Soaking device for copper material polishing
By using a waterproof motor to drive an impeller to agitate the solution and a hydraulic rod to push a copper rod in a copper polishing device, combined with a mud pump to achieve solution circulation and filtration, the problems of impurity accumulation and solution pollution during copper immersion polishing are solved, thus improving the polishing effect and environmental friendliness.
Patent Information
- Application Number
- CN202520131468.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-20
- Publication Date
- 2025-12-19
- Estimated Expiration
- 2035-01-20
AI Technical Summary
During the copper immersion polishing process, impurities precipitate and accumulate, affecting the uniformity and effectiveness of polishing. Contamination of the polishing solution leads to waste and increased production costs.
Design an immersion device for polishing copper materials, including a polishing box and a filter assembly. A waterproof motor drives an impeller to agitate the solution and remove impurities, a hydraulic rod pushes a copper rod to ensure uniform polishing, and a mud pump is set up to realize solution circulation filtration and purification.
It effectively prevents impurity buildup, ensures polishing effect and copper material quality, reduces solution waste, lowers production costs, and avoids environmental pollution.
Smart Images
Figure CN223688458U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to copper material processing technical field, concretely is a kind of soaking device for copper material polishing. BACKGROUND
[0002] In the processing of copper material, in order to improve the smoothness and quality of copper material surface, often need to polish the copper material processing. Among them, chemical soaking polishing is a commonly used method, by soaking copper material in specific polishing liquid, use chemical reaction to remove the oxide layer, impurities etc. on the surface of copper material, to achieve the effect of polishing.
[0003] In the process of soaking polishing, copper bar surface will precipitate impurities, if these impurities cannot be effectively removed, will be accumulated on the surface of copper bar, affect the uniformity and effect of polishing, reduce the quality of copper material, in addition, polishing solution will gradually pollute due to impurities mixing in the process of use, if effective circulation filtration and purification treatment cannot be carried out, not only will cause the waste of solution, also will increase production cost, simultaneously, it is not conducive to environmental protection.
[0004] Therefore, the utility model provides a kind of soaking device for copper material polishing to solve above-mentioned problems. UTILITY MODEL CONTENTS
[0005] In view of the deficiencies of prior art, the utility model provides a kind of soaking device for copper material polishing, solves above-mentioned problems.
[0006] To achieve the above object, the utility model is realized by the following technical scheme: a kind of soaking device for copper material polishing, including polishing box, the inside of the polishing box is provided with polishing assembly, the back of the polishing box is provided with filter assembly, the bottom of the polishing box is fixedly installed with support leg, the polishing assembly includes support, the support is fixedly installed in the inside of polishing box, the top of the support is placed with copper bar, the inner bottom of the polishing box is fixedly installed with waterproof motor, the output of the waterproof motor is fixedly installed with impeller.
[0007] Preferably: every two supports are fixedly provided with impeller, the top of the support is provided with recess, and the copper bar is located in the recess.
[0008] Preferably: the right side wall of the polishing box is fixedly installed with hydraulic rod, the output of the hydraulic rod is fixedly installed with push plate, and the push plate is located in the inside of polishing box and the right side of copper bar.
[0009] Preferably: the filter assembly comprises a filter box, a first mud pump is fixedly installed at the top of the filter box, a first pipeline is fixedly installed between the water inlet of the first mud pump and the polishing box, a second mud pump is fixedly installed at the right side end of the filter box, a second pipeline is fixedly installed between the second mud pump and the polishing box, and the water outlet of the first mud pump is in communication with the inside of the filter box.
[0010] Preferably: the first pipeline is in communication with the inside of the polishing box, the second pipeline is in communication with the water outlet of the second mud pump, and the water inlet of the second mud pump is in communication with the inside of the filter box.
[0011] Preferably: a front slot is formed in the side wall of the filter box, a placing block is fixedly installed in the inside of the filter box, a screen is inserted into the inside of the front slot, the screen is located above the placing block, the communication position of the water outlet of the first mud pump and the filter box is located above the screen, and the communication position of the water inlet of the second mud pump and the filter box is located below the screen.
[0012] Preferably: a sealing plate is fixedly installed at the outer side of the screen, the sealing plate is attached to the outer side wall of the filter box, a handle is fixedly installed at the outer side of the sealing plate, and a sealing gasket is fixedly installed at the attachment position of the sealing plate and the filter box and at the inner side of the sealing plate.
