Multi-purpose one-out-of-multiple bonding tool

Abstract

The utility model discloses a multi-purpose bonding tool capable of producing multiple products at one time. The device comprises a carrying disc and a first adsorption base, the carrying disc is detachably arranged on the first adsorption base in a covering mode, a plurality of containing grooves used for bearing substrates are distributed in the carrying disc, a plurality of first air exhaust holes are distributed in the containing grooves, and the first adsorption base is provided with at least one first vacuum groove. A vacuum pump is assembled at one end of the first vacuum groove, and the plurality of first air exhaust holes are communicated with the first vacuum groove; the device further comprises a second adsorption base and a second adsorption plate used for adsorbing a machine adjusting sample piece, the second adsorption plate detachably covers the second adsorption base, a plurality of second air exhaust holes are distributed in the second adsorption plate, a second vacuum groove is formed in the second adsorption base, a vacuum pump is assembled at one end of the second vacuum groove, and a second vacuum pump is assembled at the other end of the second vacuum groove. And the plurality of second air exhaust holes are communicated with the second vacuum groove.

Description

TECHNICAL FIELD

[0001] The utility model relates to power semiconductor lead bonding technical field especially relates to a multipurpose one -out -of -many bonding tool. BACKGROUND

[0002] Lead bonding is a common and important manufacturing process for power semiconductors. Lead bonding is a process that uses metal wires such as gold, aluminum or copper wires to make a metallurgical bond between the electrode of a semiconductor chip and the corresponding solder point on the lead frame, or to connect the external packaging structure or other components, so as to realize the electrical connection and mechanical fixation of the circuit.

[0003] The current bonding tool operation steps are: before lead bonding, the substrate is placed in the bonding carrier disc, and the lead bonding process needs to be debugged, and the wire cutting action is performed, that is, the metal wire (such as gold wire) is pulled out from the spool and cut off by the cutter for subsequent bonding process, and the machine sample needs to be stuck on the periphery of the bonding carrier disc with double-sided tape, and the product is taken out after bonding and put into a new product.

[0004] The current bonding tool in the bonding carrier disc usually has only one, and only one product can be bonded each time. During the bonding process, the product needs to be frequently replaced, and after the bonding of a product is completed, the product must be taken out and a new product is put in. This process takes a certain amount of time and labor, especially in a large-scale production or a highly automated production line environment, this frequent replacement of products will significantly reduce the production efficiency and increase the production cost. Moreover, the machine sample is stuck on the periphery of the bonding carrier disc with double-sided tape, when the adhesion of the double-sided tape is not enough to withstand the vibration or tension generated by the wire cutting action, the machine sample may be loose or displaced, thereby affecting the stability of the machine, and the adhesion of the double-sided tape may be affected by environmental factors such as temperature and humidity, in a high temperature or high humidity environment, the adhesion of the double-sided tape may be reduced, in addition, the double-sided tape may also be affected by dust, oil stains and other pollutants, resulting in a decrease in adhesion, thereby increasing the risk of loosening of the machine sample. UTILITY MODEL CONTENT

[0005] In view of the problems existing in the prior art, the utility model provides a multipurpose one-out-of-many bonding tool, which can effectively solve the problems existing in the prior art.

[0006] The technical scheme of the utility model is:

[0007] According to one aspect of the utility model, including: the carrier disc and first adsorption base, the carrier disc is detachable and covers first adsorption base, the carrier disc distribution has a plurality of first suction hole for placing groove of carrying substrate in a plurality of placing groove, a plurality of first suction hole and first vacuum groove are communicated,

[0008] Still include second adsorption base and second adsorption plate for adsorbing adjustment machine sample, the second adsorption plate is detachable and covers second adsorption base, the second adsorption plate distribution has a plurality of second suction hole, second adsorption base is provided with second vacuum groove, one end of second vacuum groove is equipped with vacuum pump, a plurality of second suction hole and second vacuum groove are communicated.

[0009] Further, the carrier disc includes a first adsorption plate and a frame, the first adsorption plate is detachably fixed to the first adsorption base, the frame is covered on the first adsorption plate, a plurality of support plates for carrying substrates are spaced apart on the upper end surface of the first adsorption plate, and a plurality of first suction holes are arranged in the plurality of support plates.

