Multi-hole-site semiconductor wafer electroplating clamp

Abstract

The utility model discloses a multi-hole-site semiconductor wafer electroplating clamp, and particularly relates to the technical field of semiconductor wafer electroplating. The multi-hole-site semiconductor wafer electroplating clamp comprises an installation frame, a plurality of chuck mechanisms are fixedly installed in the installation frame, a driving mechanism is fixedly installed on one side of the installation frame, and each chuck mechanism comprises an installation sleeve and an air cylinder. The mounting sleeve is fixedly mounted in the base, a mounting disc is fixedly mounted at the top of the mounting sleeve, a plurality of sliding grooves are fixedly formed in the top of the mounting disc, a rotating block is rotatably mounted at the bottom of the mounting sleeve, and clamping jaws are slidably mounted in the sliding grooves. According to the multi-hole-site semiconductor wafer electroplating clamp, through cooperation of the rotating blocks, the connecting rods, the clamping jaws, the mounting disc, the sliding grooves and the air cylinders, the air cylinders can drive the four sets of clamping jaws to synchronously move towards the circle center of the mounting disc in the sliding grooves, and a wafer on the top of the mounting disc is centered, positioned and preliminarily fixed; and after the above steps are completed, starting the sucker to adsorb the wafer, and further completing fixation.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor wafer electroplating, in particular to a multi-hole semiconductor wafer electroplating clamp. BACKGROUND

[0002] Wafer is the basic material in the semiconductor manufacturing process, usually by high-purity single crystal silicon or other semiconductor materials (such as gallium arsenide, gallium nitride, etc.) made of round sheet. Wafer is the basis for manufacturing integrated circuits (IC), sensors, solar cells and other electronic devices, wafer is the core material in semiconductor manufacturing, its quality and performance are directly related to the performance and reliability of the final product. With the progress of technology, the size and purity of the wafer are constantly improved, providing a solid foundation for the development of the semiconductor industry.

[0003] Wafer electroplating clamp is a device used to fix and support wafers during the semiconductor manufacturing process, especially in the electroplating process. The design of the electroplating clamp is crucial to ensure uniform plating on the wafer surface, improve production efficiency and ensure product quality. The design of the wafer electroplating clamp needs to consider multiple aspects such as structure, fluid dynamics, temperature control, operation convenience, safety and automation. By optimizing these factors, high-quality and uniform electroplating effects can be achieved, improving production efficiency and reducing costs. In the actual design process, detailed engineering design and test verification need to be carried out according to specific process requirements and equipment conditions.

[0004] The wafer electroplating clamp in the prior art often lacks precise positioning mechanism, resulting in inaccurate position of the wafer in the clamp, affecting the uniformity and quality of the electroplating layer. In order to overcome the above limitations, the present application proposes a new type of multi-hole semiconductor wafer electroplating clamp. Utility model content

[0005] The utility model aims at providing a multi-hole semiconductor wafer electroplating clamp to solve the problems raised in the above background technology.

[0006] To achieve the above object, the utility model provides the following technical scheme: A kind of porous site semiconductor wafer electroplating fixture, including mounting frame, the inside fixed mounting of mounting frame is equipped with several chuck mechanisms, the side fixed mounting of mounting frame is equipped with driving mechanism, the chuck mechanism includes mounting sleeve and cylinder, the inside fixed mounting of mounting sleeve, the top fixed mounting of mounting sleeve is equipped with mounting disc, the top fixed mounting of mounting disc is equipped with several sliding slots, the bottom rotation mounting of mounting sleeve is equipped with rotating block, the inside sliding installation of sliding slot is equipped with jaw, the bottom rotation mounting of jaw is equipped with connecting rod, the bottom rotation mounting of connecting rod in rotating block, the bottom fixed mounting of jaw is equipped with cylinder, the telescopic shaft of cylinder is installed in the bottom of another group of jaw, the inside fixed mounting of mounting disc is equipped with suction cup, the bottom of suction cup and cylinder is all fixedly connected with connecting hose, and the suction cup and cylinder are all fixedly connected in the side of chuck mechanism body through connecting hose.

