Cutting device for circuit board preparation

By introducing a vacuum pump-controlled vacuum nozzle and cleaning device into the circuit board cutting device, the problems of inaccurate positioning and residue cleaning during the circuit board cutting process are solved, achieving stable cutting and convenient cleaning of circuit boards.

CN223684654UActive Publication Date: 2025-12-19WEIHAI SUNGHO ELECTRONICS CO LTD
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Patent Information

Application Number
CN202520228748.0
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-02-13
Publication Date
2025-12-19
Estimated Expiration
2035-02-13

AI Technical Summary

Technical Problem

Existing circuit board cutting equipment lacks a positioning structure, which makes the circuit board prone to shifting or shaking during the cutting process, resulting in cutting errors. Furthermore, the residue after cutting is difficult to clean, affecting subsequent operations.

Method used

A cutting device was designed, comprising a support base, an operating table, a movable frame, a clamping device, and a cleaning device. The device utilizes a vacuum pump to control a vacuum nozzle to achieve precise positioning and clamping of the circuit board, and the cleaning device facilitates the removal of residue.

Benefits of technology

This technology improves the stability of circuit boards during the cutting process, reduces cutting errors, facilitates residue removal, and enhances production efficiency and safety.

✦ Generated by Eureka AI based on patent content.

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Abstract

The cutting device for circuit board preparation comprises a supporting base, an operation table and a movable frame, the operation table is fixedly arranged on the upper end face of the supporting base, and second sliding rails are connected to the two side faces of the operation table through bolts and used for being connected with the movable frame; the upper portion of the front end face of the movable frame is in bolted connection with a first sliding rail used for being connected with a laser cutting machine. Connecting grooves are symmetrically formed in the upper end face of the operation table and used for being connected with a clamping device. Supporting legs are symmetrically and fixedly arranged on the upper end face of the operation table and located on the outer side of the connecting groove. Cleaning devices are fixedly arranged at the upper ends of the supporting legs; a sundry groove is formed in the front side of the upper end face of the operation table and used for containing cleaning impurities. The clamping device is arranged on the operation table, accurate positioning and clamping of the circuit board are achieved, it is guaranteed that the circuit board does not deviate or shake in the cutting period, and cutting errors are reduced; and the cleaning device and the sundry groove are arranged on the operation table, so that residual impurities can be cleaned and collected after the circuit board is cut.
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Description

TECHNICAL FIELD

[0001] The utility model relates to a cutting device, especially a cutting device for circuit board preparation. BACKGROUND

[0002] The circuit board is composed of integrated circuits, crystal oscillators, trimmer capacitors and printed circuit boards, realizes the miniaturization and visualization of the circuit, plays an important role in the batch production of fixed circuits and the optimization of the layout of electrical appliances, optimizes the layout of electronic equipment, is mainly used for connecting various electronic components in electronic equipment and provides necessary structural support,

[0003] In the production and processing process of the circuit board, according to the work requirement, the circuit board must be accurately cut to obtain appropriate size; however, the existing cutting device for circuit board preparation is not equipped with a positioning structure, and manual holding of the circuit board is required for cutting the circuit board, which may cause safety hazards, and if the positioning is not accurate, the circuit board will shift or shake during cutting, resulting in cutting failure and waste products, and thus causing cost waste; at the same time, the residues after cutting the circuit board are not convenient to clean on the operation table, affecting the subsequent cutting process. SUMMARY

[0004] In order to solve the above technical problems, the utility model provides a cutting device for circuit board preparation.

