MEMS piezoelectric sensor packaging structure and electronic cigarette

Abstract

The utility model relates to the technical field of sensitive element and sensor manufacturing, electronic cigarettes and the like in the electronic core industry, in particular to an MEMS piezoelectric sensor packaging structure and an electronic cigarette. The utility model relates to an MEMS piezoelectric sensor packaging structure. The MEMS piezoelectric sensor packaging structure comprises a sensor module and a packaging structure, wherein the sensor module comprises a PCB; the MEMS chip is bonded on the PCB circuit board; a negative pressure sensing hole is formed below the negative pressure sensor; a first groove matched with the PCB in shape is formed in the front face of the heat insulation base, and a second communication hole communicated to the back face of the heat insulation base is formed in the bottom of the first groove; wherein the PCB circuit board is embedded into the first groove; and a negative pressure sensing hole of the MEMS chip is communicated to the back surface of the heat insulation base through the first communication hole and the second communication hole. According to the MEMS piezoelectric sensor, the heat insulation base can isolate heat conduction for the ASIC chip and MEMS sensing signals and prevent light interference, and therefore the measurement precision of the MEMS piezoelectric sensor is improved.

Description

Technical Field

[0001] This utility model relates to the manufacturing of sensitive components and sensors in the core electronics industry, and to the technical fields of electronic cigarettes, and in particular to a MEMS piezoelectric sensor packaging structure and electronic cigarettes. Background Technology

[0002] Piezoelectric MEMS sensors are microcomputer sensors that utilize the positive piezoelectric effect of piezoelectric materials. When a user inhales, the charge distribution of the MEMS chip inside the sensor changes, thereby generating a corresponding voltage (i.e., an analog signal). This voltage is then conditioned by a corresponding ASIC chip to output a digital signal usable by a microcontroller.

[0003] Compared to capacitive sensors, piezoelectric MEMS sensors offer significant advantages in applications such as high humidity (e-liquid condensate recirculation) and high corrosion (e-liquid contains ethyl acetate) in e-cigarettes. However, sudden increases or decreases in ambient temperature significantly impact the accuracy of MEMS piezoelectric sensors. Utility Model Content

[0004] I. Technical problems to be solved

[0005] This invention aims to solve at least partially one of the aforementioned technical problems.

[0006] II. Technical Solution

[0007] The first aspect of this utility model provides a MEMS piezoelectric sensor packaging structure. This MEMS piezoelectric sensor packaging structure includes: a sensor module, comprising: a substrate; a MEMS chip bonded to the substrate; a negative pressure sensing hole formed below the chip; and a heat-insulating base, the front of which has a first groove matching the shape of the substrate, and the bottom of the first groove has a second connecting hole communicating to the back of the heat-insulating base; wherein the substrate is embedded in the first groove; the first connecting hole is formed at the substrate position corresponding to the negative pressure sensing hole; the first connecting hole and the second connecting hole are connected; the negative pressure sensing hole of the MEMS chip is connected to the back of the heat-insulating base through the first connecting hole and the second connecting hole.

[0008] In some embodiments of this utility model, the sensor module further includes: an ASIC chip bonded to a substrate; a filter capacitor integrated on the substrate; N signal connection terminals integrated on the substrate, where N≥1; and a metal protective shell in the shape of a box with a downward opening, fixed to the substrate and snapped onto the outside of the MEMS chip and the ASIC chip.

[0009] In some embodiments of the utility model, MEMS chip, ASIC chip, filter capacitor are located on the first side of substrate, N signal input end is located on the second side of substrate, metal protection shell is set on the top of MEMS chip, ASIC chip, filter capacitor, the heat insulation base part of sensor module periphery includes: boss surrounds part, surrounds the outside of metal protection shell, platform surrounds part, surrounds the outside of N signal connection end, wherein, H1>H2, H1 is the height of boss surrounds part, H2 is the height of platform surrounds part, forms the step at the junction of boss surrounds part and platform surrounds part.

[0010] In some embodiments of the utility model, 0≤|H1-H3|≤0.5mm;0≤|H2-H4|≤0.5mm, wherein, H3 is the height of metal protection shell, H4 is the height of N signal connection end.

[0011] In some embodiments of the utility model, metal protection shell is square box shape.

[0012] In some embodiments of the utility model, metal protection shell is electrically grounded through substrate.

[0013] In some embodiments of the utility model, metal protection shell is prepared from one of the following materials: copper, aluminum, stainless steel, copper plating nickel, magnesium aluminum alloy.

