Wafer protection glue coating device
By improving the wafer protective adhesive coating device, and utilizing the combination of gear and eccentric column clamping technology and the design of fan heating air duct, the problems of wafer tilting and frequent maintenance caused by inaccurate suction cup fixation have been solved, achieving stable wafer coating and rapid curing of protective adhesive.
Patent Information
- Application Number
- CN202422853782.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-22
- Publication Date
- 2025-12-19
- Estimated Expiration
- 2034-11-22
AI Technical Summary
In existing technologies, suction cups cannot accurately center wafers when fixing them, causing wafers to tilt or fall during rotation. They also require regular maintenance, increasing the workload of employees.
The wafer is stably clamped by a combination of gear one, gear two, turntable, eccentric column, connecting rod belt, connecting block, clamping block, drive assembly and elastic component, and the protective adhesive is rapidly cured by a combination of fan, air outlet, filter, connecting pipe, housing and heating wire.
It improves the stability of the wafer during rotation, prevents damage from drops, reduces maintenance frequency, and increases coating efficiency and the curing speed of the protective adhesive.
Smart Images

Figure CN223683870U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to wafer processing technical field especially relates to a wafer protective glue coating device. BACKGROUND
[0002] Wafer is a kind of key material in semiconductor manufacturing, it is usually circular sheet, it is the basic material for manufacturing integrated circuit (chip) and other electronic components in semiconductor industry, in processing, the surface of wafer needs to be coated with a layer of protective glue, can effectively avoid wafer to be damaged when transmission, loading or unloading, can prevent chemical substances from causing corrosion or damage to wafer surface simultaneously.
[0003] The existing glue coating usually adopts rotary mode to coat protective glue on the surface of wafer, and in order to prevent wafer from falling during rotation, wafer is usually fixed, the existing wafer fixing mode is the mode of suction cup, after fixing wafer, protective glue is dropped on the top of wafer, and rotates to make protective glue evenly dispersed, although suction cup fixing can fix wafer, but the center point of wafer cannot be confirmed during use, the rotation speed of wafer needs to be accelerated after coating to accelerate the cooling speed of protective glue, which can easily cause wafer to tilt under the condition of wafer eccentricity, and can cause pressure to the adsorption of suction cup, further cause wafer to fall off and damage, and suction cup needs to be maintained regularly, otherwise it cannot work effectively, including cleaning and replacing suction cup gasket, to ensure its performance, further increase the labor intensity of staff, therefore a wafer protective glue coating device is proposed to solve the above problems. UTILITY MODEL CONTENT
[0004] In order to make up for the above shortcomings, the utility model provides a wafer protective glue coating device, aims at improving the problems that suction cup cannot position the center point of wafer in prior art, easily causes wafer to fall off and damage during rotation, and needs regular maintenance.
[0005] In order to achieve the above object, the utility model discloses the following technical scheme: a wafer protection glue coating device, including base, the top fixed connection shell of base, the middle part of shell is provided with glue spraying subassembly, the bottom fixed connection of glue spraying subassembly has the baffle, the inside fixed connection of base has the motor, the output fixed connection of motor has the casing, the middle part sliding connection of casing has the glue coating bucket, the middle part of glue coating bucket is provided with the recess, the top of casing is rotatably connected in the base, the inside rotatable connection of casing has gear one, the inside rotatable connection of casing has a plurality of gear no.
[0006] As a further description of the above technical scheme:
[0007] The driving assembly includes a worm, the worm is rotatably connected in the middle part of the casing, the inside rotatable connection of the casing has a worm wheel, the worm and the worm wheel are engaged with each other, the gear one is fixedly connected at the top of the worm wheel.
[0008] As a further description of the above technical scheme:
[0009] The elastic component includes a stop block, the stop block is fixedly connected on the side, away from the connecting rod band, of the connecting block, the stop block is fixedly connected with a compression spring on the side, close to the connecting block, the other end of the compression spring is fixedly connected in the inside of the clamp block.