[0013] Preferably: a fixing plate is fixedly installed at the upper and lower sides of the sealing plate, a screw rod is fixedly installed at the outer side of the filter box, the screw rod is inserted into the corresponding fixing plate, a nut is screwed on the outer side of the screw rod, and the nut is attached to the outer side of the fixing plate.
[0014] Beneficial effects
[0015] Compared with the prior art, the copper material polishing immersion device has the following advantages
[0016] Beneficial effects:
[0017] 1. The copper material polishing immersion device, by setting an impeller driven by a waterproof motor in the polishing box, when the copper bar is immersed and polished, the impeller rotates to stir the chemical solution, so that the impurities on the surface of the copper bar can be quickly removed from the surface of the copper bar under the action of the solution flow, effectively preventing the impurities from accumulating on the surface of the copper bar, thereby ensuring good polishing effect and improving the surface quality of the copper material.
[0018] 2. The copper material polishing immersion device, a movable push plate is arranged in the polishing box and driven by a hydraulic rod. During polishing, the push plate can push the copper bar to the left side, so that the parts not fully immersed in the solution and in contact with the support can be immersed in the solution for polishing, ensuring that each part of the copper bar can be uniformly and effectively polished, further improving the overall quality and consistency of the product.
[0019] 3. The copper material polishing immersion device, the first slurry pump can suck the chemical solution containing impurities from the polishing box into the filter box, after filtering through the screen, the second slurry pump re-enters the purified solution into the polishing box, realizing the recycling of the solution, not only reducing the waste of the solution, reducing the production cost, but also avoiding the environmental pollution problem caused by frequent replacement of the solution. BRIEF DESCRIPTION OF DRAWINGS
[0020] In order to more clearly illustrate the technical scheme in the embodiment of the present application or the prior art, the drawings needed to be used in the embodiment or the prior art description will be briefly introduced below, and obviously, the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained without creative labor on the basis of these drawings.
[0021] Figure 1 is the external structure perspective view of the present application;
[0022] Figure 2 is the internal structure perspective view of the present application;
[0023] Figure 3 is the back structure perspective view of the present application;
[0024] Figure 4 is the external structure perspective view of the filter box of the present application;
[0025] Figure 5 is the internal structure perspective view of the filter box of the present application.
[0026] In the figure: 1, polishing box; 2, polishing assembly; 21, support; 22, impeller; 23, waterproof motor; 24, push plate; 25, hydraulic rod; 3, filter assembly; 31, filter box; 32, first slurry pump; 33, first pipeline; 34, second pipeline; 35, sealing plate; 36, handle; 37, fixed plate; 38, screw; 39, nut; 310, screen; 311, placing block; 312, front slot; 4, supporting leg; 5, copper bar. DETAILED DESCRIPTION
[0027] It should be noted that in the description of the embodiments of the present application, the terms "front, back, left, right, top, bottom" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application. The terms "mounting", "connecting", "connecting" should be understood broadly, for example, it can be fixed connection, or detachable connection, or integrally connected; it can be directly connected, or indirectly connected through an intermediate medium; it can be the communication between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.
[0028] The present application will be further described in detail below with the aid of drawings and examples.
[0029] Referring to Figures 1 to 5 The embodiments of the present application provide a kind of copper material polishing soaking device, including polishing box 1, polishing box 1 It is provided with polishing assembly 2 in the inside, the back of polishing box 1 It is provided with filter assembly 3, the bottom of polishing box 1 It is fixedly installed with support leg 4, polishing assembly 2 It includes support 21, support 21 It is fixedly installed in the inside of polishing box 1, the top of support 21 It is placed with copper bar 5, the inner bottom of polishing box 1 It is fixedly installed with waterproof motor 23, the output end of waterproof motor 23 It is fixedly installed with impeller 22. Every two supports 21 It is fixedly provided with impeller 22, the top of support 21 It is provided with recess, copper bar 5 It is located in the inside of recess.
[0030] The right side wall of polishing box 1 It is fixedly installed with hydraulic rod 25, the output end of hydraulic rod 25 It is fixedly installed with push plate 24, push plate 24 It is located in the inside of polishing box 1 And located in the right side of copper bar 5.