[0014] In some embodiments of the utility model, signal connection end is one of the following: pad type signal connection end, rivet needle type signal connection end.

[0015] In some embodiments of the utility model, 0<(H1-H3)≤0.5mm;0<(H2-H4)≤0.5mm;Wherein, the top of sensor module is packaged in the first recess of the front of heat insulation base through encapsulation glue, the encapsulation glue is flush with boss surrounds part above metal protection shell, the encapsulation glue is flush with platform surrounds part above signal connection end.

[0016] In some embodiments of the utility model, the center axis of first communication hole and second communication hole is collinear;Wherein, on the back of heat insulation base, the periphery of second communication hole is connected to the center of heat insulation base through air guide groove.

[0017] In some embodiments of the utility model, the center axis of first communication hole and second communication hole is not collinear;Wherein, the bottom of first recess is provided with horizontal second recess, the first end of this second recess is communicated to the first communication hole on the substrate, and the second end is communicated to the second communication hole on the heat insulation base.

[0018] In some embodiments of the utility model, the center axis of first communication hole and second communication hole is not collinear;For the second recess of heat insulation base, the recess depth of first end is less than the recess depth of second end.

[0019] In some embodiments of the utility model, the width of the second groove gradually increases from the first end to the second end.

[0020] In some embodiments of the utility model, an annular groove is arranged on the periphery of the second communication hole on the back of the heat insulation base, the recess depth of the annular groove is greater than the recess depth of the edge of the second communication hole; wherein, an annular step is arranged between the edge of the second communication hole and the annular groove; or, the recess depth of the annular groove gradually increases from the inner side to the outer side of the annular groove.

[0021] In some embodiments of the utility model, the MEMS chip is an absolute pressure chip.

[0022] In some embodiments of the utility model, the substrate is a PCB circuit board.

[0023] In some embodiments of the utility model, the substrate is rectangular and the heat insulation base is cylindrical.

[0024] In some embodiments of the utility model, the substrate is fixedly bonded to the first groove by the first packaging glue, and the first packaging glue is silicone or epoxy glue.

[0025] In some embodiments of the utility model, the heat insulation base is black.

[0026] In some embodiments of the utility model, the sensor module is packaged in the first groove on the front of the heat insulation base by black epoxy glue.

[0027] In some embodiments of the utility model, the heat insulation base is made of one of the following materials: liquid crystal polymer, polyimide, polyphenylene sulfide, polytetrafluoroethylene, polyether ether ketone.

[0028] In some embodiments of the utility model, an asymmetric groove extending transversely is arranged on the back of the heat insulation base.

[0029] The utility model provides a kind of electronic cigarette in the second aspect.The electronic cigarette includes: electronic cigarette body, atomizer is arranged in its inside;MEMS piezoelectric sensor packaging structure as above, is packaged in electronic cigarette body;Wherein, MEMS piezoelectric sensor packaging structure senses the suction action of user, and the opening and closing of atomizer in electronic cigarette body are controlled.

[0030] III. Advantageous effects

[0031] From the above technical solution, the utility model at least has following beneficial effects one relative to prior art:

[0032] (1) In the prior art, the external environment can easily transfer heat to the sensor module, resulting in a sudden temperature rise or drop, which can cause the sensor to work abnormally.

[0033] In the utility model, the function of the heat insulation base and the black epoxy glue is to slow down the rate of heat conduction from the external environment to the MEMS chip. Even if the sensor module eventually rises to the same temperature as the external environment, the temperature rise is gentle, so that the temperature drift caused by the temperature rise can be eliminated by periodically resetting the signal, and the abnormal operation of the sensor caused by the sudden temperature rise is finally avoided. Therefore, the heat insulation base can isolate the ASIC chip and the MEMS sensing signal from heat conduction and prevent light interference, thereby improving the measurement accuracy of the MEMS piezoelectric sensor.

[0034] (2) In the prior art, external static electricity and electromagnetic interference can cause poor sensing signal accuracy.

[0035] In the utility model, the MEMS chip and the ASIC chip are packaged in a metal protective shell, and the metal protective shell and the circuit board together form a Faraday cage, which improves the protection capability of the sensor packaging structure against static electricity and electromagnetic interference.

[0036] (3) In the prior art, tobacco tar can easily enter the MEMS sensor, causing damage to the MEMS sensor.

[0037] In the utility model, the center axes of the first communication hole and the second communication hole are not collinear. The bottom of the first groove is provided with a transverse second groove, the first end of the second groove is communicated to the first communication hole on the PCB circuit board, and the second end is communicated to the second communication hole. Through the above arrangement, a bend is added between the second communication hole and the negative pressure sensing hole, reducing the probability of tobacco tar intrusion.