[0005] In order to solve the above technical problems, the utility model adopts the technical scheme: a cutting device for circuit board preparation, including support base, operation table and movable frame, the upper end surface of the support base is fixedly provided with the operation table, the two side surfaces of the operation table are both screw-connected with second sliding rails for connecting the movable frame, the two inner sides of the movable frame are both fixedly provided with second sliding blocks for cooperating with the second sliding rails; the movable frame is in the shape of a door, the upper front end surface of the movable frame is screw-connected with a first sliding rail for connecting a laser cutting machine, the rear end surface of the laser cutting machine is fixedly provided with a first sliding block for cooperating with the first sliding rail;

[0006] The upper surface of the operating table is symmetrically provided with connecting grooves for connecting a clamping device. The clamping device includes a clamping plate, a connecting block, a vacuum nozzle, and a vacuum pump. The clamping plate includes a first clamping plate and a second clamping plate. Connecting blocks are symmetrically fixed on the bottom end surfaces of both the first and second clamping plates, and the connecting blocks are interference-fitted with the connecting grooves. A first vacuum line is provided inside the first clamping plate, and a second vacuum line is provided inside the second clamping plate. A first opening is provided on one side of the first clamping plate for connecting a first suction pipe to the first vacuum line, and a second opening is provided on one side of the second clamping plate for connecting a second suction pipe to the second vacuum line. The first suction pipe is connected to one end of the first vacuum line and the other end is fixedly connected to the first suction port of the vacuum pump; the second suction pipe is connected to one end of the second vacuum line and the other end is fixedly connected to the second suction port of the vacuum pump; the vacuum pump is welded to one side of the support base; a number of vacuum nozzles are fixedly arranged on one side of the clamping plate, including a first vacuum nozzle and a second vacuum nozzle. The first vacuum nozzle is arranged on the first clamping plate and connected to the first vacuum line; the second vacuum nozzle is arranged on the second clamping plate and connected to the second vacuum line. The first vacuum nozzle and the second vacuum nozzle are arranged opposite to each other.

[0007] The upper surface of the operating platform is symmetrically and fixedly equipped with support legs, which are located outside the connecting groove; a cleaning device is fixedly installed at the upper end of the support legs; a debris groove is opened on the front side of the upper surface of the operating platform for placing cleaning debris.

[0008] Furthermore, the cleaning device includes a connecting plate, a connecting strip, and a cleaning strip. A connecting plate is fixedly installed above the support leg. A third slide rail is bolted to the inner side of the connecting plate. Third sliders are fixedly installed on both sides of the connecting strip to cooperate with the third slide rail. A cleaning strip is adhered to the bottom end of the connecting strip.

[0009] Furthermore, the support legs are lifting columns used to adjust the height of the cleaning device.

[0010] Furthermore, a transition plate is provided at the rear end of the debris trough, with an inclination angle of 120 degrees to buffer the falling debris.

[0011] Furthermore, a cover plate is hinged to the front end of the debris trough to prevent debris from splashing.

[0012] Furthermore, the bolts on the upper end face of the cover plate are equipped with handles.

[0013] The utility model discloses a cutting device for circuit board preparation, through setting up first clamping plate and second clamping plate on operation table, and through vacuum pump control vacuum suction nozzle, realize accurate positioning and clamping to circuit board, ensure that circuit board does not occur deviation and wobble during cutting, keep stable, have played certain shock attenuation effect simultaneously, reduced cutting failure, set up cleaning device and sundry groove on operation table, so that clean and collect residual impurity after circuit board cutting is completed, make subsequent cutting operation convenient. BRIEF DESCRIPTION OF DRAWINGS

[0014] Figure 1 It is the whole structure schematic diagram of example one.

[0015] Figure 2 It is the whole structure schematic diagram of example one. Figure 1 It is the amplification schematic diagram of A part in the middle.

[0016] Figure 3 It is the amplification schematic diagram of B part in the middle. Figure 1 It is the amplification schematic diagram of B part in the middle.

[0017] Figure 4 It is the amplification schematic diagram of C part in the middle. Figure 1 It is the amplification schematic diagram of C part in the middle.

[0018] Figure 5 It is the whole structure schematic diagram of example two.

