Power-on test board for memory product
By designing a power-on test board for memory products, the problem of damage to server platforms caused by testing DDR5 UDIMM products in harsh environments was solved, achieving low-cost and high-efficiency testing results.
Patent Information
- Application Number
- CN202520040091.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-08
- Publication Date
- 2025-12-19
- Estimated Expiration
- 2035-01-08
AI Technical Summary
In existing technologies, DDR5 UDIMM products can damage server platforms when subjected to power-on testing in harsh testing environments, resulting in high costs and low testing efficiency.
Design a power-on test board for memory products, including a power input module, a filtering module, a power conversion module, and an LED display module, which can simulate the power-on working state of DDR5 UDIMM and replace the server platform for testing.
It reduces testing costs, improves testing efficiency, enables simultaneous testing of multiple memory products, and reduces damage to the server platform.
Smart Images
Figure CN223692911U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The application relates to the technical field of power-on test of a DDR5 memory product, in particular to a memory product power-on test board. BACKGROUND
[0002] Before a DDR5 UDIMM (DDR5 is the fifth generation of double data rate memory standard, and UDIMM is a non-buffered dual in-line memory module) product is shipped, in order to ensure the reliability of the product, the product needs to be tested for reliability, and the power-on test is one of the reliability tests.
[0003] The previous test method is to insert the DDR5 UDIMM product into the test server mainboard for power-on test. However, the power-on test environment is relatively harsh (humidity 85%, temperature 85, test 1000 hours), and the general server platform is not allowed to run in such an environment, because the server platform is very valuable, and long-term operation in a harsh test environment will cause damage to the server platform components, greatly reducing the service life of the server platform, thereby causing huge cost loss. CONTENT OF THE UTILITY MODEL
[0004] The technical problem to be solved by the application is to provide a memory product power-on test board, which can simulate the power-on working state of the DDR5 UDIMM, replace the server platform for power-on test, thereby reducing the test cost and improving the test efficiency.
[0005] In order to solve the above problems, the application provides a memory product power-on test board, which comprises a power input module, a filter module, a power conversion module, an LED display module and a plurality of memory slot modules; the two ends of the power input module are respectively connected with an input power and an input end of the filter module, the output end of the filter module is connected with an input end of the power conversion module and each memory slot module, the output end of the power conversion module is connected with the LED display module, and the LED display module is respectively connected with each memory slot module.
[0006] Preferably, the power input module comprises a first power input interface element and a second power input interface element, the input interfaces of the first power input interface element and the second power input interface element are respectively connected with an input power, and the output interfaces are respectively connected with the filter module.
[0007] Preferably, the first input interface of the first power input interface element is a female port, and the first input interface is connected with a power adapter, and the second input interface of the second power input interface element is a male port.
[0008] Preferably, the filter module comprises a protection element and a plurality of capacitors, one end of the protection element is connected to the first output interface of the first power input interface element and the first output interface of the second power input interface element respectively, and is connected to the power conversion module; the other end of the protection element is connected to the second output interface of the first power input interface element and the second output interface of the second power input interface element respectively, and is grounded; the plurality of capacitors are connected in parallel between the two ends of the protection element.
[0009] Preferably, the filter module further comprises a fuse resistor, two ends of the fuse resistor are connected to the protection element and the power conversion module respectively.
[0010] Preferably, the power conversion module comprises a power chip, a third connection end of the power chip is connected to the filter module, a first connection end is grounded, and a second connection end and a fourth connection end are connected to the LED display module respectively.
[0011] Preferably, the power conversion module further comprises a thirteenth capacitor, a fourteenth capacitor and a fifteenth capacitor, two ends of the thirteenth capacitor are connected to the first connection end and the third connection end of the power chip respectively, two ends of the fourteenth capacitor are connected to the fourth connection end of the power chip and the ground respectively, and two ends of the fifteenth capacitor are connected to two ends of the fourteenth capacitor.
[0012] Preferably, the LED display module comprises a light emitting diode and a triode, a positive electrode of the light emitting diode is connected to the power conversion module, a negative electrode of the light emitting diode is connected to a collector of the triode, an emitter of the triode is grounded, and a base of the triode is connected to the power conversion module and each memory slot module.
[0013] Preferably, a first resistor is connected between the base of the triode and each memory slot module.
[0014] Preferably, the power-on test board comprises a plurality of conductive layers and a plurality of insulating layers, each conductive layer and each insulating layer are arranged in a spaced manner, and the top layer and the bottom layer of the power-on test board are the conductive layers.