[0038] Further, the recess depth of the first end of the second groove is less than the recess depth of the second end; from the first end to the second end, the width of the second groove gradually increases. The sensing hole of the MEMS chip is communicated to the back surface of the heat insulation base through the first communication hole, the second groove and the second communication hole. Through the above arrangement, tobacco tar will also flow towards the direction of the second communication hole, i.e. away from the MEMS chip, under the action of gravity, reducing the influence of tobacco tar on the MEMS chip.

[0039] (4) In the prior art, after the sensor module is entirely placed in the groove for packaging, the sensing wire is not convenient to weld. At the same time, during the packaging of the sensor module, the adjustment of the heat insulation base direction needs to increase the process.

[0040] The heat insulation base part outside the sensor module group comprises: a boss surrounding part surrounding the outside of the metal protective shell; and a platform surrounding part surrounding the outside of the N signal connection ends.

[0041] Through the above setting, the boss surrounding part can protect the metal protective shell and the MEMS chip, the ASIC chip and the filter capacitor inside the metal protective shell, so that the user is prevented from directly pressing the sensor and affecting the measurement accuracy. The platform surrounding part can facilitate the welding of the signal connection end and the signal line. The step can provide direction identification of the heat insulation base in the packaging process, and the slightly lower sensor module group and the signal connection end can provide space for the packaging glue above.

[0042] (5) In the prior art, the air inlet hole of the packaging structure silica gel sleeve is located at the center position.

[0043] In the utility model, for the structure that the second communication hole is not along the central axis of the heat insulation base, the periphery of the second through hole is communicated to the center position of the heat insulation base through the horizontal asymmetric sector air guide groove. In addition, the asymmetric sector air guide groove can also provide direction identification of the heat insulation base in the packaging process. BRIEF DESCRIPTION OF DRAWINGS

[0044] Figure 1 It is the perspective view of the overhead view of the first embodiment of the MEMS piezoelectric sensor packaging structure of the utility model.

[0045] Figure 2A And Figure 2B It is the perspective view of the overhead view of the first embodiment of the MEMS piezoelectric sensor packaging structure of the utility model. Figure 1

[0046] Figure 3A And Figure 3B It is the perspective view of the overhead view of the first embodiment of the MEMS piezoelectric sensor packaging structure of the utility model. Figure 1

[0047] It is the perspective view of the overhead view of the first embodiment of the MEMS piezoelectric sensor packaging structure of the utility model. Figure 3C Figure 1 And

[0048] It is the perspective view of the overhead view of the first embodiment of the MEMS piezoelectric sensor packaging structure of the utility model. Figure 4A Figure 4B Figure 1 It is the perspective view of the overhead view of the first embodiment of the MEMS piezoelectric sensor packaging structure of the utility model.

[0049] Figure 5 It is the perspective view of the overhead view of the first embodiment of the MEMS piezoelectric sensor packaging structure of the utility model. Figure 4A Figure 4B ​​​​A schematic view of circuit connection in the shown sensor module.

[0050] Figure 6 A perspective view of a second embodiment of the MEMS piezoelectric sensor packaging structure of the utility model.

[0051] Figure 7A 、 Figure 7B 、 Figure 7C The sectional view, top view and bottom view of the MEMS piezoelectric sensor packaging structure shown in Figure 6 .

[0052] Figure 8A And Figure 8B The perspective view of the heat insulation base in the MEMS piezoelectric sensor packaging structure shown in Figure 6 from top and bottom. DETAILED DESCRIPTION

[0053] The utility model provides a kind of MEMS piezoelectric sensor packaging structure, the purpose is to avoid the temperature of the environment where MEMS chip is located to rise or drop sharply, while reducing electromagnetic interference and light interference.

[0054] To make the purpose, technical scheme and advantage of the utility model more clear and apparent, below, combining with specific embodiment, and referring to drawing, the utility model is further detailed.

[0055] The utility model provides a kind of MEMS piezoelectric sensor packaging structure in the first aspect. Figure 1 It is the perspective view of top view of the first embodiment of the MEMS piezoelectric sensor packaging structure of the utility model. Figure 2A And Figure 2B It is the perspective view of A view and B view of the MEMS piezoelectric sensor packaging structure shown in Figure 1 . Figure 3A And Figure 3B It is the perspective view of front view and back view of the heat insulation base in the MEMS piezoelectric sensor packaging structure shown in Figure 1 . Figure 3C It is the top view of the heat insulation base in the MEMS piezoelectric sensor packaging structure shown in Figure 1 .

