer to Figure 4 The communication equipment includes a plurality of optical module boxes 20 arranged in the housing 50, the optical module box 20 has a receiving cavity 01 for receiving the optical module 400 and the optical module connector 300, and the mainboard 100 includes a first surface 110 and a second surface 120 arranged oppositely, and the first surface 110 and the second surface 120 are both provided with the optical module box 20, i.e. at least two layers of optical module boxes 20 are arranged in the housing 50, so that the communication equipment can accommodate more optical modules 400 under the same height. The first surface 110 can be a surface of the mainboard 100 facing the first shell 51, and the second surface 120 can be a surface of the mainboard 100 facing the second shell 52.

[0048] Optionally, the optical module box 20 on the first surface 110 and the optical module box 20 on the second surface 120 are arranged in mirror symmetry along the mainboard 100, which is compact in structure and fully utilizes the internal space of the communication equipment.

[0049] However, under the condition that the size of the cabinet remains unchanged, the increase of the port density of the communication equipment will lead to the increase of the power of the communication equipment, which puts higher requirements on the heat dissipation performance of the communication equipment.

[0050] Therefore, Figure 5A structure diagram of a heat sink mounted on an optical module box according to an embodiment of the present application, Figure 6 An exploded view of an optical module box, a heat sink and an optical module according to an embodiment of the present application, Figure 5 and Figure 6 The optical module box 20 has a first opening 02 and a second opening 03. The first opening 02 is used to allow the optical module 400 to enter and exit the accommodation cavity 01. The first opening 02 is an opening in the depth direction D1 of the optical module box 20. The depth direction D1 of the optical module box 20 is the same as the insertion and extraction direction of the optical module 400. The second opening 03 is provided on the surface of the optical module box 20 away from the mainboard 100. The second opening 03 is an opening in the height direction D2 of the optical module box 20. The height direction D2 of the optical module box 20 is the stacking direction of the optical module box 20 with at least two layers. The size of the second opening 03 can be set according to actual needs. As shown in Figure 6 , the width of the second opening 03 is equal to the width of the optical module box 20. It can be understood that the larger the area of the second opening 03, the more conducive to air convection, thereby significantly improving the heat dissipation effect of the optical module 400.

[0051] Continuing to refer to Figure 5 to Figure 6 , the communication device further comprises a heat sink 700 provided on the side of the optical module box 20 away from the mainboard 100. The heat sink 700 comprises a support plate 720 and a plurality of heat dissipation fins 710 provided on the support plate 720. The support plate 720 is provided on the side of the optical module box 20 away from the mainboard 100 and covers at least part of the second opening 03. Among them, the heat dissipation fins 710 are perpendicular to the support plate 720. The support plate 720 is provided with a plurality of through holes to increase the heat exchange between the optical module 400 and the heat dissipation fins 710.

[0052] Referring to Figure 5 and Figure 6 , the heat sink 700 is fixed to the optical module box 20 by a limiting piece 800. The limiting piece 800 comprises two oppositely arranged clamping plates 810 and a connecting plate 820 provided between the two clamping plates 810. The connecting plate 820 and the two clamping plates 810 form a U-shaped structure. The connecting plate 820 is provided on the side of the support plate 720 away from the optical module box 20. The clamping plate 810 is provided with a limiting hole 04. The side wall of the optical module box 20 is provided with a protrusion 23 which can be inserted into the limiting hole 04, thereby fixing the heat sink 700 to the optical module box 20.

[0053] Continuing to refer to Figure 5 and Figure 6 , the connecting plate 820 can be provided with an avoiding opening 05 for avoiding the heat dissipation fins 710, so that at least part of the heat dissipation fins 710 can pass through the avoiding opening 05.

[0054] In order to further improve the heat conduction efficiency between the optical module and the heat sink, a thermal interface material (TIM) is filled between the optical module and the heat sink, which can squeeze out the small gap between the two, reduce the thermal resistance, and inevitably increase the friction when the optical module is plugged in, resulting in poor plugging experience, and even the optical module cannot be inserted.

[0055] Therefore, as shown in the figure, the inner wall of the optical module box 20 is provided with a sliding part 900, which is used for sliding connection with the optical module 400, so as to facilitate the plugging of the optical module 400. Figure 6

[0056] In some optional embodiments, the sliding part 900 can include a first track 910 and a second track 920, and correspondingly, the optical module 400 is provided with a sliding piece 420 towards the side wall of the optical module box 20, which can slide along the first track 910 and the second track 920.

