Display device and mobile phone

Abstract

The utility model discloses a display device and a mobile phone. The display device comprises a display panel, a middle plate and a heat exchange plate. The display panel is provided with a first surface and a second surface, the first surface is a light-emitting surface of the display panel, the middle plate is arranged on the second surface of the display panel, and a component is arranged on one surface, back to the display panel, of the middle plate; the heat exchange plate is arranged between the display panel and the middle plate, the middle plate is provided with a via hole, and the heat exchange plate is connected with the component through the via hole. The middle plate of the display device is used for fixing each component in the display device, and plays a role in supporting and protecting each component. The heat exchange plate is used for heat dissipation of the display panel and the components, the via holes are formed in the middle plate, the components can make direct contact with the middle plate, the heat exchange efficiency of the heat exchange plate and the components is improved, and therefore the heat dissipation capacity of the mobile phone can be improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of mobile phones, in particular to a display device and a mobile phone. BACKGROUND

[0002] With the improvement of mobile phone manufacturing process, while the chip transistor density, performance and energy efficiency of mobile phones have been comprehensively improved, the power consumption of mobile phones has also increased exponentially. Since entering the 5G era, while mobile phones have faster network speed and lower latency, the power consumption of mobile phones is 1.5-2.5 times that of 4G mobile phones. In order to solve the pain point of fast power consumption of mobile phones, in recent years, the charging power of mobile phones has reached 200W. Under the trend of increasing mobile phone power consumption and charging power year by year, in order to ensure the user's temperature rise experience and safety, as well as the demand for product reliability, it is urgent to improve the heat dissipation capacity of mobile phones. CONTENT OF THE UTILITY MODEL

[0003] In view of the above problems, the present application provides a display device and a mobile phone. By forming a via hole on the middle plate, the heat exchange plate is connected to the components on the middle plate through the via hole, so that the heat dissipation capacity of the display device can be improved.

[0004] To solve the above technical problems, one technical solution adopted by the present application is to provide a display device, which comprises a display panel, a middle plate and a heat exchange plate. The display panel has a first face and a second face, the first face being the light emitting face of the display panel, the middle plate being arranged on the second face of the display panel, and one face of the middle plate facing away from the display panel being provided with components. The heat exchange plate is arranged between the display panel and the middle plate, wherein the middle plate has a via hole, and the heat exchange plate is connected to the components through the via hole.

[0005] In one possible implementation, the heat exchange plate is provided with a protruding structure, and the protruding structure is connected to the components through the via hole.

[0006] In one possible implementation, the heat exchange plate and the protruding structure are integrally formed.

[0007] In one possible implementation, the components include a processor, a memory device and a power supply device, and the components are arranged in close contact with the protruding structure.

[0008] In one possible implementation, the number of via holes is multiple, and each component is connected to the components through one via hole.

[0009] In one possible implementation, the display device further comprises a driving chip, and the driving chip is arranged on the second face of the display panel and connected to the middle plate through a heat-conducting adhesive.

[0010] In a possible implementation, the display device further includes a shielding sheet, which is arranged between the component and the convex structure.

[0011] In a possible implementation, the display device further includes a middle frame, which is annular and forms the accommodating cavity, and the middle plate and the heat exchange plate are arranged in the accommodating cavity.

[0012] In a possible implementation, the heat exchange plate is a stamped stainless steel sheet, and the thickness of the heat exchange plate is not greater than 0.3 mm.

[0013] To solve the above technical problems, another technical solution adopted by the present application is to provide a mobile phone, which comprises the display device.