[0010] As a further description of the above technical scheme:
[0011] The top of the casing is rotatably connected with a connecting plate, the connecting plate is fixedly connected in the middle part of the shell, the top of the connecting plate is fixedly connected with a fan, the input of the fan is installed with a filter screen, the output of the fan is fixedly connected with a connecting pipe, the other end of the connecting pipe is fixedly connected with a box, the middle part of the box is installed with an electric heating wire, the other side of the box is fixedly connected with an air outlet, the other side of the air outlet is towards the middle part of the casing.
[0012] As a further description of the above technical scheme:
[0013] The bottom of the baffle is fixedly connected with a sliding block, the top of the glue coating bucket is fixedly connected with a sliding groove, the sliding block is slidingly connected in the middle part of the sliding groove.
[0014] As a further description of the above technical solutions:
[0015] The clamping block is in contact with the glue coating barrel, and one side of the clamping block facing the glue coating barrel is provided in an arc shape.
[0016] As a further description of the above technical solutions:
[0017] The gear ratio of the first gear is greater than the gear ratio of the second gear.
[0018] As a further description of the above technical solutions:
[0019] The worm is fixedly connected with a handle on the side away from the shell, and a rubber sleeve is arranged on the outer periphery of the handle.
[0020] The utility model has the following beneficial effects:
[0021] 1. In the utility model, through the mutual cooperation of the first gear, the second gear, the rotating disc, the eccentric column, the connecting rod belt, the connecting block, the stop block, the clamping block, the driving assembly and the elastic assembly, the wafer can be prevented from being damaged when the worm is rotated under the action of the elastic assembly, the clamping degree of the wafer can be increased, the stability of the wafer during rotation can be improved, the wafer can be prevented from falling and being damaged, cleaning is not necessary, the glue coating barrel can be taken out and cleaned or replaced by pressing the clamping block, and the glue coating barrel can be conveniently cleaned.
[0022] 2. In the utility model, through the mutual cooperation of the fan, the air outlet, the filter screen, the connecting pipe, the box body and the electric heating wire, dust or solid impurities can be prevented from entering the inside of the fan under the action of the filter screen, air can be transported into the box body by driving the fan, air can be heated and hot air can be blown into the glue coating barrel under the action of the electric heating wire, the solidification speed of the protective glue can be accelerated, and the efficiency of glue coating can be improved. BRIEF DESCRIPTION OF DRAWINGS
[0023] Figure 1 A three-dimensional schematic view of a wafer protective glue coating device is provided in the utility model;
[0024] Figure 2 A structure schematic view of a shell of a wafer protective glue coating device is provided in the utility model;
[0025] Figure 3 A structure schematic view of a chute of a wafer protective glue coating device is provided in the utility model;
[0026] Figure 4 A structure schematic view of a driving assembly of a wafer protective glue coating device is provided in the utility model;
[0027] Figure 5 A structure diagram of a compression spring of a wafer protective glue coating device is provided in the utility model.
[0028] Figure 6 A structure diagram of a sliding block of a wafer protective glue coating device is provided in the utility model.
[0029] Figure 7 A structure diagram of a filter screen of a wafer protective glue coating device is provided in the utility model.
[0030] Legend:
[0031] 1, base; 2, shell; 3, glue spraying assembly; 4, sliding block; 5, baffle; 6, motor; 7, shell; 8, sliding groove; 9, recess; 10, gear one; 11, gear two; 12, rotating disc; 13, eccentric column; 14, connecting rod belt; 15, connecting block; 16, stop block; 17, compression spring; 18, clamping block; 19, worm; 20, worm wheel; 21, connecting plate; 22, fan; 23, air outlet; 24, connecting pipe; 25, box body; 26, heating wire; 27, filter screen; 28, glue coating barrel. DETAILED DESCRIPTION
[0032] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the utility model.
