IRM support for low-cost machine type

Abstract

The utility model relates to the technical field of infrared receiving, solves the technical problems of high cost of manufacturing materials and poor heat dissipation performance in the prior art, and particularly relates to an IRM (infrared receiving module) support for a low-cost machine type, which comprises a support mechanism and an auxiliary bonding hole for releasing glue stress, a welding plate is arranged at the top of the support mechanism, and the welding plate is arranged on the support mechanism. A wafer base plate is arranged above the welding plate, the wafer base plate comprises a wafer plate used for installing wafers, a plurality of heat dissipation grooves used for heat dissipation are formed in the side end of the wafer plate, fixing is achieved through the wafer base plate, heat is dissipated to the outer side through the heat dissipation grooves, effective heat dissipation can be achieved, and the heat dissipation effect is good. Meanwhile, a folding cover structure is omitted at the top end, the material cost and the manufacturing cost of the IRM support are greatly reduced, the limiting plate can prevent the wafer from deviating when the wafer is installed, the adhesion effect of glue on the wafer is improved through the adhesion holes, and the safety of the wafer on the IRM support is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to infrared receiving technical field especially relates to a kind of IRM support for low-cost machine. BACKGROUND

[0002] IRM generally refers to infrared remote control receiving head, it is mainly composed of infrared sensitive element, amplifier, limiter, filter, decoder, output end etc., when the key on remote controller is pressed, its internal infrared emitter will emit specific frequency infrared light signal, the IRM material on the market, all exist in colloid inside fold cover structure, to cover IC chip in colloid, to increase the anti-interference of material, improve the receiving performance of material, for part machine, because customer application design is different, part customer in application for the anti-interference performance of material is not valued, in order to optimize reduce material cost, in this case, continue to use the support with fold cover will cause the cost of material to rise, cause the waste of material cost, and IRM itself is poor in heat dissipation performance in the use process, causing infrared receiver service life to shorten, improve maintenance cost. SUMMARY

[0003] In view of the deficiencies in the prior art, the utility model provides a kind of IRM support for low-cost machine, solve the technical problems that the manufacturing material cost of prior art is higher and the heat dissipation performance is not good, reach the purpose that the material cost of IRM support is effectively reduced and the heat dissipation performance of IRM support is improved.

[0004] To solve the above technical problems, the utility model provides the following technical scheme: a kind of IRM support for low-cost machine, including support mechanism and the auxiliary adhesion hole for releasing glue stress, the support mechanism top is provided with welding plate, the welding plate top is provided with wafer pedestal plate.

[0005] Preferably, the wafer pedestal plate includes a wafer plate for mounting a wafer, the wafer plate side end is provided with a plurality of heat dissipation grooves for heat dissipation, the wafer plate top end is fixedly connected with a limiting plate for limiting the wafer, the wafer plate central position is provided with an adhesion hole for increasing the adhesion of glue, and the wafer plate bottom is provided with a cross hole.

[0006] Preferably, the adhesion hole is spiral groove, and the adhesion hole and the cross hole are respectively through the front and back of the wafer plate.

[0007] Preferably, the welding plate includes a support plate, and the support plate top end is provided with a welding area for welding gold wire.

[0008] Preferably, the auxiliary adhesion hole includes a top auxiliary hole, and the top auxiliary hole bottom is provided with a bottom auxiliary hole.

[0009] Preferably, the support mechanism comprises support rods for supporting the wafer base plate and the welding plate, the bottom end of the support rods is fixedly connected with a stable base that increases the stability of the wafer base plate and the welding plate, the bottom end of the stable base is fixedly connected with a base plate, and the middle part of the base plate is provided with a fixing hole for fixing the IRM support.

[0010] Preferably, a gap area is arranged between the wafer base plate and the welding plate to facilitate welding operation.

[0011] By the above technical scheme, the utility model provides a kind of IRM support for low-cost machine type, at least have following beneficial effects:

[0012] 1, the utility model is fixed by wafer base plate to lens, heat is dissipated to outside by the heat dissipation groove of wafer base plate edge, can effectively dissipate heat, while the top end of wafer base plate cancels the folding cover structure, substantially reduces the material cost and manufacturing cost of IRM support, additional limiting plate can effectively limit wafer, prevent wafer from deviating in the process of installing wafer, increase the adhesion of glue to wafer by adhesion hole, effectively fix wafer, improve the security of wafer on IRM support.