[0014] Different from the prior art, the present application provides a display device and a mobile phone. The display device comprises a display panel, a middle plate and a heat exchange plate. The display panel has a first surface and a second surface, the first surface being a light exit surface of the display panel, the middle plate being arranged on the second surface of the display panel, and a surface of the middle plate facing away from the display panel being provided with a component. The heat exchange plate is arranged between the display panel and the middle plate, wherein the middle plate has a through hole, and the heat exchange plate is connected with the component through the through hole. The display device described above uses the middle plate to fix various components inside the display device, and the middle plate supports and protects the various components. The heat exchange plate is used to dissipate heat for the display panel and the component. By forming the through hole on the middle plate, the component can be in direct contact with the middle plate, the heat exchange efficiency of the heat exchange plate and the component is improved, and thus the heat dissipation capacity of the mobile phone can be improved.

[0015] The above description is only a summary of the technical solutions of the present application. In order to more clearly understand the technical means of the present application, the specific embodiments of the present application can be implemented according to the content of the description, and in order to make the above and other purposes, characteristics and advantages of the present application more obvious and easy to understand, the following will describe the specific embodiments of the present application. BRIEF DESCRIPTION OF DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings needed in the embodiment description. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without any creative effort.

[0017] Figure 1 FIG. 1 is a structural schematic diagram of an embodiment of the display device of the present application;

[0018] Figure 2 FIG. 2 is a structural schematic diagram of the middle plate of the display device; Figure 1 FIG. 3 is a structural schematic diagram of the middle plate of the display device; and

[0019] Figure 3 For Figure 1 The heat exchange plate of the display device is shown in the figure.

[0020] Figure 4 For Figure 1 The structure of the heat exchange plate is shown in the figure.

[0021] Wherein, 100, display device; 10, display panel; 101, first surface; 102, second surface; 11, driving chip; 12, heat-conducting adhesive; 20, middle plate; 21, via hole; 30, heat exchange plate; 31, convex structure; 40, component; 50, back shell. DETAILED DESCRIPTION

[0022] The embodiments of the technical scheme of the present application will be described in detail below. The following embodiments are only used to more clearly illustrate the technical scheme of the present application, and therefore only serve as examples, and cannot limit the protection scope of the present application.

[0023] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs; the terms used herein are only for the purpose of describing specific embodiments of the present application, and are not intended to limit the present application; the terms "include" and "have" and any variations thereof in the specification and claims of the present application and the above description of drawings are intended to cover non-exclusive inclusion.

[0024] In the description of the embodiments of the present application, the technical terms "first", "second", etc. are only used to distinguish different objects, and cannot be understood as indicating or implying relative importance or implicitly indicating the number, specific order or primary and secondary relationship of the indicated technical features. In the description of the embodiments of the present application, unless otherwise explicitly and specifically limited, the term "a plurality of" refers to two or more (including two), and similarly, "a plurality of groups" refers to two or more groups (including two groups), and "a plurality of pieces" refers to two or more pieces (including two pieces).

[0025] In this paper, the phrase "embodiment" means that the specific features, structures or properties described in conjunction with the embodiment can be included in at least one embodiment of the present application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment to other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0026] In the description of the embodiments of the present application, the term "and / or" is only to describe the association relationship of the associated objects, which means that there can be three relationships, for example, A and / or B, which can represent the three cases of A existing alone, A and B existing simultaneously, and B existing alone. In addition, the character " / " in this paper generally represents that the front and rear associated objects are in an "or" relationship.

[0027] In the description of the embodiments of the present application, the technical terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the embodiments of the present application and simplifying the description, and does not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the embodiments of the present application.

[0028] In the description of the embodiments of the present application, unless otherwise explicitly specified and limited, the technical terms "mounting", "connection", "connection", "fixing" and the like should be understood in a broad sense, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

[0029] With the increasing trend of mobile phone power consumption and charging power year by year, in order to ensure the user's temperature rise experience and safety, as well as the demand for product reliability, it is urgent to improve the heat dissipation capacity of the mobile phone.

[0030] Based on the above consideration, in order to improve the heat dissipation capacity of the mobile phone, the present application provides a display device and a mobile phone. The display device has a via hole formed on the middle plate. The via hole is arranged to enable the components to be directly connected with the heat exchange plate, thereby improving the heat exchange efficiency of the heat exchange plate and the components.

