High-temperature-resistant pyrograph film

By using high-temperature resistant materials and pigments, combined with an edge-sealing design, the problems of pattern shifting and ink discoloration under high temperatures in heat transfer film have been solved, thus improving the quality of heat transfer printing.

CN223686240UActive Publication Date: 2025-12-19NANYANG DESHIWEI DIGITAL MATERIAL CO LTD
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Patent Information

Application Number
CN202520210447.5
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-02-11
Publication Date
2025-12-19
Estimated Expiration
2035-02-11

AI Technical Summary

Technical Problem

When the hot melt adhesive layer of existing heat transfer films melts under high temperature conditions, the other layers are not heat-resistant, causing the pattern to shift or the ink to change color, thus affecting the quality of the heat transfer.

Method used

High-temperature resistant materials such as silicone oil coating, polytetrafluoroethylene, polyamide hot melt adhesive and polyurethane microspheres are used, combined with high-temperature resistant pigments, to ensure that the ink pattern layer and hot melt adhesive layer do not melt or deform at high temperatures, and edge sealing is used to prevent impurities from entering.

Benefits of technology

It improves the stability and aesthetics of heat transfer film patterns under high temperature conditions, prevents pattern displacement and ink discoloration, and enhances the quality of heat transfer printing.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the technical field of pyrography, and discloses a high-temperature-resistant pyrography film which comprises an ink pattern layer, a release layer fixedly connected to the bottom of the ink pattern layer, a hot melt adhesive layer fixedly connected to the bottom of the ink pattern layer, a bottom layer fixedly connected to the bottom of the hot melt adhesive layer, and an adhesive layer fixedly connected to the bottom of the bottom layer. The outer wall of the release layer is detachably connected with a sealing edge, the outer wall of the ink pattern layer can make contact with the inner wall of the sealing edge, the inner wall of the sealing edge is detachably connected to the outer wall of the bottom layer, the outer wall of the hot melt adhesive layer can make contact with the inner wall of the sealing edge, and reinforcing glue microspheres are arranged on the inner wall of the hot melt adhesive layer. And the reinforcing glue microspheres are made of polyurethane. According to the pyrograph film, the high-temperature-resistant materials are adopted as the materials of all the layers of the pyrograph film, so that the pyrograph film is not prone to being influenced by high temperature in the pyrograph process, and therefore when the hot melt adhesive layer is melted, other layers are not influenced by the high temperature, and the pyrograph quality is guaranteed.
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Description

TECHNICAL FIELD

[0001] The utility model relates to a pyrography technical field especially relates to a high temperature resistant pyrography film. BACKGROUND

[0002] The working principle of pyrography film is to sublimate the pattern on the transfer paper to the medium such as cloth through high temperature and high pressure. It has hot melt glue behind, and the glue melts after heating to make the pattern firmly attached. The application scenarios are wide, and it is used for pattern printing of T-shirts, sportswear and the like in the clothing industry; in the field of ornaments, it can be used for making mobile phone cases and key buckles with exquisite patterns; it can also be used for home decoration, such as pyrography on a throw pillow and a curtain to add beauty and personality.

[0003] Pyrography film mainly includes a release layer, an ink layer and a hot melt adhesive layer. The release layer plays an isolation role, facilitates pattern transfer and can make the ink layer smoothly separate when heated. The ink layer bears the required pattern or text, and under high temperature and high pressure, the ink sublimates and transfers to the target object surface. The hot melt adhesive layer is located at the lowermost layer and will melt after heating, firmly adhering the sublimated ink to the target object, so that the pattern can be attached for a long time to achieve the purpose of decoration or identification.

[0004] In the prior art, the material of part of the pyrography film is easily affected by high temperature during pyrography, so that when the hot melt adhesive layer melts, the other layers melt due to not being resistant to high temperature, for example, the ink layer will be affected by high temperature, resulting in pattern displacement and ink discoloration, thereby reducing the pyrography quality. Therefore, a high-temperature-resistant pyrography film is proposed to solve the above problems. UTILITY MODEL CONTENTS

[0005] In order to make up for the above shortcomings, the utility model provides a high-temperature-resistant pyrography film, aiming at improving the problem that in the prior art, when the hot melt adhesive layer melts, the other layers melt due to not being resistant to high temperature, for example, the ink layer will be affected by high temperature, resulting in pattern displacement and ink discoloration, thereby reducing the pyrography quality.

[0006] In order to achieve the above purpose, the utility model adopts the following technical scheme:

[0007] A high-temperature-resistant pyrography film, comprising an ink pattern layer, the bottom of the ink pattern layer is fixedly connected with a release layer, the bottom of the ink pattern layer is fixedly connected with a hot melt adhesive layer, and the bottom of the hot melt adhesive layer is fixedly connected with a bottom layer.

[0008] As a further description of the above technical scheme:

[0009] The outer wall of the release layer is detachably connected with an edge cover, and the outer wall of the ink pattern layer can contact the inner wall of the edge cover.