[0019] In the drawing: 1, support base, 2, operation table, 3, movable frame, 4, first sliding rail, 5, first sliding block, 6, laser cutting machine, 7, connecting groove, 8, connecting block, 9, clamping plate, 10, vacuum suction nozzle, 11, vacuum pump, 12, second sliding rail, 13, second sliding block, 14, third sliding rail, 15, third sliding block, 16, connecting strip, 17, cleaning strip, 18, lifting stand, 19, connecting plate, 20, sundry groove, 21, transition plate, 22, cover plate. DETAILED DESCRIPTION

[0020] The utility model will be further explained in detail in connection with the drawings and specific embodiment.

[0021] Example one:

[0022] Figures 1-4 The utility model discloses a cutting device for circuit board preparation, through setting up first clamping plate and second clamping plate on operation table, and through vacuum pump control vacuum suction nozzle, realize accurate positioning and clamping to circuit board, ensure that circuit board does not occur deviation and wobble during cutting, keep stable, have played certain shock attenuation effect simultaneously, reduced cutting failure, set up cleaning device and sundry groove on operation table, so that clean and collect residual impurity after circuit board cutting is completed, make subsequent cutting operation convenient.

[0023] The movable frame 3 is in the shape of a door, and a first sliding rail 4 is bolted to the upper end face of the front end of the movable frame 3 for connecting a laser cutting machine 6. The rear end face of the laser cutting machine 6 is fixedly provided with a first sliding block 5 for cooperating with the first sliding rail 4. The first sliding rail 4 is arranged in parallel with the x-axis direction, so as to facilitate the movement of the laser cutting machine 6 in the x-axis direction. Under the action of the second sliding rail 12 and the first sliding rail 4, the laser cutting machine 6 can cut the circuit board at different positions of the circuit board under the condition that the circuit board is fixed.

[0024] A connecting groove 7 is symmetrically formed in the upper end face of the operating table 2 for connecting a clamping device. The connecting groove 7 is a cuboid. The clamping device comprises a clamping plate 9, a connecting block 8, a vacuum nozzle 10 and a vacuum pump 11.

[0025] In this embodiment, the clamping plate 9 comprises a first clamping plate and a second clamping plate. The bottom end face of the first clamping plate and the bottom end face of the second clamping plate are both symmetrically fixedly provided with the connecting block 8. The connecting block 8 is interference-fitted into the connecting groove 7. When the clamping plate is used to fix the circuit board, the connecting block 8 is interference-fitted into the connecting groove 7. After use, the connecting block 8 is taken out of the connecting groove 7.

[0026] The first clamping plate is internally provided with a first vacuum pipeline, and the second clamping plate is internally provided with a second vacuum pipeline. A first opening is formed in one side of the first clamping plate for connecting a first air suction pipe to the first vacuum pipeline. A second opening is formed in one side of the second clamping plate for connecting a second air suction pipe to the second vacuum pipeline. The other end of the first air suction pipe connected to one end of the first vacuum pipeline is fixedly connected to a first air suction port of the vacuum pump 11. The other end of the second air suction pipe connected to one end of the second vacuum pipeline is fixedly connected to a second air suction port of the vacuum pump 11. The vacuum pump 11 is welded to one side face of the support base 1.

[0027] A plurality of vacuum nozzles 10 are fixedly arranged on one side of the clamping plate 9. In this embodiment, 16 vacuum nozzles 10 are fixedly arranged on the clamping plate 9. The vacuum nozzles 10 comprise 8 first vacuum nozzles and 8 second vacuum nozzles. The first vacuum nozzles are arranged on the first clamping plate. A plurality of air suction ports of the first vacuum pipeline penetrate the front end face of the first clamping plate to connect the first vacuum nozzles, i.e. the first vacuum nozzles are connected to the first vacuum pipeline. The second vacuum nozzles are arranged on the second clamping plate. A plurality of air suction ports of the second vacuum pipeline penetrate the rear end face of the second clamping plate to connect the second vacuum nozzles, i.e. the second vacuum nozzles are connected to the second vacuum pipeline. At this time, the first vacuum nozzles and the second vacuum nozzles are oppositely arranged.