[0056] It needs to be explained that in the actual scene of MEMS piezoelectric sensor packaging structure, the upper of sensor module is sealed by packaging glue, preferably black epoxy glue.In Figure 1 、 Figure 2A 、 Figure 2B , in order to clearly observe the related structure of sensor module and heat insulation base, packaging glue part is omitted.

[0057] The MEMS piezoelectric sensor packaging structure of the present embodiment is described in detail below with reference to the accompanying drawings.

[0058] As shown in the drawings, the MEMS piezoelectric sensor packaging structure of the present embodiment comprises:

[0059] The sensor module 100 comprises a PCB circuit board 110 and a MEMS chip 120 bonded to the PCB circuit board, and a negative pressure sensing hole is formed below the MEMS chip, wherein a first communication hole 111 is formed in the PCB circuit board at a position corresponding to the negative pressure sensing hole of the MEMS chip.

[0060] The heat insulation base 200 has a first recess 211 formed on its front face and matching the shape of the PCB circuit board, and a second communication hole 221 is formed in the bottom of the first recess and communicates with the back face of the heat insulation base.

[0061] The sensor module is embedded into the first recess 211, the first communication hole 111 and the second communication hole 221 are in communication, and the negative pressure sensing hole communicates with the back face of the heat insulation base through the first communication hole 111 and the second communication hole 221.

[0062] The various components of the MEMS piezoelectric sensor packaging structure of the present embodiment are described in detail below.

[0063] Those skilled in the art should understand that although a PCB circuit board is used in the present embodiment, other types of substrates such as lead frames can also be used in other embodiments of the present application.

[0064] Figure 4A and Figure 4B are respectively Figure 1 the front view and the back view of the sensor module in the MEMS piezoelectric sensor packaging structure shown in FIGS. 1 and 2. Figure 5 is Figure 4A and Figure 4B is a schematic diagram of the circuit connection in the sensor module. As shown in the drawings, the sensor module 100 of the present embodiment further comprises an ASIC chip 130 bonded to the PCB circuit board and a metal protective shell 140 fixed to the PCB circuit board and buckled on the outer side of the MEMS chip and the ASIC chip, which is electrically grounded through the PCB circuit board.

[0065] In the present embodiment, the material of the metal protective shell 140 is copper, but the present application is not limited thereto. In other embodiments of the present application, the material of the metal protective shell can also be electromagnetic shielding materials such as aluminum, stainless steel, copper-nickel plating, and magnesium-aluminum alloy.

[0066] In the embodiment, the MEMS chip 120 and the ASIC chip 130 are packaged in the metal protective shell 140, and the metal protective shell and the circuit board form a Faraday cage together, thereby improving the protection capability of the sensor packaging structure against electrostatic interference and electromagnetic interference.

[0067] In the embodiment, the MEMS chip 120 is an absolute pressure chip, that is, only has a negative pressure sensing hole facing the first communication hole 111, and the suction action of the user is determined by the air pressure difference between the external air pressure and the air pressure in the absolute pressure cavity. By using the absolute pressure chip, the embodiment can avoid the cost increase caused by the gas flow hole on the metal protective shell, and also can avoid the tobacco tar gas flow hole entering the inside of the MEMS chip.

[0068] However, the utility model is not limited to this. In other embodiments of the utility model, a MEMS chip including two sensing holes and relying on gas flow to sense the suction action of the user can also be used. In this case, a gas flow hole needs to be opened on the metal protective shell, and the anti-tobacco tar capability of this technical solution is slightly inferior to that of the embodiment.

[0069] In the embodiment, the metal protective shell simultaneously reduces electrostatic interference and electromagnetic interference for both the MEMS chip and the ASIC chip. However, the utility model is not limited to this. In some other embodiments of the utility model, the sensor module can also include only the MEMS chip, and although the effect is slightly inferior to that of the embodiment, the utility model can still be implemented, and is still within the protection scope of the utility model.

[0070] Please continue to refer to the drawings, the sensor module 100 further includes: a filter capacitor 150 integrated on the PCB circuit board; and three signal connection terminals 160 integrated on the PCB circuit board. The filter capacitor 150 is used for decoupling filtering of the sensing signal. The signal connection terminals 160 are connected with the ASCIC chip 130 in signal and are used for outputting the sensing signal to the outside. In an actual device, the N signal connection terminals are respectively led out through signal connection lines 161.