[0031] In the embodiments, when copper bar 5 is soaked and polished, copper bar 5 is placed on support 21 in the inside of polishing box 1, when polishing, start the plurality of waterproof motors 23 below, the rotation of waterproof motor 23 can drive the rotation of impeller 22 above, the rotation of impeller 22 can stir the chemical solution in the inside of polishing box 1, the rapid stirring of chemical solution can make the impurities precipitated on the surface of copper bar 5 quickly move away from the surface of copper bar 5 when the solution flows, so as to prevent the impurities precipitated on the surface of copper bar 5 from accumulating, thereby ensuring the polishing effect, and after polishing for a period of time, the hydraulic rod 25 is started, the hydraulic rod 25 drives the push plate 24 to move, the push plate 24 moves to move the copper bar 5 to the left side by a distance, after moving, the part in contact with the support 21 can be immersed in the solution, to ensure that the part in contact with the support 21 can also be polished.
[0032] Referring to Figures 1 to 5In one aspect of the embodiment, the filtering assembly 3 comprises a filtering box 31, a first mud pump 32 is fixedly installed on the top of the filtering box 31, a first pipeline 33 is fixedly installed between the water inlet of the first mud pump 32 and the polishing box 1, a second mud pump 313 is fixedly installed on the right side end of the filtering box 31, a second pipeline 34 is fixedly installed between the second mud pump 313 and the polishing box 1, and the water outlet of the first mud pump 32 communicates with the inside of the filtering box 31. The first pipeline 33 communicates with the inside of the polishing box 1, the second pipeline 34 communicates with the water outlet of the second mud pump 313, and the water inlet of the second mud pump 313 communicates with the inside of the filtering box 31. A front slot 312 is formed in the side wall of the filtering box 31, a placing block 311 is fixedly installed in the inside of the filtering box 31, a screen 310 is inserted into the inside of the front slot 312, the screen 310 is located above the placing block 311, the communication position of the water outlet of the first mud pump 32 and the filtering box 31 is located above the screen 310, and the communication position of the water inlet of the second mud pump 313 and the filtering box 31 is located below the screen 310.
[0033] A sealing plate 35 is fixedly installed on the outer side of the screen 310, the sealing plate 35 is attached to the outer side wall of the filtering box 31, a handle 36 is fixedly installed on the outer side of the sealing plate 35, a sealing gasket is fixedly installed at the attachment position of the sealing plate 35 and the inside of the filtering box 31. A fixing plate 37 is fixedly installed on the upper and lower sides of the sealing plate 35, a screw rod 38 is fixedly installed on the outside of the filtering box 31, the screw rod 38 is inserted into the corresponding fixing plate 37, a nut 39 is screwed on the outside of the screw rod 38, and the nut 39 is attached to the outside of the fixing plate 37.
[0034] In the embodiment, when polishing is performed, the first mud pump 32 is started, the first mud pump 32 sucks the chemical solution and impurities through the first pipeline 33 and into the inside of the filtering box 31, the impurities are filtered through the screen 310, and the filtered solution is re-introduced into the polishing box 1 through the second pipeline 34 and the second mud pump 313, so as to achieve the purposes of cleaning the precipitated impurities and circulating the solution, and ensure that the precipitated impurities do not affect the subsequent polishing. When the screen 310 needs to be cleaned, the nut 39 is unscrewed, the fixing of the sealing plate 35 is released, the sealing plate 35 and the screen 310 are pulled out through the handle 36 after the fixing of the sealing plate 35 is released, the screen 310 is cleaned after being pulled out, and the screen 310 is re-installed after being cleaned, so as to achieve the effect of conveniently cleaning the screen 310.
[0035] Meanwhile, the contents not described in detail in the specification all belong to the prior art known by those skilled in the art.
[0036] Working principle: when the copper bar 5 is immersed and polished, the copper bar 5 is placed on the support 21 inside the polishing box 1, when polishing, the waterproof motors 23 below are started, the rotation of the waterproof motors 23 can drive the rotation of the impeller 22 above, the rotation of the impeller 22 can stir the chemical solution inside the polishing box 1, through the rapid stirring of the chemical solution, the impurities precipitated on the surface of the copper bar 5 can be quickly removed from the surface of the copper bar 5 when the solution flows, so that the precipitated impurities can be prevented from accumulating on the surface of the copper bar 5, thereby ensuring the polishing effect, and after a period of polishing, the hydraulic rod 25 is started, the hydraulic rod 25 drives the push plate 24 to move, the copper bar 5 can be moved a distance to the left side through the movement of the push plate 24, after moving, the part in contact with the support 21 can be immersed in the solution to ensure that the part in contact with the support 21 can also be polished; when polishing, the first mud pump 32 is started, the first mud pump 32 sucks the chemical solution together with the impurities into the filter box 31 through the first pipeline 33, the impurities are filtered through the internal screen 310, after filtering, the second pipeline 34 and the second mud pump 313 are used to re-input into the polishing box 1, so as to realize the purpose of cleaning the precipitated impurities and circulating the solution, so as to ensure that the precipitated impurities do not affect the subsequent polishing, and when the screen 310 needs to be cleaned, the nut 39 is unscrewed to release the fixation of the sealing plate 35, the sealing plate 35 is extracted with the screen 310 inside through the handle 36 after the fixation of the sealing plate 35 is released, the screen 310 is cleaned after being extracted, and the screen 310 is reinstalled after being cleaned, so as to realize the effect of conveniently cleaning the screen 310.
