Sensor debugging device

Abstract

A sensor debugging device comprises a first cavity and a second cavity, and the first cavity and the second cavity are connected into a whole; the first end of the bearing part is connected with the surface of the inner wall of the top of the first cavity, and the second end of the bearing part is connected with the surface of the inner wall at the opening of the first cavity; and the simulation device is arranged on the surface of the inner wall of the top of the second cavity. The sensor debugging device detects the luminous flux threshold value of the sensor independent of the machine table in the wafer sorting machine, the influence on the machine table in the debugging process is avoided, the debugging period can be shortened as much as possible, the debugging frequency can be reduced as much as possible, and the utilization rate of the machine table is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the field of semiconductor manufacturing especially relates to a sensor debugging device. BACKGROUND

[0002] The wafer sorting machine is an automatic device for classifying, detecting and processing wafers in the semiconductor manufacturing process. It plays a crucial role in the semiconductor production line, ensuring efficient flow and quality control of wafers between different processes.

[0003] The sensors on the hand fork in the domestic wafer sorting machine are all light sensors. When the sensor is blocked, it will feedback the light transmittance value. When the light transmittance value exceeds the set threshold, it is recognized as triggering. The wafer position is confirmed to be normal by detecting the sensor state.

[0004] However, there is no debugging tool for sensor debugging at present, which makes the wafer sorting machine easy to be triggered by mistake, affecting the performance of the wafer sorting machine. UTILITY MODEL CONTENT

[0005] The technical problem solved by the utility model is how to improve the performance of the wafer sorting machine.

[0006] To solve the above technical problem, the utility model embodiment provides a sensor debugging device, which comprises: a first cavity and a second cavity, the first cavity and the second cavity are connected as a whole; a bearing piece, the first end of the bearing piece is connected with the top inner wall surface of the first cavity, and the second end of the bearing piece is connected with the inner wall surface of the opening of the first cavity; an analog device, the analog device is arranged on the top inner wall surface of the second cavity.

[0007] Optionally, the connection mode of the first cavity and the second cavity comprises bolt connection, welding connection or extrusion connection, and the height of the second cavity ranges from 9mm to 10mm.

[0008] Optionally, the top cavity of the first cavity and the top cavity of the second cavity are connected or shared, forming an "H" shaped device, wherein the opening direction of the first cavity is opposite to that of the second cavity.

[0009] Optionally, the side cavity of the first cavity and the side cavity of the second cavity are connected or shared, forming an "E" shaped device, wherein the opening direction of the first cavity is the same as that of the second cavity.

[0010] Optionally, the side cavity of the first cavity and the side cavity of the second cavity are connected or shared, forming an "S" shaped device, wherein the opening direction of the first cavity is opposite to that of the second cavity.

[0011] Optionally, the bearing member comprises: a platform arranged on both sides of the first cavity opening, and the platform is adapted to support a wafer to be measured; a support column, a first end of the support column being connected with an inner wall surface of a top of the first cavity, and the support column is adapted to fix the wafer to be measured; and a buffer pad connected with a second end of the first cavity.

[0012] Optionally, the support column comprises a screw or a spring, and the buffer pad comprises a sponge pad or a plastic pad.

[0013] Optionally, the height of the platform ranges from 0.9 mm to 1.1 mm.

[0014] Optionally, the simulation device is a simulation coating, and the simulation coating is a Teflon tape.

[0015] Optionally, the sensor debugging device further comprises a visualization module connected with the sensor, and the visualization module is adapted to display the change of the light flux of the sensor.