[0071] In the embodiment, the epoxy glue above the sensor module can ensure the reliable sealing of the sensor module, and the black epoxy glue can block the penetration of external interference light and avoid affecting the MEMS chip.

[0072] In the embodiment, the signal connection terminals 160 are pad type signal connection terminals, and the ground terminal (GND), the power supply terminal (VDD), and the signal terminal (Vout) are respectively connected with the outside through the corresponding pad type signal connection terminals.

[0073] But the utility model is not limited to this. In other embodiments of the utility model, the signal connection end can also be a rivet needle type signal connection end, and the number of signal connection ends can also be set as needed, for example, 2 or 4 or 5 signal connection ends.

[0074] In the embodiment, the PCB circuit board is rectangular, and the specification is 4.0mm*3.0mm. The heat insulation base 200 is cylindrical, and the diameter is Φ6mm. The front surface of the heat insulation base is provided with a rectangular first recess 211 matching the shape of the PCB circuit board. The PCB circuit board 110 is fixed between the first recess bottom through silica gel or epoxy glue, and the glue coverage area is shown by the red part in Figure 2A and Figure 2B The bottom of the first recess is provided with a second communication hole 221 communicated to the back surface of the heat insulation base. The diameter of the second communication hole 221 is 0.3-1mm.

[0075] In the prior art, the external environment can easily transmit heat to the sensor module, resulting in temperature rising or falling, and the temperature rising or falling can cause the sensor to work abnormally.

[0076] In the embodiment, the heat insulation base 200 is integrally formed and is made of black liquid crystal polymer (LCP for short). At the same time, the sensor module is packaged in the first recess through the upper black epoxy glue. The functions of the heat insulation base and the black epoxy glue are to slow down the rate of heat conduction from the external environment to the MEMS chip. Even if the sensor module finally rises to the same temperature as the external environment, the temperature rise speed is gentle, so that the temperature drift caused by the temperature rise can be eliminated by introducing a signal periodic reset, and finally the abnormal work of the sensor caused by the temperature rise is avoided. Therefore, the heat insulation base and the black epoxy glue can isolate the heat conduction and prevent light interference for the ASIC chip and the MEMS sensing signal, thereby improving the measurement accuracy of the MEMS piezoelectric sensor.

[0077] Those skilled in the art should understand that in addition to the black LCP material, other dark polyimide, polyphenylene sulfide, polytetrafluoroethylene, polyether ether ketone plastic materials can also be applied to the utility model, and are also within the protection scope of the utility model. In addition to the black epoxy glue, other types of packaging glue can also be used to package the sensor module, and the utility model can also be achieved, but the effect is slightly inferior to the embodiment.

[0078] As shown in the figure, the negative pressure sensing hole of the MEMS chip corresponds to the first communication hole 111 opened on the PCB position. The bottom of the first groove is provided with the second communication hole 221 communicated to the back surface of the heat insulation base. The second communication hole 221 is arranged along the central axis of the heat insulation base, and the central axes of the first communication hole 111 and the second communication hole 221 are not collinear. The bottom of the first groove 211 is provided with the transverse second groove 212, the first end of the second groove 212 is communicated to the first communication hole on the PCB, and the second end is communicated to the second communication hole. Through the above arrangement, the bending is increased on the path between the second communication hole and the negative pressure sensing hole, and the probability of tobacco oil invasion is reduced.

[0079] Further, in the second groove 212, the recess depth of the first end is less than that of the second end; from the first end to the second end, the width of the second groove gradually increases. The sensing hole of the MEMS chip is communicated to the back surface of the heat insulation base through the first communication hole 111, the second groove 212 and the second communication hole 221. Through the above arrangement, the tobacco oil will also flow towards the second communication hole 221 direction under the action of gravity, that is, flow away from the MEMS chip, reducing the influence of the tobacco oil on the MEMS chip.

[0080] Please continue to refer to the drawings, on the back surface of the heat insulation base, the periphery of the second communication hole is provided with an annular groove 231, and the recess depth of the annular groove is greater than that of the edge of the second communication hole. The annular groove 231 is arranged between the edge of the second communication hole and the annular groove. Through the above arrangement, the tobacco oil on the back surface of the heat insulation base will also enter the annular groove 231 as much as possible, and the amount entering the second communication hole is reduced.

[0081] In this embodiment, the recess depth of the annular groove is constant. In another embodiment of the present application, from the inside to the outside of the annular groove, the recess depth of the annular groove gradually increases, which can further enhance the tobacco oil collection effect.