[0010] As a further description of the above technical scheme:

[0011] The inner wall of the edge sealing is detachably connected to the outer wall of the bottom layer, and the outer wall of the hot melt adhesive layer is in contact with the inner wall of the edge sealing;

[0012] As a further description of the above technical solution:

[0013] The inner wall of the hot melt adhesive layer is provided with reinforced glue microspheres, and the material of the reinforced glue microspheres is polyurethane;

[0014] As a further description of the above technical solution:

[0015] The material of the release layer is a silicone oil coating, and the material of the ink pattern layer is a high-temperature-resistant pigment type ink;

[0016] As a further description of the above technical solution:

[0017] The material of the bottom layer is polytetrafluoroethylene, and the material of the hot melt adhesive layer is polyamide hot melt adhesive;

[0018] The utility model has the advantages of the following beneficial effects:

[0019] In the utility model, the ink pattern layer uses high-temperature-resistant inorganic pigments such as iron oxide, diiron trioxide, chrome yellow, chrome green and titanium dioxide, or organic pigments such as azo pigment, phthalocyanine pigment and quinacridone pigment as the material, so that the ink pattern layer is not affected by high temperature during the heating process, thereby preventing the melting of the pigment or the deformation of the ink, and affecting the quality of the iron-on picture. BRIEF DESCRIPTION OF DRAWINGS

[0020] Figure 1 A three-dimensional schematic view of the high-temperature-resistant iron-on picture film is provided for the utility model;

[0021] Figure 2 A structure schematic view of the release layer of the high-temperature-resistant iron-on picture film is provided for the utility model;

[0022] Figure 3 A structure schematic view of the hot melt adhesive layer of the high-temperature-resistant iron-on picture film is provided for the utility model;

[0023] Figure 4 A Figure 2 An enlarged view of position A in FIG. 1;

[0024] Figure 5 A Figure 3 An enlarged view of position B in FIG. 1.

[0025] LEGEND:

[0026] 1, release layer; 2, ink pattern layer; 3, hot melt adhesive layer; 4, bottom layer; 5, reinforced glue microspheres; 6, edge sealing. DETAILED DESCRIPTION

[0027] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0028] With reference to Figure 1 , Figure 2 and Figure 4 , one embodiment provided by the present application: the bottom of the ink pattern layer 2 is fixedly connected with the release layer 1, the material of the release layer 1 adopts a silicone oil coating, the silicone oil has good heat resistance and can withstand a certain degree of high temperature without decomposition or loss of its isolation performance, the silicone oil coating can effectively prevent the release layer 1 from excessive adhesion with the pattern layer and the glue layer below, and ensure that the release process proceeds smoothly, the bottom of the ink pattern layer 2 is fixedly connected with the hot melt adhesive layer 3, the hot melt adhesive layer 3 adopts polyamide hot melt adhesive with a lower melting point than other layers, so that the hot melt adhesive layer 3 can be normally melted without affecting other layers, thereby not affecting the normal work of other layers.

[0029] The bottom of the hot melt adhesive layer 3 is fixedly connected with the bottom layer 4, the bottom layer 4 adopts polytetrafluoroethylene, which has a high melting point and can maintain stable chemical structure and physical properties, and will not melt or decompose, better allowing the hot melt adhesive layer 3 to play a role of physical support and object adhesion, the outer wall of the release layer 1 is detachably connected with the edge sealing 6, the edge sealing 6 is used to prevent dust and other impurities from entering the inside of the heat transfer printing film when the heat transfer printing film is not in use, thereby affecting the subsequent heat transfer printing, the outer wall of the ink pattern layer 2 is in contact with the inner wall of the edge sealing 6, the inner wall of the edge sealing 6 is detachably connected to the outer wall of the bottom layer 4, and the outer wall of the hot melt adhesive layer 3 is in contact with the inner wall of the edge sealing 6;

[0030] With reference to Figure 2 , Figure 3 and Figure 5The inner wall of the hot melt adhesive layer 3 is provided with reinforced glue microspheres 5. The reinforced glue microspheres 5 can be distributed in the bonding interface between the pattern and the substrate after the glue is melted and transferred. When the glue is cooled and solidified, the microspheres can enhance the cohesion and adhesion of the glue. The material of the reinforced glue microspheres 5 is polyurethane. The melting point of polyurethane is close to that of polyamide hot melt adhesive, and polyurethane also has good elasticity and adhesion. After the glue is melted and transferred, the polyurethane microspheres can use their own elastic properties to play a buffering and filling role in the bonding interface between the pattern and the substrate, preventing cracks or peeling between the glue layer and the pattern layer or the substrate.