[0031] In the present application, the display device can be a mobile phone, a computer, a tablet computer or the like. In the following embodiments, a display device of an embodiment of the present application is taken as a mobile phone for illustration.

[0032] Please refer to Figures 1 to 4 , Figure 1 for the structural schematic diagram of the display device of an embodiment of the present application; Figure 2 for Figure 1 the structural schematic diagram of the middle plate of the display device; Figure 3 for Figure 1A schematic view of the heat exchange plate of the display device; Figure 4 For Figure 1 A schematic view of the structure of the heat exchange plate away from the middle plate. In a specific embodiment, the display device 100 includes a display panel 10, a middle plate 20 and a heat exchange plate 30.

[0033] The display panel 10 has a first face 101 and a second face 102, the first face 101 is the light emitting face of the display panel 10, the middle plate 20 is arranged on the second face 102 of the display panel 10, and the middle plate 20 is provided with components 40 away from the display panel 10. The heat exchange plate 30 is arranged between the display panel 10 and the middle plate 20, wherein the middle plate 20 has a through hole 21, and the heat exchange plate 30 is connected with the components 40 through the through hole 21. Specifically, the display panel 10 can be a liquid crystal panel, an LED (Light Emitting Diode) panel, an OLED (Organic Light-Emitting Diode) panel, etc., and the specific type of the display panel 10 is not limited. The middle plate 20 is arranged inside the housing of the display device 100, and the middle plate 20 plays a role of structural support inside the housing of the display device 100, and the middle plate 20 can be provided with a mounting structure such as a clamping groove (not marked) to fix the components 40 on the middle plate 20. Wherein, the components 40 can include a processor (not marked), a memory device (not marked) and a power supply device (not marked) and the like. In addition, the middle plate 20 also plays a role of dustproof protection and shielding electromagnetic interference. In this embodiment, the middle plate 20 is a metal middle plate, and in some other embodiments, the middle plate 20 can also be a plastic middle plate. The heat exchange plate 30 is used for heat exchange with the components 40, the display panel 10 and the like inside the display device 100. In the related art, the components 40 and the heat exchange plate 30 are located on both sides of the middle plate 20, and the components 40 and the heat exchange plate 30 are arranged in a spaced manner, and the heat exchange efficiency of the components 40 and the heat exchange plate 30 in the related art is not high. In this embodiment, the through hole 21 is arranged on the middle plate 20, and the arrangement of the through hole 21 enables the components 40 on both sides of the middle plate 20 to be connected with the heat exchange plate 30, thereby improving the heat exchange efficiency of the components 40 and the heat exchange plate 30 and improving the heat dissipation capacity of the display device 100.

[0034] Different from the prior art, the display device 100 provided by the application comprises a display panel 10, a middle plate 20 and a heat exchange plate 30. The display panel 10 has a first surface 101 and a second surface 102, the first surface 101 is the light exit surface of the display panel 10, the middle plate 20 is arranged on the second surface 102 of the display panel 10, and a component 40 is arranged on the surface of the middle plate 20 which is opposite to the display panel 10; the heat exchange plate 30 is arranged between the display panel 10 and the middle plate 20, wherein the middle plate 20 has a through hole 21, and the heat exchange plate 30 is connected with the component 40 through the through hole 21. The above-mentioned middle plate 20 is used to fix each component 40 inside the display device 100, and plays a supporting and protecting role for each component 40. The heat exchange plate 30 is used to dissipate heat for the display panel 10 and the component 40, wherein the through hole 21 is formed on the middle plate 20, so that the component 40 can be in direct contact with the middle plate 20, the heat exchange efficiency of the heat exchange plate 30 and the component 40 is improved, and thus the heat dissipation capacity of the mobile phone can be improved.

[0035] In the embodiment, the heat exchange plate 30 is a stainless steel heat exchange plate, which has excellent heat conduction performance. In some other embodiments, the heat exchange plate 30 can also be a copper heat exchange plate, an aluminum heat exchange plate or a ceramic heat exchange plate, etc.

