Wafer cooling device

Abstract

The utility model discloses a wafer cooling device, which comprises a base and a bearing assembly, the base is provided with an accommodating cavity with an opening at one end, and the accommodating cavity is used for bearing a cooling medium. The bearing assembly is connected to the pedestal and seals the opening, thereby preventing the detection of the wafer from being interfered by the leakage of the cooling medium. A plurality of air holes extending in the first direction are formed in the side, away from the base, of the bearing assembly, and the air holes are configured to be capable of absorbing wafers in a vacuum mode. The bearing assembly is further provided with a first cavity and a second cavity which are arranged in a spaced mode, the second cavity is arranged outside the first cavity in a surrounding mode, part of the air holes are communicated with the first cavity, and part of the air holes are communicated with the second cavity. One end of the first interface is communicated with the first cavity, and the other end of the first interface is communicated with vacuum equipment. One end of the second interface is communicated with the second cavity, and the other end is communicated with vacuum equipment. The wafer cooling device can be used for fixing wafers of different sizes, so that the applicability of the wafer cooling device is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor, especially relates to a wafer cooling device. BACKGROUND

[0002] With the development of semiconductor chip industry, part of chips will produce heat in the process of testing, cause the surface temperature rise of the chip supporting table, this requires the surface temperature of the chip supporting table to be reduced in the temperature range that meets the test. In the related art, a passage is arranged below the chip supporting table to allow liquid or gas to enter to exchange heat and thus realize cooling, and then realize the cooling of the chip. However, in the process of chip detection, the chip is usually fixed by vacuum adsorption, but the vacuum chuck in the related art can only be applied to a chip of one size specification, and the applicability is low. SUMMARY

[0003] The main purpose of the utility model is to provide a wafer cooling device, which aims to improve the applicability of the wafer cooling device.

[0004] To achieve the above purpose, the utility model provides a wafer cooling device, which comprises:

[0005] A base has an accommodating cavity with one end open, and the accommodating cavity is used for carrying a cooling medium;

[0006] A receiving assembly is connected to the base and seals the opening, and the receiving assembly is provided with a plurality of air holes extending in a first direction on the side away from the base, each air hole is configured to be able to vacuum adsorb a wafer, and the first direction is parallel to the direction of the receiving assembly pointing to the base;

[0007] Among them, the receiving assembly further has a first cavity and a second cavity arranged at intervals, the second cavity is arranged outside the first cavity, part of the air holes are communicated with the first cavity, and part of the air holes are communicated with the second cavity; the receiving assembly comprises a first interface and a second interface, one end of the first interface and the second interface is communicated with a vacuum device, the other end of the first interface is further communicated with the first cavity, and the other end of the second interface is communicated with the second cavity.

[0008] In some embodiments, the receiving assembly includes an adapter and a receiving member, the adapter is located between the base and the receiving member, the adapter includes a first connecting member, a second connecting member and a third connecting member, the first connecting member is sleeved in the second connecting member, the second connecting member is sleeved in the third connecting member, the receiving member is provided with a first groove, a second groove and a third groove which are spaced from each other on a side of the receiving member facing the accommodating cavity, the first connecting member is located at the first groove and closes the first groove to define a first passage, the second connecting member is located at the second groove and closes the second groove to define a second passage, the third connecting member is located at the third groove and closes the third groove to define a third passage, the first passage and the second passage are communicated to form the first cavity, and the third passage is spaced from the second passage to form the second cavity.

[0009] In some embodiments, the receiving member has a first flow channel communicating with the first interface and a second flow channel communicating with the second interface, the first flow channel extends along a second direction which is perpendicular to the first direction, the first flow channel communicates with the first passage and the second passage, the second flow channel extends along the second direction, and the second flow channel communicates with the third passage.

[0010] In some embodiments, the first groove has a first groove bottom facing and spaced from the first connecting member, the second groove has a second groove bottom facing and spaced from the second connecting member, and the third groove has a third groove bottom facing and spaced from the third connecting member, the first groove bottom, the second groove bottom and the third groove bottom are flush with each other.

[0011] The receiving member has a bearing surface for bearing the wafer, the first flow channel is located between the bearing surface and the first groove bottom, the first flow channel has a first extension hole extending along the first direction and penetrating through the first groove bottom to communicate with the first passage, and the first flow channel has a second extension hole extending along the first direction and penetrating through the second groove bottom to communicate with the second passage.