[0016] Compared with the prior art, the technical scheme of the embodiment of the utility model has the following beneficial effects:

[0017] In the technical scheme of the utility model, the sensor triggering light flux threshold is debugged by the sensor debugging device, and the sensor debugging device comprises a first cavity and a second cavity, a bearing member is arranged in the first cavity, the bearing member can bear a wafer, and then the sensor in the first cavity can test the light flux of the wafer with different light fluxes, detect and set the minimum light flux threshold of the sensor triggering, an simulation device is arranged in the second cavity, the simulation device in the second cavity can simulate the influence of the upper and lower forks on the light flux of the sensor, the maximum light flux of the sensor being mistakenly triggered when the upper and lower forks are staggered is continuously debugged and detected, and the maximum light flux is set as the threshold lower limit of the sensor, the sensor debugging device in the utility model detects the light flux threshold of the sensor independently of the machine table in the wafer sorting machine, avoids affecting the machine table in the debugging process, can shorten the debugging period and reduce the debugging frequency as much as possible, and improves the utilization rate of the machine table.

[0018] Further, by arranging the visualization module in the sensor debugging device, the size of the adjusted light flux can be intuitively confirmed in the debugging process, the visualization and convenience of the sensor adjustment degree are realized, the debugging period is further shortened and the debugging frequency is reduced, and the utilization rate of the machine table is improved. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1 Fig. 1 is a structure schematic view of a fork in a wafer sorting machine;

[0020] Figure 2 is a structural schematic view of a sensor debugging device in an embodiment of the present application;

[0021] Figure 3 is a structural schematic view of another sensor debugging device in an embodiment of the present application;

[0022] Figure 4 is a structural schematic view of still another sensor debugging device in an embodiment of the present application;

[0023] Figure 5 is a structural schematic view of still another sensor debugging device in an embodiment of the present application;

[0024] Figure 6 is a structural schematic view of still another sensor debugging device in an embodiment of the present application. DETAILED DESCRIPTION

[0025] It should be noted that the "surface", "upper", in the specification, are used to describe the relative position relationship in space, and are not limited to whether they are in direct contact.

[0026] The current wafer sorting machine includes two forks, which are an upper fork and a lower fork, wherein the structure of the lower fork refers to Figure 1 , which comprises: a fork body 105; a fixing member 102 connected with the fork body; a wafer 101 connected with the fork body 105 through the fixing member 102; a first sensor 103 connected with the fork body 105, and the first sensor 103 is located on the lower surface of the wafer 101; and a second sensor 104 connected with the fork body 105, and the second sensor 104 is located on the fork body 105 outside the edge of the wafer 101.

[0027] In a specific embodiment, the fixing member 102 is a screw.

[0028] In other embodiments, the wafer 101 sorting machine further includes an upper fork, and the structure of the upper fork is the same as that of the lower fork, the difference being that the upper fork is located on the lower fork during the operation of the machine, and the structure of the upper fork will not be described again.

[0029] In one embodiment, the first sensor 103 is a position detection sensor, and the position detection sensor is used to detect whether the wafer 101 is placed on the lower fork; and the second sensor 104 is an offset detection sensor, and the offset detection sensor is used to detect whether the position of the wafer 101 is offset.

[0030] In a specific embodiment, an initial value of the light flux of the in-position detection sensor is 0, when the wafer is placed on the lower fork, the light flux of the in-position detection sensor starts to change, when the light flux of the in-position detection sensor is greater than a first preset threshold value, it is judged that the wafer has been placed on the lower fork; the initial value of the light flux of the offset detection sensor is 0, when the wafer is placed on the lower fork, and the light flux of the offset detection sensor is greater than a second preset threshold value at this time, it is judged that the position of the wafer at this time is offset.

[0031] In the above scheme, for the in-position detection sensor, when the in-position detection sensor detects some wafers with poor light sensitivity, the wafer may have been placed on the lower fork, but the light flux of the in-position detection sensor does not reach the first preset threshold value, at this time, the optical fiber interface needs to be adjusted constantly, and the size of the first preset threshold value needs to be detected again, so that when the wafer with poor light sensitivity is detected, the sensor can also be triggered normally, but this method will cause the sensor to change every time the debugging is performed, so a long debugging period is required, which reduces the detection efficiency and affects the use rate of the machine.