[0036] In some embodiments, the heat exchange plate 30 is provided with a protruding structure 31, and the protruding structure 31 is connected with the component 40 through the through hole 21. Specifically, the component 40 is connected with the protruding structure 31, so that the component 40 can be in direct contact with the heat exchange plate 30 for heat exchange, the waste heat generated by the component 40 can be more quickly conducted out, and the heat dissipation capacity of the display device 100 is improved. Further, in the embodiment, the heat exchange plate 30 is a stainless steel heat exchange plate, wherein the heat exchange plate 30 and the protruding structure 31 are an integrally formed structure. The advantage of this arrangement is that there is no connecting part between the heat exchange plate 30 and the protruding structure 31, the structural integrity is better, and the heat conduction efficiency is higher. The heat exchange plate 30 and the protruding structure 31 on the heat exchange plate 30 can be integrally manufactured by stamping. The heat exchange plate 30 manufactured in this way is a stamped stainless steel sheet. The thickness of the heat exchange plate 30 manufactured by stamping can be not greater than 0.3 mm. For example, the thickness of the heat exchange plate 30 can be 0.3 mm, 0.28 mm, 0.25 mm, etc. The above-mentioned thickness of the heat exchange plate 30 is smaller, which conforms to the development trend of the light and thin display device 100. In some other embodiments, the protruding structure 31 can not be an integrally formed structure with the heat exchange plate 30. For example, the protruding structure 31 can be connected with the heat exchange plate 30 by welding, clamping, heat-conducting glue, etc. In addition, in the embodiment, the protruding structure 31 is a rectangular body, and in some other embodiments, the protruding structure 31 can also be a cylindrical body, an irregular polygonal body, etc., which is not limited in particular.

[0037] In some embodiments, the plurality of components 40 include a processor, a memory device, and a power supply device, and the components 40 are arranged to be attached to the protruding structure 31. Specifically, the components 40 can be fixed to the middle plate 20 by means of clamping, screws, adhesives, or the like. In some other embodiments, the components 40 can also include, for example, a power supply control chip, a microphone, an earpiece, or the like, and the types and number of the components 40 are not specifically limited. The components 40 are arranged to be attached to the protruding structure 31, so that the components 40 contact the protruding structure 31, and the protruding structure 31 can directly exchange heat with the components 40, and quickly transfer the waste heat of the components 40 to the heat exchange plate 30. In some embodiments, the power supply device further includes a back shell 50 on the side away from the middle plate 20, and the back shell 50 is used to protect the power supply device and the components 40, wherein a heat absorbing sheet (not shown) is arranged between the back shell 50 and the power supply device, and the heat absorbing sheet can be made of graphene or the like.

[0038] Further, in some embodiments, the middle plate 20 has a plurality of through holes 21, and each component 40 is connected to the component 40 through a through hole 21. Specifically, the middle plate 20 has a through hole 21 corresponding to each component 40. In addition, the shape of the through hole 21 can be rectangular, circular, irregular polygonal, or the like, and is not specifically limited.

[0039] In some embodiments, the display device 100 further includes a driving chip 11. The driving chip 11 is arranged on the second surface 102 of the display panel 10, and the driving chip 11 is further connected to the middle plate 20 through the heat-conducting adhesive 12. Specifically, the display panel 10 includes a display area (not shown) and a non-display area (not shown) around the display area, and the driving chip 11 is located in the non-display area of the display panel 10. The driving chip 11 is used to control the display of the display panel 10, and the driving chip 11 is further connected to the processor on the middle plate 20. The driving chip 11 is connected to the middle plate 20 through the heat-conducting adhesive 12, so that the driving chip 11 can exchange heat with the middle plate 20, the middle plate 20 is connected to the heat exchange plate 30, and thus the driving chip 11 can exchange heat with the heat exchange plate 30 at a distance, which can improve the heat dissipation effect of the display device 100.