[0013] 2, the utility model is installed in the process of IRM support, the stability of IRM can be increased by the cooperation of support rod and stable base, avoid IRM support from shaking in the process of installation, by the action of base plate and fixed hole, it is convenient for mechanical clamp to be clamped in the process of installing IRM support, increase the security of IRM support, reduce installation risk, improve yield. ACCURACY

[0014] The drawings described herein are used to provide further understanding of the present application, and form part of the present application, the illustrative embodiments of the present application and the description thereof are used to explain the present application, and do not constitute improper limitation on the present application. In the drawings:

[0015] Figure 1 It is a perspective view of the utility model for low-cost machine type IRM support;

[0016] Figure 2 It is a bottom side perspective view of the utility model IRM support;

[0017] Figure 3 It is Figure 2 the local enlarged view of A in the middle;

[0018] Figure 4 It is Figure 2 the local enlarged view of B in the middle;

[0019] Figure 5 The utility model relates to a plan view for low -cost machine kind's IRM support.

[0020] In the figure: 1, wafer base plate; 11, wafer plate; 12, heat dissipation groove; 13, limiting plate; 14, adhesion hole; 15, cross hole position; 2, welding plate; 21, support plate; 22, welding area; 3, auxiliary adhesion hole; 31, top auxiliary hole; 32, bottom auxiliary hole; 4, support mechanism; 41, support rod; 42, stable base; 43, base plate; 44, fixed hole. DETAILED DESCRIPTION

[0021] In order to make the above-mentioned purpose, features and advantages of the utility model more obvious and easy to understand, the utility model will be further described in detail below with the help of the attached drawings and specific implementation ways. By this, the realization process of how to apply technical means to solve technical problems and achieve technical effects in this application can be fully understood and implemented.

[0022] Due to the technical problems of higher manufacturing material cost and poor heat dissipation performance of the prior art, please refer to Figure 1 - Figure 5 The embodiment provides a kind of IRM support for low-cost machine kind, can effectively reduce the material cost of IRM support and improve the heat dissipation performance of IRM support, the IRM support includes a kind of IRM support for low-cost machine kind, including support mechanism 4 and auxiliary adhesion hole 3 for releasing glue stress, support mechanism 4 top is provided with welding plate 2, welding plate 2 top is provided with wafer base plate 1, wafer base plate 1 and welding plate 2 between gap region for facilitating welding operation are set, wafer base plate 1 includes the wafer plate 11 for installing wafer, wafer plate 11 side end is provided with a plurality of heat dissipation grooves 12 for heat dissipation, wafer plate 11 top is fixedly connected with the limiting plate 13 for facilitating wafer limiting, wafer plate 11 central position is provided with the adhesion hole 14 for increasing glue combination, wafer plate 11 bottom is provided with cross hole position 15, adhesion hole 14 is spiral groove, adhesion hole 14 and cross hole position 15 respectively penetrate the front and back two sides of wafer plate 11.

[0023] The utility model discloses a support mechanism supports the whole IRM support, releases the glue stress in the process of the structure of auxiliary adhesion hole 3 on the support adhesion, increases the firmness of adhesion, and the operation stability in the welding process is strengthened through the welding plate, and the fixed mounting of wafer is completed in combination with wafer base plate 1, specifically, the wafer is installed through wafer plate 11 of wafer base plate 1, a plurality of radiating grooves 12 are set up on wafer plate side end edge and are used for radiating to the outside, effectively transfer heat to the outside, and the limiting plate 13 can assist wafer plate 11 to keep in a fixed position in the use process, plays the limiting effect to wafer plate 11, and the adhesion hole 14 is set as spiral groove shape, and cooperation cross hole site 15 can provide adhesion space when using glue to adhere wafer, and the spiral groove can provide more force point after the glue is fixed, increase the stability after wafer installation, when vertical direction movement occurs, also can provide better stability, avoid the wafer deviation in the movement process, and the wafer is installed and fixed through wafer base plate, and the heat is dissipated to the outside through the radiating groove of wafer base plate edge, can effectively radiate heat, and the top of wafer base plate cancels the folding cover structure, greatly reduces the material cost and manufacturing cost of IRM support, and the limiting plate can effectively limit the wafer, prevent the wafer deviation in the process of installing wafer, increase the adhesion of glue to wafer through the adhesion hole, effectively fix the wafer, improve the safety of wafer on IRM support.

[0024] The welding plate 2 includes a support plate 21, and the support plate 21 is provided with a welding area 22 for welding gold wires at the top end.