[0032] For the offset detection sensor, the offset detection sensor may be mis-triggered during the process of detecting the placement position of the wafer, specifically, when the upper fork overlaps the lower fork, the light flux of the offset detection sensor on the lower fork changes due to the coverage of the upper fork, which causes the mis-triggering of the offset detection sensor. At present, the threshold value is set by experience value, and the experience value is not accurate. If the threshold value is set too small, the upper fork will still be detected on the lower fork when the upper fork and the lower fork are staggered, which will cause mis-triggering problem, and further cause the machine to be down.

[0033] To solve the above technical problems, the utility model provides a kind of sensor debugging device, and sensor debugging device is arranged to the light flux threshold value of sensor triggering is debugged, and sensor debugging device includes first cavity and second cavity, and the light flux of different types of wafers can be tested in the first cavity The minimum threshold value of sensor triggering is detected;In the second cavity, the influence of the upper fork on the light flux of the sensor can be simulated by the simulation device, and the minimum threshold value of the light flux of the mis-triggered sensor is detected, so that the light flux threshold value of the sensor in the utility model is detected independently by wafer sorting machine Machine, avoid affecting machine during debugging process, can shorten the debugging period as far as possible and reduce the debugging frequency, improve the use rate of machine.

[0034] In order to make the above-mentioned purposes, characteristics and beneficial effects of the utility model more obvious and easy to understand, the specific embodiments of the utility model will be described in detail below with reference to the drawings.

[0035] Please refer toFigure 2 The sensor debugging device comprises a first cavity 201 and a second cavity 202 which are connected as a whole, a bearing 2011, a first end of the bearing 2011 being connected with a top inner wall surface of the first cavity 201, a second end of the bearing 2011 being connected with an inner wall surface at an opening of the first cavity 201, and an analog device 2021 arranged on a top inner wall surface of the second cavity 202.

[0036] In some embodiments of the present application, the sensor debugging device is suitable for detecting the photosensitive threshold of the sensor in the wafer 203 sorting machine before the wafer 203 sorting machine works.

[0037] In specific embodiments, the sensor comprises an in-place detection sensor and an offset detection sensor.

[0038] In other embodiments not shown in the drawings, the sensor is provided with a fiber interface, the fiber interface being connected with the sensor through a pin, and specifically, the photosensitive capability of the sensor is adjusted by adjusting the exposed length of the fiber of the fiber interface.

[0039] In some embodiments of the present application, the bearing 2011 is suitable for bearing the wafer 203, and the analog device 2021 is suitable for simulating the position of the fork in the wafer 203 sorting machine.

[0040] In some embodiments of the present application, the connection mode of the first cavity 201 and the second cavity 202 comprises bolt connection, welding connection or extrusion connection, and the height H of the second cavity 202 ranges from 9 mm to 10 mm.

[0041] In some embodiments of the present application, the analog device 2021 is an analog coating, and the analog coating is a Teflon tape.

[0042] In specific embodiments, the sensor debugging device is placed on the wafer 203 sorting machine on the basis of the wafer 203 sorting machine and the wafer 203. Figure 2 Figure 1 The working process of the sensor debugging device is as follows: the sensor debugging device is placed on the wafer 203 sorting machine on the basis of the wafer 203 sorting machine and the wafer 203. Figure 1 ​When detecting the first sensor 204 (i.e. the in-position detection sensor), the first cavity 201 is placed on the first sensor 204, so that the first sensor 204 is located in the first cavity 201, and when the first sensor 204 is located in the first cavity 201, the wafer 203 is located on the first sensor 204, and the change in light flux of the first sensor 204 and the triggering condition can be detected; during the debugging detection, the wafer 203 with poor light flux can be placed in the first cavity 201 to detect the minimum light flux threshold of the first sensor 204, and the minimum light flux threshold is set as the triggering threshold of the first sensor 204.