[0082] So far, the first embodiment of the MEMS piezoelectric sensor packaging structure of the present application is introduced.

[0083] Figure 6 It is a perspective view of the second embodiment of the MEMS piezoelectric sensor packaging structure of the present application. Figure 7A 、 Figure 7B 、 Figure 7C Respectively Figure 6 It is a sectional view, a top view and a bottom view of the MEMS piezoelectric sensor packaging structure shown in the figure. Figure 8A and Figure 8B Respectively Figure 6The perspective view of the heat insulation base in the MEMS piezoelectric sensor packaging structure from the top view and the bottom view. The following mainly introduces the differences between the second embodiment and the first embodiment. For other contents, please refer to the relevant description of the first embodiment.

[0084] As shown in the first embodiment, the MEMS chip, the ASIC chip, and the filter capacitor are located on the first side of the substrate, and the three signal input ends 160 are located on the second side of the substrate. The metal protective shell 140' is in the shape of a square box with an opening downward, and is buckled above the MEMS chip, the ASIC chip, and the filter capacitor. By also arranging the filter capacitor in the metal protective shell, the protection capability against electrostatic interference and electromagnetic interference is further enhanced. Figure 6 Unlike the heat insulation base part of the sensor module periphery in the first embodiment, which is of the same height, in the present embodiment, the heat insulation base part of the sensor module periphery includes: a boss surrounding part 241 surrounding the outside of the metal protective shell; and a platform surrounding part 242 surrounding the outside of the N signal connection ends, wherein:

[0085] H1>H2, 0≤|H1-H3|≤0.5mm; 0≤|H2-H4|≤0.5mm

[0086] H1 is the height of the boss surrounding part, H2 is the height of the platform surrounding part, H3 is the height of the metal protective shell, and H4 is the height of the N signal connection ends. A step 243 is formed at the junction of the boss surrounding part and the platform surrounding part. The boss surrounding part can protect the metal protective shell and the MEMS chip, the ASIC chip, and the filter capacitor inside it, avoiding the user directly pressing the sensor and affecting the measurement accuracy. The platform surrounding part can facilitate the welding of the signal connection ends and the signal lines. The step can provide direction identification of the heat insulation base in the packaging process.

[0087] Preferably, 0<(H1-H3)≤0.5mm; 0<(H2-H4)≤0.5mm. The slightly lower sensor module and signal connection end can provide space for the packaging glue above. In the present embodiment, the black epoxy glue is flush with the boss surrounding part above the metal protective shell, and the black epoxy glue is flush with the platform surrounding part above the signal connection end.

[0088] Unlike the first embodiment, in which the center axes of the first communication hole and the second communication hole are not collinear, but are communicated through the second groove, in the present embodiment, the first communication hole is designed to align the second communication hole 221. Such design can greatly reduce the difficulty of drawing glue at the bottom of the first groove for fixing / sealing the sensor module.

[0089] Unlike the first embodiment, in which the center axes of the first communication hole and the second communication hole are not collinear, but are communicated through the second groove, in the present embodiment, the first communication hole is designed to align the second communication hole 221. Such design can greatly reduce the difficulty of drawing glue at the bottom of the first groove for fixing / sealing the sensor module.

[0090] In the above design, the second communication hole is not located on the central axis of the heat insulation base, and the problem cannot be aligned with the central hole of the matched silica gel sleeve. In this case, the periphery of the second communication hole is communicated to the central position of the heat insulation base through the transverse asymmetric fan-shaped air guide groove 244. In addition, the asymmetric fan-shaped air guide groove 244 can also provide direction identification of the heat insulation base in the packaging process.

[0091] Those skilled in the art should understand that in addition to the asymmetric fan shape, other asymmetric shapes can also be used to make the air guide groove, and the direction identification of the heat insulation base can also be achieved in the packaging process, which will not be repeated here. In addition, in addition to the air guide groove, a special transversely extending asymmetric groove can also be provided on the back of the heat insulation base to provide direction identification of the heat insulation base. Here, the transverse direction is parallel to the central axis of the heat insulation base.

[0092] The above is the content of the second embodiment of the present embodiment, which is different from the first embodiment. The other contents of the present embodiment can refer to the description of the first embodiment, which will not be repeated here.

[0093] So far, the second embodiment of the MEMS piezoelectric sensor packaging structure of the present application has been introduced.