[0012] In some embodiments, the second flow channel is located between the bearing surface and the third groove bottom, the second flow channel has a third extension hole extending along the first direction and penetrating through the third groove bottom to communicate with the third passage.

[0013] Alternatively,

[0014] The second flow channel extends along the second direction and penetrates through a side wall of the third groove to communicate with the third passage.

[0015] In some embodiments, the adapter has a plurality of recesses spaced around the circumference of the body portion, each of the recesses extending in a second direction perpendicular to the first direction, and the wafer cooling device further comprises a temperature probe configured to be inserted into the recesses to obtain the temperature of the adapter.

[0016] In some embodiments, the base is provided with a boss, the boss is located in the receiving cavity, at least part of the first connecting member is connected to the boss, at least part of the second connecting member is connected to the boss, and at least part of the third connecting member is connected to the boss.

[0017] In some embodiments, the base has a first surface at one end of the opening, the boss has a second surface facing the one end of the opening, and the first surface is flush with the second surface.

[0018] In some embodiments, at least part of the first surface is connected to the third connecting member.

[0019] and / or,

[0020] At least part of the first surface is connected to the side of the adapter facing away from the wafer.

[0021] In some embodiments, the base has a liquid inlet and a liquid outlet arranged adjacently, the liquid inlet and the liquid outlet are both in communication with the receiving cavity, and the liquid inlet and the liquid outlet are respectively located on two sides of the boss.

[0022] Compared with the prior art, the utility model has the advantages of:

[0023] In the technical scheme of the utility model, wafer cooling device includes base and receiving assembly, base has the accommodating cavity of one end opening, this accommodating cavity is used for bearing cooling medium. Receiving assembly is connected to the base and seals the opening, thereby avoiding the leakage of cooling medium to cause the detection of wafer to be interfered with. The side of receiving assembly away from the base is provided with a plurality of air holes extending along the first direction, each air hole is configured to be capable of vacuum adsorbing wafer, thereby improving the convenience of taking and placing in the wafer detection process. Among them, receiving assembly also has the first cavity and the second cavity arranged at intervals, the second cavity is arranged around the first cavity, part of the air holes are communicated with the first cavity, and part of the air holes are communicated with the second cavity. Receiving assembly also includes first interface and second interface, one end of first interface is communicated with first cavity, and the other end is communicated with vacuum equipment. One end of second interface is communicated with second cavity, and the other end is communicated with vacuum equipment. Then, the air holes corresponding to the first cavity can be used to adsorb the wafer of the first size, and the air holes corresponding to the second cavity and the air holes corresponding to the first cavity can be used to adsorb the wafer of the second size, wherein the size of the wafer of the first size is smaller than the size of the wafer of the second size. In other words, the wafer cooling device of the present application can be used to fix wafers of different sizes, thereby improving its applicability.

[0024] In the related art, the same vacuum interface is used to vacuumize the wafer receiving table, so the wafer receiving table can only place one size of chip. Even if a chip with a size smaller than the arrangement range of the air holes on the wafer receiving table is placed, the air holes outside the outline of the chip will cause the vacuum adsorption of the chip to fail during chip detection. Moreover, even if the chip can be adsorbed on the wafer receiving table, the airflow generated by the air holes outside the outline of the chip will also interfere with the detection of the chip, causing large detection data errors or even distortion. Placing a chip with a size larger than the arrangement range of the air holes on the wafer receiving table will easily cause poor adsorption effect of the chip, and even cause uneven local stress distribution of the chip. In addition, the chip outside the edge of the wafer receiving table is easy to be damaged by collision during detection. Compared with the related art, the wafer cooling device provided by the present application can improve its applicability while ensuring good adsorption effect of the wafer, and reduce cost. BRIEF DESCRIPTION OF DRAWINGS

[0025] In order to more clearly illustrate the technical scheme in the embodiments of the utility model or the prior art, the drawings needed to be used in the following embodiment or prior art description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the utility model, and those skilled in the art can also obtain other drawings from the structures shown in these drawings without creating any creative labor.