[0010] The frame is provided with a plurality of hollow parts for exposing a plurality of support plates, and each hollow part corresponds to one support plate; the hollow part and the support plate form a placing groove.

[0011] Further, the first adsorption plate is provided with a plurality of positioning columns extending towards the frame, the frame is correspondingly provided with a plurality of positioning notches, and the plurality of positioning columns are respectively arranged in the plurality of positioning notches.

[0012] Further, the periphery of the hollow part is provided with a support member for supporting the substrate extending towards the support plate, and the upper end surface of the support member is flush with the upper end surface of the support plate.

[0013] Further, the first vacuum groove is provided with a first air hole, the second vacuum groove is provided with a second air hole, the first air hole and the second air hole are respectively provided with an air pipe, and the two air pipes are communicated with the air pump.

[0014] Further, the air pipe is a PU pipe.

[0015] Further, it further includes a base and a tangent tool, the tangent tool is fixed to one end of the base, the second adsorption base is fixed to the upper end of the tangent tool, the first adsorption base is fixed to the upper end of the base, the base is provided with a mounting hole for mounting to the bonding machine workbench, and the base is bolted to the bonding machine workbench through the mounting hole.

[0016] Compared with the prior art, the utility model has the beneficial effects that:

[0017] The present scheme sets several placement slots for carrying substrates, and multiple placement slots allow multiple substrates to be placed simultaneously, so that the bonding operation of multiple products can be completed in one cycle, reducing the time and manpower required for product replacement, especially in large-scale production or highly automated production environments, this design can significantly improve production efficiency, workers can prepare the product of the next placement slot while the product of one placement slot is being bonded, thereby optimizing the production process and reducing waiting time, this parallel processing method helps to maintain the continuity and stability of the production line, and improving production efficiency means that more products can be produced per unit time; The true gas adsorption fixes the substrate and the machine sample by generating negative pressure, which is more firm and stable than double-sided tape, and even under the vibration or tension generated by the tangent action, the true gas adsorption can maintain the stable position of the substrate and the machine sample, thereby improving the stability of the machine. BRIEF DESCRIPTION OF DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, a brief introduction will be given below to the drawings needed to be used in the embodiments or prior art description. Obviously, the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained from these drawings without creative labor.

[0019] Figure 1 It is a schematic diagram of the three-dimensional structure of the present application;

[0020] Figure 2 It is a schematic diagram of the explosion structure of the present application;

[0021] Figure 3 It is a schematic diagram of the three-dimensional structure of the first adsorption plate in the present application;

[0022] Figure 4 It is a schematic diagram of the three-dimensional structure of the frame in the present application;

[0023] Figure 5 It is a schematic diagram of the three-dimensional structure of the second adsorption plate in the present application;

[0024] Figure 6 It is a schematic diagram of the three-dimensional structure of the present application from the bottom up perspective Figure 1 ;

[0025] Figure 7 It is a schematic diagram of the three-dimensional structure of the present application from the bottom up perspective Figure 2 ;

[0026] In the diagram: Base-1, Cutting tool-11, Mounting hole-12, First adsorption base-2, Positioning post-20, First vacuum groove-21, First vent hole-22, First fixing hole-23, Carrier plate-3, First adsorption plate-31, Support plate-311, First air extraction hole-312, Third fixing hole-313, Frame-32, Hollow part-321, Support member-322, Positioning notch-323, Placement groove-33, Second adsorption base-4, Second vacuum groove-41, Second vent hole-42, Second fixing hole-43, Second adsorption plate-5, Second air extraction hole-51, Fourth fixing hole-52. Detailed Implementation

[0027] The present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be particularly noted that the following embodiments are only for illustrating the present invention and do not limit the scope of the present invention. Similarly, the following embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present invention.

[0028] like Figures 1 to 7 As shown, this solution provides a multi-purpose, one-output, multi-bonding tooling.