[0057] Specifically, the optical module box 20 includes a first side wall 21 and a second side wall 22 which are perpendicular and opposite to the mainboard 100, the surface of the first side wall 21 towards the second side wall 22 is provided with a first track 910, and the surface of the second side wall 22 towards the first side wall 21 is provided with a second track 920, both the first track 910 and the second track 920 extend along a first direction D1, wherein the first direction D1 is the direction in which the first opening 02 points to the optical module connector 300.

[0058] In some optional embodiments, the sliding part 900 can also be a sliding block provided on the inner wall of the optical module box 20, and the optical module 400 is provided with a sliding rail matched with the sliding block towards the side wall of the optical module box 20, so that the optical module 400 and the optical module box 20 can relatively slide along the first direction D1, facilitating the plugging of the optical module 400.

[0059] In summary, in the case of improving the port density, the heat dissipation efficiency of the communication equipment in the present application is also significantly improved. At a speed of 10G, a common SFP module has 56 channels, and two 40-watt fans are needed for heat dissipation. The communication equipment in the present application has 256 channels, and two 40-watt fans can meet the heat dissipation demand, that is, the heat dissipation efficiency of the communication equipment in the present application is improved by more than 4 times, effectively saving energy and reducing consumption, and improving the energy efficiency level of the communication equipment.

[0060] Obviously, those skilled in the art can make various modifications and variations to the embodiments of the present application without departing from the spirit and scope of the present application. Thus, if these modifications and variations of the present application fall within the scope of the claims of the present application and their equivalent technologies, the present application also intends to include these modifications and variations.​

Claims

1. A communication device, characterized in that, It includes a motherboard, a communication device chip disposed on the surface of the motherboard, and M optical module connectors. Each of the optical module connectors and the communication device chip are connected through multiple signal line groups, where M is a positive integer greater than or equal to 1. The optical module connector is used for detachable connection with the optical module, the optical module includes multiple transmission channels, and one of the signal line groups is used for signal connection with one of the transmission channels, wherein the multiple signal line groups correspond to the multiple transmission channels.

2. The communication device according to claim 1, characterized in that, The number of signal line groups between any of the optical module connectors and the communication device chip is 4N, where N is a positive integer greater than or equal to 1; the number of transmission channels of any of the optical modules is 4N. Each of the signal line groups includes a first signal line and a second signal line, wherein the first signal line is used to transmit a signal from the communication device chip to the optical module connector, and the second signal line is used to transmit a signal from the optical module connector to the communication device chip.

3. The communication device according to claim 1, characterized in that, The M optical module connectors include first gold finger pins and second gold finger pins. The first gold finger pins are used to transmit a first type of signal, and the number of the first gold finger pins corresponds to the number of transmission channels in the optical module. The second gold finger pins are used to transmit a second type of signal, and the number of the second gold finger pins corresponds to the number of optical modules.

4. The communication device according to any one of claims 1-3, characterized in that, The communication device includes a primary indicator light and a secondary indicator light. The primary indicator light is used to indicate the operating status of the optical module, and the secondary indicator light is used to indicate the operating status of the multiple transmission channels corresponding to each optical module.

5. The communication device according to any one of claims 1-3, characterized in that, The communication device includes multiple optical module boxes, each optical module box having a receiving cavity for accommodating the optical module and the optical module connector. The motherboard includes a first surface and a second surface disposed opposite to each other, and the optical module boxes are provided on both the first surface and the second surface.

6. The communication device according to claim 5, characterized in that, The optical module box located on the first surface and the optical module box located on the second surface are arranged symmetrically in mirror image along the motherboard.

7. The communication device according to claim 5, characterized in that, The optical module box has a first opening and a second opening. The first opening is an opening in the depth direction of the optical module box and is used to allow the optical module to enter and exit the receiving cavity. The second opening is located on the surface of the optical module box away from the motherboard and is an opening in the height direction of the optical module box.

8. The communication device according to claim 7, characterized in that, The communication device also includes a heat sink, which is located on the side of the optical module box opposite to the motherboard.

9. The communication device according to claim 7, characterized in that, The inner wall of the optical module box is provided with a sliding part, which is used to slide and connect with the optical module.

10. The communication device according to claim 9, characterized in that, The sliding part includes a first track and a second track. The optical module box includes a first sidewall and a second sidewall that are perpendicular to and opposite to the motherboard. The first track is provided on the surface of the first sidewall facing the second sidewall, and the second track is provided on the surface of the second sidewall facing the first sidewall. Both the first track and the second track extend along a first direction, wherein the first direction is the direction in which the first opening points to the optical module connector.

Images