[0037] It should be noted that the relational terms herein such as first and second and the like are used solely to distinguish one entity or action from another, without necessarily requiring or implying any such actual relationship or order between such entities or actions. Moreover, the terms "comprises", "comprising", or any other variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but can include other elements not expressly listed or inherent to such process, method, article, or apparatus.
[0038] Although the embodiments of the present application have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made thereto without departing from the principles and spirit of the present application, the scope of which is defined by the appended claims and their equivalents.
Claims
1. A copper material polishing immersion device comprising a polishing tank (1), characterized in that: The inside of the polishing box (1) is provided with a polishing assembly (2), the back of the polishing box (1) is provided with a filter assembly (3), the bottom of the polishing box (1) is fixedly installed with supporting legs (4), the polishing assembly (2) comprises a support (21), the support (21) is fixedly installed in the inside of the polishing box (1), the top of the support (21) is placed with a copper bar (5), the inside bottom of the polishing box (1) is fixedly installed with a waterproof motor (23), and the output end of the waterproof motor (23) is fixedly installed with an impeller (22).
2. The copper material polishing immersion device according to claim 1, characterized by: Impellers (22) are fixedly arranged between every two supports (21), recesses are formed in the top of the support (21), and the copper bar (5) is located in the recess.
3. The copper material polishing immersion device according to claim 2, characterized by: The right side wall of the polishing box (1) is fixedly installed with a hydraulic rod (25), the output end of the hydraulic rod (25) is fixedly installed with a push plate (24), and the push plate (24) is located in the inside of the polishing box (1) and the right side of the copper bar (5).
4. The copper material polishing immersion device according to claim 1, characterized by: The filter assembly (3) comprises a filter box (31), the top of the filter box (31) is fixedly installed with a first mud pump (32), the water inlet of the first mud pump (32) and the polishing box (1) are fixedly installed with a first pipeline (33), the right side end of the filter box (31) is fixedly installed with a second mud pump (313), the second mud pump (313) and the polishing box (1) are fixedly installed with a second pipeline (34), and the water outlet of the first mud pump (32) is communicated with the inside of the filter box (31).
5. The copper material polishing immersion device according to claim 4, characterized by: The first pipeline (33) is communicated with the inside of the polishing box (1), the second pipeline (34) is communicated with the water outlet of the second mud pump (313), and the water inlet of the second mud pump (313) is communicated with the inside of the filter box (31).
6. The copper material polishing immersion device according to claim 5, characterized by: A front groove (312) is formed in the side wall of the filter box (31), the inside of the filter box (31) is fixedly installed with a placing block (311), the inside of the front groove (312) is inserted with a screen (310), the screen (310) is located above the placing block (311), the communication position of the water outlet of the first mud pump (32) and the filter box (31) is located above the screen (310), and the communication position of the water inlet of the second mud pump (313) and the filter box (31) is located below the screen (310).
7. The copper material polishing immersion device according to claim 6, characterized by: The outside side of the screen (310) is fixedly installed with a sealing plate (35), the sealing plate (35) is attached to the outside side wall of the filter box (31), the outside of the sealing plate (35) is fixedly installed with a handle (36), and the sealing gasket is fixedly installed at the attachment position of the sealing plate (35) and the filter box (31) and located on the inside of the sealing plate (35).
8. The copper material polishing immersion device according to claim 7, characterized by: The upper and lower sides of the sealing plate (35) are fixedly installed with fixed plates (37), the outside of the filter box (31) is fixedly installed with a screw rod (38), the screw rod (38) is inserted into the corresponding fixed plate (37), the outside of the screw rod (38) is screwed with a nut (39), and the nut (39) is attached to the outside of the fixed plate (37).