[0026] Figure 1 It is the structural schematic drawing of the first perspective of wafer cooling device in an embodiment of the utility model;

[0027] Figure 2 It is the structure explosion schematic view of the wafer cooling device in one embodiment of the utility model;

[0028] Figure 3 It is the structure schematic view of the second visual angle of the wafer cooling device in one embodiment of the utility model;

[0029] Figure 4 It is the sectional view of the wafer cooling device in one embodiment of the utility model along Figure 3 Direction A-A is cut;

[0030] Figure 5 It is the structure schematic view of the third visual angle of the wafer cooling device in one embodiment of the utility model;

[0031] Figure 6 It is the sectional view of the wafer cooling device in one embodiment of the utility model along Figure 5 Direction B-B is cut;

[0032] Figure 7 It is the structure schematic view of the receiving member in one embodiment of the utility model;

[0033] Figure 8 It is the structure schematic view of the receiving assembly in one embodiment of the utility model; wherein, the receiving assembly includes receiving member and adapter;

[0034] Figure 9 It is the structure schematic view of the base in one embodiment of the utility model.

[0035] Explanation of figure mark:

[0036] Wafer cooling device 100;

[0037] Base 110;

[0038] Cavity 111; Opening 112; Boss 113; First surface 114; Second surface 115; Liquid inlet 116; Liquid outlet 117;

[0039] Receiving assembly 120;

[0040] Air hole 121; First cavity 122; Second cavity 123; First interface 124; Second interface 125;

[0041] Adapter 126; First connecting piece 1261; Second connecting piece 1262; Third connecting piece 1263;

[0042] Receiving member 127; First recess 1271; Second recess 1272; Third recess 1273; First flow channel 1274; Second flow channel 1275; First extension hole 1276; Second extension hole 1277; Third extension hole 1278;

[0043] first channel 130; second channel 140; third channel 150; counterbore 160;

[0044] first direction X; second direction Y.

[0045] The purposes, functional features and advantages of the utility model will be further described with reference to the drawings in combination with embodiments. DETAILED DESCRIPTION

[0046] The technical solutions in the embodiments of the utility model will be clearly and completely described in combination with the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the utility model.

[0047] In the related art, the same vacuum interface is used to perform vacuumization on the chip supporting table, so that the chip supporting table can only place one size of chip. Even if a chip with a size smaller than the arrangement range of the air holes on the chip supporting table is placed, the air holes outside the contour of the chip will cause the vacuum adsorption of the chip to fail during the chip detection process. Moreover, even if the chip can be adsorbed on the chip supporting table, the airflow generated by the air holes outside the contour of the chip will also interfere with the detection of the chip, causing large detection data errors or even distortion. In addition, placing a chip with a size larger than the arrangement range of the air holes on the chip supporting table will easily cause poor adsorption of the chip, and even cause uneven local stress distribution of the chip. Furthermore, the chip exceeding the edge of the chip supporting table is easily damaged by collision during the detection process.

[0048] In view of this, please refer to Figures 1 to 9The utility model provides a kind of wafer cooling device 100, including pedestal 110 and receiving assembly 120.Wherein, pedestal 110 has the accommodating cavity 111 of one end opening 112, accommodating cavity 111 is used to carry cooling medium.It needs to be explained, cooling medium includes but is not limited to cooling water, coolant and cooling airflow etc., for easy description, following with cooling medium as coolant is exampled to explain.Receiving assembly 120 is connected to pedestal 110 and seals opening 112, to ensure that cooling medium cannot leak, improve the security in wafer detection process and the accuracy of detection data.It needs to be explained, the connecting mode of receiving assembly 120 and pedestal 110 includes but is not limited to welding.In some embodiments, receiving assembly 120 and pedestal 110 are connected in the mode for brazing.Receiving assembly 120 is provided with multiple air holes 121 extending along first direction X on the side away from pedestal 110, each air hole 121 is configured to be able to vacuum adsorb wafer, to ensure the stability of wafer in detection process.First direction X is parallel to the direction by receiving assembly 120 pointing to pedestal 110, i.e.

[0049] Wherein, receiving assembly 120 also has first cavity 122 and second cavity 123 being arranged at intervals, second cavity 123 is around first cavity 122, part air hole 121 is communicated with first cavity 122, part air hole 121 is communicated with second cavity 123.Receiving assembly 120 includes first interface 124 and second interface 125, one end of first interface 124 and second interface 125 is communicated vacuum equipment, the other end of first interface 124 is also communicated first cavity 122, the other end of second interface 125 is communicated second cavity 123.So the different regions for carrying wafer of receiving assembly 120 can be independently controlled.When vacuum equipment starts, it will suck air through first interface 124 and / or second interface 125, form negative pressure in first cavity 122 and second cavity 123, then wafer is adsorbed and fixed through air hole 121.

