Double-layer COB circuit board

Abstract

The utility model relates to a double-layer COB circuit board, which comprises a front character layer, a front windowing layer, a front circuit layer and a back windowing layer which are laminated and connected from top to bottom in sequence, the front circuit layer comprises a light-emitting unit, the light-emitting unit comprises COB chip connecting points, the COB chip connecting points are connected one by one on the same straight line, and the back windowing layer is connected with the front character layer. By arranging the front circuit layer used for pasting the components and the COB chip connection points are compactly arranged, the number of the components pasted in the double-layer COB circuit board can be increased.

Description

TECHNICAL FIELD

[0001] The utility model relates to the field of flexible circuit board, in particular to a double -deck COB circuit board. BACKGROUND

[0002] Flexible circuit board (namely Flexible Printed Circuit Board, usually simply called "soft board", also be called FPC in the industry) is a kind of printed circuit board based on flexible insulating base material (mainly adopt polyimide or polyester film).It has the ability of free bending, winding and folding.FPC can effectively reduce the volume of electronic products, and meet the trend of electronic products to high density, miniaturization and high reliability.Flexible printed circuit board is divided into single-sided, double-sided and multilayer board, and its main base material is polyimide copper-clad plate, which is strong in heat resistance and good in dimensional stability.Through pressing process, it is combined with covering film with mechanical protection and good electrical insulation performance to form the final product.Double-sided and multilayer printed circuit board realizes electrical connection between surface layer and inner layer conductor through metallization process.However, the existing FPC circuit board is limited in space and lacks reasonable circuit arrangement structure, resulting in fewer internal pads. SUMMARY

[0003] The utility model provides a double -deck COB circuit board, aims at at least one of the technical problems existing in prior art.

[0004] The technical scheme of the utility model is a double -deck COB circuit board, comprising: positive text layer, positive window layer, positive circuit layer and reverse window layer that are connected in layers from top to bottom, the positive circuit layer includes light emitting unit, the light emitting unit includes COB chip connecting point, the COB chip connecting point is connected one by one on the same straight line.

[0005] According to some embodiments of the utility model, a plurality of the light emitting unit is connected in sequence.

[0006] According to some embodiments of the utility model, the positive circuit layer further includes white light negative electrode soldering point, yellow light negative electrode soldering point and positive electrode soldering point in sequence from left to right.

[0007] According to some embodiments of the utility model, the light emitting unit is arranged below the white light negative electrode soldering point, the yellow light negative electrode soldering point and the positive electrode soldering point.

[0008] According to some embodiments of the utility model, the light emitting unit is connected by a plurality of the COB chip connecting point through circuit.

[0009] According to some embodiments of the utility model, the COB chip connecting point includes first COB chip connecting point, second COB chip connecting point, third COB chip connecting point, fourth COB chip connecting point, fifth COB chip connecting point, sixth COB chip connecting point, seventh COB chip connecting point, eighth COB chip connecting point, ninth COB chip connecting point, first zero COB chip connecting point, first one COB chip connecting point, first two COB chip connecting point, first three COB chip connecting point, first four COB chip connecting point, first five COB chip connecting point and first six COB chip connecting point are sequentially connected from top to bottom.

[0010] According to some embodiments of the utility model, the double-layer COB circuit board further includes at least one substrate drill hole, the substrate drill hole is arranged below the reverse side window layer, and the substrate drill hole sequentially penetrates the front side character layer, the front side window layer, the front side circuit layer and the reverse side window layer.

[0011] According to some embodiments of the utility model, the front side circuit layer is a rounded square.

[0012] The utility model discloses beneficial effect includes: double-layer COB circuit board includes front side character layer, front side window layer, front side circuit layer and reverse side window layer from top to bottom sequentially connected, and front side circuit layer includes light emitting unit, and light emitting unit includes COB chip connecting point, and COB chip connecting point is connected on the same straight line, and through setting the front side circuit layer for pasting component, and COB chip connecting point compact arrangement can increase the quantity of pasting component in double-layer COB circuit board.

[0013] In addition, additional aspects and advantages of the utility model will be given partly in the following description. Some beneficial effects of the utility model will become obvious from the following description, or be known by the practice of the utility model. BRIEF DESCRIPTION OF DRAWINGS

[0014] Figure 1 It is the schematic diagram of white light negative pole welding point, yellow light negative pole welding point, positive pole welding point and light emitting unit in the front side circuit layer of a double-layer COB circuit board of the utility model embodiment.

[0015] Figure 2 It is the schematic diagram of the front side character layer of a double-layer COB circuit board of the utility model embodiment.