[0029] Please see Figures 1 to 4 The system includes a carrier disk 3 and a first adsorption base 2. The carrier disk 3 is detachably mounted on the first adsorption base 2. The carrier disk 3 has several placement grooves 33 for supporting a substrate (not shown). Several first suction holes 312 are distributed in the placement grooves 33. The first adsorption base 2 is provided with at least one first vacuum groove 21. A vacuum pump (not shown) is installed at one end of the first vacuum groove 21. The vacuum pump is a direct application of existing technology, and its working principle will not be described in detail here. The several first suction holes 312 are connected to the first vacuum groove 21.

[0030] Preferably, the carrier plate 3 includes a first adsorption plate 31 and a frame 32. The first adsorption plate 31 is detachably fixed to the first adsorption base 2. Specifically, the first adsorption plate 31 is provided with a plurality of third fixing holes 313 around its perimeter, and the first adsorption base 2 is correspondingly provided with a plurality of first fixing holes 23. Bolts are fitted between the plurality of third fixing holes 313 and the plurality of first fixing holes 23 to enable the first adsorption plate 31 to be detachably fixed to the first adsorption base 2. The frame 32 covers the first adsorption plate 31, and a plurality of support plates 311 for supporting the substrate are distributed at intervals on the upper surface of the first adsorption plate 31. A plurality of first air extraction holes 312 are all provided on the plurality of support plates 311.

[0031] The frame 32 is provided with a plurality of hollow parts 321 for exposing a plurality of support plates 311, each hollow part 321 corresponds to one of the support plates 311; the hollow part 321 and the support plate 311 form a placing groove 33. In this embodiment, the number of the carrier disc 3 is two, the two carrier discs 3 are distributed on the first adsorption base 2, the number of the placing groove 33 in each carrier disc 3 is eight, so that the total number of the placing groove 33 arranged in this embodiment is sixteen. The number of the first vacuum groove 21 is four, the four first vacuum grooves 21 are distributed on the first adsorption base 2, each first vacuum groove 21 corresponds to four placing grooves 33.

[0032] Please refer to Figure 1 、 Figure 2 and Figure 4 , the first adsorption plate 31 is provided with a plurality of positioning columns 20 extending towards the frame 32, the frame 32 is correspondingly provided with a plurality of positioning notches 323, and the plurality of positioning columns 20 are respectively arranged in the plurality of positioning notches 323. Through the cooperation of the positioning column 20 and the positioning notch 323, the assembly of the frame 32 and the first adsorption plate 31 is facilitated.

[0033] Please refer to Figure 4 , the support member 322 for supporting the substrate is arranged around the hollow part 321 and extends towards the support plate 311, and the upper end surface of the support member 322 is flush with the upper end surface of the support plate 311.

[0034] Please refer to Figure 1 、 Figure 2 and Figure 5 , further comprising a second adsorption base 4 and a second adsorption plate 5 for adsorbing a test piece (not shown in the figure), the second adsorption plate 5 is detachably arranged on the second adsorption base 4, specifically, the second adsorption plate 5 is provided with a plurality of fourth fixing holes 52, the second adsorption base 4 is correspondingly provided with a plurality of second fixing holes 43, a plurality of fourth fixing holes 52 and a plurality of second fixing holes 43 are assembled with bolts, so that the second adsorption plate 5 is detachably arranged on the second adsorption base 4; the second adsorption plate 5 is provided with a plurality of second air exhaust holes 51, the second adsorption base 4 is provided with a second vacuum groove 41, one end of the second vacuum groove 41 is assembled with a vacuum pump, and the plurality of second air exhaust holes 51 are in communication with the second vacuum groove 41. Further comprising a base 1 and a tangent tool 11, the tangent tool 11 is assembled with a tangent assembly (not shown in the figure) when in use, the tangent tool 11 is fixedly arranged on one end of the base 1, the second adsorption base 4 is fixedly arranged on the upper end of the tangent tool 11, the first adsorption base 2 is fixedly arranged on the upper end of the base 1, and the base 1 is provided with a mounting hole 12 for mounting on a bonder workbench (not shown in the figure), and the base 1 is bolted to the bonder workbench through the mounting hole 12.

[0035] Please refer to Figure 6 and Figure 7The first vacuum groove 21 is provided with a first air hole 22, and the second vacuum groove 41 is provided with a second air hole 42.