[0050] Specifically, by controlling the vacuum device to extract air from the first interface 124, the receiving assembly 120 can be used to carry and fix the first wafer. At this time, there is a negative pressure in the first cavity 122, and the air holes 121 connected to the first cavity 122 can adsorb the wafer, while the air holes 121 connected to the second cavity 123 do not work, thereby avoiding the interference caused by the air flow of the air holes 121 connected to the second cavity 123 during the wafer detection process. When it is necessary to detect the second wafer (the size is larger than that of the first wafer), the vacuum device simultaneously extracts air from the first interface 124 and the second interface 125, and the first cavity 122 and the second cavity 123 are both in a negative pressure state. The air holes 121 corresponding to the first cavity 122 and the air holes 121 corresponding to the second cavity 123 all adsorb the second wafer, thereby ensuring the stability of the second wafer during the detection process. The combination of the first interface 124 and the first cavity 122 and the combination of the second interface 125 and the second cavity 123 effectively improve the applicability of the wafer cooling device 100 to wafers of different sizes. It should be noted that the receiving assembly 120 can also have a third cavity, a fourth cavity, etc., and the receiving assembly 120 is provided with a third interface connected to the third cavity, a fourth interface connected to the fourth cavity, etc., to further improve the applicability of the wafer cooling device 100.

[0051] Please refer to Figure 2The receiving assembly 120 includes an adapter 126 and a receiving member 127, and the adapter 126 is located between the base 110 and the receiving member 127. The adapter 126 can reduce the manufacturing difficulty of the first cavity 122 and the second cavity 123 while sealing the accommodating cavity 111 to avoid leakage of the cooling medium. The adapter 126 includes a first connecting member 1261, a second connecting member 1262, and a third connecting member 1263. The first connecting member 1261 is sleeved in the second connecting member 1262, and the second connecting member 1262 is sleeved in the third connecting member 1263. In some embodiments, the first connecting member 1261, the second connecting member 1262, and the third connecting member 1263 are sleeved with each other and connected by brazing. The receiving member 127 is provided with a first groove 1271, a second groove 1272, and a third groove 1273 which are spaced from each other on the side facing the accommodating cavity 111. The first connecting member 1261 is located at the first groove 1271 and closes the first groove 1271 to define a first passage 130. The second connecting member 1262 is located at the second groove 1272 and closes the second groove 1272 to define a second passage 140. The third connecting member 1263 is located at the third groove 1273 and closes the third groove 1273 to define a third passage 150. The first passage 130 and the second passage 140 are communicated to form the first cavity 122, and the third passage 150 is spaced from the second passage 140 to form the second cavity 123. In some embodiments, the first connecting member 1261, the second connecting member 1262, and the third connecting member 1263 are connected to the receiving member 127 by brazing.

[0052] This multi-layer nested design not only enhances the stability of the structure, but also makes the isolation between the first cavity 122 and the second cavity 123 more effective, avoiding interference between different cavities. At the same time, since each connecting member is tightly fitted with the corresponding groove, it also helps to improve the effect of vacuum adsorption and ensure the stability of the wafer during the entire processing process. In addition, this design simplifies the manufacturing process and reduces costs, because each component can be produced standardized and then assembled on site, reducing the time and difficulty of on-site debugging.

[0053] In some embodiments, to adapt to different processing needs, the material of the adapter 126 can be selected to have excellent thermal conductivity, including but not limited to aluminum, copper, and other materials, so as to more effectively conduct the cooling capacity brought by the cooling medium. For large wafers or applications requiring higher precision, more cavities can be added or the layout of the existing cavities can be changed to meet specific adsorption and cooling requirements.

[0054] Please refer to Figure 1 and Figure 6In some embodiments, the receiving member 127 has a first flow channel 1274 communicating with the first interface 124, the first flow channel 1274 extending along a second direction Y perpendicular to the first direction X, the first flow channel 1274 communicating with the first passage 130 and the second passage 140, and a second flow channel 1275 communicating with the second interface 125, the second flow channel 1275 extending along the second direction Y and communicating with the third passage 150, so as to realize the vacuum suction function of the wafer cooling device 100 on the wafer.

[0055] Specifically, such a structural design can ensure that the wafer is stably adsorbed on the receiving assembly 120, and by separating the first cavity 122 and the second cavity 123, the vacuum degree of different areas can be better controlled, the applicability of the wafer cooling device 100 to wafers of different sizes is improved, the cooling efficiency is improved, and the influence of pressure changes in a single cavity on the wafer is prevented.