[0016] Figure 3 It is the schematic diagram of the front side window layer of a double-layer COB circuit board of the utility model embodiment.

[0017] Figure 4 It is the schematic diagram of the reverse side window layer of a double-layer COB circuit board of the utility model embodiment.

[0018] Figure 5 Figure 1 is a schematic diagram of a front surface of a double-layer COB circuit board according to an embodiment of the present application.

[0019] Figure 6 Figure 2 is a schematic diagram of a section of a front surface circuit layer of a double-layer COB circuit board according to an embodiment of the present application.

[0020] The above figures contain the following reference signs:

[0021] White light negative electrode wire bonding point 1, yellow light negative electrode wire bonding point 2, positive electrode wire bonding point 3, first COB chip connection point 4, second COB chip connection point 5, third COB chip connection point 6, fourth COB chip connection point 7, fifth COB chip connection point 8, sixth COB chip connection point 9, seventh COB chip connection point 10, eighth COB chip connection point 11, ninth COB chip connection point 12, first zero COB chip connection point 13, first one COB chip connection point 14, first two COB chip connection point 15, first three COB chip connection point 16, first four COB chip connection point 17, first five COB chip connection point 18, first six COB chip connection point 19.

[0022] In the above figures, in order to maintain clear display, the positions of the circuit components are indicated by reference signs and lines, and the outlines of the actual circuit components can be hidden, but this does not affect the description. DETAILED DESCRIPTION

[0023] The concept, specific structure and technical effects of the present application will be described clearly and completely below in combination with embodiments and drawings, so as to fully understand the purpose, scheme and effects of the present application. It should be noted that the embodiments in the present application and the features in the embodiments can be combined with each other without conflict.

[0024] It should be noted that, unless otherwise specified, when a certain feature is referred to as being "fixed" or "connected" to another feature, it can be directly fixed or connected to the other feature, or indirectly fixed or connected to the other feature. In addition, the up, down, left, right, top, bottom and other descriptions used in the present application are only relative to the relative positions of the components of the present application in the drawings.

[0025] In addition, unless otherwise defined, all technical and scientific terms used herein have the same meaning as understood by those skilled in the art. The terms used in the specification herein are only for describing specific embodiments and are not intended to limit the present application. The term "and / or" used herein includes any combination of one or more related listed items.

[0026] It should be understood that, although the terms first, second, third, etc. can be employed in this disclosure to describe various elements, these elements should not be limited to these terms. These terms are only used to distinguish one type of element from another type of element. For example, a first element could also be termed a second element, and, similarly, a second element could also be termed a first element, without departing from the scope of the present disclosure.

[0027] Referring to Figures 1 to 6 illustrated, Figure 1 is a schematic diagram of a white light negative welding point, a yellow light negative welding point, a positive welding point and a light emitting unit in a front circuit layer of a double-layer COB circuit board according to an embodiment of the present application, Figure 2 is a schematic diagram of a front text layer of a double-layer COB circuit board according to an embodiment of the present application, Figure 3 is a schematic diagram of a front window layer of a double-layer COB circuit board according to an embodiment of the present application, Figure 4 is a schematic diagram of a back window layer of a double-layer COB circuit board according to an embodiment of the present application, Figure 5 is a schematic diagram of a front lamination of a double-layer COB circuit board according to an embodiment of the present application, Figure 6 is a schematic diagram of a section of a front circuit layer of a double-layer COB circuit board according to an embodiment of the present application. In some embodiments, the double-layer COB circuit board according to the present application comprises a front text layer, a front window layer, a front circuit layer and a back window layer which are connected in turn from top to bottom, the front circuit layer comprises a light emitting unit, the light emitting unit comprises a COB chip connection point, and the COB chip connection points are connected one by one on the same straight line.

[0028] It should be understood that the front window layer is a windowed part on the solder mask, that is, the part where the copper is exposed for welding. The main function of the solder mask is to prevent solder from flowing to unwanted areas during welding, while protecting the circuit board from the effects of moisture, corrosion and other environmental factors. The window is to allow the solder to contact the copper part that needs to be welded.

[0029] Specifically, the front text layer is used for printing text on the front, the front circuit layer is used for pasting components, the front window layer is used for windowing to expose the front text layer and the front circuit layer, and the back window layer is used for windowing to expose the front circuit layer. It is easy to understand that by providing the front circuit layer for pasting components, and the compact arrangement of the COB chip connection points, the number of components pasted in the double-layer COB circuit board can be increased.