[0015] Compared with the prior art, the present application has at least one of the following beneficial technical effects:
[0016] The input power supply of the power input module passes through the filtering module to obtain a stable power supply with stable output. The stable power supply is converted by the power conversion module conversion circuit to output a low-voltage power supply. The low-voltage power supply passes through the LED display module and supplies power to a plurality of memory slot modules. The LED display module can monitor whether the power supply circuit is normally powered in real time. Each power-on test board can be inserted into a plurality of memory slot modules at the same time, and then the power-on test board is placed in a test environment for power-on testing. On the one hand, the power-on test board can simulate the power-on working state of the DDR5 UDIMM, and replace the server platform to perform power-on testing, thereby reducing the testing cost and improving the testing efficiency. On the other hand, a power-on test board can simultaneously test a plurality of memory products, and a plurality of power-on test boards can also be connected at the same time for batch testing, thereby greatly improving the power-on testing efficiency. BRIEF DESCRIPTION OF DRAWINGS
[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed in the embodiment description will be briefly introduced. Obviously, the drawings in the following description are some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without creative labor.
[0018] Figure 1 The structure diagram of the power input module and the filtering module in the embodiment of the present application.
[0019] Figure 2 The structure diagram of the power conversion module in the embodiment of the present application.
[0020] Figure 3 The structure diagram of the LED display module in the embodiment of the present application.
[0021] Figure 4 The structure diagram of the memory slot module in the embodiment of the present application.
[0022] Figure 5 The overall structure diagram of the power-on test board in the embodiment of the present application.
[0023] Figure 6 The laminated structure diagram of the power-on test board in the embodiment of the present application.
[0024] Explanation of reference numerals: J1, first power input interface element; J2, second input power interface element; D1, protection element; F1, fuse resistor; U1, power chip; C13, thirteenth capacitor; C14, fourteenth capacitor; C15, fifteenth capacitor; D2, light-emitting diode; Q1, triode; R2, second resistor; R3, third resistor; R4, fourth resistor; 1, filtering module; 2, power conversion module; 3, LED display module; 4, memory slot module. DETAILED DESCRIPTION
[0025] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are some of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by a person of ordinary skill in the art without creative effort are within the protection scope of the present application.
[0026] It should be understood that, when used in the specification and the appended claims, the terms “comprise” and “include” indicate the presence of described features, integers, steps, operations, elements, and / or components, but do not exclude one or more other features, integers, steps, operations, elements, components, and / or groups thereof.
[0027] It should also be understood that the terms used in the present application specification are only for the purpose of describing particular embodiments and are not intended to limit the present application. As used in the present application specification and the appended claims, the singular forms “a,” “an,” and “the” are intended to include the plural forms unless the context clearly indicates otherwise.
[0028] It should be further understood that the term “and / or” used in the present application specification and the appended claims means any combination of one or more of the associated listed items and all possible combinations, and includes these combinations.
[0029] Please refer to Figures 1 to 6 The embodiments of the present application provide a memory product power-on test board, which can be used for power-on test of DDR5 UDIMM, RDIMM, SODIMM, LRDIMM, and other memory products. The power-on test board includes a power input module, a filter module 1, a power conversion module 2, an LED display module 3, and a plurality of memory slot modules 4.
[0030] The two ends of the power input module are respectively connected to an input power and an input end of the filter module 1. The output end of the filter module 1 is connected to an input end of the power conversion module 2 and each memory slot module 4. The output end of the power conversion module 2 is connected to the LED display module 3, and the LED display module 3 is respectively connected to each memory slot module 4.
[0031] The input power supply of the power input module is filtered by the filtering module 1 to obtain a stable power supply, and the stable power supply is converted by the power conversion module 2 to output a low-voltage power supply. The low-voltage power supply is supplied to the LED display module 3 and the plurality of memory slot modules 4. The LED display module 3 can monitor whether the power supply circuit is normally powered in real time. Each power-on test board can be inserted into the plurality of memory slot modules 4 at the same time, and then the power-on test board is placed in a test environment for power-on testing. On the one hand, the power-on test board can simulate the power-on working state of the DDR5 UDIMM, and replace the server platform to perform power-on testing, thereby reducing the testing cost and improving the testing efficiency. On the other hand, one power-on test board can simultaneously test a plurality of memory products, and a plurality of power-on test boards can be simultaneously connected for batch testing, thereby greatly improving the power-on testing efficiency.
[0032] Please refer to Figure 1 In an embodiment, the power input module includes a first power input interface element J1 and a second power input interface element J2. The first input interface of the first power input interface element J1 and the second input interface of the second power input interface element J2 are respectively connected to the input power supply, and the output interfaces are respectively connected to the filtering module 1.