[0056] In some embodiments, the design of the first flow channel 1274 and the second flow channel 1275 can be further optimized. For example, an adjusting valve can be arranged in the first flow channel 1274 for more finely adjusting the vacuum degree of the first cavity 122; or a temperature sensor can be introduced into the second flow channel 1275 to monitor the heat transferred from the second cavity 123, so as to timely adjust the flow or temperature of the cooling medium, thereby realizing more accurate temperature control.

[0057] Please refer to Figure 2 and Figure 7 In some embodiments, the first recess 1271 has a first groove bottom facing the first connecting member 1261 and spaced from the first connecting member 1261, the second recess 1272 has a second groove bottom facing the second connecting member 1262 and spaced from the second connecting member 1262, and the third recess 1273 has a third groove bottom facing the third connecting member 1263 and spaced from the third connecting member 1263, the first groove bottom, the second groove bottom and the third groove bottom being flush with each other. This ensures that the first connecting member 1261, the second connecting member 1262 and the third connecting member 1263 can be tightly fitted with the corresponding recesses, and the first passage 130, the second passage 140 and the third passage 150 are closed to form the complete first cavity 122 and the second cavity 123.

[0058] The receiving member 127 has a bearing surface for bearing the wafer, and the first flow channel 1274 is located between the bearing surface and the first groove bottom. It should be noted that the first flow channel 1274 is below the top surface of the receiving member 127 (i.e., the surface bearing the wafer) but above the first groove bottom, and both can be considered as "the first flow channel 1274 is located between the bearing surface and the first groove bottom". The first flow channel 1274 has a first extension hole 1276 extending along the first direction X and penetrating the first groove bottom to communicate with the first passage 130, and a second extension hole 1277 extending along the first direction X and penetrating the second groove bottom to communicate with the second passage 140. This design allows the gas to flow inside the first flow channel 1274 and enter the corresponding passage through the extension hole, and then reach the first cavity 122. Such a design allows the first flow channel 1274 to effectively transmit the negative pressure generated by the vacuum device to each part in the first cavity 122.

[0059] In addition, since the first flow channel 1274 is located below the bearing surface but close to the groove bottom, it will not affect the air extraction of the air hole 121. It should be noted that the air hole 121 communicates with the first passage 130, the first passage 130 communicates with the first flow channel 1274 through the first extension hole 1276, and the first flow channel 1274 communicates with the vacuum device through the first interface 124. Therefore, the air hole 121 can be ensured to be vacuumized while the additional pipeline is saved, and the material cost is reduced. In addition, it can also ensure the effective circulation of the cooling medium, promote the heat exchange process, and at the same time maintain good mechanical properties, so that the wafer can be processed in a stable environment.

[0060] Please refer to Figure 4 and Figure 6 In some embodiments, the second flow channel 1275 is located between the bearing surface of the receiving member 127 and the third groove bottom. It should be noted that the second flow channel 1275 is below the top surface of the receiving member 127 (i.e., the surface bearing the wafer) but above the third groove bottom, and both can be considered as "the second flow channel 1275 is located between the bearing surface and the third groove bottom". The second flow channel 1275 is provided with a third extension hole 1278 extending along the first direction X (i.e., perpendicular to the bearing surface) and penetrating the third groove bottom to communicate with the third passage 150. Such a layout ensures that the second flow channel 1275 can effectively transmit the negative pressure generated by the vacuum device to the air hole 121 in the second cavity 123, thereby vacuum-adsorbing the wafer in the specific area.

[0061] In some embodiments, the second flow channel 1275 extends along the second direction Y (parallel to the bearing surface and perpendicular to the first direction X) and directly communicates with the third channel 150 through the side wall of the third groove 1273. This makes the flow path design of the negative pressure simpler and easier to manufacture, allowing more flexible arrangement of internal components while ensuring effective negative pressure conduction.

[0062] In this way, the second flow channel 1275 can provide a stable vacuum environment for the second cavity 123, supporting the air holes 121 connected to the second cavity 123 to complete the precise adsorption task of the wafer. Such a design not only enhances the functionality of the device, but also improves the flexibility and adaptability of the operation, allowing the selection of the most suitable flow channel configuration scheme according to the actual wafer size requirements. In order to further optimize the vacuum adsorption performance, micro-texture treatment can be added to the inner surface of the third groove 1273 or the outer surface of the third connecting piece 1263 to increase the friction and improve the sealing effect.