[0043] When detecting the second sensor 205 (i.e. the offset detection sensor), the second cavity 202 is placed on the second sensor 205, so that the second sensor 205 is located in the second cavity 202, and when the second sensor 205 is located in the second cavity 202, the simulated coating is located on the second sensor 205, and the change in light flux of the second sensor 205 and the triggering condition can be detected; during the debugging detection, the distance between the simulated coating and the second sensor 205 is the same as the distance between the upper hand fork and the second sensor 205, and the material of the simulated coating is also the same as the upper hand fork, so in the second cavity 202, the influence of the simulated coating on the light flux of the second sensor 205 can simulate the influence of the upper hand fork on the light flux of the second sensor 205, and then when the upper hand fork and the lower hand fork are staggered, the maximum light flux threshold of the second sensor 205 is detected, and the lower limit of the light flux threshold at which the second sensor 205 is triggered is set as the value of the maximum light flux threshold, to avoid the second sensor 205 being triggered by mistake.

[0044] In the above scheme, the sensor debugging device is arranged to debug the light flux threshold triggered by the sensor, and the sensor debugging device comprises a first cavity 201 and a second cavity 202, a bearing 2011 is arranged in the first cavity 201, the bearing 2011 can bear a wafer 203, and then the sensor in the first cavity 201 can test the light flux of the wafer 203 with different light fluxes, detect and set the minimum light flux threshold triggered by the sensor; an analog device 2021 is arranged in the second cavity 202, the analog device 2021 in the second cavity 202 can simulate the influence of the upper and lower forks on the light flux of the sensor, and the maximum light flux at which the sensor is triggered by mistake when the upper and lower forks are staggered is detected by continuous debugging, and the maximum light flux is set as the lower limit of the threshold of the sensor. The sensor debugging device in the utility model is independent of the machine table in the wafer 203 sorting machine to detect the light flux threshold of the sensor, avoids affecting the machine table during debugging, can shorten the debugging period and reduce the debugging frequency as much as possible, and improves the utilization rate of the machine table.

[0045] In a specific embodiment, the minimum light flux threshold range of the first sensor 204 (i.e. the in-place detection sensor) is 350, and the lower limit of the light flux threshold triggered by the second sensor 205 (i.e. the offset detection sensor) is 350.

[0046] Please refer to Figure 3 The bearing 2011 comprises a platform 20111, the platform 20111 is arranged on both sides of the opening of the first cavity 201, and the platform 20111 is adapted to support the wafer 203 to be tested; a support column 20113, a first end of the support column 20113 is connected with the inner wall surface of the top of the first cavity 201, and the support column 20113 is adapted to fix the wafer 203 to be tested; and a buffer pad 20112, the buffer pad 20112 is connected with the second end of the first cavity 201.

[0047] In some embodiments of the utility model, the thickness of the buffer pad 20112 ranges from 2.8 mm to 3.2 mm, and the height of the support column 20113 ranges from 4.8 mm to 5.2 mm.

[0048] Preferably, the thickness of the buffer pad 20112 is 3 mm, and the height of the support column 20113 is 5 mm. In this embodiment, the thickness of the buffer pad 20112 is 3 mm, and the height of the support column 20113 is 5 mm.

[0049] In some embodiments of the utility model, the support column 20113 comprises a screw or a spring, and the buffer pad 20112 comprises a sponge pad or a plastic pad.

[0050] In the above scheme, after the wafer 203 is placed on the platform 20111, the utility model further fixes the upper surface of the wafer 203 through the supporting column 20113, ensures that the wafer 203 does not displace in the debugging and detecting process, and further improves the accuracy of the detection result.

[0051] In addition, the utility model further sets the buffer pad 20112 between the supporting column 20113 and the wafer 203, can enlarge the area of the pressure applied by the supporting column 20113 to the wafer 203 in the process of fixing the wafer 203, avoids the damage caused by the direct pressure of the supporting column 20113 to the wafer 203, and ensures the integrity of the wafer 203.