[0033] With reference to Figures 1-3 , the utility model provides an embodiment: a wafer protective glue coating device, including base 1, the top fixed connection shell 2 of base 1, the middle part of shell 2 is provided with glue spraying assembly 3, the bottom fixed connection of glue spraying assembly 3 has baffle 5, the inside fixed connection of base 1 has motor 6, the output end fixed connection of motor 6 has shell 7, the middle part sliding connection of shell 7 has glue coating barrel 28, the middle part of glue coating barrel 28 is equipped with recess 9, first, the wafer is placed in glue coating barrel 28, under the action of glue spraying assembly 3, baffle 5 can be driven to move down, at the same time, protective glue is dropped on the surface of wafer, by driving motor 6, wafer can be rotated, and under the action of baffle 5, protective glue can be prevented from splashing, the bottom fixed connection of baffle 5 has sliding block 4, the top fixed connection of glue coating barrel 28 has sliding groove 8, sliding block 4 sliding connection is in the middle part of sliding groove 8, under the action of sliding block 4 and sliding groove 8, baffle 5 can be closed glue coating barrel 28 at the same time without delaying the rotation of glue coating barrel 28.
[0034] With reference to Figures 3-5, the shell 7 is rotationally connected at the top of the base 1, the inside of the shell 7 is rotationally connected with a gear one 10, the inside of the shell 7 is rotationally connected with a plurality of gear twos 11, the plurality of gear twos 11 are all meshed with the gear one 10, the gear ratio of the gear one 10 is greater than the gear ratio of the gear two 11, through the arrangement, the rotating speed of the gear two 11 can be greater than the rotating speed of the gear one 10, the gear two 11 can be quickly driven to rotate, thereby the labor intensity of the staff can be reduced, the top of the gear two 11 is fixedly connected with a rotating disc 12, the top of the rotating disc 12 is fixedly connected with an eccentric column 13, the inside of the shell 7 is slidingly connected with a connecting rod belt 14, the eccentric column 13 is arranged at the middle of the connecting rod belt 14, one side of the connecting rod belt 14 close to the glue coating barrel 28 is fixedly connected with a connecting block 15, the other side of the connecting block 15 is slidingly connected with a clamping block 18, the clamping block 18 is insertedly connected with the groove 9, the connecting block 15 and the clamping block 18 are fixedly connected with an elastic assembly.
[0035] With reference to Figures 3-5 When the gear one 10 rotates, the gear two 11 and the rotating disc 12 can be driven to rotate, the eccentric column 13 can be moved while the rotating disc 12 rotates, at the same time, the connecting rod belt 14 and the connecting block 15 can be limited by the clamping block 18, so that they are driven by the eccentric column 13 and only move in translation when the eccentric column 13 moves, thereby the clamping block 18 can enter the middle of the groove 9 and clamp the outer side of the wafer, so that the wafer is prevented from tilting when rotating, the force of clamping the wafer can be reduced under the action of the elastic assembly, while the clamping block 18 is ensured to clamp the wafer, the middle of the shell 7 is rotationally connected with a driving assembly, the gear one 10 can be driven to rotate under the action of the driving assembly.
[0036] With reference to Figure 4 The driving assembly comprises a worm 19, the worm 19 is rotationally connected at the middle of the shell 7, the inside of the shell 7 is rotationally connected with a worm wheel 20, the worm 19 and the worm wheel 20 are meshed with each other, the gear one 10 is fixedly connected at the top of the worm wheel 20, the worm wheel 20 can be driven to rotate by rotating the worm 19, thereby the gear one 10 can be driven to rotate, the wafer can be clamped, after the wafer is taken off, the glue coating barrel 28 can be replaced by pressing the clamping block 18, the replaced glue coating barrel 28 can be cleaned without affecting the processing of the wafer, at the same time, the glue coating barrel 28 can be disassembled and cleaned, the glue coating barrel 28 can be more conveniently cleaned, the side of the worm 19 away from the shell 7 is fixedly connected with a handle, a rubber sleeve is sleeved on the outer periphery of the handle, the handle and the rubber sleeve can be more conveniently and comfortably rotated.