[0094] Based on the MEMS piezoelectric sensor packaging structure of the above embodiment, the second aspect of the present application further provides an electronic cigarette. The electronic cigarette of the present embodiment comprises: an electronic cigarette body, which is internally provided with an atomizer; a MEMS piezoelectric sensor packaging structure as in the above embodiment, which is packaged in the electronic cigarette body; wherein the MEMS piezoelectric sensor packaging structure senses the puffing action of the user and controls the opening and closing of the atomizer in the electronic cigarette body.

[0095] For the specific content of the electronic cigarette body and the atomizer in the present embodiment, please refer to the related description of the prior art. For the MEMS piezoelectric sensor packaging structure in the present embodiment, please refer to the related description of the previous embodiment. Both parts will not be repeated here.

[0096] In the electronic cigarette of the present embodiment, since the MEMS piezoelectric sensor packaging structure as above is used, the heat interference, light interference and signal interference are reduced, the test accuracy of the MEMS chip is improved, the puffing action of the user of the electronic cigarette can be more accurately sensed, and the user experience is improved.

[0097] So far, the various embodiments of the present application have been introduced. According to the above description, those skilled in the art should have a clear understanding of the present application.

[0098] For certain implementation ways, if it is not the key content of the present application, and is well known to those skilled in the art, it is not described in detail in the drawings or the text of the specification due to the limitation of the volume, at this time, it can be understood by referring to the related prior art.

[0099] It should be noted that, unless explicitly stated to the contrary, numerical parameters in the description and claims of the present application can be approximations. Variations to these values can occur depending on the use of the present application and are intended to be included in the application.

[0100] The ordinal numbers used in the description and claims, such as "first", "second", and Arabic numerals, letters, etc., are used to modify the corresponding elements, and their original intention is only to make one element with a certain name distinguishable from another element with the same name, and do not mean that the element has any ordinal number, nor represent the order of one element and another element.

[0101] It should also be noted that the directional phrases mentioned in the embodiments, such as "up", "down", "center", "lateral", "longitudinal", "top", "bottom", "front", "back", "left", "right", "inside", "outside", etc. The orientation or position relationship indicated is only based on the orientation or position relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, and does not mean or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, therefore it cannot be understood as a limitation on the present application. And, throughout the drawings, the same elements are represented by the same or similar reference numerals. In addition, the shapes and sizes of the components in the drawings do not reflect the actual size and ratio, but only illustrate the content of the embodiments of the present application.

[0102] In the description of the present application, it should be noted that, unless otherwise explicitly specified and limited, the terms "connected", "connected" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be directly connected, or indirectly connected through an intermediate medium, it can be the communication inside two elements. For those skilled in the art, the specific meaning of the above terms can be understood according to the specific circumstances.

[0103] Those skilled in the art should understand that in the claims and description of the present application, the word "comprising" does not exclude the presence of elements not listed in the claims. The word "one" or "an" before an element does not exclude the presence of multiple such elements.

[0104] Moreover, the above-described embodiments of the application are merely descriptive of its purposes and the application can be implemented in many different forms, and should not be interpreted as being limited to the embodiments described herein.

[0105] Similarly, it is to be understood that the embodiments of the application can alternately be phrased or described substantially similarly to examples disclosed in the art, such as in U.S. Patent No. 6,809,219, the disclosure of which is incorporated by reference. For example, the application can be described as a method comprising the steps of: receiving a request for a service; determining whether the request is for a service that is provided by a service provider; and if the request is for a service that is provided by a service provider, then providing the service to the user. Similarly, it is to be understood that, for the purposes of brevity and clarity, each feature of the application described in the above examples of the application can be grouped together in a single embodiment, drawing, or description of the application. However, the application should not be interpreted as reflecting the intention that the application requires more features than are explicitly claimed in each claim. Rather, the various aspects of the application are defined solely by the claims, as interpreted by the courts and patent officials. Furthermore, the embodiments can be used in combination with each other or with other embodiments, as is appropriate, based on design and reliability considerations, i.e., the technical features of different embodiments can be freely combined to form further embodiments. Thus, the claims following the detailed description are hereby expressly incorporated into this detailed description, with each claim acting as a separate embodiment of the application. The claims are not to be interpreted under the provisions of 35 U.S.C. 112(f) only.

[0106] The above detailed description of various embodiments of the application has been presented for the purposes of illustration and description. It is not intended to be exhaustive or to limit the application to the precise form disclosed. Many modifications and variations are possible in light of this disclosure. It is intended that the scope of the application be limited not with this detailed description, but rather by the claims appended hereto.