[0052] In some embodiments of the utility model, the height of the platform 20111 ranges from 0.9 mm to 1.1 mm.

[0053] Preferably, the height of the platform 20111 is 1 mm.

[0054] When the height of the platform 20111 is 1 mm, the distance of the wafer 203 placed on the upper prongs or the lower prongs can be simulated, and the accuracy of the detection result is improved.

[0055] In some embodiments of the utility model, the sensor debugging device further comprises a visualization module 206, the visualization module 206 is connected with the sensor, and the visualization module 206 is adapted to display the change of the luminous flux of the sensor.

[0056] In a specific embodiment, the visualization module 206 is an LED display screen.

[0057] In the above scheme, by setting the visualization module 206 in the sensor debugging device, the size of the luminous flux after adjustment can be intuitively confirmed in the debugging process, the visualization and convenience of the adjustment degree of the sensor are realized, the debugging cycle is further shortened, the debugging frequency is reduced, and the utilization rate of the machine is improved.

[0058] In some other embodiments of the utility model, please refer to Figure 3 on the basis of Figure 4 The top cavity of the first cavity 301 and the top cavity of the second cavity 302 are connected or shared, forming an "H" shaped device, wherein the opening direction of the first cavity 301 is opposite to the opening direction of the second cavity 302.

[0059] In the embodiment, the first cavity 301 and the second cavity 302 are formed into an integrated model by pouring.

[0060] In the embodiment, the sensor debugging device further comprises a carrier 3011, a first end of the carrier 3011 is connected with the top inner wall surface of the first cavity 301, and a second end of the carrier 3011 is connected with the inner wall surface at the opening of the first cavity 301; and an analog device 3021 is arranged on the top inner wall surface of the second cavity 302.

[0061] In specific embodiments, the carrier 3011 comprises a platform 30111 arranged on both sides of the opening of the first cavity 301, and the platform 30111 is adapted to support the wafer 303 to be tested; a support column 30113, a first end of the support column 30113 is connected with the top inner wall surface of the first cavity 301, and the support column 30113 is adapted to fix the wafer 303 to be tested; and a buffer pad 30112 connected with the second end of the first cavity 301.

[0062] In some embodiments of the utility model, the support column 30113 comprises a screw or a spring, and the buffer pad 30112 comprises a sponge pad or a plastic pad.

[0063] In the above scheme, after the wafer 303 is placed on the platform 30111, the utility model further fixes the upper surface of the wafer 303 through the support column 30113, so that the wafer 303 is not displaced during the debugging and detection process, thereby improving the accuracy of the detection result.

[0064] In addition, the utility model further sets the buffer pad 30112 between the support column 30113 and the wafer 303, so that the buffer pad 30112 can enlarge the area of the pressure applied by the support column 30113 to the wafer 303 during the fixing of the wafer 303, thereby avoiding damage caused by the direct application of pressure by the support column 30113 to the wafer 303, and ensuring the integrity of the wafer 303.

[0065] In some embodiments of the utility model, the analog device 3021 is an analog coating, and the analog coating is a Teflon tape.

[0066] In some embodiments of the utility model, the height of the platform 30111 ranges from 0.9 mm to 1.1 mm.

[0067] Preferably, the height of the platform 30111 is 1 mm.

[0068] When the height of the platform 30111 is 1 mm, the distance of the wafer 303 placed on the upper tongs or the lower tongs can be simulated, thereby improving the accuracy of the detection result.

[0069] In some embodiments of the utility model, please in Figure 3 On the basis of referring to Figure 5 The side cavity of the first cavity 401 and the side cavity of the second cavity 402 are connected or shared, forming an '' E '' shaped device, wherein the opening direction of the first cavity 401 is the same as the opening direction of the second cavity 402.

[0070] In this embodiment, the first cavity 401 and the second cavity 402 are formed into an integrated model by pouring.