[0033] In this embodiment, the first input interface of the first power input interface element J1 is a female port, and the first power input interface element J1 is soldered on the power-on test board in the form of a plug-in element. The first power input interface element J1 needs to be connected to a power adapter for use. When in use, the input end (i.e. the plug) of the power adapter (12V) is connected to the household 220V alternating current, and the output end is connected to the first input interface. The 220V alternating current is output as 5V direct current after passing through the adapter, and the output 5V direct current is filtered by the filtering module 1 to output stable 5V direct current for powering the power-on test board.
[0034] In this embodiment, the second input interface of the second power input interface element J2 is a male port, and the second power input interface element J2 is also soldered on the power-on test board in the form of a plug-in element, and does not need to be connected to a power adapter for use, and can be used as a backup power input. When in use, the positive electrode of a 5V direct current power supply (such as a battery, a power bank, etc.) is connected to the positive electrode (5V) of the second power input interface element J2, and the negative electrode of the direct current power supply is connected to the negative electrode (GND) of the second power input interface element J2 to directly provide 5V direct current power supply for the power-on test board.
[0035] In a specific embodiment, the filter module 1 comprises a protection element D1 and a plurality of capacitors. One end of the protection element D1 is connected to the first output interface of the first power input interface element J1 and the first output interface of the second power input interface element J2 respectively, and is connected to the power conversion module 2. The other end of the protection element D1 is connected to the second output interface of the first power input interface element J1 and the second output interface of the second power input interface element J2 respectively, and is grounded. The plurality of capacitors are connected in parallel across the protection element D1. In this embodiment, there are 12 capacitors (C1-C12) connected in parallel across the protection element D1.
[0036] In this embodiment, the protection element D1 (Electrostatic Discharge Protection Device) is a component specially used to prevent electronic devices from being damaged by external electrostatic discharge (ESD). When an ESD event occurs, the protection element D1 will have a very low resistance value and discharge the current on the ESD current path to the ground or another port with a minimum reverse voltage. The plurality of capacitors are connected in parallel across the protection element D1. In this filter module 1, the capacitors are used to filter out the alternating component, making the output direct current smoother.
[0037] In a specific embodiment, the filter module 1 further comprises a fuse resistor F1, the two ends of the fuse resistor F1 are connected to the protection element D1 and the power conversion module 2 respectively. In this filter module 1, the fuse resistor F1 plays the dual role of fuse and resistor. The fuse resistor F1 can be blown in time when there is an overcurrent, protecting other components in the circuit from damage. When a short circuit fault occurs in the circuit load, the temperature of the fuse resistor F1 will rise to 500-600°C in a very short time, at which point the resistance layer will peel off and be blown, serving as a fuse and achieving the purpose of improving circuit safety.
[0038] Please refer to Figure 2 In a specific embodiment, the power conversion module 2 comprises a power chip U1. The third connection end of the power chip U1 is connected to the filter module 1, the first connection end is grounded, and the second and fourth connection ends are connected to the LED display module 3 respectively. In this embodiment, the power chip U1 is a DC-DC power chip, which is a three-terminal output low-dropout linear regulator with an output current of 1A. It has various versions such as 1.2V, 1.8V, 2.5V, 3.3V, 5.0V and adjustable output voltage, and its voltage drop is only 1.2V at 1A. Here, the power chip U1 can convert the 5V DC power output by the filter module 1 into a 3.3V low-voltage power output, and the output 3.3V power supply is used for small components on the power-on test board, such as capacitors, resistors, LEDs, etc.
[0039] In a specific embodiment, the power conversion module 2 further comprises a thirteenth capacitor C13, a fourteenth capacitor C14 and a fifteenth capacitor C15. The two ends of the thirteenth capacitor C13 are respectively connected to the first connection end and the third connection end of the power chip U1, the two ends of the fourteenth capacitor C14 are respectively connected to the fourth connection end of the power chip U1 and the ground, and the two ends of the fifteenth capacitor C15 are respectively connected to the two ends of the fourteenth capacitor C14. Here, the thirteenth capacitor C13, the fourteenth capacitor C14 and the fifteenth capacitor C15 control the flow of current through the charging and discharging process, thereby converting 5V direct current into 3.3V alternating current.