[0025] The utility model discloses a support space is provided through the support plate 21 of welding plate 2, and the gold wire of conductive is welded through welding area 22, and welding area 22 is set as wide square to facilitate the determination of welding point and the quick operation of welding work, and the glue can cover on top auxiliary hole 31 and bottom auxiliary hole 32 in the process of encapsulating IRM device, and top auxiliary hole 31 can help the glue to connect the wafer part of top, so that the wafer and bottom are more firm, and bottom auxiliary hole 32 can help IRM device to adhere to the shell part, and the adhesion of glue is released through two holes, the adhesion of glue is increased, the adhesion effect of glue joint is increased, and the service life is prolonged.

[0026] The support mechanism 4 includes a support rod 41 for supporting the wafer base plate 1 and the welding plate 2, and the support rod 41 is fixedly connected at the bottom end with a stable base 42 for increasing the stability of the wafer base plate 1 and the welding plate 2. The stable base 42 is fixedly connected at the bottom end with a base plate 43, and the base plate 43 is provided in the middle with a fixing hole 44 for fixing the IRM support.

[0027] The utility model discloses, through the support rod 41 in support mechanism 4 is supported up IRM device, wherein support rod 41 needs can conduct electricity and is made of the metal of relatively hard material, stable base 42 can cooperate support rod 41 when installing IRM device can provide more stable effect, stable base 42 is set up as the trapezoidal of upper narrow lower wide, and the contact area of wide bottom can increase the stability of support, and the base plate 43 is the plate contact structure of width wide, and the wide plate structure can provide more holding area for support, and cooperate the setting of fixed hole 44, can make support holding stable, in the process of handling IRM support, make mechanical clamp convenient to hold and not damage support itself, through the effect of support mechanism, in the process of installing IRM support, can increase the stability of IRM through the cooperation of support rod and stable base, avoid the shaking of IRM support in the process of installation, through the effect of base plate and fixed hole, can be convenient for mechanical clamp to hold in the installation of IRM support, increased the security of IRM support, reduced the installation risk, improved the yield.

[0028] Each embodiment in the specification is described in a progressive manner, and each embodiment focuses on the difference from other embodiments. The same or similar parts between each embodiment can be referred to each other. For each embodiment, since it is basically similar to the method embodiment, the description is relatively simple, and the relevant part can be referred to the part of the method embodiment.

[0029] The above embodiments are described in detail, and the principle and implementation of the utility model are described by applying specific examples. The above embodiment is only used to help understand the method and core idea of the utility model. For those skilled in the art, according to the idea of the utility model, the specific implementation and application range will be changed. The above description should not be understood as a limitation of the utility model.

Claims

1. An IRM holder for low cost machine species comprising a holder mechanism (4) and an auxiliary bonding hole (3) for releasing glue stress, characterized in that, The support mechanism (4) top is provided with a welding plate (2), the welding plate (2) is provided with wafer pedestal plate (1) above; The wafer pedestal plate (1) includes a wafer plate (11) for mounting a wafer, the wafer plate (11) is provided with a plurality of heat dissipation grooves (12) for heat dissipation at the side end, the wafer plate (11) is fixedly connected with a limiting plate (13) at the top end, the wafer plate (11) is provided with an adhesive hole (14) for increasing the adhesion of glue at the central position, and the wafer plate (11) is provided with a cross hole (15) at the bottom.

2. The IRM support according to claim 1, characterized in that, The adhesive hole (14) is spiral groove, the adhesive hole (14) and cross hole (15) are respectively through the front and back of wafer plate (11).

3. The IRM support of claim 1, wherein, The welding plate (2) includes a support plate (21), and the support plate (21) is provided with a welding area (22) for welding gold wire at the top end.

4. The IRM support of claim 1, wherein, The auxiliary bonding hole (3) includes a top auxiliary hole (31), and the bottom auxiliary hole (32) is provided at the bottom of the top auxiliary hole (31).

5. The IRM support of claim 1, wherein, The support mechanism (4) includes a support rod (41) for supporting the wafer pedestal plate (1) and the welding plate (2), the support rod (41) is fixedly connected with a stable base (42) at the bottom end, the stable base (42) is fixedly connected with a base plate (43) at the bottom end, and the base plate (43) is provided with a fixing hole (44) for fixing the IRM support at the middle.

6. The IRM support of claim 1, wherein, The wafer pedestal plate (1) and the welding plate (2) are provided with a gap area for facilitating welding operation between them.

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