[0063] Please refer to Figure 6 In some embodiments, the receiving member 127 is provided with a plurality of counterbores 160 spaced around the body portion. For example, the number of counterbores 160 can be 2, 3, 4, 8, etc. In some embodiments, the counterbores 160 are equally spaced. These counterbores 160 extend along the second direction Y (perpendicular to the first direction X). In some embodiments, the extension depth of adjacent counterbores 160 is different in order to detect the temperature of different cavities. For ease of description, define the counterbores 160 used for inserting temperature control probes to detect the temperature of the first cavity 122 as first holes, and the counterbores 160 used for inserting temperature control probes to detect the temperature of the second cavity 123 as second holes, the extension depth of the first holes is greater than that of the second holes. The wafer cooling device 100 further comprises a temperature control probe configured to be inserted into the counterbores 160 for real-time monitoring of the temperature change of the receiving member 127. To help detect and control the working state of the cooling device, ensure the cooling efficiency and protect the wafer from being over-cooled or over-heated, thereby maintaining the temperature stability during the wafer processing process.

[0064] By embedding the temperature control probe on the receiving member 127, more accurate temperature data can be obtained, and fine control of the cooling process can be achieved. In addition, since the counterbores 160 are distributed at different positions of the receiving member 127, temperature information can be obtained from multiple points, which helps to understand the temperature distribution of the entire receiving member 127, which is beneficial for the simultaneous processing of large wafers or multiple wafers.

[0065] In some embodiments, an intelligent temperature control system is further introduced. For example, combined with the data feedback of the temperature control probe, the temperature or flow of the cooling medium is adjusted in real time using an automatic control system to ensure the best cooling effect.

[0066] Referring to Figure 9 In some embodiments, the base 110 is provided with a boss 113 located within the receiving cavity 111. At least part of the first, second and third connectors 1261, 1262 and 1263 of the adapter 126 are connected to the boss 113 respectively. This design allows the connectors to be firmly fixed on the base 110 and ensures the effective sealing of the first, second and third channels 130, 140 and 150 through the close fit between the adapter 127.

[0067] Specifically, the boss 113 provides additional support points for the first, second and third connectors 1261, 1262 and 1263, enhancing the mechanical strength of the entire adapter assembly 120. In addition, the boss 113 helps to reduce the degree of deformation of the adapter assembly 120 after long-term use (the adapter assembly 120 may be deformed under the combined action of heat generated during wafer detection and cooling medium, and the boss 113 can provide a force to resist the deformation trend of the adapter assembly 120, thereby reducing its degree of deformation), prolonging the service life. At the same time, since the boss 113 is located within the receiving cavity 111, it can also serve as a support to prevent the cooling medium from exerting excessive pressure on the adapter assembly 120. Furthermore, such an arrangement helps to simplify the installation process, as all the connectors can be directly installed to a common reference point, i.e. the boss 113, thereby improving the assembly efficiency.

[0068] When the vacuum equipment is started, the cooling medium enters the receiving cavity 111 and flows around the boss 113, while the first and second interfaces 124 and 125 transmit the vacuum pressure to the first and second cavities 122 and 123. The boss 113 not only improves the overall stability of the adapter assembly 120, but also improves the flow path of the cooling medium, reducing the possibility of dead corners or turbulent flow, which is conducive to improving the cooling efficiency. In addition, by fixing the connectors through the boss 113, effective support is provided, reducing the failure rate during long-term use. In some embodiments, the connection between the boss 113 and the connectors can be by brazing.

[0069] Referring to Figure 9 The base 110 has a first surface 114 at one end of the opening 112, and the boss 113 has a second surface 115 at one end of the opening 112, with the first surface 114 flush with the second surface 115. That is, the first surface 114 of the base 110 and the second surface 115 of the boss 113 are at the same level, forming a flat and continuous contact interface. This reduces the possibility of gaps or steps between the two, avoiding leakage problems caused by uneven surfaces and ensuring good sealing between the adapter assembly 120 and the base 110.

[0070] At least part of the first surface 114 is connected to the third connecting member 1263, and / or at least part of the first surface 114 is connected to the side of the receiving member 127 away from the wafer.

[0071] Referring to Figure 4 In some embodiments, at least part of the first surface 114 is connected to the third connecting member 1263, and at the same time, part of the first surface 114 is also connected to the side of the receiving member 127 away from the wafer, which can effectively disperse the force and reduce local stress concentration, thereby improving the mechanical strength of the system. At the same time, since the first surface 114 and the second surface 115 are flush, this not only helps to simplify the assembly process, but also ensures good sealing effect and prevents leakage of the cooling medium. This double connection method further strengthens the integrity between the receiving assembly 120 and the base 110, making them tightly combined and less likely to displace. In addition, since the first surface 114 and the second surface 115 are flush, it is also conducive to accurate processing during manufacturing to ensure the matching degree between the components.