[0007] Preferably, the inner side of the jaw is fixedly installed with a first rubber pad.

[0008] Preferably, the top of the mounting disc is fixedly installed with a second rubber pad.

[0009] Preferably, the top of the mounting disc is fixedly installed with a proximity capacitive sensor.

[0010] Preferably, the driving mechanism includes a mounting frame, a first air pump is fixedly installed on one side of the mounting frame, a second air pump is fixedly installed on the other side of the mounting frame, a first air pump is fixedly connected with a first air pump on one side of the first air pump through a connecting hose, a first manifold is fixedly connected with the first air pump on one side of the second air pump through a connecting hose, a plurality of electric control valves are fixedly installed on the top of the first manifold and the second manifold, a connecting hose is fixedly connected with the electric control valve on one side of the electric control valve, the first manifold is fixedly connected on one side of a plurality of suction cups through a plurality of connecting hoses and electric control valves, and the second manifold is fixedly connected on one side of a plurality of cylinders through a plurality of electric control valves and connecting hoses.

[0011] Preferably, the first manifold and the second manifold are fixedly installed with a pressure gauge on one side.

[0012] Preferably, the connecting hose is made of polyurethane.

[0013] Compared with the prior art, the utility model has the beneficial effects that the porous site semiconductor wafer electroplating fixture;

[0014] 1. By setting the rotating block, connecting rod, jaw, mounting disc, sliding slot, cylinder, the cylinder can drive four groups of jaws to displace in the inside of sliding slot to the center of mounting disc synchronous, the wafer on the top of mounting disc is centrally positioned and preliminarily fixed, after the above steps are completed, the suction cup is started to adsorb the wafer, and further fixed;

[0015] 2. Through the first air pump, the connecting hose, the second manifold control the operation of the cylinder, and then through the second air pump, the connecting hose, the first manifold control the operation of the chuck, in the above process, through the pressure gauge to detect the air pressure inside the first manifold and the second manifold, to ensure that the clamping force of the chuck mechanism is within the appropriate range, and then through the electric control valve to control the air flow path between the driving mechanism and the chuck mechanism, cooperate with the proximity capacitive sensor to control the driving mechanism to drive only the chuck mechanism that places the wafer, reduce resource waste. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 It is a structural schematic diagram of the utility model;

[0017] Figure 2 It is a bottom structure schematic diagram of the utility model;

[0018] Figure 3 It is a structural schematic diagram of the chuck mechanism of the utility model;

[0019] Figure 4 It is a structural schematic diagram of the driving mechanism of the utility model.

[0020] In the drawing: 1, mounting frame; 2, chuck mechanism; 201, mounting sleeve; 202, mounting disc; 203, sliding groove; 204, rotating block; 205, clamping jaw; 206, connecting rod; 207, cylinder; 208, chuck; 209, first rubber pad; 210, second rubber pad; 3, driving mechanism; 301, mounting frame; 302, first air pump; 303, second air pump; 304, first manifold; 305, second manifold; 306, pressure gauge; 307, electric control valve; 4, proximity capacitive sensor; 5, connecting hose. DETAILED DESCRIPTION

[0021] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the utility model.