[0071] In this embodiment, the sensor debugging device further comprises a carrier 4011, the first end of the carrier 4011 is connected with the top inner wall surface of the first cavity 401, and the second end of the carrier 4011 is connected with the inner wall surface at the opening of the first cavity 401; an analog device 4021 is arranged on the top inner wall surface of the second cavity 402.

[0072] In a specific embodiment, the carrier 4011 comprises a platform 40111, the platform 40111 is arranged on both sides of the opening of the first cavity 401, and the platform 40111 is adapted to support the wafer 403 to be tested; a support column 40113, the first end of the support column 40113 is connected with the top inner wall surface of the first cavity 401, and the support column 40113 is adapted to fix the wafer 403 to be tested; a buffer pad 40112, the buffer pad 40112 is connected with the second end of the first cavity 401.

[0073] In some embodiments of the utility model, the support column 40113 comprises a screw or a spring, and the buffer pad 40112 comprises a sponge pad or a plastic pad.

[0074] In the above scheme, after the wafer 403 is placed on the platform 40111, the utility model further fixes the upper surface of the wafer 403 through the support column 40113, ensures that the wafer 403 does not shift during the debugging and detection process, and thus improves the accuracy of the detection result.

[0075] In addition, the utility model further sets a buffer pad 40112 between the support column 40113 and the wafer 403, so that the buffer pad 40112 can enlarge the area of the pressure applied by the support column 40113 to the wafer 403 during the fixing of the wafer 403, avoids damage caused by the direct application of pressure by the support column 40113 to the wafer 403, and ensures the integrity of the wafer 403.

[0076] In some embodiments of the utility model, the analog device 4021 is an analog coating, and the analog coating is a Teflon tape.

[0077] In some embodiments of the utility model, the height of the platform 40111 ranges from 0.9 mm to 1.1 mm.

[0078] Preferably, the height of the platform 40111 is 1 mm.

[0079] When the height of the platform 40111 is 1 mm, the distance of the wafer 403 placed on the upper prongs or the lower prongs can be simulated, and the accuracy of the detection result is improved.

[0080] In some other embodiments of the utility model, please refer to Figure 3 on the basis of Figure 6 The side cavity of the first cavity 501 and the side cavity of the second cavity 502 are connected or shared, forming an "S" shaped device, wherein the opening direction of the first cavity 501 is opposite to the opening direction of the second cavity 502.

[0081] In this embodiment, the first cavity 501 and the second cavity 502 are formed into an integrated model by pouring.

[0082] In this embodiment, the sensor debugging device further comprises a carrier 5011, the first end of the carrier 5011 is connected with the top inner wall surface of the first cavity 501, and the second end of the carrier 5011 is connected with the inner wall surface at the opening of the first cavity 501; an analog device 5021 is arranged on the top inner wall surface of the second cavity 502.

[0083] In a specific embodiment, the carrier 5011 comprises a platform 50111, the platform 50111 is arranged on both sides of the opening of the first cavity 501, and the platform 50111 is adapted to support the wafer 503 to be tested; a support column 50113, the first end of the support column 50113 is connected with the top inner wall surface of the first cavity 501, and the support column 50113 is adapted to fix the wafer 503 to be tested; a buffer pad 50112, the buffer pad 50112 is connected with the second end of the first cavity 501.

[0084] In some embodiments of the utility model, the support column 50113 comprises a screw or a spring, and the buffer pad 50112 comprises a sponge pad or a plastic pad.

[0085] In the above scheme, after the wafer 503 is placed on the platform 50111, the utility model further fixes the upper surface of the wafer 503 through the support column 50113, so that the wafer 503 is not displaced during the debugging and detection process, and the accuracy of the detection result is improved.

[0086] Further, the utility model still set up the buffer pad 50112 between the support column 50113 and the wafer 503, can expand the support column 50113 to the area of the wafer 503 exerted pressure in the process of fixing the wafer 503, avoid the support column 50113 directly to the wafer 503 exerted pressure and cause damage, guarantee the integrity of wafer 503.