[0040] Please refer to Figure 3 and Figure 4 In a specific embodiment, the LED display module 3 comprises a light-emitting diode D2 and a triode Q1. The anode of the light-emitting diode D2 is connected to the 3.3V alternating current input by the power conversion module 2, the cathode of the light-emitting diode D2 is connected to the collector of the triode Q1, the emitter of the triode Q1 is grounded, the base of the triode Q1 is connected to the power conversion module 2 and each memory slot module 4, and each memory slot module 4 is respectively connected to a PG signal line. The PG signal line is used to detect whether the memory slot module 4 is correctly inserted into the memory slot of the power-on test board. When all the to-be-tested memory slot modules 4 are correctly inserted into the memory slot and the power-on test board is normally powered, the light-emitting diode D2 (i.e. the LED lamp) will light up, and if the light-emitting diode D2 does not light up, it means that the memory slot module 4 is not correctly inserted into the memory slot.
[0041] Further, the base of the triode Q1 is respectively connected to each memory slot module 4 through a first resistor, and the LED display module 3 further comprises a second resistor R2, a third resistor R3 and a fourth resistor R4. The two ends of the second resistor R2 are respectively connected to the 3.3V alternating current input by the power conversion module 2 and the anode of the light-emitting diode D2, the two ends of the third resistor R3 are respectively connected to the emitter and the base of the triode Q1, and the two ends of the fourth resistor R4 are respectively connected to the 3.3V alternating current input by the power conversion module 2 and the base of the triode Q1. In this embodiment, the triode Q1 is an NPN triode Q1. In this embodiment, the number of memory slot modules 4 is set to 10 groups (PG1-PG10), and therefore the first resistor is also set to 10 groups (R16-R25). In other embodiments, the memory slot module 4 and the first resistor can also be 5 groups, 15 groups or 20 groups, etc.
[0042] Therefore, when using the power-on test board, the operator first inserts the memory products to be tested into the memory slots of the power-on test board and locks them, and one power-on test board can simultaneously insert 10 groups of memory products. Then the memory products are placed in a "double 85" test environment, i.e., a test environment with a humidity of 85% and a temperature of 85°C, and then the power-on test board is connected to a 5V power supply to start the power-on test. The power-on test needs to last for 1000 hours, and finally the memory products after 1000 hours of power-on test are taken out and transferred to the server platform for retest. If the memory products after power-on test can still be used normally, it means that the memory products pass the power-on test; if they cannot be used normally, such as cannot be started normally, it means that the memory products do not pass the power-on test.
[0043] Please refer to Figure 6 In a specific embodiment, the power-on test board includes a plurality of conductive layers and a plurality of insulating layers, each conductive layer and each insulating layer are arranged in an interval, and the top layer and the bottom layer of the test board are conductive layers. In this embodiment, the insulating layer is a PP layer and a core layer, and the conductive layer is a copper foil layer, so the arrangement order of the power-on test board stack is Top conductive layer, PP insulating layer, G / P conductive layer, core insulating layer, G / P conductive layer, PP insulating layer and Bottom conductive layer. The design of the power-on test board as a stack can reduce the vulnerability of the circuit to external noise (here, the noise refers to the noise of the signal, not the general sense of sound noise), and reduce the amplitude and solve the impedance and crosstalk problems in the layout of the high-speed power-on test board.
[0044] The above is only a specific embodiment of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art can easily think of various equivalent modifications or replacements within the technical scope disclosed in the present application, and these modifications or replacements should be covered within the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.
Claims
1. A memory product power-up test board, characterized by: The power input module, the filter module, the power conversion module, the LED display module and the memory slot module are included. The input power is connected to the two ends of the power input module, and the input end of the filter module is connected to the output end of the filter module.
2. The memory product power-on test board of claim 1, wherein, The first input interface of the first power input interface element is a female port, and the second input interface of the second power input interface element is a male port.
3. The memory product power-on test board of claim 2, wherein, The filter module includes a protection element and a plurality of capacitors.
4. The memory product power-on test board of claim 2, wherein, The filter module further includes an insurance resistor, and the two ends of the insurance resistor are connected to the protection element and the power conversion module.
5. The memory product power-up test board of claim 4, wherein, The power conversion module includes a power chip, and the third connection end of the power chip is connected to the filter module.
6. The memory product power-on test board of claim 1, wherein, The power conversion module further includes a thirteenth capacitor, a fourteenth capacitor and a fifteenth capacitor.
7. A memory product power-up test board as claimed in claim 6, wherein, The LED display module includes a light emitting diode and a triode.
8. The memory product power-on test board of claim 1, wherein, The base of the triode is connected to each memory slot module.
9. The memory product power-up test board of claim 8, wherein, The upper power test board includes a plurality of conductive layers and a plurality of insulating layers.
10. The memory product power-on test board of claim 1, wherein,