[0022] Please refer to Figures 1-3The utility model provides a technical scheme: a kind of porous site semiconductor wafer electroplating fixture, several chuck mechanisms 2 are fixedly installed in the inside of mounting frame 1, driving mechanism 3 is fixedly installed in the side of mounting frame 1, chuck mechanism 2 includes mounting sleeve 201 and cylinder 207, mounting sleeve 201 is fixedly installed in the inside of 101, mounting sleeve 201 is fixedly installed at top, several sliding grooves 203 are fixedly installed at the top of mounting disc 202, rotating mounting has rotating block 204 in the bottom of mounting sleeve 201, chuck claw 205 is slidably installed in the inside of sliding groove 203, connecting rod 206 is rotatably installed in the bottom of rotating block 204 in one end of chuck claw 205, cylinder 207 is fixedly installed in the bottom of chuck claw 205, the telescopic shaft of cylinder 207 is installed in the bottom of another group of chuck claw 205, suction disc 208 is fixedly installed in the inside of mounting disc 202, and connecting hose 5 is fixedly connected in the bottom of suction disc 208 and cylinder 207, and suction disc 208 and cylinder 207 are fixedly connected in the body side of chuck mechanism 2 by connecting hose 5, first rubber pad 209 is fixedly installed in the inside of chuck claw 205, wafer is prevented from being directly contacted with chuck claw 205 by first rubber pad 209, chuck claw 205 is prevented from damaging wafer, second rubber pad 210 is fixedly installed at the top of mounting disc 202, wafer is prevented from being directly contacted with mounting disc 202 by second rubber pad 210, mounting disc 202 is prevented from damaging wafer, and proximity capacitive sensor 4 is fixedly installed at the top of mounting disc 202.

[0023] The utility model specifically is: through the cooperation between rotating block 204, connecting rod 206, chuck claw 205, mounting disc 202, sliding groove 203, cylinder 207, so that cylinder 207 can drive four groups of chuck claw 205 in the inside of sliding groove 203 to the center of mounting disc 202 Synchronous displacement, the wafer on the top of mounting disc 202 is positioned in the middle, and is preliminarily fixed, after the above-mentioned steps are started, suction disc 208 is adsorbed to wafer, and further fixed.

[0024] Please refer to Figures 1-4The utility model provides a technical scheme: A kind of porous site semiconductor wafer electroplating fixture, drive mechanism 3 including mounting frame 301, first air pump 302 is fixedly installed in one side of mounting frame 301, second air pump 303 is fixedly installed in the other side of mounting frame 301, first air pump 302 side is fixedly connected with first manifold 304 by connecting hose 5, second air pump 303 side is fixedly connected with first manifold 304 by connecting hose 5, the top of first manifold 304 and second manifold 305 is fixedly installed with several electric control valves 307, electric control valve 307 side is fixedly connected with connecting hose 5, first manifold 304 is fixedly connected in the side of several suction cups 208 by several connecting hose 5 and electric control valve 307, second manifold 305 is fixedly connected in the side of several air cylinders 207 by several electric control valves 307 and connecting hose 5, the side of first manifold 304 and second manifold 305 is fixedly installed with pressure gauge 306, connecting hose 5 is made of polyurethane.

[0025] The embodiment is specific: the operation of air cylinder 207 is controlled by first air pump 302, connecting hose 5 and second manifold 305, and the operation of suction cup 208 is controlled by second air pump 303, connecting hose 5 and first manifold 304, the air pressure in first manifold 304 and second manifold 305 is detected by pressure gauge 306 in the above process, to ensure that the clamping force of chuck mechanism 2 is within a suitable range, and the air flow passage between drive mechanism 3 and several chuck mechanisms 2 is controlled by electric control valve 307, to cooperate with proximity capacitive sensor 4 to control drive mechanism 3 to drive only the chuck mechanism 2 on which the wafer is placed, to reduce resource waste.

[0026] Working principle: when the porous site semiconductor wafer electroplating fixture is used, the cooperation between rotating block 204, connecting rod 206, clamping jaw 205, mounting disc 202, sliding groove 203 and air cylinder 207 enables air cylinder 207 to drive four sets of clamping jaws 205 to synchronously displace in the interior of sliding groove 203 to the center of mounting disc 202, to centrally position and preliminarily fix the wafer on the top of mounting disc 202, and after the above steps are completed, suction cup 208 is started to adsorb the wafer, to further fix it;