Claims

1. A MEMS piezoelectric sensor package structure, characterized by, The MEMS piezoelectric sensor packaging structure comprises a sensor module and a heat insulation base. The sensor module comprises a substrate, a MEMS chip bonded to the substrate, and a negative pressure sensing hole formed below the MEMS chip. The substrate is provided with a first communication hole corresponding to the position of the negative pressure sensing hole of the MEMS chip. The heat insulation base is provided with a first groove matching the shape of the substrate on the front surface, and the bottom of the first groove is provided with a second communication hole communicating with the back surface of the heat insulation base. The sensor module is embedded into the first groove, the first communication hole and the second communication hole are communicated, and the negative pressure sensing hole of the MEMS chip is communicated to the back surface of the heat insulation base through the first communication hole and the second communication hole.

2. The MEMS piezoelectric sensor packaging structure according to claim 1, wherein the sensor module further comprises an ASIC chip bonded to the substrate, a filter capacitor integrated on the substrate, and N signal connection terminals integrated on the substrate, wherein N≥1.

3. The MEMS piezoelectric sensor packaging structure according to claim 2, wherein the MEMS chip, the ASIC chip, and the filter capacitor are located on a first side of the substrate, and the N signal connection terminals are located on a second side of the substrate.

4. The MEMS piezoelectric sensor packaging structure according to claim 3, wherein 0≤|H1-H3|≤0.5mm and 0≤|H2-H4|≤0.5mm, wherein H1 is the height of the boss surrounding part, H2 is the height of the platform surrounding part, H3 is the height of the metal protective shell, and H4 is the height of the N signal connection terminals.

5. The MEMS piezoelectric sensor packaging structure according to claim 4, wherein the metal protective shell is in the shape of a square box, and / or the metal protective shell is electrically grounded through the substrate, and / or the metal protective shell is made of one of the following materials: copper, aluminum, stainless steel, copper plated with nickel, and magnesium-aluminum alloy.

6. The MEMS piezoelectric sensor packaging structure according to claim 1, wherein 0<(H1-H3)≤0.5mm and 0<(H2-H4)≤0.5mm, wherein the sensor module is packaged in the first groove on the front surface of the heat insulation base by packaging glue, the packaging glue is flush with the boss surrounding part above the metal protective shell, and the packaging glue is flush with the platform surrounding part above the signal connection terminals. ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ The center axes of the first and second communication holes are collinear; wherein, on the back of the heat insulation base, the periphery of the second communication hole is connected to the center of the heat insulation base through the air guide groove; Or, the center axes of the first and second communication holes are not collinear; wherein, the bottom of the first groove is provided with a transverse second groove, the first end of the second groove is connected to the first communication hole on the substrate, and the second end is connected to the second communication hole on the heat insulation base.

7. The MEMS piezoelectric sensor package structure of claim 6, wherein, The center axes of the first and second communication holes are not collinear; for the second groove of the heat insulation base, The recess depth of the first end is smaller than that of the second end; And / or, the width of the second groove gradually increases from the first end to the second end.

8. The MEMS piezoelectric sensor packaging structure according to claim 1, wherein, On the back of the heat insulation base, the periphery of the second communication hole is provided with an annular groove, and the recess depth of the annular groove is greater than that of the edge of the second communication hole; Wherein, an annular step is arranged between the edge of the second communication hole and the annular groove; or, the recess depth of the annular groove gradually increases from the inner side to the outer side.

9. The MEMS piezoelectric sensor packaging structure according to any one of claims 1 to 8, wherein, The MEMS chip is an absolute pressure type chip; And / or, the substrate is a PCB circuit board; And / or, the substrate is rectangular, and the heat insulation base is cylindrical; And / or, the substrate is bonded and fixed in the first groove by the first packaging glue, which is silicone or epoxy glue; And / or, the heat insulation base is black; And / or, the upper part of the sensor module is packaged in the first groove on the front of the heat insulation base by black epoxy glue; And / or, the heat insulation base is made of one of the following materials: liquid crystal polymer, polyimide, polyphenylene sulfide, polytetrafluoroethylene, polyether ether ketone; And / or, an asymmetric groove extending transversely is arranged on the back of the heat insulation base.

10. An electronic cigarette, characterized in that, Comprise: An electronic cigarette body, which is internally provided with an atomizer; The MEMS piezoelectric sensor packaging structure according to any one of claims 1 to 9 is packaged in the electronic cigarette body; Wherein, the MEMS piezoelectric sensor packaging structure senses the puffing action of the user and controls the opening and closing of the atomizer in the electronic cigarette body.

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