[0072] When the cooling device is working, the cooling medium will circulate in the containing cavity 111, and the design of the flush first surface 114 and the second surface 115 can effectively disperse the pressure exerted by the cooling medium and reduce local stress concentration. At the same time, since there is no obvious height difference, it is also convenient for cleaning and maintenance to prevent the risk of pollution caused by the accumulation of residues.

[0073] In some embodiments, a layer of corrosion-resistant coating can be applied on the first surface 114 and the second surface 115 to prolong the service life, especially in the case of using special cooling medium.

[0074] In some embodiments, in order to enhance the connection strength, a metal insert can be embedded between the first surface 114 and the second surface 115, and welded or bonded to ensure that the connection remains good even under extreme conditions.

[0075] Referring to Figure 9 The base 110 has an inlet 116 and an outlet 117 arranged adjacent to each other, both of which communicate with the containing cavity 111, and the inlet 116 and the outlet 117 are located on both sides of the boss 113. Such an arrangement allows the cooling medium to enter the containing cavity 111 from one side and be discharged from the other side after sufficient heat exchange, forming a complete circulation path. Specifically, by placing the inlet 116 and the outlet 117 on both sides of the boss 113, the space can be effectively utilized, the occupied area can be reduced, and the pipeline connection and maintenance operation can be facilitated. In addition, this layout is also conducive to keeping the flow direction of the cooling medium consistent, reducing the possibility of turbulence, and improving the heat exchange efficiency.

[0076] When the cooling device is running, the cooling medium enters the containing cavity 111 through the liquid inlet 116, flows around the boss 113 and exchanges heat with it, and then is discharged through the liquid outlet 117. Since the liquid inlet 116 and the liquid outlet 117 are located on the two sides of the boss 113 respectively, the cooling medium covers a larger surface area during the whole process, increasing the chances of contact with the base 110 and thus improving the cooling effect.

[0077] The liquid inlet 116 and the liquid outlet 117 are respectively arranged on the opposite sides of the boss 113, and the boss 113 can also guide the flow of the cooling medium, so that the cooling medium can flow fully in the containing cavity 111 before being discharged through the liquid outlet 117, optimizing the flow path of the cooling medium, reducing energy loss, and improving the energy efficiency ratio of the overall system. Ensuring temperature control during wafer processing helps to improve product quality and production efficiency.

[0078] In some embodiments, flow regulating valves can be provided at the liquid inlet 116 and the liquid outlet 117, allowing the operator to adjust the flow rate of the cooling medium according to actual needs, achieving more precise temperature control. A filter can also be installed near the liquid inlet 116 to remove impurities in the cooling medium and protect internal components from contamination. In addition, to monitor the state of the cooling medium, temperature and pressure sensors can be provided between the liquid inlet 116 and the liquid outlet 117 to provide real-time feedback data to the control system, so that parameters can be adjusted in time to ensure optimal cooling effect.

[0079] In some embodiments, the circumferential side of the receiving member 127 is also provided with a plurality of first mounting holes, and the bottom of the base 110 is provided with a plurality of second mounting holes, so that the operator can install the wafer cooling device 100 on other equipment through the first mounting holes and the second mounting holes to improve the integration of the system.

[0080] It should be noted that if the present application involves directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement condition, etc. between the components in a certain posture, and if the certain posture changes, the directional indications will also change accordingly.

[0081] In addition, if the description of "first", "second" and the like is involved in the embodiments of the utility model, the description of "first", "second" and the like is only for the purpose of description, and cannot be understood as indicating or implying the relative importance of the same or implicitly indicating the number of the indicated technical features. Therefore, the features limited by "first", "second" can be explicitly or implicitly included at least one of the features. In addition, if "and / or", "and / or" or "and / or" appears throughout the text, it means that the three parallel schemes include "A and / or B", including A scheme, or B scheme, or A and B scheme. In addition, the technical solutions of each embodiment can be combined with each other, but it must be based on the realization of ordinary skilled in the art, when the combination of technical solutions appears contradictory or cannot be realized, it should be considered that the combination of technical solutions does not exist, nor is it within the scope of the utility model claimed by the utility model.