[0028] Support legs are symmetrically fixedly arranged on the upper end face of the operating table 2. The support legs are located outside the connecting groove 7. In this embodiment, 4 support legs are fixedly arranged on the upper end face of the operating table 2, and are symmetrically arranged in pairs. The upper ends of the support legs are fixedly provided with cleaning devices.

[0029] The cleaning device in the embodiment comprises a connecting plate 19, a connecting strip 16 and a cleaning strip 17; the upper part of the supporting leg is fixedly provided with the connecting plate 19, that is, two connecting plates 19 are symmetrically arranged, the inner side of the connecting plate 19 is bolted with the third sliding rail 14, the two sides of the connecting strip 16 are fixedly provided with the third sliding block 15 for matching the third sliding rail 14, and the bottom end surface of the connecting strip 16 is bonded with the cleaning strip 17; the third sliding rail 14 is arranged in parallel with the y-axis, so that the cleaning strip 17 cleans from the rear end to the front end of the operation table 2.

[0030] The supporting leg in the embodiment is a lifting column 18 for adjusting the height of the cleaning device; the height of the cleaning device is adjusted by arranging the lifting column 18, so that the thick cleaning strip 17 is not needed, and the material consumption of the cleaning strip 17 is saved.

[0031] The front side of the upper end surface of the operation table 2 is provided with a sundry groove 20 for placing sundries; the rear end of the sundry groove 20 is provided with a transition plate 21, the inclination angle of the transition plate 21 is 120 degrees for buffering the falling of the sundries; after the sundries are cleaned, the sundries slide to the sundry groove 20 through the transition plate 21, so that the impact force generated when the sundries freely fall is effectively reduced, thereby reducing the splashing of the sundries.

[0032] The operation process of the utility model comprises the following steps:

[0033] I. According to the size of the circuit board, the clamping plate 9 is placed at a proper position, and the vacuum suction nozzle 10 abuts against the circuit board;

[0034] II. The first suction pipe and the second suction pipe are connected with the first vacuum pipe and the second vacuum pipe respectively; the vacuum pump 11 is started;

[0035] III. According to the cutting effect required by the circuit board, the first sliding block 5 and the second sliding block 13 are remotely controlled, and the laser cutting machine 6 is turned on, so as to control the cutting operation and the cutting position of the laser cutting machine 6;

[0036] IV. After cutting is completed, the vacuum pump 11 is turned off, the cutting is stopped by remote control, and the circuit board is taken out;

[0037] V. The clamping plate 9 is taken off from the upper end of the operation table 2;

[0038] VI. The lifting column 18 is lowered to the position where the cleaning strip 17 can abut against the operation table 2;

[0039] VII. The third sliding block 15 is remotely controlled, so that the cleaning strip 17 moves from the rear end to the front end of the operation table 2, and the third sliding block 15 is stopped when the sundries are pushed to the sundry groove 20;

[0040] VIII. After the cutting device is used for a period of time, the sundries in the sundry groove 20 are removed by using the dust collector.

[0041] Example 2:

[0042] like Figure 5 As shown, a cover plate 22 is hinged to the front end of the debris trough 20 to prevent debris from splashing. A handle is bolted on the upper end face of the cover plate 22. When using the cleaning device, the cover plate 22 is opened to allow the debris to fall into the debris trough 20. After use, the cover plate 22 is closed to prevent the debris in the debris trough 20 from splashing due to other reasons, such as the vibration generated during subsequent cutting.

[0043] In summary, the second embodiment in this specification mainly describes the differences from the first embodiment. The same or similar parts between the first embodiment and other embodiments can be referred to each other.

[0044] The above embodiments are not intended to limit the present utility model, nor is the present utility model limited to the examples given above. Any changes, modifications, additions or substitutions made by those skilled in the art within the scope of the technical solution of the present utility model are also within the protection scope of the present utility model.