[0087] In some embodiments of the utility model, the simulation device 5021 is a simulation coating, and the simulation coating is a Teflon tape.

[0088] In some embodiments of the utility model, the height of the platform 50111 ranges from 0.9 mm to 1.1 mm.

[0089] Preferably, the height of the platform 50111 is 1 mm.

[0090] When the height of the platform 50111 is 1 mm, the distance of the wafer 503 placed on the upper tongs or the lower tongs can be simulated, improving the accuracy of the detection result.

[0091] In the above scheme, the shape of the sensor debugging device includes "H" type, "E" type and "S" type, which realizes the diversity of the structure of the sensor debugging device while ensuring the debugging function of the sensor debugging device.

[0092] In summary, the utility model discloses a sensor debugging device for debugging the light flux threshold triggered by the sensor, and the sensor debugging device includes a first cavity and a second cavity. In the first cavity, the sensor can test the light flux of different types of wafers and detect the minimum threshold triggered by the sensor. In the second cavity, the simulation device can simulate the influence of the upper tongs on the light flux of the sensor, and then detect the minimum threshold of the light flux that triggers the sensor. Therefore, the sensor debugging device in the utility model detects the light flux threshold of the sensor independently of the machine table in the wafer sorting machine, avoids affecting the machine table during debugging, can shorten the debugging period and reduce the debugging frequency as much as possible, and improves the utilization rate of the machine table.

[0093] Although the utility model discloses as above, the utility model discloses not limited to this. Any person skilled in the art, without departing from the spirit and scope of the utility model, can make various changes and modifications, therefore the protection scope of the utility model should be limited by the range defined in the claims.

Claims

1. A sensor commissioning device, characterized in that, Comprising: a first cavity and a second cavity, the first cavity and the second cavity are connected as one; a carrier, a first end of the carrier is connected with a top inner wall surface of the first cavity, a second end of the carrier is connected with an inner wall surface at an opening of the first cavity; a simulation device, the simulation device is disposed on a top inner wall surface of the second cavity.

2. The sensor commissioning device of claim 1, wherein, The connection mode of the first cavity and the second cavity comprises: bolt connection, welding connection or extrusion connection, the height of the second cavity ranges from 9mm to 10mm.

3. The sensor commissioning device of claim 2, wherein, The top cavity of the first cavity and the top cavity of the second cavity are connected or shared, forming a "H" shaped device, wherein the opening direction of the first cavity is opposite to the opening direction of the second cavity.

4. The sensor commissioning device of claim 2, wherein, The side cavity of the first cavity and the side cavity of the second cavity are connected or shared, forming an "E" shaped device, wherein the opening direction of the first cavity is the same as the opening direction of the second cavity.

5. The sensor commissioning device of claim 2, wherein, The side cavity of the first cavity and the side cavity of the second cavity are connected or shared, forming an "S" shaped device, wherein the opening direction of the first cavity is opposite to the opening direction of the second cavity.

6. The sensor commissioning device of claim 1, wherein, The carrier comprises: a platform, the platform is disposed on both sides of the opening of the first cavity, and the platform is adapted to support a wafer to be measured; a support column, a first end of the support column is connected with a top inner wall surface of the first cavity, and the support column is adapted to fix a wafer to be measured; a buffer pad, the buffer pad is connected with a second end of the first cavity.

7. The sensor commissioning device of claim 6, wherein, The support column comprises a screw or a spring, and the buffer pad comprises a sponge pad or a plastic pad.

8. The sensor commissioning device of claim 6, wherein, The height of the platform ranges from 0.9mm to 1.1mm.

9. The sensor commissioning device of claim 1, wherein, The simulation device is a simulation coating, and the simulation coating is a Teflon tape.

10. The sensor commissioning device of claim 1, wherein, Further comprising: a visualization module, the visualization module is connected with a sensor, and the visualization module is adapted to display the change of luminous flux of the sensor.

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