[0030] Referring to Figure 1 illustrated, in some embodiments, the plurality of light emitting units are connected in turn at the head and tail.

[0031] Referring to Figure 1As shown in the drawings, in some embodiments, the front circuit layer further comprises a white light negative welding point 1, a yellow light negative welding point 2 and a positive welding point 3 which are adjacent to each other from left to right. It should be understood that the white light negative welding point 1 is the welding position of the negative electrode in the white light LED lamp, the yellow light negative welding point 2 is the welding position of the negative electrode in the yellow light LED lamp, and the positive welding point 3 is the welding point for connecting the positive lead.

[0032] Referring to Figure 1 As shown in the drawings, in some embodiments, the light emitting unit is arranged below the white light negative welding point 1, the yellow light negative welding point 2 and the positive welding point 3.

[0033] Referring to Figure 1 As shown in the drawings, in some embodiments, the light emitting unit is connected by wires through a plurality of COB chip connection points.

[0034] Referring to Figure 1 As shown in the drawings, in some embodiments, the COB chip connection points comprise a first COB chip connection point 4, a second COB chip connection point 5, a third COB chip connection point 6, a fourth COB chip connection point 7, a fifth COB chip connection point 8, a sixth COB chip connection point 9, a seventh COB chip connection point 10, an eighth COB chip connection point 11, a ninth COB chip connection point 12, a first zero COB chip connection point 13, a first one COB chip connection point 14, a first two COB chip connection point 15, a first three COB chip connection point 16, a first four COB chip connection point 17, a first five COB chip connection point 18 and a first six COB chip connection point 19 which are connected in order from top to bottom.

[0035] Referring to Figure 1 As shown in the drawings, in some embodiments, the front circuit layer is a rounded square.

[0036] In some embodiments, the double-layer COB circuit board further comprises at least one substrate drill hole arranged below the back window layer, the substrate drill hole sequentially penetrating the front text layer, the front window layer, the front circuit layer and the back window layer. It should be noted that a double-layer COB circuit board comprises a front text layer, a front window layer, a front circuit layer, a back window layer, a substrate drill hole and a front lamination which are sequentially stacked and connected from top to bottom.

[0037] The above is only a preferred embodiment of the present application, and the present application is not limited to the above-mentioned embodiments, as long as the same means achieve the technical effects of the present application, any modification, equivalent replacement, improvement, etc. within the spirit and principles of the present disclosure should be included in the protection scope of the present disclosure. All should belong to the protection scope of the present application. The technical solutions and / or embodiments within the protection scope of the present application can have various modifications and changes.

Claims

1. A double-layer COB wiring board, characterized by, Comprise: The front text layer, the front window layer, the front circuit layer and the back window layer are connected in turn from top to bottom, the front circuit layer comprises a light emitting unit, the light emitting unit comprises a COB chip connection point, and the COB chip connection points are connected one by one on the same straight line.

2. The double-layer COB circuit board according to claim 1, wherein A plurality of light emitting units are connected in turn.

3. The double-layer COB circuit board according to claim 1, wherein The front circuit layer further comprises a white light negative electrode welding point (1), a yellow light negative electrode welding point (2) and a positive electrode welding point (3) adjacent in turn from left to right.

4. The double-layer COB circuit board according to claim 3, wherein The light emitting unit is arranged below the white light negative electrode welding point (1), the yellow light negative electrode welding point (2) and the positive electrode welding point (3).

5. The double-layer COB circuit board according to claim 1, wherein The light emitting unit is connected by a plurality of COB chip connection points through a circuit.

6. The double-layer COB circuit board according to claim 5, wherein The COB chip connection points comprise a first COB chip connection point (4), a second COB chip connection point (5), a third COB chip connection point (6), a fourth COB chip connection point (7), a fifth COB chip connection point (8), a sixth COB chip connection point (9), a seventh COB chip connection point (10), an eighth COB chip connection point (11), a ninth COB chip connection point (12), a first zero COB chip connection point (13), a first one COB chip connection point (14), a first two COB chip connection point (15), a first three COB chip connection point (16), a first four COB chip connection point (17), a first five COB chip connection point (18) and a first six COB chip connection point (19) connected in turn from top to bottom.

7. The double-layer COB circuit board according to claim 1, wherein The double-layer COB circuit board further comprises at least one substrate drill hole, the substrate drill hole is arranged below the back window layer, and the substrate drill hole passes through the front text layer, the front window layer, the front circuit layer and the back window layer in turn.

8. The double-layer COB circuit board according to claim 1, wherein The front circuit layer is a rounded square.

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