Claims

1. A cutting device for circuit board preparation, comprising a supporting base (1), an operating table (2) and a movable frame (3), the upper end surface of the supporting base (1) is fixedly provided with the operating table (2), the two side surfaces of the operating table (2) are both bolted with a second sliding rail (12) for connecting the movable frame (3), and the two inner lower sides of the movable frame (3) are both fixedly provided with a second sliding block (13) for matching the second sliding rail (12); characterized in that: The movable frame (3) is in the form of a door, and a first sliding rail (4) is bolted to the upper end face of the movable frame (3) for connecting a laser cutting machine (6), and a first sliding block (5) is fixedly arranged on the rear end face of the laser cutting machine (6) for cooperating with the first sliding rail (4); The upper end face of the operation table (2) is symmetrically provided with a connecting groove (7) for connecting a clamping device, and the clamping device comprises a clamping plate (9), a connecting block (8), a vacuum nozzle (10) and a vacuum pump (11), the clamping plate (9) comprises a first clamping plate and a second clamping plate; the bottom end face of the first clamping plate and the bottom end face of the second clamping plate are symmetrically fixedly provided with the connecting block (8), and the connecting block (8) is interference-fitted with the connecting groove (7); the first clamping plate is internally provided with a first vacuum pipeline, and the second clamping plate is internally provided with a second vacuum pipeline; a first opening is formed in one side of the first clamping plate for connecting a first suction pipe to the first vacuum pipeline, and a second opening is formed in one side of the second clamping plate for connecting a second suction pipe to the second vacuum pipeline; the other end of the first suction pipe connected to one end of the first vacuum pipeline is fixedly connected to a first air inlet of the vacuum pump (11), and the other end of the second suction pipe connected to one end of the second vacuum pipeline is fixedly connected to a second air inlet of the vacuum pump (11); the vacuum pump (11) is welded to one side of the support base (1); a plurality of vacuum nozzles (10) are fixedly arranged on one side of the clamping plate (9), the vacuum nozzles (10) comprise first vacuum nozzles and second vacuum nozzles, the first vacuum nozzles are arranged on the first clamping plate and connected to the first vacuum pipeline, the second vacuum nozzles are arranged on the second clamping plate and connected to the second vacuum pipeline, and the first vacuum nozzles and the second vacuum nozzles are arranged opposite to each other; The upper end face of the operation table (2) is symmetrically fixedly provided with support legs, and the support legs are located outside the connecting grooves (7); the upper end of each support leg is fixedly provided with a cleaning device; and a sundry groove (20) is formed in the front side of the upper end face of the operation table (2) for placing and cleaning sundries.

2. The cutting apparatus for manufacturing a circuit board according to Claim 1, wherein: The cleaning device comprises a connecting plate (19), a connecting strip (16) and a cleaning strip (17), the upper end of each support leg is fixedly provided with the connecting plate (19), the inner side of the connecting plate (19) is bolted to a third sliding rail (14), and the two sides of the connecting strip (16) are fixedly provided with third sliding blocks (15) for cooperating with the third sliding rail (14); and the bottom end face of the connecting strip (16) is bonded with the cleaning strip (17).

3. The cutting apparatus for manufacturing a circuit board according to Claim 1, wherein: The support legs are lifting columns (18) for adjusting the height of the cleaning device.

4. The cutting apparatus for manufacturing a circuit board according to Claim 1, wherein: The rear end of the sundry groove (20) is provided with a transition plate (21), and the inclination angle of the transition plate (21) is 120 degrees for buffering the falling of the sundries.

5. The cutting apparatus for manufacturing a circuit board according to Claim 1, wherein: The front end of the sundry groove (20) is hingedly provided with a cover plate (22) for preventing the sundries from splashing.

6. The cutting apparatus for manufacturing a circuit board according to claim 5, wherein: The upper end face of the cover plate (22) is bolted with a handle.