[0027] First rubber pad 209 prevents the wafer from directly contacting clamping jaw 205, to prevent clamping jaw 205 from damaging the wafer, and second rubber pad 210 prevents the wafer from directly contacting mounting disc 202, to prevent mounting disc 202 from damaging the wafer;

[0028] The operation of the cylinder 207 is controlled by the first air pump 302, the connecting hose 5 and the second manifold 305, and the operation of the chuck 208 is controlled by the second air pump 303, the connecting hose 5 and the first manifold 304, in the above process, the air pressure in the first manifold 304 and the second manifold 305 is detected by the pressure gauge 306, so as to ensure that the clamping force of the chuck mechanism 2 is within a proper range, and then the air flow passage between the driving mechanism 3 and the chuck mechanisms 2 is controlled by the electric control valve 307, and the driving mechanism 3 is controlled to drive only the chuck mechanism 2 on which the wafer is placed by cooperating with the proximity capacitive sensor 4, so as to reduce resource waste.

[0029] Although the embodiments of the present application have been shown and described, it is to be understood that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present application, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A porous site semiconductor wafer electroplating clamp, comprising a mounting frame (1), a plurality of chuck mechanisms (2) are fixedly installed inside the mounting frame (1), and a driving mechanism (3) is fixedly installed on one side of the mounting frame (1), characterized in that: The chuck mechanism (2) comprises a mounting sleeve (201) and a cylinder (207), the mounting sleeve (201) is fixedly installed in the inside of (101), the top of the mounting sleeve (201) is fixedly installed with a mounting disc (202), the top of the mounting disc (202) is fixedly installed with a plurality of sliding grooves (203), the bottom of the mounting sleeve (201) is rotatably installed with a rotating block (204), the inside of the sliding groove (203) is slidably installed with a clamping jaw (205), the bottom of the clamping jaw (205) is rotatably installed with a connecting rod (206), one end of the connecting rod (206) is rotatably installed at the bottom of the rotating block (204), the cylinder (207) is fixedly installed at the bottom of the clamping jaw (205), the telescopic shaft of the cylinder (207) is installed at the bottom of the other group of clamping jaws (205), the inside of the mounting disc (202) is fixedly installed with a suction cup (208), the bottom of the suction cup (208) and the cylinder (207) are fixedly connected with a connecting hose (5), and the suction cup (208) and the cylinder (207) are fixedly connected to the body side of the chuck mechanism (2) through the connecting hose (5).

2. The porous wafer electroplating fixture of claim 1, wherein, The inner side of the clamping jaw (205) is fixedly installed with a first rubber pad (209).

3. The porous wafer electroplating fixture of claim 1, wherein: The top of the mounting disc (202) is fixedly installed with a second rubber pad (210).

4. The porous wafer electroplating fixture of claim 1, wherein, The top of the mounting disc (202) is fixedly installed with a proximity capacitive sensor (4).

5. The porous wafer electroplating fixture of claim 4, wherein, The driving mechanism (3) comprises a mounting frame (301), one side of the mounting frame (301) is fixedly installed with a first air pump (302), the other side of the mounting frame (301) is fixedly installed with a second air pump (303), one side of the first air pump (302) is fixedly connected with the first air pump (302) through a connecting hose (5), one side of the second air pump (303) is fixedly connected with a first manifold (304) through a connecting hose (5), the top of the first manifold (304) and a second manifold (305) is fixedly installed with a plurality of electric control valves (307), one side of the electric control valve (307) is fixedly connected with a connecting hose (5), the first manifold (304) is fixedly connected to one side of a plurality of suction cups (208) through a plurality of connecting hoses (5) and electric control valves (307), and the second manifold (305) is fixedly connected to one side of a plurality of cylinders (207) through a plurality of electric control valves (307) and connecting hoses (5).

6. The porous wafer electroplating fixture of claim 5, wherein, One side of the first manifold (304) and the second manifold (305) is fixedly installed with a pressure gauge (306).

7. The porous wafer electroplating fixture of claim 1, wherein, The connecting hose (5) is made of polyurethane.

Images