[0036] Working principle: the substrates to be bonded are respectively placed into the placing grooves 33, and the tuning sample is placed above the second suction plate 5, the vacuum pump is started, the vacuum environment is generated, the air pressure in the placing grooves 33 and the second suction plate 5 is lower than the air pressure in the external environment, thereby a negative pressure is generated, because the external air pressure is higher than the air pressure in the placing grooves 33 and the second suction plate 5, the substrates and the tuning sample are tightly adsorbed on the surface of the placing grooves 33 and the second suction plate 5 under the pushing effect of the external air pressure.

[0037] The above examples are only used to illustrate the technical solutions of the present application, and not to limit it; although the present application has been described in detail with reference to the foregoing examples, those skilled in the art should understand that the technical solutions recorded in the foregoing examples can still be modified, or some technical features can be replaced equivalently; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A multi-purpose multi-out multi-key bonding tool, characterized by, The utility model relates to a substrate loading and positioning device for a bonding machine, comprising: a carrier plate (3) and a first adsorption base (2), the carrier plate (3) is detachably covered on the first adsorption base (2), the carrier plate (3) is distributed with a plurality of placing grooves (33) for carrying substrates, a plurality of first air exhaust holes (312) are distributed in a plurality of the placing grooves (33), the first adsorption base (2) is provided with at least a first vacuum groove (21), one end of the first vacuum groove (21) is equipped with a vacuum pump, a plurality of the first air exhaust holes (312) are communicated with the first vacuum groove (21); and further comprising a second adsorption base (4) and a second adsorption plate (5) for adsorbing and adjusting a sample piece, the second adsorption plate (5) is detachably covered on the second adsorption base (4), the second adsorption plate (5) is distributed with a plurality of second air exhaust holes (51), the second adsorption base (4) is provided with a second vacuum groove (41), one end of the second vacuum groove (41) is equipped with a vacuum pump, a plurality of the second air exhaust holes (51) are communicated with the second vacuum groove (41).

2. The multi-use, one-out-of-many bonding tool of claim 1, wherein, The carrier plate (3) comprises a first adsorption plate (31) and a frame (32), the first adsorption plate (31) is detachably fixed on the first adsorption base (2), the frame (32) is covered on the first adsorption plate (31), the upper end surface of the first adsorption plate (31) is spacedly distributed with a plurality of support plates (311) for carrying substrates, a plurality of the first air exhaust holes (312) are arranged in a plurality of the support plates (311); The frame (32) is provided with a plurality of hollow parts (321) for exposing a plurality of the support plates (311), each of the hollow parts (321) corresponds to one of the support plates (311); the hollow part (321) and the support plate (311) form a placing groove (33).

3. A multi-use, one out of many bonding tool as defined in claim 2, wherein, The first adsorption plate (31) is provided with a plurality of positioning columns (20) extending towards the frame (32), the frame (32) is correspondingly provided with a plurality of positioning notches (323), and a plurality of the positioning columns (20) are respectively arranged in a plurality of the positioning notches (323).

4. The multi-use, one-out-of-many bonding tool of claim 2, wherein, The periphery of the hollow part (321) is provided with a support member (322) extending towards the support plate (311) for supporting the substrate, and the upper end surface of the support member (322) is flush with the upper end surface of the support plate (311).

5. The multi-use, one-out-of-many bonding tool of claim 1, wherein, The first vacuum groove (21) is provided with a first air vent (22), the second vacuum groove (41) is provided with a second air vent (42), and the first air vent (22) and the second air vent (42) are respectively equipped with an air vent pipe, and the two air vent pipes are communicated with the vacuum pump.

6. A multi-use, one out of many bonding tool as defined in claim 5, wherein, The air vent pipe is a PU pipe.

7. The multi-use, one-to-many bonding tool of claim 1, wherein, Further comprising a base (1) and a tangent tool (11), the tangent tool (11) is fixed on one end of the base (1), the second adsorption base (4) is fixed on the upper end of the tangent tool (11), the first adsorption base (2) is fixed on the upper end of the base (1), the base (1) is provided with a mounting hole (12) for mounting on the workbench of the bonding machine, and the base (1) is bolted with the workbench of the bonding machine through the mounting hole (12).

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