[0037] With reference to Figure 5The elastic assembly comprises a stopper 16 fixedly connected to one side of the connecting block 15 away from the connecting rod belt 14, a compression spring 17 fixedly connected to one side of the stopper 16 close to the connecting block 15, and a clamping block 18 fixedly connected to the other end of the compression spring 17. When the connecting rod belt 14 moves to contact the clamping block 18, the gear 11 continues to rotate to compress the compression spring 17 and press the clamping block 18, thereby enhancing the clamping of the wafer without damaging the wafer, and improving the stability of the wafer.
[0038] With reference to Figure 1 , Figure 6 and Figure 7 , the top of the shell 7 is rotatably connected with a connecting plate 21 fixedly connected to the middle of the shell 2, the top of the connecting plate 21 is fixedly connected with a fan 22, the input end of the fan 22 is installed with a filter screen 27, and the output end of the fan 22 is fixedly connected with a connecting pipe 24. The filter screen 27 can filter the air to prevent dust or solid impurities from entering the inside of the fan 22 to cause damage or blockage of the fan 22, improve the working efficiency of the fan 22, and increase the service life of the fan 22.
[0039] With reference to Figure 1 , Figure 6 and Figure 7 , the other end of the connecting pipe 24 is fixedly connected with a box 25, the middle of the box 25 is installed with an electric heating wire 26, the other side of the box 25 is fixedly connected with an air outlet 23, and the other side of the air outlet 23 faces the middle of the shell 7. The fan 22 can suck the filtered air into the connecting pipe 24 and transport it to the box 25, heat the air under the action of the electric heating wire 26, blow the heated air to the surface of the wafer through the air outlet 23, thereby accelerating the solidification speed of the protective glue, improving the efficiency of the glue coating, and setting the side of the clamping block 18 facing the glue coating barrel 28 as an arc shape. When the clamping block 18 contacts the glue coating barrel 28, the arc shape can quickly extrude the clamping block 18.
[0040] Working principle: in use, by inserting the glue bucket 28 into the middle of the shell 7, the compression spring 17 is compressed when entering, when the groove 9 moves to the original position of the clamp block 18, the clamp block 18 can be inserted into the middle of the groove 9 under the action of the compression spring 17, the glue bucket 28 and the shell 7 can be connected, the wafer is placed in the middle of the glue bucket 28, and the gear one 10 and the gear two 11 can be rotated by rotating the worm 19, the rotating gear two 11 can drive the rotating disc 12 and the eccentric column 13, the connecting block 15 and the connecting rod 14 can be limited under the action of the clamp block 18, the clamp block 18 can be moved to the middle of the glue bucket 28 when the eccentric column 13 moves, and the wafer can be extruded, the compression spring 17 is compressed before extruding the wafer, and the compression spring 17 can continuously press the clamp block 18 to stabilize the wafer, the glue bucket 28 can be taken out by pressing the clamp block 18, the glue bucket 28 can be conveniently cleaned, and the glue bucket 28 can be replaced when taken out.
[0041] By driving the glue spraying assembly 3, the baffle 5 can be moved downward and contacted with the glue bucket 28, and the protective glue can be dropped on the wafer, the wafer can be rotated by driving the motor 6, and the protective glue can be prevented from splashing under the action of the baffle 5.
[0042] When the coating is completed, the air can enter the inside of the connecting pipe 24 by the fan 22, the air can be filtered under the action of the filter screen 27, the dust and solid impurities in the air can be prevented from entering the fan 22, the gas can be transported into the inside of the box 25 under the action of the connecting pipe 24, the gas can be heated under the action of the electric heating wire 26 and blown to the inside of the glue bucket 28 through the air outlet 23, and the solidification speed of the protective glue can be accelerated.