[0040] In some embodiments, the display device 100 further includes a shielding sheet (not shown) arranged between the components 40 and the protruding structure 31. Specifically, the shielding sheet is used to reduce the electromagnetic radiation generated by the components 40, reduce the electromagnetic interference between the components 40, and improve the stability of the components 40. In some preferred embodiments, the shielding layer is a copper foil layer, which has excellent heat conduction performance, so that the arrangement of the shielding sheet does not affect the heat exchange between the heat exchange plate 30 and the components 40.

[0041] In some embodiments, the display device 100 further comprises a middle frame (not shown), which is annular and forms a receiving cavity, and the middle plate 20 and the heat exchange plate 30 are arranged in the receiving cavity. Specifically, the middle frame plays a role of structural support in the display device 100, and can be used to reinforce the display panel 10, the middle plate 20, the heat exchange plate 30, etc. In some preferred embodiments, a thermally conductive material such as graphene is arranged on the inner side of the middle frame to improve the heat dissipation capacity of the display device 100.

[0042] Different from the prior art, the display device 100 provided by the present application comprises a display panel 10, a middle plate 20 and a heat exchange plate 30. The display panel 10 has a first surface 101 and a second surface 102, the first surface 101 is the light exit surface of the display panel 10, the middle plate 20 is arranged on the second surface 102 of the display panel 10, and a component 40 is arranged on the surface of the middle plate 20 facing away from the display panel 10; the heat exchange plate 30 is arranged between the display panel 10 and the middle plate 20, wherein the middle plate 20 has a via hole 21, and the heat exchange plate 30 is connected with the component 40 through the via hole 21. Through the formation of the via hole 21 on the middle plate 20, the component 40 can be in direct contact with the middle plate 20, and the heat exchange efficiency of the heat exchange plate 30 and the component 40 is improved, so that the heat dissipation capacity of the mobile phone can be improved.

[0043] Correspondingly, the present application also provides a mobile phone comprising the display device 100, wherein the display device 100 is the display device 100 described above.

[0044] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement for part or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application, and they should be covered in the scope of the claims and the description of the present application. Especially, as long as there is no structural conflict, each technical feature mentioned in each embodiment can be combined in any way. The present application is not limited to the specific embodiments disclosed in the text, but includes all technical solutions falling within the scope of the claims.

Claims

1. A display device, characterized in that, The display device includes: The display panel has a first surface and a second surface, wherein the first surface is the light-emitting surface of the display panel. A middle plate is disposed on the second side of the display panel, and components are disposed on the side of the middle plate facing away from the display panel; A heat exchange plate is disposed between the display panel and the middle plate, wherein the middle plate has a through hole, and the heat exchange plate is connected to the component through the through hole.

2. The display device according to claim 1, characterized in that, The heat exchange plate is provided with a raised structure, which is connected to the component through the through hole.

3. The display device according to claim 2, characterized in that, The heat exchange plate and the protruding structure are integrally formed.

4. The display device according to claim 3, characterized in that, The components include a processor, a memory device, and a power supply device, and the components are fitted to the protruding structure.

5. The display device according to claim 4, characterized in that, The number of vias is multiple, and each component is connected to the component through one of the vias.

6. The display device according to claim 5, characterized in that, The display device further includes: A driver chip is disposed on the second side of the display panel, and the driver chip is also connected to the middle plate by a thermally conductive adhesive.

7. The display device according to claim 6, characterized in that, The display device further includes: A shielding sheet is disposed between the component and the protruding structure.

8. The display device according to claim 7, characterized in that, The display device further includes: The middle frame is annular and has a receiving cavity, and the middle plate and the heat exchange plate are disposed in the receiving cavity.

9. The display device according to claim 8, characterized in that, The heat exchange plate is a stamped stainless steel sheet, and the thickness of the heat exchange plate is no more than 0.3 mm.

10. A mobile phone, characterized in that, The mobile phone includes a display device, which is the display device according to any one of claims 1-9.

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