[0082] The above is only the preferred embodiment of the utility model, and does not limit the patent range of the utility model, and any equivalent structural transformation made by the utility model specification and the attached drawings, or direct / indirect application in other related technical fields under the utility model concept of the utility model is included in the patent protection range of the utility model.

Claims

1. A wafer cooling device, characterized by, The application relates to a wafer cooling device, comprising: a base having a receiving cavity with an opening at one end, the receiving cavity being used for carrying a cooling medium; a receiving assembly connected to the base and sealing the opening, the receiving assembly being provided with a plurality of air holes extending in a first direction on a side away from the base, each of the air holes being configured to be capable of vacuum adsorbing a wafer, the first direction being parallel to a direction in which the receiving assembly points to the base; wherein the receiving assembly further has a first cavity and a second cavity arranged at intervals, the second cavity being arranged around the first cavity, part of the air holes being communicated with the first cavity, and part of the air holes being communicated with the second cavity; the receiving assembly comprising a first interface and a second interface, one end of the first interface and one end of the second interface being communicated with a vacuum device, the other end of the first interface being further communicated with the first cavity, and the other end of the second interface being communicated with the second cavity.

2. The wafer cooling device according to claim 1, wherein the receiving assembly comprises an adapter and a receiving piece, the adapter being located between the base and the receiving piece, the adapter comprising a first connecting piece, a second connecting piece and a third connecting piece, the first connecting piece being sleeved in the second connecting piece, the second connecting piece being sleeved in the third connecting piece, a side of the receiving piece facing the receiving cavity being provided with a first groove, a second groove and a third groove at intervals, the first connecting piece being located at the first groove and closing the first groove to define a first channel, the second connecting piece being located at the second groove and closing the second groove to define a second channel, the third connecting piece being located at the third groove and closing the third groove to define a third channel, the first channel and the second channel being communicated to form the first cavity, and the third channel being spaced from the second channel to form the second cavity.

3. The wafer cooling device according to claim 2, wherein the receiving piece has a first flow channel communicated with the first interface and a second flow channel communicated with the second interface, the first flow channel extending in a second direction, the second direction being perpendicular to the first direction, the first flow channel being communicated with the first channel and the second channel, the second flow channel extending in the second direction, and the second flow channel being communicated with the third channel.

4. The wafer cooling device according to claim 3, wherein the first groove has a first groove bottom facing the first connecting piece and spaced from the first connecting piece, the second groove has a second groove bottom facing the second connecting piece and spaced from the second connecting piece, and the third groove has a third groove bottom facing the third connecting piece and spaced from the third connecting piece, the first groove bottom, the second groove bottom and the third groove bottom being flush with each other. The receiving member has a bearing surface for bearing the wafer, the first flow channel is located between the bearing surface and the first groove bottom, the first flow channel has a first extension hole and a second extension hole, the first extension hole extends along the first direction and penetrates through the first groove bottom to communicate with the first passage, and the second extension hole extends along the first direction and penetrates through the second groove bottom to communicate with the second passage.

5. The wafer cooling device of claim 4, wherein: the second flow channel is located between the bearing surface and the third groove bottom, the second flow channel has a third extension hole, the third extension hole extends along the first direction and penetrates through the third groove bottom to communicate with the third passage; or the second flow channel extends along the second direction and penetrates through the side wall of the third groove to communicate with the third passage.

6. The wafer cooling device of claim 2, wherein: the receiving member has a plurality of counterbores arranged at intervals around the peripheral side of the body portion, each of the counterbores extends along a second direction, the second direction is perpendicular to the first direction, and the wafer cooling device further comprises a temperature control probe configured to be inserted into the counterbores to obtain the temperature of the receiving member.

7. The wafer cooling device of claim 2, wherein: the base is provided with a boss, the boss is located in the accommodation cavity, at least part of the first connecting member is connected to the boss, at least part of the second connecting member is connected to the boss, and at least part of the third connecting member is connected to the boss.

8. The wafer cooling device of claim 7, wherein: the base has a first surface located at one end of the opening, the boss has a second surface facing one end of the opening, and the first surface is flush with the second surface.

9. The wafer cooling device of claim 8, wherein: at least part of the first surface is connected to the third connecting member; and / or at least part of the first surface is connected to the side of the receiving member away from the wafer.

10. The wafer cooling device of claim 7, wherein: the base has an inlet and an outlet arranged adjacent to each other, the inlet and the outlet both communicate with the accommodation cavity, and the inlet and the outlet are respectively located on two sides of the boss. ​ ​

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