[0043] Finally, it should be noted that: the above only describes the preferred embodiments of the present application, and is not used to limit the present application, although the present application has been described in detail with reference to the foregoing embodiments, for those skilled in the art, the technical solutions recorded in the foregoing embodiments can be modified, or some technical features can be replaced, any modification, equivalent replacement, improvement, etc. within the spirit and principles of the present application should be included in the protection scope of the present application.
Claims
1. A wafer protection glue coating device comprising a base (1), characterized in that: The top of the base (1) is fixedly connected with an outer shell (2), the middle of the outer shell (2) is provided with a glue spraying assembly (3), the bottom of the glue spraying assembly (3) is fixedly connected with a baffle (5), the inside of the base (1) is fixedly connected with a motor (6), the output end of the motor (6) is fixedly connected with a shell (7), the middle of the shell (7) is slidably connected with a glue applying barrel (28), the middle of the glue applying barrel (28) is provided with a groove (9), the shell (7) is rotatably connected with the top of the base (1), the inside of the shell (7) is rotatably connected with a gear one (10), the inside of the shell (7) is rotatably connected with a plurality of gear twos (11), the plurality of gear twos (11) are all in mesh with the gear one (10), the top of the gear two (11) is fixedly connected with a rotating disc (12), the top of the rotating disc (12) is fixedly connected with an eccentric column (13), the inside of the shell (7) is slidably connected with a connecting rod belt (14), the eccentric column (13) is arranged in the middle of the connecting rod belt (14), one side of the connecting rod belt (14) close to the glue applying barrel (28) is fixedly connected with a connecting block (15), the other side of the connecting block (15) is slidably connected with a clamping block (18), the clamping block (18) is in plug-in cooperation with the groove (9), the connecting block (15) and the clamping block (18) are fixedly connected with an elastic assembly, the middle of the shell (7) is rotatably connected with a driving assembly.
2. The wafer protection glue coating device according to claim 1, wherein: The driving assembly comprises a worm (19), the worm (19) is rotatably connected with the middle of the shell (7), the inside of the shell (7) is rotatably connected with a worm wheel (20), the worm (19) and the worm wheel (20) are in mesh with each other, and the gear one (10) is fixedly connected with the top of the worm wheel (20).
3. The wafer protection glue coating device according to claim 1, wherein: The elastic assembly comprises a stop block (16), the stop block (16) is fixedly connected with one side of the connecting block (15) away from the connecting rod belt (14), one side of the stop block (16) close to the connecting block (15) is fixedly connected with a compression spring (17), and the other end of the compression spring (17) is fixedly connected with the inside of the clamping block (18).
4. The wafer protection glue coating device according to claim 1, wherein: The top of the shell (7) is rotatably connected with a connecting plate (21), the connecting plate (21) is fixedly connected with the middle of the outer shell (2), the top of the connecting plate (21) is fixedly connected with a fan (22), the input end of the fan (22) is provided with a filter screen (27), the output end of the fan (22) is fixedly connected with a connecting pipe (24), the other end of the connecting pipe (24) is fixedly connected with a box body (25), the middle of the box body (25) is provided with an electric heating wire (26), the other side of the box body (25) is fixedly connected with an air outlet (23), and the other side of the air outlet (23) faces the middle of the shell (7).
5. The wafer protection glue coating device according to claim 1, wherein: The bottom of the baffle (5) is fixedly connected with a sliding block (4), the top of the glue applying barrel (28) is fixedly connected with a sliding groove (8), and the sliding block (4) is slidably connected with the middle of the sliding groove (8).
6. The wafer protection glue coating device according to claim 1, wherein: The clamping block (18) is in contact with the glue coating barrel (28), and one side of the clamping block (18) towards the glue coating barrel (28) is provided in an arc shape.
7. The wafer protection glue coating device according to claim 1, wherein: The gear ratio of the gear wheel one (10) is greater than the gear ratio of the gear wheel two (11).
8. The wafer protection glue coating device according to claim 2, wherein: A handle is fixedly connected to one side of the worm (19) away from the shell (7), and a rubber sleeve is sleeved on the outer periphery of the handle.