[0031] The material of the release layer 1 is a silicone oil coating. Silicone oil has good heat resistance and can withstand a certain degree of high temperature without decomposing or losing its isolation performance. The silicone oil coating can effectively prevent the release layer 1 from excessive adhesion with the pattern layer and the glue layer below, ensuring smooth release process. The material of the ink pattern layer 2 is high-temperature resistant pigment ink. High-temperature resistant inorganic pigments such as iron oxide, ferric oxide, chrome yellow, chrome green, and titanium white powder, or organic pigments such as azo pigments, phthalocyanine pigments, and quinacridone pigments are used. This will prevent the ink pattern layer 2 from being affected by high temperatures during heating, causing the pigments to melt or the ink to deform.

[0032] The material of the bottom layer 4 is polytetrafluoroethylene. Polytetrafluoroethylene has a high melting point and can maintain stable chemical structure and physical properties without melting or decomposing. It better allows the hot melt adhesive layer 3 to serve as a physical support and adhere to the object. The material of the hot melt adhesive layer 3 is polyamide hot melt adhesive, which has a lower melting point than other layers. It can melt normally without affecting other layers, thus not affecting the normal work of other layers.

[0033] Working principle: When the heat transfer film is needed, first tear off the edges 6 on both sides. The edges 6 prevent dust and other impurities from entering the heat transfer film when it is not in use, which can affect subsequent heat transfer. Then place the heat transfer film on the object to be heat transferred. Lower the heating plate to make it fully contact with the heat transfer film and keep it for a certain period of time. After the heat transfer is completed, peel off the release layer 1 to complete the heat transfer.

[0034] The material of the release layer 1 adopts a silicone oil coating, the silicone oil has good heat resistance, can withstand a certain degree of high temperature without decomposition or loss of its isolation performance, the silicone oil coating can effectively prevent the release layer 1 from excessive adhesion with the underlying pattern layer and the glue layer, and ensure the smooth release process, and the ink pattern layer 2 adopts high-temperature-resistant inorganic pigments such as iron oxide, ferric oxide, chrome yellow, chrome green and titanium white powder, or organic pigments such as azo pigments, phthalocyanine pigments and quinacridone pigments, which can prevent the ink pattern layer 2 from being affected by high temperature during the heating process, thereby preventing the melting of the pigments or the deformation of the ink, and the hot melt adhesive layer 3 adopts polyamide hot melt adhesive with a lower melting point than other layers, so that the hot melt adhesive layer 3 can be normally melted without affecting other layers, thereby not affecting the normal work of other layers.

[0035] The bottom layer 4 adopts polytetrafluoroethylene, which has a high melting point and can maintain stable chemical structure and physical properties, and will not melt or decompose, so that the hot melt adhesive layer 3 can better play a role in physically supporting and adhering to the object, and the reinforcing glue microspheres 5 can be distributed in the bonding interface between the pattern and the substrate after the glue is melted and transferred. When the glue cools and solidifies, the microspheres can enhance the cohesive force and adhesion of the glue, and the material of the reinforcing glue microspheres 5 adopts polyurethane, which has a melting point close to that of the polyamide hot melt adhesive and also has good elasticity and adhesion. After the glue is melted and transferred, the polyurethane microspheres can use their own elastic properties to play a role in buffering and filling in the bonding interface between the pattern and the substrate, preventing cracks or peeling between the glue layer and the pattern layer or the substrate.

[0036] Finally, it should be noted that: the above only for the preferred embodiments of the present application, and not for limiting the present application, although the present application has been described in detail with reference to the foregoing embodiments, for those skilled in the art, it can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement for part of the technical features, any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application, shall be included in the protection scope of the present application.

Claims

1. A high temperature resistant transfer film comprising an ink design layer (2), characterized in that: The bottom of the ink pattern layer (2) is fixedly connected with a release layer (1), the bottom of the ink pattern layer (2) is fixedly connected with a hot melt adhesive layer (3), and the bottom of the hot melt adhesive layer (3) is fixedly connected with a bottom layer (4).

2. The heat-resistant transfer film according to claim 1, wherein: The outer wall of the release layer (1) is detachably connected with an edge sealing (6), and the outer wall of the ink pattern layer (2) can be in contact with the inner wall of the edge sealing (6).

3. The heat-resistant transfer film according to claim 2, wherein: The inner wall of the edge sealing (6) is detachably connected to the outer wall of the bottom layer (4), and the outer wall of the hot melt adhesive layer (3) can be in contact with the inner wall of the edge sealing (6).

4. The heat-resistant transfer film according to claim 3, wherein: The inner wall of the hot melt adhesive layer (3) is provided with reinforced glue microspheres (5), and the material of the reinforced glue microspheres (5) is polyurethane.

5. The heat-resistant transfer film according to claim 1, wherein: The material of the release layer (1) is a silicone oil coating, and the material of the ink pattern layer (2) is a high-temperature-resistant pigment type ink.

6. The heat-resistant transfer film according to claim 1, wherein: The material of the bottom layer (4) is polytetrafluoroethylene, and the material of the hot melt adhesive layer (3) is polyamide hot melt adhesive.